CN209343380U - A kind of RFID label tag of buried cable thermometric - Google Patents

A kind of RFID label tag of buried cable thermometric Download PDF

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Publication number
CN209343380U
CN209343380U CN201822236111.9U CN201822236111U CN209343380U CN 209343380 U CN209343380 U CN 209343380U CN 201822236111 U CN201822236111 U CN 201822236111U CN 209343380 U CN209343380 U CN 209343380U
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China
Prior art keywords
thermometric
substrate
chip
antenna
layer
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CN201822236111.9U
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Chinese (zh)
Inventor
刘波
陈琼
王政
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GUANGZHOU YUNWEI ELECTRIC POWER SCIENCE & TECHNOLOGY Co Ltd
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GUANGZHOU YUNWEI ELECTRIC POWER SCIENCE & TECHNOLOGY Co Ltd
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Priority to CN201822236111.9U priority Critical patent/CN209343380U/en
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Abstract

The utility model provides a kind of RFID label tag of buried cable thermometric, comprising: label body, thermometric chip, antenna;The label body is from top to bottom successively superimposed with encapsulated layer, conductive metal film, substrate, chip line layer and adhesive layer by upper epidermis and is formed;The bottom surface of label body is arranged in the release paper, and release paper and label body pass through adhesive layer Adherents junction;The upper surface of substrate is arranged in the thermometric chip, and thermometric chip is connected with substrate by bonding mode;The upper surface of substrate is arranged in the antenna, and antenna is connected with substrate by bonding mode.The advantages that by the improvement in structure, it is high that there is radio frequency receiving signal intensity, and have high tenacity and high-weatherability, sufficiently improving the practicality energy, thus the problem of effective solution the utility model proposes in existing apparatus and deficiency.

Description

A kind of RFID label tag of buried cable thermometric
Technical field
The utility model relates to fields of communication technology, more specifically, more particularly to a kind of buried cable thermometric RFID label tag.
Background technique
The safety of buried cable is very important for power plant, substation, high in During Process of Long-term Operation The outside of voltage cable is due to junction contacts are bad etc., and under high current effect, connector temperature is increased, and contact resistance increases etc. Factor be easy to cause thermal fault, it is therefore necessary to carry out thermometric monitoring to buried cable, prevent the generation of security risk.
Mostly use reader by way of reading the thermometric RFID label tag on buried cable buried cable thermometric at present It completes, but that there is also signal receiving circuits is not perfect for existing thermometric RFID label tag, causes between reader Radio frequency receiving signal intensity is weaker, influences using and itself toughness and weatherability are poor, cause device physical life shorter etc. Problem.
In view of this, being studied improvement for existing problem, a kind of signal strength height is provided, with long service lifely The RFID label tag of lower cable thermometric, it is intended to by the technology, achieve the purpose that solve the problems, such as and improve practical value.
Utility model content
The purpose of this utility model is to provide a kind of RFID label tags of buried cable thermometric, to solve above-mentioned background skill That there is also signal receiving circuits is not perfect for the existing thermometric RFID label tag proposed in art, leads to penetrating between reader Frequency received signal strength is weaker, influences using and itself toughness and weatherability are poor, cause device physical life shorter etc. and ask Topic and deficiency.
To achieve the above object, the utility model provides a kind of RFID label tag of buried cable thermometric, by following tool Body technique means are reached: the label body is from top to bottom successively by upper epidermis and encapsulated layer, conductive metal film, substrate, core Piece line layer and adhesive layer superposition composition;The bottom surface of label body is arranged in the release paper, and release paper and label body are logical Cross adhesive layer Adherents junction;The upper surface of substrate is arranged in the thermometric chip, and thermometric chip and substrate pass through bonding mode It is connected;The upper surface of substrate is arranged in the antenna, and antenna is connected with substrate by bonding mode;The coupling circuit The upper surface of substrate is set, and coupling circuit are connected with substrate by bonding mode.
As advanced optimizing for the technical program, the thermometric chip uses UHF electronic thermometric chip, and thermometric The right end of chip and the left capacitive folding line of antenna, the left end of right capacitive folding line weld together.
As advanced optimizing for the technical program, the antenna is curved by copper patch and left capacitive folding line and right capacitive Broken line composition, and the right end of the left capacitive folding line of antenna, the left end of right capacitive folding line weld together with coupling circuit.
As advanced optimizing for the technical program, the coupling circuit use inductive coupling circuit, and in coupling circuit Equipped with signal amplification circuit and wake-up circuit at one.
As advanced optimizing for the technical program, the upper epidermis passes through SMART process ARM material using surface Manufactured oblong-shaped, and upper epidermis is covered on the upper surface of encapsulated layer by hot pressing mode.
As advanced optimizing for the technical program, the encapsulated layer is one layer of high toughness two-in-one plastic film, and is sealed The upper surface of the conductive metal film of aluminum is arranged in by bonding mode for dress layer, and is bonded together with substrate.
As advanced optimizing for the technical program, the chip line layer welds structure by circuit patch and thermometric chip At, and the circuit structure of circuit patch is the circuit of antenna in chip line layer.
Due to the application of the above technical scheme, the utility model has the advantage that compared with prior art
1, a kind of RFID label tag of buried cable thermometric of the utility model, by increasing between coupling circuit and antenna Add signal amplification circuit at one, so that the rf signal reception intensity between the device and reader be made to effectively improve.
2, a kind of RFID label tag of buried cable thermometric of the utility model uses table by the setting on label body surface Face is by upper epidermis made of SMART process ARM material and cooperates high toughness two-in-one plastic film, has the device High tenacity, it is anti-aging, corrosion-resistant, heat-resisting, heat preservation, moisturizing the advantages of, to sufficiently extend the service life of the device.
3, the utility model has radio frequency receiving signal intensity height by the improvement to above-mentioned apparatus in structure, and The advantages that having high tenacity and high-weatherability, sufficiently improving the practicality energy, so that effective solution the utility model is being carried on the back The problem of being proposed in scape technology one and deficiency.
Detailed description of the invention
The attached drawing constituted part of this application is used to provide a further understanding of the present invention, the utility model Illustrative embodiments and their description are not constituteed improper limits to the present invention for explaining the utility model.In attached drawing In:
Fig. 1 is the schematic view of the front view of the utility model;
Fig. 2 is the schematic diagram of internal structure of the utility model;
Fig. 3 is the A point partial structural diagram of the utility model;
Fig. 4 is the circuit principle structure schematic diagram of the utility model;
Fig. 5 is the signal amplification circuit structural schematic diagram of the utility model;
Fig. 6 is the wake-up circuit structural schematic diagram of the utility model.
In figure: label body 1, release paper 2, thermometric chip 3, antenna 4, coupling circuit 5, upper epidermis 101, encapsulated layer 102, Conductive metal film 103, substrate 104, chip line layer 105, adhesive layer 106.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Meanwhile in the description of the present invention, unless otherwise clearly defined and limited, term " connected ", " connection " are answered It is interpreted broadly, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can be mechanical connect It connects, is also possible to be electrically connected;It can be directly connected, it can also be indirectly connected through an intermediary.For the general of this field For logical technical staff, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Referring to Figure 1 to Fig. 6, the particular technique that the utility model provides a kind of RFID label tag of buried cable thermometric is real Apply scheme: include: label body 1, release paper 2, thermometric chip 3, antenna 4, coupling circuit 5, upper epidermis 101, encapsulated layer 102, Conductive metal film 103, substrate 104, chip line layer 105, adhesive layer 106;Label body 1 is from top to bottom successively by upper epidermis 101 are superimposed composition with encapsulated layer 102, conductive metal film 103, substrate 104, chip line layer 105 and adhesive layer 106;Release paper 2 The bottom surface of label body 1 is set, and release paper 2 and label body 1 pass through 106 Adherents junction of adhesive layer;Thermometric chip 3 is arranged In the upper surface of substrate 104, and thermometric chip 3 is connected with substrate 104 by bonding mode;Substrate 104 is arranged in antenna 4 Upper surface, and antenna 4 is connected with substrate 104 by bonding mode;The upper surface of substrate 104, and coupling is arranged in coupling circuit 5 Circuit 5 is closed to be connected with substrate 104 by bonding mode.
Specifically, thermometric chip 3 uses UHF electronic thermometric chip, and thermometric chip 3 and the left capacitive folding line of antenna 4 Right end, the left end of right capacitive folding line welds together.
Specifically, antenna 4 is made of copper patch and left capacitive folding line and right capacitive folding line, and the left capacitive of antenna 4 The right end of folding line, left end and the coupling circuit 5 of right capacitive folding line weld together.
Specifically, coupling circuit 5 use inductive coupling circuit, and coupling circuit 5 be equipped with one at signal amplification circuit and Wake-up circuit.
Specifically, upper epidermis 101 passes through oblong-shaped made of SMART process ARM material, and upper table using surface Layer 101 is covered on the upper surface of encapsulated layer 102 by hot pressing mode.
Specifically, encapsulated layer 102 is one layer of high toughness two-in-one plastic film, and encapsulated layer 102 is set by bonding mode It sets in the upper surface of the conductive metal film 103 of aluminum, and is bonded together with substrate 104.
Specifically, chip line layer 105 is formed by welding by circuit patch and thermometric chip 3, and electric in chip line layer 105 The circuit structure of road patch is the circuit of antenna 4.
Specific implementation step: by the way that label body 1 is pasted onto underground by taking and passing through adhesive layer 106 in release paper 2 off On cable, when to buried cable thermometric, radiofrequency signal is sent by reader, antenna 4 receives signal and feeds back to survey At warm chip 3, buried cable temperature data is fed back in reader by antenna 4 and is read out by thermometric chip 3.
In summary: a kind of RFID label tag of buried cable thermometric, by increasing between coupling circuit and antenna Add signal amplification circuit at one, so that the rf signal reception intensity between the device and reader be made to effectively improve;It is logical It crosses and upper epidermis made of SMART process ARM material is passed through using surface in the setting of label body surface and cooperates high tenacity Two-in-one plastic film makes the device have the advantages that high tenacity, anti-aging, corrosion-resistant, heat-resisting, heat preservation, moisturizing, thus sufficiently Extend the service life of the device.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (7)

1. a kind of RFID label tag of buried cable thermometric, including label body (1), release paper (2), thermometric chip (3), antenna (4), coupling circuit (5), upper epidermis (101), encapsulated layer (102), conductive metal film (103), substrate (104), chip line layer (105), adhesive layer (106);It is characterized by: the label body (1) is from top to bottom successively by upper epidermis (101) and encapsulated layer (102), conductive metal film (103), substrate (104), chip line layer (105) and adhesive layer (106) superposition composition;It is described release Paper (2) setting is in the bottom surface of label body (1), and release paper (2) and label body (1) pass through adhesive layer (106) Adherents junction; Thermometric chip (3) setting is in the upper surface of substrate (104), and thermometric chip (3) passes through bonding mode phase with substrate (104) Connection;The antenna (4) is arranged in the upper surface of substrate (104), and antenna (4) is connected with substrate (104) by bonding mode It connects;Coupling circuit (5) setting is in the upper surface of substrate (104), and coupling circuit (5) and substrate (104) pass through bonding side Formula is connected.
2. a kind of RFID label tag of buried cable thermometric according to claim 1, it is characterised in that: the thermometric chip (3) UHF electronic thermometric chip, and the right end of thermometric chip (3) and antenna (4) left capacitive folding line, right capacitive bending are used The left end of line welds together.
3. a kind of RFID label tag of buried cable thermometric according to claim 1, it is characterised in that: the antenna (4) It is made of copper patch and left capacitive folding line and right capacitive folding line, and the right end of the left capacitive folding line of antenna (4), right capacitive The left end of folding line welds together with coupling circuit (5).
4. a kind of RFID label tag of buried cable thermometric according to claim 1, it is characterised in that: the coupling circuit (5) inductive coupling circuit is used, and coupling circuit (5) are equipped with signal amplification circuit and wake-up circuit at one.
5. a kind of RFID label tag of buried cable thermometric according to claim 1, it is characterised in that: the upper epidermis (101) using surface by oblong-shaped made of SMART process ARM material, and upper epidermis (101) passes through hot pressing mode It is covered on the upper surface of encapsulated layer (102).
6. a kind of RFID label tag of buried cable thermometric according to claim 1, it is characterised in that: the encapsulated layer It (102) is one layer of high toughness two-in-one plastic film, and the conductive metal of aluminum is arranged in by bonding mode for encapsulated layer (102) The upper surface of film (103), and be bonded together with substrate (104).
7. a kind of RFID label tag of buried cable thermometric according to claim 1, it is characterised in that: the chip route Layer (105) be formed by welding by circuit patch and thermometric chip (3), and in chip line layer (105) circuit patch circuit structure For the circuit of antenna (4).
CN201822236111.9U 2018-12-28 2018-12-28 A kind of RFID label tag of buried cable thermometric Active CN209343380U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822236111.9U CN209343380U (en) 2018-12-28 2018-12-28 A kind of RFID label tag of buried cable thermometric

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822236111.9U CN209343380U (en) 2018-12-28 2018-12-28 A kind of RFID label tag of buried cable thermometric

Publications (1)

Publication Number Publication Date
CN209343380U true CN209343380U (en) 2019-09-03

Family

ID=67759862

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822236111.9U Active CN209343380U (en) 2018-12-28 2018-12-28 A kind of RFID label tag of buried cable thermometric

Country Status (1)

Country Link
CN (1) CN209343380U (en)

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