CN209544313U - A kind of diode based on graphene encapsulation - Google Patents

A kind of diode based on graphene encapsulation Download PDF

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Publication number
CN209544313U
CN209544313U CN201920336201.7U CN201920336201U CN209544313U CN 209544313 U CN209544313 U CN 209544313U CN 201920336201 U CN201920336201 U CN 201920336201U CN 209544313 U CN209544313 U CN 209544313U
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China
Prior art keywords
diode
packaging body
graphene
backlight unit
layer
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Application number
CN201920336201.7U
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Chinese (zh)
Inventor
王焕东
陈红英
王威
王焕忠
王鸿宇
王海宇
林俊杰
甘文林
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Guangdong Hui Xin Electronic Technology Co Ltd
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Guangdong Hui Xin Electronic Technology Co Ltd
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Abstract

The utility model discloses a kind of diode based on graphene encapsulation, including packaging body and it is mounted on the intracorporal diode ontology of encapsulation, the inner surface of packaging body is covered with one layer of graphene film.The utility model is equipped with graphene film between diode ontology and packaging body, since graphene has excellent thermally conductive, heat dissipation performance, graphene film one side is bonded with diode ontology, another side is bonded with packaging body, effectively the heat that diode ontology generates can be conducted to packaging body, it is further that heat is outwardly quick, and then improve radiating efficiency.

Description

A kind of diode based on graphene encapsulation
Technical field
The utility model relates to diode manufacturing technology field, espespecially a kind of diode based on graphene encapsulation.
Background technique
Diode is one of most common electronic component, its maximum characteristic is exactly unilateal conduction, that is, electric current is only To flow through from diode a direction, diode mainly acts on the various modulation such as rectification circuit, detecting circuit, voltage regulator circuit Circuit.With the extensive use of diode, requirement of the people for diode is also higher and higher, especially the thermal diffusivity of diode Can, common diode does not have radiator, and in powerful diode, a large amount of heat can be generated when passing through high current It measures, common diode radiating poor performance, is easily damaged in use process, broken down so as to cause rectifying output circuit, Substantially reduce the service life of diode
Summary of the invention
To solve the above problems, the utility model provides, a kind of structure is simple, heat dissipation effect is good is sealed based on graphene The diode of dress.
To achieve the above object, the technical solution adopted in the utility model is to provide a kind of two poles based on graphene encapsulation Pipe, including packaging body and it is mounted on the intracorporal diode ontology of encapsulation, the inner surface of the packaging body is covered with one layer of graphene Film.
As a preferred embodiment, the diode ontology includes diode chip for backlight unit and what is connect with diode chip for backlight unit draw Foot, the diode chip for backlight unit are mounted in packaging body, and the pin is leant out out of packaging body.
As a preferred embodiment, the mounting groove of installation diode chip for backlight unit, the mounting groove are provided in the packaging body Surface be covered with one layer of graphene film.
As a preferred embodiment, the outer surface of the packaging body is covered with one layer of thermal grease layer.
As a preferred embodiment, it is provided with heat sink in the thermal grease layer, is provided on the heat sink several Radiating fin.
As a preferred embodiment, the two sides of the radiating fin are jagged radiating surface.
As a preferred embodiment, the packaging body includes upper housing and lower case, and the upper housing and lower case buckle Connection.
The utility model has the beneficial effects that:
The utility model is equipped with graphene film between diode ontology and packaging body, since graphene is with excellent Thermally conductive, heat dissipation performance, graphene film one side are bonded with diode ontology, and another side is bonded with packaging body, can be effectively by two The heat that pole pipe ontology generates is conducted to packaging body, further outwardly quickly disperses heat, and then improves heat dissipation effect Rate;In addition to this, installation protecting effect is played to diode ontology by packaging body, and protecting effect is good.
Detailed description of the invention
Fig. 1 is the structural exploded view of the utility model.
Fig. 2 is the schematic cross-section of packaging body.
Drawing reference numeral explanation: 1- packaging body;2- diode ontology;3- graphene film;4- diode chip for backlight unit;5- pin; 6- mounting groove;7- thermal grease layer;8- heat sink;9- radiating fin;10- upper housing;11- lower case.
Specific embodiment
The utility model is described in detail with Figure of description combined with specific embodiments below.
It please refers to shown in Fig. 1-2, the utility model is about a kind of diode based on graphene encapsulation, including packaging body 1 And it is mounted on the diode ontology 2 in packaging body 1, the inner surface of the packaging body 1 is covered with one layer of graphene film 3.
The utility model is equipped with graphene film 3 between diode ontology 2 and packaging body 1, since graphene is with excellent Good thermally conductive, heat dissipation performance, 3 one side of graphene film are bonded with diode ontology 2, and another side is bonded with packaging body 1, can be effective Ground conducts the heat that diode ontology 2 generates to packaging body 1, further outwardly quickly disperses heat, and then improves Radiating efficiency;In addition to this, installation protecting effect is played to diode ontology 2 by packaging body 1, and protecting effect is good.
In the present embodiment, the diode ontology 2 includes diode chip for backlight unit 4 and the pin 5 connecting with diode chip for backlight unit 4, The mounting groove 6 of installation diode chip for backlight unit 4 is provided in the packaging body 1, the diode chip for backlight unit 4 is mounted in mounting groove 6, institute Pin 5 is stated to lean out out of packaging body 1.By being provided with mounting groove 6 in packaging body 1, other than being capable of fixing diode chip for backlight unit 4, Since the setting of mounting groove 6 causes slot milling in packaging body 1 larger, diode chip for backlight unit 4 generates heat and is relatively easy to spread, and is conducive to Heat dissipation.
As shown in Fig. 2, the surface of the mounting groove 6 is covered with one layer of graphene film 3, just in addition to 1 inner surface of packaging body In quickly dispersing heat, the heat accumulation for avoiding the generation of diode chip for backlight unit 4 together, influences service life, improves heat dissipation Effect.Further, the outer surface of the packaging body 1 is covered with one layer of thermal grease layer 7, and the heating conduction of heat-conducting silicone grease is excellent It is different, at work, the heat absorption of packaging body 1 is come using thermal grease layer 7, accelerates the heat dissipation speed in packaging body 1 Rate, and then improve heat dissipation performance.
In order to further increase radiating efficiency, heat sink 8 is provided in the thermal grease layer 7, the heat sink 8 is copper The partial heat of packaging body 1 is conducted through by heat sink 8 further, several dissipate is provided on the heat sink 8 by plate Hot fin 9, then conducted heat by radiating fin 9.Specifically, the two sides of the radiating fin 9 are jagged Radiating surface sets zigzag for radiating surface, not only reduces manufacturing cost, also adds heat dissipation area, can more effectively dissipate Heat substantially increases radiating efficiency.
For the ease of encapsulation, the packaging body 1 includes upper housing 10 and lower case 11, the upper housing 10 and lower case 11 It snaps connection, be easily installed and dismantle diode ontology 2, recycle diode ontology 2, avoid the wasting of resources.
Embodiment of above is only that preferred embodiments of the present invention are described, not to the utility model Range be defined, under the premise of not departing from the spirit of the design of the utility model, this field ordinary engineering and technical personnel to this The various changes and improvements that the technical solution of utility model is made should all fall into the guarantor that claims of the utility model determine It protects in range.

Claims (7)

1. a kind of diode based on graphene encapsulation, including packaging body and it is mounted on the intracorporal diode ontology of encapsulation, it is special Sign is: the inner surface of the packaging body is covered with one layer of graphene film.
2. a kind of diode based on graphene encapsulation according to claim 1, it is characterised in that: the diode ontology Including diode chip for backlight unit and the pin connecting with diode chip for backlight unit, the diode chip for backlight unit is mounted in packaging body, the pin It is leant out out of packaging body.
3. a kind of diode based on graphene encapsulation according to claim 2, it is characterised in that: set in the packaging body It is equipped with the mounting groove of installation diode chip for backlight unit, the surface of the mounting groove is covered with one layer of graphene film.
4. a kind of diode based on graphene encapsulation according to claim 1, it is characterised in that: outside the packaging body Surface is covered with one layer of thermal grease layer.
5. a kind of diode based on graphene encapsulation according to claim 4, it is characterised in that: the thermal grease layer On be provided with heat sink, several radiating fins are provided on the heat sink.
6. a kind of diode based on graphene encapsulation according to claim 5, it is characterised in that: the radiating fin Two sides are jagged radiating surface.
7. a kind of diode based on graphene encapsulation according to claim 1, it is characterised in that: the packaging body includes Upper housing and lower case, the upper housing and lower case snap connection.
CN201920336201.7U 2019-03-15 2019-03-15 A kind of diode based on graphene encapsulation Active CN209544313U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920336201.7U CN209544313U (en) 2019-03-15 2019-03-15 A kind of diode based on graphene encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920336201.7U CN209544313U (en) 2019-03-15 2019-03-15 A kind of diode based on graphene encapsulation

Publications (1)

Publication Number Publication Date
CN209544313U true CN209544313U (en) 2019-10-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920336201.7U Active CN209544313U (en) 2019-03-15 2019-03-15 A kind of diode based on graphene encapsulation

Country Status (1)

Country Link
CN (1) CN209544313U (en)

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