CN209150344U - Thermometric connector, thermometric support plate and temp measuring system - Google Patents
Thermometric connector, thermometric support plate and temp measuring system Download PDFInfo
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- CN209150344U CN209150344U CN201822234521.XU CN201822234521U CN209150344U CN 209150344 U CN209150344 U CN 209150344U CN 201822234521 U CN201822234521 U CN 201822234521U CN 209150344 U CN209150344 U CN 209150344U
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- 238000007789 sealing Methods 0.000 claims abstract description 69
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000009529 body temperature measurement Methods 0.000 claims description 72
- 238000005259 measurement Methods 0.000 abstract description 2
- 239000000523 sample Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model discloses a kind of thermometric connector, thermometric support plate and temp measuring systems.Thermometric connector includes flexible sealing structure, first lead connector and a plurality of first lead；Flexible sealing structure is used for across the sealed chamber setting for needing thermometric and is movably tightly connected with chamber；One end is arranged in flexible sealing structure chamber in first lead connector, is provided with multiple first contact terminals on first lead connector；A plurality of first lead is separately positioned in flexible sealing structure, and a plurality of first lead is electrically connected with corresponding first contact terminal respectively；Flexible sealing structure is able to drive first lead connector and moves along chamber, so that each first contact terminal is electrically connected or separates with the second contact terminal corresponding on the second feedthrough connector on thermometric support plate.Using split type lead wire connection structure, the structure of temp measuring system can simplify.Using the thermometric mode being directly embedded in temperature sensor in support plate ontology, the accuracy of measurement temperature can be improved.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field, concretely relates to temperature measurement connector, temperature measurement support plate and temperature measurement system.
Background
Generally, semiconductor processing equipment, such as Metal-organic chemical Vapor Deposition (MOCVD) equipment, can have a temperature of up to 900 ℃ in a chamber thereof during operation, and generally requires a non-contact infrared high temperature sensor to measure the temperature of the carrier plate, wherein a probe of the infrared high temperature sensor indirectly measures the temperature of the carrier plate by receiving radiation light from the carrier plate.
However, when the semiconductor processing equipment is limited by conditions such as insufficient internal space or complex operating conditions, the infrared high-temperature sensor and the heating lamp tube must be installed on the same side, and the probe of the infrared high-temperature sensor can penetrate through the gap of the heating lamp tube when measuring the temperature at the bottom of the carrier plate, so that during temperature measurement, the probe can receive other objects such as stray light of the heating lamp tube besides receiving the radiation light at the bottom of the carrier plate, which can generate uncontrollable interference and cause inaccurate measured temperature.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a temperature measurement connector, a temperature measurement support plate and a temperature measurement system.
In order to achieve the above object, a first aspect of the present invention provides a temperature measuring connector, including a telescopic sealing structure, a first lead connector, and a plurality of first leads; the telescopic sealing structure penetrates through a sealing cavity needing temperature measurement and is movably connected with the cavity in a sealing way; the first lead connector is arranged at one end in the cavity of the telescopic sealing structure, and a plurality of first contact terminals are arranged on the first lead connector; the plurality of first leads are respectively arranged in the telescopic sealing structure and are respectively electrically connected with the corresponding first contact terminals; the telescopic sealing structure can drive the first lead connectors to move along the cavity, so that the first contact terminals are electrically connected with or separated from the corresponding second contact terminals on the second lead connectors on the temperature measurement carrier plate.
Optionally, one end in the cavity of the telescopic sealing structure is connected with the first lead connector in a swinging mode through a swinging pair.
Optionally, the swing pair includes two first installation parts symmetrically disposed on the first lead connector, two second installation parts symmetrically disposed at one end in the cavity of the telescopic sealing structure, and a pin shaft passing through the first installation parts and the corresponding second installation parts.
Optionally, the telescoping seal arrangement comprises a connection assembly and a resilient seal sleeve, wherein,
a first end of the connecting assembly is connected with the first lead connector, a second end of the connecting assembly penetrates out of the cavity, and a gap is formed between the connecting assembly and the cavity in the radial direction of the cavity;
the elastic sealing sleeve is sleeved on the outer side of the connecting assembly, the first end of the elastic sealing sleeve is connected with the cavity in a sealing mode, and the second end of the elastic sealing sleeve is fixedly connected with the second end of the connecting assembly.
Optionally, the elastic sealing sleeve comprises a bellows, a first end of the bellows is in sealing connection with the chamber via a mounting flange assembly, and a second end of the bellows is in fixed sealing connection with a second end of the connecting assembly.
Optionally, the connection assembly comprises a leadthrough and a vacuum connector; wherein,
the first end of the lead sleeve is connected with the first lead connector, and the second end of the lead sleeve penetrates out of the cavity and is connected with the vacuum connector;
the vacuum connector comprises a plurality of leading-in pins and a plurality of leading-out pins;
the elastic sealing sleeve is sleeved on the outer side of the lead sleeve and is fixedly connected with the vacuum connector;
each first lead penetrates through the lead sleeve and is electrically connected with the corresponding lead-in pin.
Optionally, the lead sleeve comprises a first lead sub-sleeve and a second lead sub-sleeve, and the telescopic sealing structure further comprises an elastic member;
the first end of the first lead sub-sleeve is connected with the first lead connector, and the second end of the first lead sub-sleeve is connected with the first end of the elastic element;
the first end of the second lead sub-sleeve is connected with the second end of the elastic element, and the second end of the second lead sub-sleeve penetrates out of the cavity and is connected with the vacuum connector.
A second aspect of the present invention provides a temperature measurement carrier plate, which comprises a carrier plate body, a plurality of temperature sensors, a plurality of second leads and a second lead connector; the plurality of temperature sensors are respectively embedded in the carrier plate body; the second lead connector is positioned on one surface of the carrier plate body along the thickness direction of the carrier plate body, a plurality of second contact terminals are arranged on the second lead connector, and the second contact terminals are used for being electrically connected with the corresponding first contact terminals on the first lead connector in the temperature measuring connector; the first end of each second lead is electrically connected with the corresponding temperature sensor, and the second end of each second lead is electrically connected with the corresponding second contact terminal.
Optionally, a plurality of lead grooves and a backfill sealing layer filled in the lead grooves are arranged in the carrier plate body, and a second end of each second lead penetrates through the corresponding lead groove to be electrically connected with the corresponding second contact terminal.
Optionally, a plurality of buckles are arranged on the other surface of the carrier body in the thickness direction at intervals, and the second end of each second lead sequentially penetrates through each buckle to be electrically connected with the corresponding second contact terminal.
The third aspect of the utility model provides a temperature measurement system, including temperature measurement connector and temperature measurement support plate, the temperature measurement connector adopt in the foretell record the temperature measurement connector, the temperature measurement support plate adopts in the foretell record the temperature measurement support plate.
Optionally, the cross-sectional dimension of the second contact terminal is larger than the cross-sectional dimension of the corresponding first contact terminal.
The utility model discloses a temperature measurement connector, temperature measurement support plate and temperature measurement system adopts split type pin connection structure, be located the temperature sensor on the temperature measurement support plate, second lead wire and second lead wire connector can remove along with the temperature measurement support plate, and simultaneously, the removal that is located the flexible seal structure on the temperature measurement connector can cooperate the temperature measurement support plate, and the first lead wire connector of drive removes along the cavity to make first contact terminal be connected or separate with second contact terminal electricity, thereby can accurately measure the temperature of portable temperature measurement support plate. In addition, the temperature measurement mode that directly embeds temperature sensor in the support plate body is adopted, the real-time temperature of feedback support plate body can be directly measured, and the influence of other environmental factors is avoided, so that the accuracy of measuring the temperature can be further improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a temperature measurement system according to a first embodiment of the present invention;
fig. 2 is a schematic view of a partial assembly of a first lead connector and a second lead connector according to a second embodiment of the present invention;
FIG. 3 is a cross-sectional view of the first lead connector and the second lead connector shown in FIG. 2;
FIG. 4 is a schematic structural view of a temperature measuring carrier plate according to a third embodiment of the present invention;
FIG. 5 is a partial schematic view of a telescopic sealing structure in a temperature measuring connector according to a fourth embodiment of the present invention;
FIG. 6 is a cross-sectional view of the telescoping seal arrangement shown in FIG. 5;
FIG. 7 is a top plan view of the telescoping seal arrangement shown in FIG. 5;
FIG. 8 is a schematic view of the bellows of the telescoping seal arrangement shown in FIG. 5;
FIG. 9 is a schematic view of the vacuum connector in the telescoping seal arrangement shown in FIG. 5;
fig. 10 is a schematic diagram of a second lead according to a fifth embodiment of the present invention;
fig. 11 is a schematic view of a second lead according to a sixth embodiment of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
Referring to fig. 1, a temperature measuring system 300, the temperature measuring system 300 includes a temperature measuring connector 100, the temperature measuring connector 100 includes a telescopic sealing structure 110, a first lead connector 120 and a plurality of first leads (not shown). Wherein, the telescopic sealing structure 110 is arranged through the sealing chamber 400 needing temperature measurement and is movably connected with the chamber 400 in a sealing way. Referring to fig. 2 and 3 together, the first lead connector 120 is disposed at an end of the telescopic sealing structure 110 located in the cavity 400, and a plurality of first contact terminals 121 are disposed on the first lead connector 120. The plurality of first leads are respectively disposed in the stretchable sealing structure 110, and the plurality of first leads are respectively electrically connected to the corresponding first contact terminals 121.
Referring to fig. 1 and fig. 4, the temperature measurement system 300 further includes a temperature measurement carrier 200, wherein the temperature measurement carrier 200 includes a carrier body 210, a plurality of temperature sensors 220, a plurality of second leads 230, and a second lead connector 240. Wherein, the surface of the carrier body 210 can carry a plurality of substrates 600. The plurality of temperature sensors 220 are embedded in the carrier body 210, each temperature sensor 220 may correspond to one substrate 600, and the temperature sensor 220 may be disposed corresponding to a central position of the substrate 600. The second lead connector 240 is located on one surface of the carrier body 210 along a thickness direction thereof, and a plurality of second contact terminals 241 are disposed on the second lead connector 240. A first end of each second lead 230 is electrically connected to the corresponding temperature sensor 220, and a second end of each second lead 230 is electrically connected to the corresponding second contact terminal 241.
In the present embodiment, referring to fig. 1, the temperature measuring carrier 200 can enter and exit the chamber 400 through the chamber door 410 on the right side of the chamber 400 under the driving of the driving member 500 (e.g., a roller). Specifically, when the temperature measurement carrier 200 enters the chamber 400 to the process position under the driving of the driving element 500, at this time, the telescopic sealing structure 110 in the temperature measurement connector 100 may drive the first lead connector 120 to move in the chamber 400 toward the direction close to the temperature measurement carrier 200 until the first contact terminal 121 on the first lead connector 120 is electrically connected to the corresponding second contact terminal 241 on the second lead connector 240, so that the second lead 230 and the corresponding first lead are electrically connected to achieve the temperature measurement function. On the contrary, after the process is completed, when the temperature measurement carrier 200 is ready to leave the cavity 400, at this time, the flexible sealing structure 110 of the temperature measurement connector 100 drives the first lead connector 120 to move in the cavity 400 in a direction away from the temperature measurement carrier 200 until the first contact terminal 121 on the first lead connector 120 is separated from the corresponding second contact terminal 241 on the second lead connector 240, and at this time, the driving member 500 may be used to drive the temperature measurement carrier 200 to leave the cavity 400.
The temperature measurement system 300 in this embodiment adopts a split-type lead connection structure, the temperature sensor 220, the second lead 230 and the second lead connector 240 on the temperature measurement carrier 200 can move together with the temperature measurement carrier 200, and meanwhile, the flexible sealing structure 110 on the temperature measurement connector 100 can drive the first lead connector 120 to move along the cavity 400 in coordination with the movement of the temperature measurement carrier 200, so that the first contact terminal 121 and the second contact terminal 241 are electrically connected or separated, and the temperature of the movable temperature measurement carrier 200 can be accurately measured. In addition, the temperature measurement mode of directly embedding the temperature sensor 220 in the carrier plate body 210 is adopted, so that the real-time temperature of the carrier plate body 210 can be directly measured and fed back, and the influence of other environmental factors is avoided, and the accuracy of temperature measurement can be further improved.
It should be noted that, the specific structure of the temperature sensor 220 is not limited, for example, the temperature sensor 220 may be a thermocouple sensor, or the temperature sensor 220 may also be some other sensing device capable of measuring temperature.
It should be further noted that, the specific structure of the telescopic sealing structure 110 is not limited, for example, a driving mechanism such as a rack and pinion mechanism, a crank block mechanism, etc. may be adopted, and those skilled in the art may determine the specific telescopic sealing structure according to actual needs.
It should be noted that, no limitation is made on the specific number of the first lead wire and the second lead wire 230, and a person skilled in the art can determine the required specific number of the lead wires according to actual needs, but it should be noted that, taking the temperature sensor 220 as a thermocouple sensor as an example, two lead wires (positive and negative electrodes) are required to be provided for each thermocouple sensor, and therefore, the number of the second lead wire 230 and the first lead wire should be twice as large as that of the thermocouple sensor.
It should be appreciated that the material from which the first lead connector 120 and the second lead connector 240 are made should be a non-conductive, high temperature resistant material (e.g., may be ceramic and is not limited to ceramic).
Referring to fig. 2 and 3, one end of the telescopic sealing structure 110 located in the chamber 400 is connected to the first lead connector 120 through the swing pair 130 in a swing manner.
In the present embodiment, since it is difficult to continuously ensure the good verticality of the telescopic sealing structure 110 during installation or after long-term use in a high-temperature environment, the verticality directly affects the contact state of the first contact terminal 121 and the second contact terminal 241 (in the case of the slant of the contact terminals, it is easy to cause close contact of part of the contact terminals, and even poor or no contact of part of the contact terminals), and further signal errors are generated. Therefore, in the present embodiment, the swing pair 130 is added above the first lead connector 120 (the swing pair 130 may be unidirectional or universal, depending on specific requirements), so that the first lead connector 120 can be ensured to be always vertical, and further, the contact between the first contact terminal 121 and the second contact terminal 241 can be ensured to be in a stable and uniform state, a good signal transmission effect is achieved, and the temperature measurement accuracy is improved.
With reference to fig. 2 and fig. 3, the swing pair 130 includes two first mounting members 131 symmetrically disposed on the first lead connector 120, two second mounting members 132 symmetrically disposed on the telescopic sealing structure 110, and a pin 133 passing through the first mounting members 131 and the corresponding second mounting members 132.
Besides the above-mentioned structures, the structure of the swing pair 130 may be formed by other members capable of realizing swing.
In addition, referring to fig. 2 and 3, the cross-sectional size of the second contact terminal 241 may be larger than the cross-sectional size of the corresponding first contact terminal 121. Like this, can obtain great contact range and better contact effect to can further guarantee that the contact of first contact terminal 121 and second contact terminal 241 is in steady even state, realize better signal transmission effect, improve the temperature measurement degree of accuracy.
Referring to fig. 1 and 2, the telescopic sealing structure 110 may include a connecting member 111 and an elastic sealing sleeve 112. Wherein a first end of the connection assembly 111 is connected with the first lead connector 120, a second end of the connection assembly 111 passes through the chamber 400, and a gap is formed between the connection assembly 111 and the chamber 400 in a radial direction of the chamber 400. The elastic sealing sleeve 112 is sleeved outside the connecting component 111, a first end of the elastic sealing sleeve 112 is connected with the chamber 400 in a sealing manner, and a second end of the elastic sealing sleeve 112 is fixedly connected with a second end of the connecting component 111.
Referring to fig. 5, 6, 7 and 8, the elastic sealing sleeve 112 may be a bellows, a first end of the bellows is connected to the chamber 400 via the mounting flange assembly 113 in a sealing manner, and a second end of the bellows is connected to the second end of the connecting assembly 111 in a fixed sealing manner.
It should be noted that the elastic sealing sleeve 112 may be a bellows structure, but may also be some other elastic sealing sleeve structures, for example, the elastic sealing sleeve 112 may also be a metal thin-wall tube, etc.
Specifically, referring to fig. 6, the mounting flange assembly 113 includes a first mounting flange 113a, a second mounting flange 113b, a pressing block 113c and a sealing ring 113 d. The first mounting flange 113a is fixedly connected with the chamber 400, the second mounting flange 113b is fixedly connected with the first end of the bellows, the sealing ring 113d is clamped between the first mounting flange 113a and the second mounting flange 113b, the pressing block 113c is overlapped on the second mounting flange 113b and is fixedly connected with the first mounting flange 113a, for example, the pressing block 113c may be fixedly connected with the first mounting flange 113a through a bolt 113 e.
Referring to fig. 1, the connection assembly 111 includes a lead sleeve 111a and a vacuum connector 111b, and the vacuum connector 111b may be connected to an output shaft of the driving motor 700. The first end of the lead sleeve 111a is connected to the first lead connector 120, the second end of the lead sleeve 111a penetrates through the chamber 400 and is connected to the vacuum connector 111b, and each first lead is disposed in the lead sleeve 111a, so that the first lead is prevented from being damaged by a high-temperature environment in the chamber 400, the conduction yield of the first lead and the second lead 230 can be improved, the service life of the first lead is prolonged, and the use cost of the temperature measurement system 300 is reduced. Referring also to fig. 9, the vacuum connector 111b includes a plurality of leading pins 111b1 and a plurality of leading pins 111b2, each leading pin 111b1 is inserted into the second end of the corresponding first lead, and each leading pin 111b2 is used for being inserted into a corresponding measurement lead (not shown). The bellows is sleeved outside the lead sleeve 111a and is fixedly connected with the vacuum connector 111b, for example, the bellows can be welded on the vacuum connector 111 b.
Specifically, referring to fig. 1, when the temperature measurement carrier 200 enters the chamber 400 to the process position, at this time, the driving motor 700 drives the vacuum connector 111b to move downward, the bellows is compressed and deformed, and meanwhile, the lead bushing 111a moves downward to drive the first lead connector 120 to move downward until the first contact terminal 121 on the first lead connector 120 and the corresponding second contact terminal 241 on the temperature measurement carrier 200 are in good electrical contact, so that the first lead and the second lead 230 can be electrically conducted, and the temperature measurement function is realized. On the contrary, before the temperature measurement carrier 200 is ready to leave the chamber 400, the driving motor 700 drives the vacuum connector 111b to move upward, the bellows generates tensile deformation, and meanwhile, the wire sleeve 111a moves upward to drive the first wire connector 120 to move upward, so that the first contact terminal 121 on the first wire connector 120 is separated from the second contact terminal 241 on the temperature measurement carrier 200, so that the temperature measurement carrier 200 leaves the chamber 400.
Referring to fig. 2 and 3, the lead sleeve 111a includes a first lead sub-sleeve 111a1 and a second lead sub-sleeve 111a2, and the telescopic sealing structure 110 further includes an elastic member 114. A first end of the first lead sub-sleeve 111a1 is connected to the first lead connector 120, and a second end of the first lead sub-sleeve 111a1 is connected to a first end of the elastic member 114. The first end of the second lead sub-sleeve 111a2 is connected to the second end of the elastic member 114, and the second end of the second lead sub-sleeve 111a2 exits the chamber 400 and is connected to the vacuum connector 111 b.
In this embodiment, in order to ensure that the first contact terminal 121 of the first lead connector 120 is in close contact with the second contact terminal 241 of the second lead connector 240, a force slightly overloading the two connectors needs to be applied, and in this case, energy can be absorbed by the elastic member 114 provided. Meanwhile, whether the contact state of the first contact terminal 121 and the second contact terminal 241 is good or not can be judged by monitoring the expansion amount or the stress of the elastic member 114, so that the conduction yield of the first lead and the second lead 230 can be improved, and the accuracy of the temperature sensor 220 in measuring the temperature of the carrier body 210 can be improved.
It should be noted that, the specific structure of the elastic member 114 is not limited, for example, the elastic member 114 may be a spring, or the elastic member 114 may also be rubber, and of course, the elastic member 114 may also be some other device structure having an elastic function.
Referring to fig. 4 and 10, the temperature sensors 220 may be thermocouple sensors, and each of the probes 221 of the thermocouple sensors is encapsulated in the carrier body 210. The carrier body 210 is provided with a plurality of lead grooves 211 and a backfill sealing layer 212 filled in the lead grooves 211, and the sealing material in the backfill sealing layer 212 may be, for example, a sealing material such as graphite glue. Each of the second lead wires 230 is electrically connected with the corresponding second contact terminal 241 through the corresponding lead wire groove 211.
When selecting the thermocouple sensor, the thermocouple sensors with different division numbers can be flexibly selected according to requirements such as temperature measurement range and accuracy, and are not limited to the division numbers such as K, S. The thermocouple sensor is a bare wire thermocouple, a high-temperature-resistant flexible protective sleeve is additionally arranged, and the material of the protective sleeve is not limited to silicon dioxide.
The thermocouple sensor may be mounted on the upper surface or the lower surface of the carrier body 210, depending on the limitation of the process and other conditions (such as surface finishing, cleaning, no impurities, etc.) on whether the surface of the carrier body 210 can be mounted, referring to fig. 4 and 10, the arrangement points of the probes 221 may be aligned with the center of the substrate 600 placed on the carrier body 210 as much as possible, the mounting manner may be screw mounting, and specifically, referring to fig. 10 and 11, a plurality of threaded holes may be provided on the carrier body 210, so that each probe 221 may be plugged into the corresponding threaded hole, and the probe 221 may be screwed into the threaded hole by the inner screw 222.
Of course, the second leads 230 may be routed outside the carrier body 210 in addition to inside the carrier body 210, specifically, referring to fig. 11, a plurality of latches 213 are disposed on the surface of the carrier body 210 at intervals, and the second end of each second lead 230 sequentially passes through each latch 213 to be electrically connected to the corresponding second contact terminal 241.
The two routing modes can be selected according to specific needs, and of course, besides the two routing modes, other routing modes can be selected, and the two routing modes can be determined according to actual needs.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A temperature measurement connector is characterized by comprising a telescopic sealing structure, a first lead connector and a plurality of first leads; the telescopic sealing structure penetrates through a sealing cavity needing temperature measurement and is movably connected with the cavity in a sealing way; the first lead connector is arranged at one end in the cavity of the telescopic sealing structure, and a plurality of first contact terminals are arranged on the first lead connector; the plurality of first leads are respectively arranged in the telescopic sealing structure and are respectively electrically connected with the corresponding first contact terminals; the telescopic sealing structure can drive the first lead connectors to move along the cavity, so that the first contact terminals are electrically connected with or separated from the corresponding second contact terminals on the second lead connectors on the temperature measurement carrier plate.
2. The thermometric connector of claim 1, wherein one end of said telescoping seal configuration chamber is pivotally connected to said first lead connector by a pair of pendulums.
3. The thermometric connector of claim 1, wherein said telescoping seal arrangement comprises a connection assembly and a resilient seal sleeve, wherein,
a first end of the connecting assembly is connected with the first lead connector, a second end of the connecting assembly penetrates out of the cavity, and a gap is formed between the connecting assembly and the cavity in the radial direction of the cavity;
the elastic sealing sleeve is sleeved on the outer side of the connecting assembly, the first end of the elastic sealing sleeve is connected with the cavity in a sealing mode, and the second end of the elastic sealing sleeve is fixedly connected with the second end of the connecting assembly.
4. The thermometric connector of claim 3, wherein said connection assembly comprises a leadwire sleeve and a vacuum connector; wherein,
the first end of the lead sleeve is connected with the first lead connector, and the second end of the lead sleeve penetrates out of the cavity and is connected with the vacuum connector;
the vacuum connector comprises a plurality of leading-in pins and a plurality of leading-out pins;
the elastic sealing sleeve is sleeved on the outer side of the lead sleeve and is fixedly connected with the vacuum connector;
each first lead penetrates through the lead sleeve and is electrically connected with the corresponding lead-in pin.
5. The thermometric connector according to claim 4, wherein the leadthrough comprises a first leadthrough and a second leadthrough, the telescoping seal arrangement further comprising an elastomeric member;
the first end of the first lead sub-sleeve is connected with the first lead connector, and the second end of the first lead sub-sleeve is connected with the first end of the elastic element;
the first end of the second lead sub-sleeve is connected with the second end of the elastic element, and the second end of the second lead sub-sleeve penetrates out of the cavity and is connected with the vacuum connector.
6. A temperature measurement carrier plate is characterized by comprising a carrier plate body, a plurality of temperature sensors, a plurality of second leads and a second lead connector; the plurality of temperature sensors are respectively embedded in the carrier plate body; the second lead connector is positioned on one surface of the carrier plate body along the thickness direction of the carrier plate body, a plurality of second contact terminals are arranged on the second lead connector, and the second contact terminals are used for being electrically connected with the corresponding first contact terminals on the first lead connector in the temperature measuring connector; the first end of each second lead is electrically connected with the corresponding temperature sensor, and the second end of each second lead is electrically connected with the corresponding second contact terminal.
7. The temperature measuring carrier plate according to claim 6, wherein a plurality of lead grooves and a backfill sealing layer filled in the lead grooves are arranged in the carrier plate body, and a second end of each second lead passes through the corresponding lead groove and is electrically connected with the corresponding second contact terminal.
8. The temperature measurement carrier plate of claim 6, wherein a plurality of fasteners are disposed at intervals on another surface of the carrier plate body along the thickness direction thereof, and the second end of each second lead sequentially passes through each fastener to be electrically connected to the corresponding second contact terminal.
9. A temperature measurement system comprises a temperature measurement connector and a temperature measurement carrier plate, and is characterized in that the temperature measurement connector adopts the temperature measurement connector of any one of claims 1 to 5, and the temperature measurement carrier plate adopts the temperature measurement carrier plate of any one of claims 6 to 8.
10. The thermometric system of claim 9, wherein the cross-sectional dimension of the second contact terminal is greater than the cross-sectional dimension of the corresponding first contact terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822234521.XU CN209150344U (en) | 2018-12-28 | 2018-12-28 | Thermometric connector, thermometric support plate and temp measuring system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822234521.XU CN209150344U (en) | 2018-12-28 | 2018-12-28 | Thermometric connector, thermometric support plate and temp measuring system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209150344U true CN209150344U (en) | 2019-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822234521.XU Active CN209150344U (en) | 2018-12-28 | 2018-12-28 | Thermometric connector, thermometric support plate and temp measuring system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209150344U (en) |
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2018
- 2018-12-28 CN CN201822234521.XU patent/CN209150344U/en active Active
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Effective date of registration: 20210126 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: Room A129-1, No. 10 Zhongxing Road, Changping District Science and Technology Park, Beijing 102200 Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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