CN209319420U - Ceramic wafer top circle processing device - Google Patents

Abstract

The utility model discloses a kind of ceramic wafer top circle processing devices, it includes rack, for pressing ceramic wafer and making the ceramic wafer of pressure holding with the pressure holding rotating mechanism of the axial direction rotation center rotation of ceramic wafer and for the cylindrical grinding mechanism being ground by the outer circle for the ceramic wafer that pressure holding rotating mechanism presses and rotates.The utility model can be realized the processing to the outer circle of ceramic wafer, reduces labor intensity, improves its working efficiency.

Description

Ceramic wafer top circle processing device

Technical field

The utility model relates to a kind of ceramic wafer top circle processing devices.

Background technique

Currently, original circle infrared ceramic porcelain plate processing excircles use common driller, pass through the diamond dust of compression bar and customization The shortcomings that wheel is processed, and there are the following aspects:

1, compression bar needs often adjustment, and unstable, often shakes, and is easy to open outer circle partially.

2, grinding wheel hole making drill is prone to wear, and low efficiency is at high cost.

3, product centering is positioned by three-jaw locator, return in insensitive lead to product deviation.

4, it is adjusted when replacement hole making drill can replace product cumbersome.

Movement is complicated, and worker operation intensity is big.

Summary of the invention

Technical problem to be solved in the utility model is to overcome the deficiencies of existing technologies, and provides a kind of ceramic wafer outer circle and adds Tooling is set, it can be realized the processing to the outer circle of ceramic wafer, is reduced labor intensity, is improved its working efficiency.

The utility model solves above-mentioned technical problem and adopts the technical scheme that: a kind of ceramic wafer top circle processing device, it Include:

Rack；

Pressure holding rotation for pressing ceramic wafer and rotating the ceramic wafer of pressure holding with the axial direction rotation center of ceramic wafer Mechanism；

For to the cylindrical grinding mechanism being ground by the outer circle for the ceramic wafer that pressure holding rotating mechanism presses and rotates.

A kind of specific structure for pressing rotating mechanism is further provided, the pressure holding rotating mechanism includes:

Lower supporting wheel, the lower supporting wheel can be rotated to support in rack；

Upper splenium part, the upper splenium part include upper platen, upper platen rotary components and upper platen lifting assembly, it is described on Platen lifting assembly directly or indirectly acts on the upper platen, so that upper platen lifting assembly drives the upper downward supporting wheel of platen Direction is mobile, makes ceramic wafer pressure holding between upper platen and lower supporting wheel, the upper platen rotary components and the upper platen It is connected, so that upper platen rotary components drive upper platen rotation.

Further provide a kind of specific structure of upper platen rotary components, be provided with slide in the rack, it is described on Platen rotary components include:

Rotary shaft, the rotary shaft is rotatable and is liftably mounted on slide, the lower end of the rotary shaft with it is described Upper platen is connected, and the upper end of the rotary shaft is connected with the upper platen lifting assembly, so that the upper platen lifting assembly drives The rotary shaft is moved to move up and down；

Rotary shaft rotary drive mechanism, the rotary shaft rotary drive mechanism is connect with the transmission of rotary axis, to drive The rotary shaft is moved to rotate on slide.

Further, the upper platen lifting assembly is piston cylinder, and the rotary shaft is rotatably connect with the piston cylinder.

Further provide a kind of specific structure of rotary shaft rotary drive mechanism, the rotary shaft rotary drive mechanism packet Motor and transmission wheel set are included, the motor is connected with the main driving wheel of the transmission wheel set, the slave driving wheel of the transmission wheel set It is connected with the rotary shaft, and the rotary shaft opposite can be moved up and down from driving wheel, the motor is driven by transmission wheel set Move the rotary shaft rotation.

Further, positioning chuck is provided in the rack, the lower supporting wheel can be rotated to support on positioning chuck On.

Further, the motor is speed regulating motor.

A kind of specific structure of cylindrical grinding mechanism is further provided, the cylindrical grinding mechanism includes:

Emery wheel mechanism, the emery wheel rotation driving that the emery wheel mechanism includes emery wheel, is connected with emery wheel and emery wheel is driven to rotate Mechanism；

Mechanism is connected with emery wheel, and drive emery wheel mechanism action control emery wheel grinding ceramic wafer outer circle the amount of feeding into Give amount regulating mechanism.

A kind of specific structure of amount of feeding regulating mechanism is further provided, the amount of feeding regulating mechanism includes:

Regulating piston cylinder；

Mounting base group, the mounting base group are movably connected in the tailpiece of the piston rod of regulating piston cylinder, the mounting base group and institute It states and is provided between rack in the movement of regulating piston cylinder, the feeding guide mechanism of feeding guiding is carried out to mounting base group；

Emery wheel mechanism, the emery wheel mechanism are connected in the mounting base group.

After above-mentioned technical proposal, the utility model have it is below the utility model has the advantages that

1, the utility model uses pressure holding rotating mechanism pressure holding ceramic wafer and makes the ceramic wafer of pressure holding with the axial direction of ceramic wafer For rotation center rotation；It is carried out again by cylindrical grinding mechanism to by the outer circle for the ceramic wafer that pressure holding rotating mechanism presses and rotates Grinding reduces labor intensity, improves its working efficiency to realize the processing to the outer circle of ceramic wafer；

2, fixture being done using piston cylinder and intermediate plate being carried out to ceramic wafer, making it, intermediate plate is tight and steady during exercise；

3, speed regulating motor can be used and drive ceramic wafer rotation, and rotation speed is adjusted the speed, run evener slow；

4, the emery wheel of external cutting can use diamond-impregnated wheel, more durable, save the cost；

6, working efficiency is improved, the round ceramic plate of different size can be processed, from diameter 38mm to diameter 238mm Ceramic wafer can adjust processing, can be processed size range it is big；

7, employee is easy to operate, reduces labor intensity；

8, qualification rate improves, dimensionally stable.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the pressure holding rotating mechanism of the utility model embodiment；

Fig. 2 is the structural schematic diagram of the cylindrical grinding mechanism of the utility model embodiment.

Specific embodiment

In order to make the content of the utility model be easier to be clearly understood, below according to specific embodiment and combine attached Figure, is described in further detail the utility model.

Fig. 1 is the structural schematic diagram of the pressure holding rotating mechanism of the utility model embodiment.

Fig. 2 is the structural schematic diagram of the cylindrical grinding mechanism of the utility model embodiment.

Ginseng as shown in FIGS. 1 and 2, present embodiments provide a kind of ceramic wafer top circle processing device of structure, it includes:

Rack 1；

Pressure for pressing ceramic wafer 10 and rotating the ceramic wafer 10 of pressure holding with the axial direction rotation center of ceramic wafer 10 Hold rotating mechanism；

For to the cylindrical grinding mechanism being ground by the outer circle for the ceramic wafer 10 that pressure holding rotating mechanism presses and rotates.

Specifically, shown in Figure 1, the pressure holding rotating mechanism includes:

Lower supporting wheel 21, the lower supporting wheel 21 can be rotated to support in rack 1；

Upper splenium part, the upper splenium part include upper platen 22, upper platen rotary components and upper platen lifting assembly, described Upper platen lifting assembly directly or indirectly acts on the upper platen 22, so that upper platen lifting assembly drives upper platen 22 branch downwards It is mobile to support 21 direction of turntable, makes the pressure holding of ceramic wafer 10 between upper platen 22 and lower supporting wheel 21, the upper platen rotation group Part is connected with the upper platen 22, so that upper platen rotary components drive upper platen 22 to rotate.

Specifically, shown in Figure 1, slide 11 is provided in the rack 1, the upper platen rotary components include:

Rotary shaft 23, the rotary shaft 23 is rotatable and is liftably mounted on slide 11, under the rotary shaft 23 End is connected with the upper platen 22, and the upper end of the rotary shaft 23 is connected with the upper platen lifting assembly, so as to the upper pressure Disk lifting assembly drives the rotary shaft 23 to move up and down；

Rotary shaft rotary drive mechanism, the rotary shaft rotary drive mechanism and the rotary shaft 23 are sequentially connected, so as to The rotary shaft 23 is driven to rotate on slide 11.

It is shown in Figure 1, the upper platen lifting assembly can be piston cylinder 24, the rotary shaft 23 rotatably with institute State the connection of piston cylinder 24.

Specifically, shown in Figure 1, the rotary shaft rotary drive mechanism includes motor 25 and transmission wheel set, the electricity Machine 25 is connected with the main driving wheel 26 of the transmission wheel set, the slave driving wheel 27 of the transmission wheel set and 23 phase of rotary shaft Even, and the rotary shaft 23 opposite can be moved up and down from driving wheel 27, and the motor 25 drives the rotation by transmission wheel set Shaft 23 rotates.

Specifically, shown in Figure 1, positioning chuck 12 is provided in the rack 1, the lower supporting wheel 21 is rotatable Ground is supported on positioning chuck 12.

Ceramic wafer to be processed is mounted on lower supporting wheel 21 by the present embodiment, is driven and is revolved by upper platen lifting assembly Shaft 23 moves down, and the rotary shaft 23 opposite can be moved up and down from driving wheel 27, so being not follow from driving wheel 27 What rotary shaft 23 moved down, the upper platen 22 of drive that moves down of rotary shaft 23 moves down, until ceramic wafer is pressed upper Between platen 22 and lower supporting wheel 21, then start motor, rotary shaft 23 is moved by driving wheel subband and is rotated, thus on driving Platen 22 rotates, so that ceramic wafer 10 also and then rotates.

Shown in Figure 1, the motor 25 can be speed regulating motor, and the rotation of ceramic wafer 10 is adjusted by speed regulating motor Speed.

Specifically, shown in Figure 2, the cylindrical grinding mechanism includes:

Emery wheel mechanism 100, the emery wheel mechanism 100 include emery wheel, the emery wheel for being connected with emery wheel and emery wheel being driven to rotate rotation Turn driving mechanism；

Mechanism is connected with emery wheel, and drive the amount of feeding of the outer circle of emery wheel mechanism action control emery wheel grinding ceramic wafer 10 Amount of feeding regulating mechanism.

Specifically, shown in Figure 2, the amount of feeding regulating mechanism includes:

Regulating piston cylinder 31；

Mounting base group 32, the mounting base group 32 are movably connected in the tailpiece of the piston rod of regulating piston cylinder 31, the mounting base It is provided between group 32 and the rack 1 when regulating piston cylinder 31 acts, the feeding of feeding guiding is carried out to mounting base group 32 Guiding mechanism；

Emery wheel mechanism 100, the emery wheel mechanism 100 are connected in the mounting base group 32.

It in the rotary course of ceramic wafer 10, is ground, is ground by outer circle of the cylindrical grinding mechanism to ceramic wafer 10 The amount of feeding, the movement of regulating piston cylinder 31 can be passed through, drive installation seat group 32 is mobile, due to being provided with feeding Guiding machine Structure, so as to control the amount of feeding of emery wheel.

Particular embodiments described above, to the utility model solve the technical issues of, technical scheme and beneficial effects into It has gone further description, it should be understood that the foregoing is merely specific embodiment of the utility model, and has not had to In limitation the utility model, within the spirit and principle of the utility model, any modification, equivalent substitution and improvement done Deng should be included within the scope of protection of this utility model.

Claims (9)

1. a kind of ceramic wafer top circle processing device, which is characterized in that it includes:

Rack (1)；

For pressing ceramic wafer (10) and rotating the ceramic wafer (10) of pressure holding with the axial direction rotation center of ceramic wafer (10) Press rotating mechanism；

For to the cylindrical grinding mechanism being ground by the outer circle for the ceramic wafer (10) that pressure holding rotating mechanism presses and rotates.

2. ceramic wafer top circle processing device according to claim 1, it is characterised in that: the pressure holding rotating mechanism includes:

Lower supporting wheel (21), the lower supporting wheel (21) can be rotated to support on rack (1)；

Upper splenium part, the upper splenium part include upper platen (22), upper platen rotary components and upper platen lifting assembly, it is described on Platen lifting assembly directly or indirectly acts on the upper platen (22), so that upper platen lifting assembly drives upper platen (22) downward Supporting wheel (21) direction is mobile, makes ceramic wafer (10) pressure holding between upper platen (22) and lower supporting wheel (21), it is described on Platen rotary components are connected with the upper platen (22), so that upper platen rotary components drive upper platen (22) rotation.

3. ceramic wafer top circle processing device according to claim 2, it is characterised in that: be provided with cunning on the rack (1) Seat (11), the upper platen rotary components include:

Rotary shaft (23), the rotary shaft (23) is rotatable and is liftably mounted on slide (11), the rotary shaft (23) Lower end be connected with the upper platen (22), the upper end of the rotary shaft (23) is connected with the upper platen lifting assembly, so as to The upper platen lifting assembly drives the rotary shaft (23) to move up and down；

Rotary shaft rotary drive mechanism, the rotary shaft rotary drive mechanism and the rotary shaft (23) are sequentially connected, to drive The rotary shaft (23) is moved to rotate on slide (11).

4. ceramic wafer top circle processing device according to claim 3, it is characterised in that: the upper platen lifting assembly is to live Plug cylinder (24), the rotary shaft (23) rotatably connect with the piston cylinder (24).

5. ceramic wafer top circle processing device according to claim 3, it is characterised in that: the rotary shaft rotary drive mechanism Including motor (25) and transmission wheel set, the motor (25) is connected with the main driving wheel (26) of the transmission wheel set, the transmission The slave driving wheel (27) of wheel set is connected with the rotary shaft (23), and the rotary shaft (23) can be opposite from driving wheel (27) Lower movement, the motor (25) drive rotary shaft (23) rotation by transmission wheel set.

6. ceramic wafer top circle processing device according to claim 2, it is characterised in that: it is fixed to be provided on the rack (1) Position chuck (12), the lower supporting wheel (21) can be rotated to support on positioning chuck (12).

7. ceramic wafer top circle processing device according to claim 5, it is characterised in that: the motor (25) is speed regulation electricity Machine.

8. ceramic wafer top circle processing device according to claim 1, it is characterised in that: the cylindrical grinding mechanism includes:

Emery wheel mechanism, the emery wheel rotary drive mechanism that the emery wheel mechanism includes emery wheel, is connected with emery wheel and emery wheel is driven to rotate；

Mechanism is connected with emery wheel, and drive emery wheel mechanism action control emery wheel grinding ceramic wafer (10) outer circle the amount of feeding into Give amount regulating mechanism.

9. ceramic wafer top circle processing device according to claim 8, it is characterised in that: the amount of feeding regulating mechanism packet It includes:

Regulating piston cylinder (31)；

Mounting base group (32), the mounting base group (32) are movably connected in the tailpiece of the piston rod of regulating piston cylinder (31), the installation It is provided between seat group (32) and the rack (1) when regulating piston cylinder (31) act, mounting base group (32) is fed The feeding guide mechanism of guiding；

Emery wheel mechanism, the emery wheel mechanism are connected on the mounting base group (32).