CN209329967U - A kind of stack bus bar with exchange exit - Google Patents

A kind of stack bus bar with exchange exit Download PDF

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Publication number
CN209329967U
CN209329967U CN201821890859.4U CN201821890859U CN209329967U CN 209329967 U CN209329967 U CN 209329967U CN 201821890859 U CN201821890859 U CN 201821890859U CN 209329967 U CN209329967 U CN 209329967U
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China
Prior art keywords
bus bar
busbar
exchange
alternating current
input
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CN201821890859.4U
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Chinese (zh)
Inventor
胡卫丰
马汝祥
胥峥
侍红兵
周洪益
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State Grid Corp of China SGCC
Yancheng Power Supply Co of State Grid Jiangsu Electric Power Co Ltd
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State Grid Corp of China SGCC
Yancheng Power Supply Co of State Grid Jiangsu Electric Power Co Ltd
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Priority to CN201821890859.4U priority Critical patent/CN209329967U/en
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Abstract

The utility model discloses a kind of stack bus bar with exchange exit, including an input busbar, three intermediate busbars, an exchange switching busbar, an alternating current bus bar.Wherein, the input busbar, alternating current bus bar are L-shaped, including a horizontal plane and a vertical plane;It is described input busbar, alternating current bus bar vertical plane be generally aligned in the same plane.The utility model utilizes alternating current bus bar, and the exchange end of mould group is drawn out to and DC terminal same plane, so that the difficulties in installation and maintenance of mould group greatly reduces, the relatively sharp beauty of the connecting wiring of mould group.Meanwhile laminated bus bar structure is simple, the simple to install of internal power semiconductor device.

Description

A kind of stack bus bar with exchange exit
Technical field
The utility model belongs to stack bus bar technical field, and in particular to a kind of stack bus bar with exchange exit.
Background technique
With the development of electrical engineering, the application demand of high voltage and high capacity gradually increases.By power semiconductor The restriction of voltage class and its production cost, it is unreliable and uneconomical by single power semiconductor.It can be used in engineering Multiple power semiconductor module mould group directly in series, topology is simple, and control and protection are simple.
Currently, multiple power semiconductor module mould group directly in series, direct-flow input end (including electrode input end and negative Pole input terminal) and ac input end be located at one in front and one in back two planes.In practical application, wiring is difficult to carry out by same wire casing Cabling, part cabling are usually needed across interior of equipment cabinet where series mould set, and layout is relatively chaotic.Simultaneously as space limits, Worker is often difficult to directly contact rear of cabinet, causes mould group difficult to install;Similarly, when system jam, to mould group The difficulty overhauled and replaced increases.
Utility model content
In view of above-mentioned, the utility model provides a kind of stack bus bar with exchange exit, which passes through Alternating current bus bar is generally aligned in the same plane exchange exit, electrode input end, negative input.Meanwhile the parasitic electricity of stack bus bar Feel small, be conducive to the series connection of power semiconductor, and laminated bus bar structure is compact, simple to install is convenient.
A kind of stack bus bar with exchange exit, is made of six parts, including one has electrode input end, bears The input busbar of pole input terminal, three intermediate busbars with power semiconductor mounting hole, an exchange switching busbar, one Part has the alternating current bus bar of exchange exit;Wherein, the input busbar, alternating current bus bar are L-shaped, including a horizontal plane and one A vertical plane;The electrode input end, negative input are located at the input busbar vertical plane, and the exchange exit is located at institute State alternating current bus bar vertical plane;The input busbar vertical plane and the alternating current bus bar vertical plane are generally aligned in the same plane, the input Bus-bar horizontal face is located at below the alternating current bus bar horizontal plane.
Further, the input busbar and the intermediate busbar include five layer laminates, from top to bottom successively are as follows: lower layer Insulation board, lower layer's conductor plate, intermediate insulation plate, top conductor plate, upper layer insulation board;The exchange switching busbar is exposed copper Row;The alternating current bus bar is the copper bar for wrapping up insulating layer.
Further, the intermediate busbar includes four power semiconductor mounting holes;The exchange switching busbar packet Containing two power semiconductor mounting holes and two switching mounting holes.
Further, the alternating current bus bar horizontal plane includes two switching mounting holes, and the switching is installed pore size and opened Hole is corresponding with switching mounting hole on exchange switching busbar.
Further, the power semiconductor mounting hole packet size and aperture correspond to the size of power semiconductor With installation pin.
Further, the power semiconductor uses IGBT (insulated gate bipolar transistor) module or SiC MOSFET (silicon carbide metal-oxide semiconductor field effect transistor) module.
The utility model utilize alternating current bus bar, by the exchange end of mould group be drawn out to DC terminal same plane so that mould group Difficulties in installation and maintenance greatly reduce, the relatively sharp beauty of the connecting wiring of mould group.Meanwhile laminated bus bar structure is simple, The simple to install of internal power semiconductor device.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of specific embodiment of the present utility model.
Fig. 2 (a) is the left view that busbar is inputted in Fig. 1;Wherein, electrode input end, negative input and exit is exchanged It is generally aligned in the same plane.
Fig. 2 (b) be input the electrode input end of busbar, negative input and alternating current bus bar in Fig. 1 exchange exit Main view.
Fig. 2 (c) is the cross-sectional view that busbar, intermediate busbar are inputted in Fig. 1.
Fig. 3 is the schematic diagram of alternating current bus bar in Fig. 1.
Fig. 4 (a) is that busbar, intermediate busbar and the structural schematic diagram for exchanging switching busbar are inputted in Fig. 1.
The specific embodiment that Fig. 4 (b) is Fig. 1 is applied to eight concatenated connection schematic diagrams of power semiconductor.
Fig. 4 (c) is that the power semiconductor in Fig. 4 (b) is SiC MOSFET (silicon carbide metal-oxide semiconductor Field effect transistor) module when equivalent schematic diagram.
Fig. 4 (d) is the power semiconductor in Fig. 4 (b) when being IGBT (insulated gate bipolar transistor) module etc. Imitate schematic diagram.
Specific embodiment
In order to more specifically describe the utility model, with reference to the accompanying drawing and specific embodiment is to the utility model Technical solution is described in detail.
As shown in Figure 1, present embodiment discloses a kind of stack bus bar with exchange exit, including input busbar 1, intermediate busbar 2,3,4, exchange switching busbar 5, alternating current bus bar 6.
As shown in Fig. 2 (a) and Fig. 2 (b), input busbar 1, alternating current bus bar 6 are L-shaped, including horizontal plane and vertical plane.Input 2,3,4 surface of 1 horizontal plane of busbar and intermediate busbar, exchange switching 5 surface of busbar are in same plane;Alternating current bus bar 6 is horizontal Face is located above input bus-bar horizontal face.Input 1 vertical plane of busbar and 6 vertical plane of alternating current bus bar are generally aligned in the same plane.Input is female Arranging 1 vertical plane includes electrode input end 103, negative input 104, for connecting higher level's DC power supply or DC capacitor busbar, 6 vertical plane of alternating current bus bar includes exchange exit 603, for connecting external communication end.Input busbar 1 and intermediate busbar 2,3,4 It is the stack bus bar for including five layer laminates, as shown in Fig. 2 (c), sectional view is formed by five layers, comprising: upper layer insulation board 001, Top conductor plate 002, intermediate insulation plate 003, lower layer's conductor plate 004, lower layer's insulation board 005.As shown in Fig. 2 (c),
As shown in figure 3, mounting hole 601,602 of transferring on alternating current bus bar 6 is used for and is exchanged on switching busbar 5 in Fig. 4 (a) Switching mounting hole 502 is connected by copper post with fastener.
Such as Fig. 4 (a), inputting busbar 1 includes power semiconductor mounting hole 101,102, and intermediate busbar 2,3,4 respectively includes Four power semiconductors mounting hole 201-204,301-304,401-404, exchange switching busbar includes power semiconductor device Part mounting hole 501,504 is used to connect with power semiconductor input electrode.The electrode input end 103 and mounting hole 101 are located at the input busbar top conductor layer, and the negative input 104 and mounting hole 102 are located under the input busbar Layer conductor layer;Similarly, mounting hole 201 and 202 is located at the intermediate 2 top conductor layer of busbar, and mounting hole 203 and 204 is located at 2 lower layer's conductor layer of intermediate busbar;Similarly, mounting hole 301 and 302 is located at the intermediate 3 top conductor layer of busbar, installation Hole 303 and 304 is located at intermediate 3 lower layer's conductor layer of busbar;Similarly, mounting hole 401 and 402 is located at the intermediate busbar 24 Top conductor layer, mounting hole 403 and 404 are located at intermediate 4 lower layer's conductor layer of busbar.
When present embodiment is applied to eight power semiconductor series connection, connection schematic diagram such as Fig. 4 (b) institute Show, mounting hole 101 connects the anode of power semiconductor M1, and the cathode of power semiconductor M1 connects mounting hole 201;Class As, mounting hole 202 connects the anode of power semiconductor M2, and the cathode of power semiconductor M2 connects mounting hole 301; Similarly, mounting hole 302 connects the anode of power semiconductor M3, and the cathode of power semiconductor M3 connects mounting hole 401;Similarly, mounting hole 402 connects the anode of power semiconductor M4, and the cathode of power semiconductor M4 connects installation Hole 501;Similarly, mounting hole 504 connects the anode of power semiconductor M5, and the cathode of power semiconductor M5 connects peace Fill hole 403;Similarly, mounting hole 404 connects the anode of power semiconductor M6, the cathode connection of power semiconductor M6 Mounting hole 303;Similarly, mounting hole 304 connects the anode of power semiconductor M7, and the cathode of power semiconductor M7 connects Connect mounting hole 203;Similarly, mounting hole 204 connects the anode of power semiconductor M8, the cathode of power semiconductor M8 Connect mounting hole 102.
When above-mentioned power semiconductor is SiC MOSFET (silicon carbide metal-oxide semiconductor field effect transistor) When module, the equivalent circuit of Fig. 4 (b) such as Fig. 4 (c).
When above-mentioned power semiconductor is IGBT (insulated gate bipolar transistor) module, the equivalent circuit of Fig. 4 (b) Such as Fig. 4 (d).
The above-mentioned description to embodiment is for that can understand and apply this practical convenient for those skilled in the art It is novel.Person skilled in the art obviously easily can make various modifications to above-described embodiment, and illustrating herein General Principle be applied in other embodiments without having to go through creative labor.Therefore, the utility model is not limited to above-mentioned Embodiment, those skilled in the art's announcement according to the present utility model, the improvement made for the utility model and modification are all answered This is within the protection scope of the utility model.

Claims (6)

1. a kind of stack bus bar with exchange exit, it is characterised in that: be made of six parts, including one has anode The input busbar of input terminal, negative input, three intermediate busbars with power semiconductor mounting hole, an exchange turn Busbar is connect, one has the alternating current bus bar of exchange exit;Wherein, the input busbar, alternating current bus bar are L-shaped, including one Horizontal plane and a vertical plane;The electrode input end, negative input are located at the input busbar vertical plane, and the exchange is drawn Outlet is located at the alternating current bus bar vertical plane;The input busbar vertical plane and the alternating current bus bar vertical plane are located at same flat Face, the input bus-bar horizontal face are located at below the alternating current bus bar horizontal plane.
2. a kind of stack bus bar with exchange exit according to claim 1, it is characterised in that: the input busbar It include five layer laminates with the intermediate busbar, from top to bottom successively are as follows: lower layer's insulation board, lower layer's conductor plate, intermediate insulation plate, Top conductor plate, upper layer insulation board;The exchange switching busbar is exposed copper bar;The alternating current bus bar is the copper for wrapping up insulating layer Row.
3. a kind of stack bus bar with exchange exit according to claim 1, it is characterised in that: the intermediate busbar Include four power semiconductor mounting holes;The exchange switching busbar includes two power semiconductor mounting holes and two A switching mounting hole.
4. a kind of stack bus bar with exchange exit according to claim 1, it is characterised in that: the alternating current bus bar Horizontal plane includes two switching mounting holes, and the switching installation pore size and aperture exchange switching busbar with described in claim 3 Upper switching mounting hole is corresponding.
5. a kind of stack bus bar with exchange exit described in any one of -4 according to claim 1, it is characterised in that: institute It states power semiconductor mounting hole packet size and aperture corresponds to the size and installation pin of power semiconductor.
6. a kind of stack bus bar with exchange exit according to claim 1, which is characterized in that the power is partly led Body device uses IGBT module or SiC MOSFET module.
CN201821890859.4U 2018-11-16 2018-11-16 A kind of stack bus bar with exchange exit Active CN209329967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821890859.4U CN209329967U (en) 2018-11-16 2018-11-16 A kind of stack bus bar with exchange exit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821890859.4U CN209329967U (en) 2018-11-16 2018-11-16 A kind of stack bus bar with exchange exit

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CN209329967U true CN209329967U (en) 2019-08-30

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109412430A (en) * 2018-11-16 2019-03-01 国网江苏省电力有限公司盐城供电分公司 A kind of stack bus bar with exchange exit
CN110971137A (en) * 2019-12-18 2020-04-07 阳光电源股份有限公司 Inversion module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109412430A (en) * 2018-11-16 2019-03-01 国网江苏省电力有限公司盐城供电分公司 A kind of stack bus bar with exchange exit
CN110971137A (en) * 2019-12-18 2020-04-07 阳光电源股份有限公司 Inversion module

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