CN209484538U

CN209484538U - A kind of LED heat dissipation copper base

Info

Publication number: CN209484538U
Application number: CN201920460907.4U
Authority: CN
Inventors: 蒋军林
Original assignee: Huizhou Guochangsheng Electronics Co Ltd
Current assignee: Huizhou Guochangsheng Electronics Co Ltd
Priority date: 2019-04-04
Filing date: 2019-04-04
Publication date: 2019-10-11
Anticipated expiration: 2029-04-04

Abstract

The utility model discloses a kind of LED heat dissipation copper base, including copper base main body, the lower surface of the copper base main body is provided with anodized insulation layer, the bottom of the copper base main body offer several shapes it is identical and perforation to anodized insulation layer bottom heat release hole, the upper surface of the copper base main body is formed with etched circuit layer, the upper surface of the etched circuit layer is connected with insulating heat-conductive frame, several chips access slot is offered on the insulating heat-conductive frame, the bottom end of the chip access slot extends to etched circuit layer.By opening up several heat release holes in copper base body lower surface, increase the contact area of copper base main body and air, and use insulating heat-conductive frame as the installation base plate of chip, in chip and etched circuit layer access adstante febre, the heat loss through conduction of copper base main body is more smooth quickly, to reduce thermal resistance, achieve the purpose that stable element service performance.

Description

A kind of LED heat dissipation copper base

Technical field

A kind of the utility model category wiring board technology field, and in particular to LED heat dissipation copper base.

Background technique

In LED illumination product, substrate is its pith, and substrate can play fixed function to LED lamp source, while inside it Circuit connects to the control circuit conductive to power to LED lamp source.At present apply the substrate of field of LED illumination have aluminum substrate, Copper base, ceramic substrate etc., these substrates itself have thermally conductive performance, itself can solve heat dissipation to a certain extent and ask Topic, wherein aluminum substrate and copper base are using relatively broad substrate, and aluminum substrate is commonly used for flexible circuit board, and copper base is commonly used for Hard wiring board, copper base is often packaged in the pedestal of LED illumination product, and itself passes through COB technology for multiple chips It is encapsulated on same copper base, therefore very big heat can be accumulated, bad student's thermal resistance influences the illumination performance of LED.

Utility model content

It is mentioned above in the background art to solve the purpose of this utility model is to provide a kind of LED heat dissipation copper base Problem.

Used technical solution is this utility model in order to achieve the above objectives:

A kind of LED heat dissipation copper base, including copper base main body, it is exhausted that the lower surface of the copper base main body is provided with oxidation film Edge layer, the bottom of the copper base main body offer several shapes it is identical and perforation to anodized insulation layer bottom heat dissipation Hole, the upper surface of the copper base main body are formed with etched circuit layer, and the upper surface of the etched circuit layer is connected with insulation and leads Hot frame, several chips access slot is offered on the insulating heat-conductive frame, and the bottom end of the chip access slot extends to etching electricity Road floor.

It further illustrates, the heat release hole is cylindrical hole, and thickness is less than the thickness of copper base main body.

It further illustrates, the anodized insulation layer is formed in copper base main body by way of anodic oxidation plated film Lower surface.

It further illustrates, it is mutually be bonded by using thermal conductive insulation glue between the etched circuit layer and insulating heat-conductive frame It is integrated.

It further illustrates, the chip access slot runs through insulating heat-conductive frame and connects with etched circuit layer, described The shape of chip access slot is opened up according to the shape of practical access chip.

Compared with prior art, the utility model has the beneficial effects that:

By opening up several heat release holes in copper base body lower surface, increase the contact surface of copper base main body and air Product, and use insulating heat-conductive frame as the installation base plate of chip, in chip and etched circuit layer access adstante febre, copper base master The heat loss through conduction of body is more smooth quickly, to reduce thermal resistance, achievees the purpose that stable element service performance.

Detailed description of the invention

Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:

Fig. 1 is the structural schematic diagram of the utility model；

Fig. 2 is the structure schematic top plan view of the utility model；

Wherein: 1, copper base main body；2, anodized insulation layer；3, heat release hole；4, etched circuit layer；5, insulating heat-conductive frame； 6, chip accesses slot.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Please refer to Fig. 1 to Fig. 2, the utility model the following technical schemes are provided:

A kind of LED heat dissipation copper base, including copper base main body 1, the lower surface of copper base main body 1 are provided with anodized insulation Layer 2, anodized insulation layer 2 is formed in the lower surface of copper base main body 1 by way of anodic oxidation plated film, to copper base main body 1 plays insulation and protective effect；The bottom of copper base main body 1 offers that several shapes are identical and perforation is to anodized insulation layer The heat release hole 3 of 2 bottoms, heat release hole 3 are cylindrical hole, and thickness is less than the thickness of copper base main body 1；The upper table of copper base main body 1 Face is formed with etched circuit layer 4, and the upper surface of etched circuit layer 4 is connected with insulating heat-conductive frame 5, and etched circuit layer 4 is led with insulation It is mutually bonded as one between hot frame 5 by using thermal conductive insulation glue, several chips access slot 6 is offered on insulating heat-conductive frame 5, The bottom end of chip access slot 6 extends to etched circuit layer 4.

Specifically, 1 surface of copper base main body offers several heat release holes 3, connecing for copper base main body 1 and air is increased Contacting surface product, the heat conduction velocity for making copper base main body 1 faster, conventional chip mounting substrate are substituted using insulating heat-conductive frame 5, Chip and 4 access adstante febre of etched circuit layer, heat is passed through itself to copper base main body 1 and heat release hole 3 is conducted to air ring In border, insulating heat-conductive frame 5 can be conducted heat in air environment by itself, the copper base heat loss through conduction effect of this structure Fruit is more smooth compared to conventional copper base quickly.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims

The copper base 1. a kind of LED radiates, including copper base main body, it is characterised in that: the lower surface of the copper base main body (1) is set It is equipped with anodized insulation layer (2), the bottom of the copper base main body (1) offers that several shapes are identical and perforation is to oxidation film The upper surface of the heat release hole (3) of insulating layer (2) bottom, the copper base main body (1) is formed with etched circuit layer (4), the erosion The upper surface for carving circuit layer (4) is connected with insulating heat-conductive frame (5), is offered several chips on the insulating heat-conductive frame (5) and is connect Enter slot (6), the bottom end of chip access slot (6) extends to etched circuit layer (4).
The copper base 2. a kind of LED according to claim 1 radiates, it is characterised in that: the heat release hole (3) is cylindrical hole, Its thickness is less than the thickness of copper base main body (1).
The copper base 3. a kind of LED according to claim 1 radiates, it is characterised in that: the anodized insulation layer (2) passes through The mode of anodic oxidation plated film is formed in the lower surface of copper base main body (1).
The copper base 4. a kind of LED according to claim 1 radiates, it is characterised in that: the etched circuit layer (4) and insulation It is mutually bonded as one between thermally conductive frame (5) by using thermal conductive insulation glue.
The copper base 5. a kind of LED according to claim 1 radiates, it is characterised in that: chip access slot (6) runs through Insulating heat-conductive frame (5) simultaneously connects with etched circuit layer (4), and the shape of chip access slot (6) is according to practical access chip Shape opens up.