CN209279747U - A kind of loop structure ultra-thin panel heat pipe - Google Patents
A kind of loop structure ultra-thin panel heat pipe Download PDFInfo
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- CN209279747U CN209279747U CN201822005715.2U CN201822005715U CN209279747U CN 209279747 U CN209279747 U CN 209279747U CN 201822005715 U CN201822005715 U CN 201822005715U CN 209279747 U CN209279747 U CN 209279747U
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- working medium
- medium passage
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- heat pipe
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Abstract
The utility model discloses a kind of loop structure ultra-thin panel heat pipes, upper coverboard and lower coverboard including forming sealing working fluid chamber, it is filled with liquid refrigerant in the sealing working fluid chamber and carries out vacuumize process, the plate loop liquid-sucking core that upper and lower surfaces fit closely coverboard and lower coverboard is provided in the sealing working fluid chamber, on the loop liquid-sucking core in the width direction alternate intervals hollow out be provided with several steam channels and working medium passage that condensation end is extended to by evaporation ends, the steam channel is connected with working medium passage in condensation end.The utility model is provided with steam flow channel and working medium return flow line on liquid sucting core structure, liquid-sucking core upper and lower surface is used to support coverboard up and down, it is more suitable for production loop structure ultra-thin panel heat pipe, and its support effect is more preferable, steam channel and working medium return flow line form loop structure, promote the liquid refrigerant refluxed evaporator end of condensation end using steam pressure, heating location dryouies when postponing high-power, to improve the greatest limit heat power of loop structure ultra-thin panel heat pipe.
Description
Technical field
The utility model relates to a kind of soaking plate structure more particularly to a kind of loop structure ultra-thin panel heat pipes, for just
Take formula electronic equipment heat radiation elements.
Background technique
Existing soaking plate majority uses vapor chamber and the liquid sucting core structure mutually independent structure in horizontal space, and uses
The structures such as support column are supported, and for conventional soaking plate structure when thickness is reduced, the reduction of coverboard thickness reduces its intensity, more holds
Easily it is recessed, increases the problem of support column quantity and diameter then bring performance to decline, and when liquid-sucking core and steam void are thick
When degree is reduced to a certain extent as being lower than 0.3mm, steam resistance and liquid refrigerant reflux resistance are steeply risen, and are seriously reduced super
The limit heat transfer property of thinning soaking plate, therefore conventional existing soaking plate structure is used for ultra-thin situation, heat transfer property decline
Will be very serious, and it is more prone to produce recess.
207214880 U of patent CN devises a kind of divergence form liquid sucting core structure, and steam channel and liquid sucting core structure are set
It sets in same level space, steam channel is divergent structure, when wick thickness is relatively thin, only relies on liquid-sucking core capillarity
Keep the amount for condensing working medium recurrence evaporation ends limited, is easy to reach capillary limitation, to limit loop structure ultra-thin panel heat pipe
Maximal heat transfer power.
Utility model content
The purpose of the utility model is to provide one kind to be suitable for loop structure ultra-thin panel heat pipe, for solving conventional structure
The problem of soaking plate its heat transfer property after thickness is reduced to ultra-thin dimensions sharply declines and coverboard is easy recess up and down, energy
The appearance for enough delaying soaking plate capillary limitation has bigger heat transport limitation compared to the soaking plate of existing structure.
The utility model adopts the following technical solution realizes:
A kind of loop structure ultra-thin panel heat pipe connects the upper coverboard and lower casing to form sealing working fluid chamber including peripheral sealing
Plate, the sealing working fluid chamber is interior to be filled with liquid refrigerant and carries out vacuumize process, be provided in the sealing working fluid chamber,
Lower surface fits closely the plate-like porous structure loop liquid-sucking core of coverboard and lower coverboard, along width side on the loop liquid-sucking core
To alternate intervals hollow out is provided with several steam channels and working medium passage that condensation end is extended to by evaporation ends, and the steam is logical
Condensation end of the road with working medium passage in the loop liquid-sucking core is connected by interconnecting channel.
Further, divide positioned at each steam channel of the evaporation ends and working medium passage towards the fan-shaped diverging of condensation extreme direction
Cloth, satisfaction exchange heat to the heat source with different heat area.
Further, working medium passage described in every includes that one end extends to the second level working medium passage of evaporation ends, connection
The other end of the second level working medium passage and the level-one working medium passage for extending to condensation end, the level-one working medium passage
Width is greater than the second level working medium passage.Larger level-one working medium return flow line width is in order to lesser flow resistance；And
Second level working medium passage narrower width, capillary force act on lower liquid refrigerant aggregation, and the steam of fire end can not be logical by second level working medium
Road is spread to condensation end, promotes liquid refrigerant reflux so as to form loop.
Further, the width of the steam channel is greater than the width of second level working medium passage.
Further, width≤0.5mm of the second level working medium passage.
Further, the condensation end of the loop liquid-sucking core is provided with and all steam channels and working medium in the width direction
The interconnecting channel that channel is connected.After the liquid refrigerant of condensation fills interconnecting channel, steam can not directly pass through interconnecting channel
Working medium passage is flowed to, meanwhile, steam pressure generates motive force to the condensation working medium for being gathered in interconnecting channel, will be in interconnecting channel
Condensation working medium be pushed to liquid-sucking core evaporation ends along working medium passage, promote condensation Working fluid flow.
Further, the condensation end of the loop liquid-sucking core is provided in the width direction several is respectively communicated with adjacent steaming
The interconnecting channel in vapour channel and working medium passage, it is mutually isolated between each interconnecting channel.When the liquid refrigerant filling of condensation is intercommunicated
Behind road, steam directly can not flow to working medium passage by interconnecting channel, meanwhile, steam pressure is to being gathered in the cold of interconnecting channel
Solidifying working medium generates motive force, and the condensation working medium in interconnecting channel is pushed to liquid-sucking core evaporation ends along working medium passage, promotes condensation
Working fluid flow.
Further, the upper surface and/or lower surface of the loop liquid-sucking core are additionally provided with one layer of porous suction of tabular
Wick-containing, to improve the amount at condensation working medium refluxed evaporator end.
Further, thickness≤1mm of the loop liquid-sucking core, thickness is thin and heat transfer property is good, meets loop structure
The cooling requirements of ultra-thin panel heat pipe.
Compared with prior art, the utility model has the following beneficial effects:
The utility model is provided with steam flow channel on liquid sucting core structure, and liquid-sucking core upper and lower surface is used to support up and down
Conventional support column arrangement is omitted in coverboard, to be more suitable for production loop structure ultra-thin panel heat pipe, and its support effect
More preferably.On the other hand, which is additionally provided with working medium return flow line, and steam channel and working medium return flow line form loop knot
Structure promotes the liquid refrigerant refluxed evaporator end of condensation end using steam pressure, and delay heating location dryouies phenomenon, to improve
The greatest limit heat power of loop structure ultra-thin panel heat pipe.
Detailed description of the invention
Fig. 1 is the perspective view of the explosion of the loop structure ultra-thin panel heat pipe of the utility model embodiment one.
Fig. 2 is the schematic diagram of the loop liquid-sucking core of the utility model embodiment one.
Fig. 3 is the local unit steam and Working fluid flow schematic diagram of the loop liquid-sucking core of the utility model embodiment one.
Fig. 4 is the partial cutaway schematic cross-section of this structure.
Fig. 5 is the schematic diagram of the ultra-thin loop liquid sucting core structure of the utility model embodiment two.
As shown in the figure are as follows: the upper coverboard of 1-, 2- loop liquid-sucking core, 21- liquid-sucking core evaporation ends, 22- steam channel, 23- interconnection
Coverboard, 4- chip under channel, 24- porous wick structure, 25- level-one working medium passage, 26- second level working medium passage, 3-.
Specific embodiment
To further understand the utility model, the utility model is described further with reference to the accompanying drawing.But it needs
Illustrate, the range of the requires of the utility model protection is not limited to the range of following embodiment statement.
Embodiment one
As shown in Figure 1, a kind of loop structure ultra-thin panel heat pipe, connects to form the upper of sealing working fluid chamber including peripheral sealing
Coverboard 1 and lower coverboard 3, the sealing working fluid chamber is interior to be filled with liquid refrigerant and carries out vacuumize process, as shown in Fig. 2, described
Sealing working fluid chamber in be provided with the plate loop liquid-sucking core 2 that upper and lower surfaces fit closely coverboard 1 and lower coverboard 3, the ring
Thickness≤1mm of road liquid-sucking core 2, using porous structure, alternate intervals ground hollow out in the width direction on the loop liquid-sucking core 2
Several steam channels 22 and working medium passage that condensation end is extended to by evaporation ends are provided with, remaining entity part becomes both to upper
Coverboard 1 and lower coverboard 3 play a supporting role and can play the role of the porous wick structure 24 of capillary force.The steam channel 22 and work
Matter channel is connected in the condensation end of the loop liquid-sucking core 2 by interconnecting channel 23.Each steam positioned at the evaporation ends is logical
Road 22 and working medium passage are distributed towards the fan-shaped diverging of condensation extreme direction.Working medium passage described in every includes one to be connected
The width of grade working medium passage 25 and second level working medium passage 26, the second level working medium passage 26 is less than the level-one working medium passage 25,
The other end of the second level working medium passage 26 extends to evaporation ends, and the other end of the level-one working medium passage 25 extends to condensation
End.The condensation end of the loop liquid-sucking core 2 is provided in the width direction to be connected with all steam channels 22 and working medium passage
Interconnecting channel 23.The width of width≤0.5mm of the second level working medium passage 26, the steam channel 22 are greater than second level working medium
The width in channel 26.
As shown in figure 4, the lower surface of shown upper coverboard 1 and the upper surface of lower coverboard 3 fit closely loop liquid-sucking core respectively
2, it is provided by it support.When work, the chip 4 is adjacent to coverboard and is located at the evaporation ends 21 of loop liquid-sucking core 2.Such as Fig. 2 institute
Show, 4 heat of chip is conducted to the evaporation ends 21, and the liquid refrigerant phase transformation evaporation in the position passes through steam channel 22
It being spread to condensation end, the steam channel 22 and level-one working medium passage 25 are connected by interconnecting channel 23, when work, steam
Liquid refrigerant is condensed into condensation end phase transformation and fills interconnecting channel 23, flow to steam can not directly by interconnecting channel 23
Level-one working medium passage 25, the second level working medium passage 26 are narrow slot road, and liquid refrigerant is filled up completely second level under capillary force effect
Working medium passage 26 promotes to follow so that the steam of phase transformation can not be spread by second level working medium passage 26 to condensation end at evaporation ends 21
Ring is formed.It is illustrated in figure 3 the flow schematic diagram of local unit steam and working medium, is flowed to the right from evaporation ends 21 along steam channel 22
What dynamic arrow represented is the flow direction of steam, and what the arrow flowed from right end to evaporation ends 21 represented is the stream for condensing working medium
Dynamic direction.Liquid refrigerant is except passing through porous wick structure 24 under capillary force effect in addition to refluxed evaporator end 21, and steam pressure is to aggregation
Condensation working medium at interconnecting channel 23 generates motive force, by the condensation working medium in interconnecting channel 23 along 25 He of level-one working medium passage
Second level working medium passage 26 is pushed to liquid-sucking core evaporation ends 21, promotes the liquid refrigerant refluxed evaporator end of condensation end, increases regurgitant volume,
Heating location dryouies when postponing high-power, to improve the greatest limit heat power of loop structure ultra-thin panel heat pipe.
Embodiment two
As shown in figure 5, the difference between this embodiment and the first embodiment lies in:
The condensation end of the loop liquid-sucking core 2 is provided in the width direction several is respectively communicated with adjacent steam channel 22
It is mutually isolated between each interconnecting channel 23 with the interconnecting channel 23 of working medium passage.The communicating passage 23 of the i.e. described loop liquid-sucking core 2
To be multiple, and it is not interconnected to each other.After the liquid refrigerant of condensation fills interconnecting channel 23, steam can not be directly by mutual
Communication channel 23 flows to working medium passage, meanwhile, steam pressure generates motive force to the condensation working medium for being gathered in interconnecting channel 23, will
Condensation working medium in interconnecting channel 23 is pushed to liquid-sucking core evaporation ends 21 along each working medium passage, and the liquid refrigerant of condensation end is promoted to return
Flow evaporator end, delay heating location dryouies phenomenon, to improve the greatest limit heat power of loop structure ultra-thin panel heat pipe.
Embodiment three
The present embodiment is in the difference of embodiment one and two:
It is additionally provided with one layer of tabular porous wick structure in the upper surface of the loop liquid-sucking core 2 and/or lower surface, with
The amount at condensation working medium refluxed evaporator end is improved, the thickness of the tabular porous wick structure can not excessively increase soaking version total thickness
It is suitably selected as needed under the premise of degree.
The above embodiments of the present invention is merely examples for clearly illustrating the present invention, and is not
Limitations of the embodiments of the present invention.For those of ordinary skill in the art, on above explained basis
On can also make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.
Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc., should be included in this reality
Within novel scope of protection of the claims.
Claims (9)
1. a kind of loop structure ultra-thin panel heat pipe, connected including peripheral sealing the upper coverboard (1) to form sealing working fluid chamber and under
Coverboard (3), the sealing working fluid chamber is interior to be filled with liquid refrigerant and carries out vacuumize process, it is characterised in that:
The plate-like porous knot that upper and lower surfaces fit closely coverboard (1) and lower coverboard (3) is provided in the sealing working fluid chamber
Structure loop liquid-sucking core (2), on the loop liquid-sucking core (2) in the width direction alternate intervals hollow out be provided with it is several by evaporation ends
(21) steam channel (22) and working medium passage of condensation end are extended to, the steam channel (22) and working medium passage are in the loop
The condensation end of liquid-sucking core (2) is connected by interconnecting channel (23).
2. loop structure ultra-thin panel heat pipe according to claim 1, which is characterized in that be located at the evaporation ends (21)
Each steam channel (22) and working medium passage are distributed towards the fan-shaped diverging of condensation extreme direction.
3. loop structure ultra-thin panel heat pipe according to claim 1, which is characterized in that working medium passage described in every is equal
Second level working medium passage (26), the other end for being connected to the second level working medium passage (26) and the extension of evaporation ends are extended to including one end
To the level-one working medium passage (25) of condensation end, the width of the second level working medium passage (26) is less than the level-one working medium passage
(25)。
4. loop structure ultra-thin panel heat pipe according to claim 3, which is characterized in that the width of the steam channel is big
Width in second level working medium passage (26).
5. loop structure ultra-thin panel heat pipe according to claim 3 or 4, which is characterized in that the second level working medium passage
(26) width≤0.5mm.
6. loop structure ultra-thin panel heat pipe according to claim 1, which is characterized in that the loop liquid-sucking core (2)
Condensation end be provided with the interconnecting channel (23) being connected with all steam channels (22) and working medium passage in the width direction.
7. loop structure ultra-thin panel heat pipe according to claim 1, which is characterized in that the loop liquid-sucking core (2)
Condensation end be provided with several interconnecting channels for being respectively communicated with adjacent steam channel (22) and working medium passage in the width direction
(23), mutually isolated between each interconnecting channel (23).
8. loop structure ultra-thin panel heat pipe according to claim 1, which is characterized in that the loop liquid-sucking core (2)
Upper surface and/or lower surface be additionally provided with one layer of tabular porous wick structure.
9. loop structure ultra-thin panel heat pipe according to claim 1, which is characterized in that the loop liquid-sucking core (2)
With a thickness of≤1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822005715.2U CN209279747U (en) | 2018-11-30 | 2018-11-30 | A kind of loop structure ultra-thin panel heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822005715.2U CN209279747U (en) | 2018-11-30 | 2018-11-30 | A kind of loop structure ultra-thin panel heat pipe |
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| Publication Number | Publication Date |
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| CN209279747U true CN209279747U (en) | 2019-08-20 |
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| CN201822005715.2U Active CN209279747U (en) | 2018-11-30 | 2018-11-30 | A kind of loop structure ultra-thin panel heat pipe |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109579584A (en) * | 2018-11-30 | 2019-04-05 | 华南理工大学 | A kind of ultra-thin loop soaking plate |
| CN113316355A (en) * | 2021-04-20 | 2021-08-27 | 江西展耀微电子有限公司 | Soaking structure and electronic equipment |
| CN113390281A (en) * | 2021-06-22 | 2021-09-14 | 上海海事大学 | Heat pipe type printed circuit board heat exchanger |
| CN113758967A (en) * | 2021-09-18 | 2021-12-07 | 西安交通大学 | Heat transfer limit measurement experimental device and method for stepped metal heat pipe liquid absorption core |
| CN114294986A (en) * | 2022-01-13 | 2022-04-08 | 广州大学 | One-way heat pipe based on reverse choked flow structure of air flue |
-
2018
- 2018-11-30 CN CN201822005715.2U patent/CN209279747U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109579584A (en) * | 2018-11-30 | 2019-04-05 | 华南理工大学 | A kind of ultra-thin loop soaking plate |
| CN113316355A (en) * | 2021-04-20 | 2021-08-27 | 江西展耀微电子有限公司 | Soaking structure and electronic equipment |
| CN113390281A (en) * | 2021-06-22 | 2021-09-14 | 上海海事大学 | Heat pipe type printed circuit board heat exchanger |
| CN113758967A (en) * | 2021-09-18 | 2021-12-07 | 西安交通大学 | Heat transfer limit measurement experimental device and method for stepped metal heat pipe liquid absorption core |
| CN114294986A (en) * | 2022-01-13 | 2022-04-08 | 广州大学 | One-way heat pipe based on reverse choked flow structure of air flue |
| CN114294986B (en) * | 2022-01-13 | 2023-07-18 | 广州大学 | Unidirectional heat pipe based on air passage reverse flow blocking structure |
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