CN209346074U - An intelligent thermoelectric heating nozzle for a food 3D printer - Google Patents

Abstract

The utility model relates to an intelligent thermoelectric heating nozzle of a food 3D printer, comprising a nozzle, a CPU central control system, a feeding pipe respectively connected to the CPU central control system, an extruding device and a semiconductor refrigeration and heating device. The device is connected to the top of the feeding pipe, and the bottom of the feeding pipe is connected to a semiconductor cooling and heating device. The nozzle is arranged inside the bottom of the feeding pipe, and the semiconductor cooling and heating device includes a Surrounding semiconductor cooling sheets, the semiconductor cooling sheet includes a cooling end, a semiconductor cold end guide bar, an N-type and a P-type semiconductor area, a semiconductor hot end guide bar and a heating end arranged in sequence, and the heating The end is connected with the feed pipe, and the refrigeration end is placed against the feed pipe. Compared with the prior art, the utility model has the advantages of solving the heating problem of the nozzle, accelerating the cooling of the printed model after the nozzle is discharged, reducing energy consumption, improving printing accuracy, and reducing the cost of food output.

Description

An intelligent thermoelectric heating nozzle for a food 3D printer

technical field

The utility model relates to a nozzle of a 3D printer, in particular to an intelligent thermoelectric heating nozzle of a food 3D printer.

Background technique

With the continuous development of science and technology, more and more new technologies have entered people's lives. Since its invention, 3D printing technology has attracted the attention of all parties, and has been hailed as the fourth industrial revolution by foreign media. Among them, the FDM printing technology is the most widely used, and the fused deposition manufacturing process has begun to be applied to the production of food. The principle of FDM3D printing is that the material is heated and melted in the nozzle, and the nozzle moves along the cross-sectional contour of the part and the filling trajectory, and the molten material is extruded at the same time. The material is quickly solidified and bonded with the surrounding materials to achieve three-dimensional molding. Compared with other methods, this printer has many advantages such as simple structure, convenient operation, and fast molding speed. The advantage of the print-and-extrude approach is that it can be used with a wider range of food materials. In the food-grade printing technology at this stage, the printing nozzle part is mainly heated. During the printing process, due to the high temperature of the nozzle, the temperature drop is slow after the nozzle extrudes the food material, resulting in slow cooling and crystallization of the material, resulting in low printing accuracy, etc. series of questions. In addition, for the print head in the prior art, a large energy consumption is required in the cooling process, which greatly increases the cost of food output.

Utility model content

The purpose of this utility model is to provide an intelligent thermoelectric heating nozzle of a food 3D printer in order to overcome the above-mentioned defects in the prior art.

The purpose of this utility model can be achieved through the following technical solutions:

An intelligent thermoelectric heating nozzle of a food 3D printer, comprising a nozzle, a CPU central control system, a feeding pipe respectively connected to the CPU central control system, an extruding device and a semiconductor cooling and heating device, the extruding device and the feeding material The top of the pipe is connected, and the bottom of the feeding pipe is connected with a semiconductor cooling and heating device. The nozzle is arranged inside the bottom of the feeding pipe, and the semiconductor cooling and heating device includes semiconductor The refrigerating sheet, the semiconductor refrigerating sheet includes a refrigerating end, a semiconductor cold-end guide bar, an N-type and a P-type semiconductor region, a semiconductor hot-end guide bar and a heating end arranged in sequence, and the heating end is connected to the output The feed pipe is connected, and the refrigeration end is placed against the feed pipe.

Preferably, the outside of the cooling end is provided with a closed annular heat absorbing plate.

Preferably, the semiconductor refrigeration and heating device further includes an insulating and heat-insulating framework, and the insulating and heat-insulating framework is fixed between the annular heat-absorbing plate and the material delivery pipe, and erected above the N-type and P-type semiconductor regions .

Preferably, a first temperature sensor is provided around the nozzle, and the first temperature sensor is connected with the CPU central control system.

Preferably, the pipe wall of the delivery pipe is provided with a second temperature sensor for sensing the temperature of the pipe wall, and the second temperature sensor is connected with the CPU central control system.

Preferably, the extrusion device includes a support rod, a fixed rib, a moving slider, a piston rod and a micro motor, the fixed rib is fixed on the top edge of the delivery pipe, and the support rod is fixed on a fixed On the rib plate, the moving slider is sleeved on the support rod, the piston rod is set in the feeding pipe and connected with the moving slider, the micro motor is fixed on the feeding pipe, and the micro motor is connected with the feeding pipe. The mobile slides are connected by threaded rods.

Preferably, the CPU central control system is a mega2560 single-chip microcomputer.

Preferably, the feeding pipe is a ceramic aluminum alloy feeding pipe.

Preferably, the number of the semiconductor cooling chips is four.

Preferably, a pressure sensor for sensing the internal pressure of the delivery pipe is provided above the nozzle, and the pressure sensor is connected with the CPU central control system.

Compared with the prior art, the utility model has the following advantages:

(1) The utility model is equipped with a semiconductor cooling and heating device outside the feeding pipe. By connecting the heating end of the semiconductor refrigeration chip with the feeding pipe, and the feeding pipe is made of ceramic aluminum alloy material with good thermal conductivity, the The heat of the heating end of the semiconductor refrigeration chip is completely introduced into the food, and the heat is transferred up and down along the feeding pipe, so that the heat in a certain place will not rise sharply, which ensures the constant temperature in the feeding pipe and prevents fluid crystallization from occurring. blockage; in addition, the semiconductor refrigeration chip can transfer heat to the top of the feeding pipe, so that the food materials inside the feeding pipe are kept in a molten state, which solves the problem of nozzle heating and rapid cooling at the nozzle, reduces energy consumption, and reduces cost of food production;

(2) The semiconductor refrigeration sheet in the semiconductor refrigeration and heating device of the present utility model is placed away from the feeding pipe around, and a closed annular heat absorbing plate is installed outside it, and the principle of the annular heat absorbing plate is the same as that of the heat sink. Both expand the area to increase the heat absorption speed, and the middle part of each surface is the place with the lowest temperature. The heat absorption plate is distributed in a ring shape, which can better keep the surrounding area at a low temperature, accelerate the temperature drop near the nozzle, and make the printing out just now Rapid prototyping of materials, accelerated cooling and crystallization of materials, and improved printing accuracy;

(3) A non-conductive, non-heat-conducting insulating and temperature-insulating frame is installed between the annular heat-absorbing plate of the utility model and the feeding pipe, which can be used as a mounting bracket for semiconductor refrigeration chips, and can also be used as a mounting bracket for semiconductor refrigeration chips. The cooling end is isolated from the heating end to ensure that the temperature at the nozzle can meet the requirements of food materials in food 3D printing to maintain a fluid state, to prevent the radiation from the semiconductor cooling end, and at the same time completely prevent the heat of the feeding pipe in the ring In the heat-absorbing plate, the rapid cooling of the printed model is realized after the nozzle is discharged;

(4) Four temperature sensors are arranged around the nozzle of the present utility model, and the temperature sensors can independently control the semiconductor refrigeration chip on the surface. In addition, the pipe wall of the feed pipe is also provided with a temperature sensor for sensing the temperature of the feed pipe wall , Each sensor can transmit the actual temperature data to the CPU central control system, the CPU central control system compares the temperature data with the set temperature, intelligently adjusts the current passing through the semiconductor refrigeration sheet, so that the temperature of the semiconductor refrigeration sheet meets the requirements, and then controls The internal temperature of the feeding tube keeps the temperature of each part constant during the printing process.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the sectional structure schematic diagram of the utility model;

The numbers in the figure indicate:

1. Support rod, 2. Moving slider, 3. Positioning thread, 4. Piston rod, 5. Delivery pipe, 6. Insulation and temperature insulation frame, 7. Annular heat-absorbing plate, 8. Semiconductor refrigeration sheet, 801, Refrigerating end, 802, semiconductor cold end guide bar, 803, N-type and P-type semiconductor regions, 804, semiconductor hot end guide bar, 805, heating end, 9, nozzle, 10, first temperature sensor, 11, The second temperature sensor, 12, pressure sensor, 13, micro motor, 14, fixed rib, 15, threaded rod.

Detailed ways

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figures 1 to 2, the utility model relates to an intelligent thermoelectric heating nozzle for a food 3D printer, including a feeding pipe 5, a support rod 1, a moving slider 2, a micro motor 13, a fixed rib 14, and a piston rod 4. Insulation and temperature insulation frame 6. Semiconductor refrigeration and heating device and CPU central control system.

The fixed rib 14 is fixed on the top edge of the feeding pipe 5 , the support rod 1 is fixed on the fixed rib 14 , and the moving slider 2 is sleeved on the support rod 1 . The piston rod 4 is arranged in the feeding pipe 5 and is connected with the moving slider 2 . A nozzle 9 is provided on the inner side of the bottom of the feed pipe 5 for controlling the extrusion of the food material. Moving slide block 2 promotes piston rod 4 to move to extrude food fluid, and fluid is extruded from nozzle 9. A pressure sensor 12 is arranged above the nozzle 9 for sensing the internal pressure of the delivery pipe 5, and the pressure sensor 12 is connected with the CPU central control system. The micromotor 13 is fixed on the feeding pipe 5, and the micromotor 13 is fixed on the fixed rib 14 by four positioning threads 3, and the fixed rib 14 is also provided with a threaded rod 15, and the micromotor 13 controls the movement of the slide by the threaded rod 15. Block 2 moves.

The bottom of the feeding pipe 5 is connected with a semiconductor cooling and heating device. The semiconductor cooling and heating device includes an annular heat absorbing plate 7 and four semiconductor cooling and heating sheets 8, and the four semiconductor cooling sheets 8 are respectively arranged around the feeding pipe 5, and the heating end 805 of the semiconductor cooling sheet 8 faces the feeding pipe 5 is placed, and the refrigeration end 801 of the semiconductor refrigeration sheet 8 is placed against the feed pipe. Between the heating end 805 and the cooling end 801, a semiconductor hot-end current guide bar 804, an N-type and a P-type semiconductor region 803, and a semiconductor cold-end current guide bar 802 are provided in sequence. A closed annular heat-absorbing plate 7 is installed on the outside of the semiconductor cold end substrate to accelerate the temperature drop near the nozzle 9 . The outer bottom of the feed pipe 5 is fixed to the semiconductor cooling and heating device through the insulating and insulating frame 6 . The insulating and temperature-insulating framework 6 is arranged between the annular heat absorbing plate 7 and the material delivery pipe 5 , and erected above the N-type and P-type semiconductor regions 803 .

The feed pipe 5 is made of a material with good thermal conductivity, such as a ceramic aluminum alloy material, which can completely guide the heat of the heating end 805 of the semiconductor refrigeration sheet 8 into the food, and transfer heat up and down along the feed pipe 5 without causing Somewhere the heat rises sharply. It can ensure that the temperature in the delivery pipe 5 is constant without fluid crystallization and blockage, and heat can be transferred to the top of the delivery pipe 5 to keep the food materials inside the delivery pipe 5 in a molten state.

Four first temperature sensors 10 are arranged around the nozzle 9, and the first temperature sensor 10 is connected with the CPU central control system; temperature sensor 11. The first temperature sensor 10 and the second temperature sensor 11 are respectively connected to the CPU central control system, which can transmit the actual perceived temperature data to the CPU central control system, and the CPU central control system compares the temperature data with the set temperature for intelligent adjustment The electric current passing through the semiconductor cooling chip 8 makes the temperature of the semiconductor cooling chip 8 meet the requirements, and then controls the internal temperature of the feeding pipe 5 to keep the temperature of each part constant during the printing process.

The CPU central control system is preferably a mega2560 single-chip microcomputer. The 3D printing spray head of the present utility model can be used not only in mechanical shaft printers, but also in triangular claw printers or camel rotary printers.

The working principle of the utility model is:

When the 3D printer is working, the CPU central control system gives instructions to control the operation of the semiconductor cooling chip 8, and the current input starts, and the inner ceramic chip of the semiconductor starts to heat, and the heat is transferred to the outer wall of the feeding tube 5 through the heat-conducting silicon, and the feeding tube 5 is The heat conduction material evenly disperses the heat in each position of the feeding pipe 5, and transfers the heat to the internal food material through conduction. At this time, the internal material becomes molten, and the micromotor 13 drives the sliding block 2 to move downward, and then drives the piston rod 4 to move downward, and the molten material is extruded from the nozzle 9 through the delivery pipe 5 . Because the feeding pipe 5 is made of heat-conducting material, excessive energy is released on the peltier 8 to ensure that the temperature at the nozzle 9 is sufficient to prevent non-melting blockage. A part of the energy can be transmitted upwards to disperse the energy of the semiconductor refrigeration sheet 8, preventing the local temperature from destroying the food nutrients caused by overheating.

The printed material is in a molten state and needs to be cooled quickly. In this utility model, the cooling end 801 of the semiconductor cooling chip 8 is placed against the nozzle 9 of the printer, so that the inside of the nozzle 9 is a high-temperature part and the outside is a cooling area. In order to ensure that the air does not Circulation, using the non-conductive, non-heat-conducting insulation frame 6 as the mounting bracket of the semiconductor cooling chip 8, once again isolating the cooling end 801 of the semiconductor cooling chip 8 from the heating end 805, ensuring that the temperature at the nozzle 9 can meet In food 3D printing, the requirement that food materials maintain a fluid state will not be affected by the radiation of the cooling end 801. At the same time, the heat of the delivery pipe 5 can be completely blocked within the annular heat-absorbing plate 7, so that the extruded part of the nozzle 9 can be rapidly cooled and formed. The outside of the cooling end 801 of the semiconductor cooling chip 8 is provided with a ring-shaped heat absorbing plate 7, and the heat absorbing plate is arranged in a ring shape to better keep the surroundings at a low temperature and accelerate the rapid prototyping of printing materials.

During the whole printing process, four first temperature sensors 10 are installed on the four sides of the nozzle 9 , and the second temperature sensor 11 is provided on the tube wall of the feeding tube 5 . The first temperature sensor 10 and the second temperature sensor 11 transmit the actual temperature data to the CPU central control system, and the CPU central control system compares the temperature data with the set temperature, and intelligently adjusts the current passed by the semiconductor refrigeration sheet 8, thereby making the semiconductor The temperature of the refrigerating sheet 8 reaches the requirement, so that the temperature inside the four sides of the feeding pipe 5 is the same, and then the temperature of each part is kept constant during the printing process. When the temperature and pressure are abnormal, the CPU central control system realizes the intelligent control of the temperature and pressure in the nozzle by adjusting the supply current of the semiconductor cooling chip 8 and the conversion of the micro motor 13, thereby improving the printing accuracy.

The above is only a specific embodiment of the utility model, but the scope of protection of the utility model is not limited thereto, any staff familiar with the technical field can easily think of various Equivalent modifications or replacements shall all fall within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be based on the protection scope of the claims.

Claims (10)

1. a kind of Intelligent hot electric heating spray head of food 3D printer, which is characterized in that including nozzle (9), CPU central control system, Conveying pipeline (5), pressurizing unit and the Semi-conductor being separately connected with CPU central control system, the pressurizing unit It is connect with the top of conveying pipeline (5), the bottom of conveying pipeline (5) is connect with Semi-conductor, and the nozzle (9) is set Bottom inside in conveying pipeline (5), the Semi-conductor include half of the bottom surrounding set on conveying pipeline (5) Conductor cooling piece (8), the semiconductor chilling plate (8) include the refrigeration end (801) set gradually, semiconductor cold end flow guide bar (802), N-type and P-type semiconductor region (803), semiconductor hot end flow guide bar (804) and heating end (805), the heating end (805) it is connect with conveying pipeline (5), the refrigeration end (801) is placed back to conveying pipeline (5).

2. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described The outside of refrigeration end (801) is equipped with closed cyclic annular absorber plate (7).

3. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 2, which is characterized in that described Semi-conductor further includes insulation thermal insulation skeleton (6), and the insulation thermal insulation skeleton (6) is fixed on cyclic annular absorber plate (7) it between conveying pipeline (5), and is erected above N-type and P-type semiconductor region (803).

4. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described Nozzle (9) is surrounded by the first temperature sensor (10), which connect with CPU central control system.

5. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described The tube wall of conveying pipeline (5) is equipped with the second temperature sensor (11) for incuding tube wall temperature, the second temperature sensor (11) it is connect with CPU central control system.

6. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described Pressurizing unit includes support rod (1), fixes floor (14), mobile sliding block (2), piston rod (4) and micromotor (13), described Fixed floor (14) are fixed on the top edge of conveying pipeline (5), and the support rod (1) is fixed on fixed floor (14), institute The mobile sliding block (2) stated is set on support rod (1), and the piston rod (4) is set in conveying pipeline (5), and with mobile sliding block (2) it connects, the micromotor (13) is fixed on conveying pipeline (5), and micromotor (13) and mobile sliding block (2) pass through screw thread Bar (15) connection.

7. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described CPU central control system is mega2560 single-chip microcontroller.

8. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described Conveying pipeline (5) is ceramic aluminum alloy conveying pipeline.

9. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described The quantity of semiconductor chilling plate (8) is four.

10. a kind of Intelligent hot electric heating spray head of food 3D printer according to claim 1, which is characterized in that described Nozzle (9) above be equipped with pressure sensor (12) for incuding conveying pipeline (5) internal pressure, the pressure sensor (12) with The connection of CPU central control system.