CN209057400U - A kind of FPC protection membrane stability bonding structure - Google Patents

A kind of FPC protection membrane stability bonding structure Download PDF

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Publication number
CN209057400U
CN209057400U CN201821443868.9U CN201821443868U CN209057400U CN 209057400 U CN209057400 U CN 209057400U CN 201821443868 U CN201821443868 U CN 201821443868U CN 209057400 U CN209057400 U CN 209057400U
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CN
China
Prior art keywords
carrier film
film
protective film
bonding structure
membrane stability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821443868.9U
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Chinese (zh)
Inventor
张燕辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD
Original Assignee
DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD filed Critical DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD
Priority to CN201821443868.9U priority Critical patent/CN209057400U/en
Application granted granted Critical
Publication of CN209057400U publication Critical patent/CN209057400U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model belongs to flexible circuit board technical field and discloses a kind of FPC protection membrane stability bonding structure; including protective film, carrier film and windowing; the upper surface of described protective film presses one layer of colored carrier film; the top of the carrier film is equipped with windowing, the protective film and carrier film for fitting in flexible circuit board together.The utility model one layer of colored carrier film of face pressure on protective film; increase protection film strength and hardness; in this way; protective film will not shake when fitting, the precision of protective film fitting be improved, in the case where not increasing protective film; general Anawgy accuracy can only accomplish 0.15-0.20mm; after increasing carrier film, Anawgy accuracy can accomplish 0.010mm, be that carrier film removes unclean undiscovered and flow to client in order to prevent using colored carrier film.

Description

A kind of FPC protection membrane stability bonding structure
Technical field
The utility model protects membrane stability bonding structure more particularly to a kind of FPC, belongs to flexible circuit board technical field.
Background technique
With the intelligentized development of electronic equipment, flexible circuit board is as the important load for realizing electronic equipment correlation function Body plays more and more crucial effect in current field of electronic device.
Because of increase or the needs of function, the wiring and pad in flexible circuit board are closer and closer, and insulating layer is caused to be opened Window is offline or mode of the more and more nearlyr insulation sandwich circuit with a distance from pad there are two types of, one is only protected with polyimides Cuticula, one is polyimides protective films, and solder mask to be added to expose.When insulating layer windowing is offline or close from pad pitch, because The harmomegathus characteristic of polyimides protective film, when especially windowing area is big, fitting protective film is easy to deviation, often will Route exposes or covers pad, seriously affects the quality of flexible circuit board.To solve this problem often through polyimides Protective film adds the mode of solder mask exposure to solve the problems, such as this, but the method will increase process and raw material, increases cost.
Utility model content
The technical problems to be solved in the utility model overcomes existing defect, provides a kind of FPC protection membrane stability fitting Structure improves protective film Anawgy accuracy and dimensional stability, promotes flexible circuit board by changing structure when protective film fitting Quality can effectively solve the problems in background technique.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:
The utility model provides a kind of FPC protection membrane stability bonding structure, including protective film, carrier film and windowing, institute It states the upper surface of protective film and presses one layer of colored carrier film, the top of the carrier film is equipped with windowing, the protective film and carrying Film for fitting in flexible circuit board together.
As a kind of optimal technical scheme of the utility model, the protective film thickness range is 22um-100um.
As a kind of optimal technical scheme of the utility model, resistance to 200 DEG C of the high temperature of carrier film.
As a kind of optimal technical scheme of the utility model, the carrier film with a thickness of 0.05-0.06mm.
As a kind of optimal technical scheme of the utility model, the top of the carrier film and protective film is drilled with hole.
The utility model beneficial effect achieved is: one layer of colored carrier film of face pressure on protective film, increases and protects Film strength and hardness are protected, in this way, protective film will not shake when fitting, the precision of protective film fitting is improved, does not increase protection In the case where film, general Anawgy accuracy can only accomplish 0.15-0.20mm, and after increasing carrier film, Anawgy accuracy can be accomplished 0.010mm is that carrier film removes unclean undiscovered and flow to client in order to prevent using colored carrier film.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.
In the accompanying drawings:
Fig. 1 is a kind of FPC protection membrane stability bonding structure overall structure diagram described in the utility model embodiment;
Figure label: 1, protective film;2, carrier film;3, it opens a window.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Embodiment: it referring to Fig. 1, a kind of FPC of the utility model protects membrane stability bonding structure, including protective film 1, holds Film carrier 2 and windowing 3, the upper surface of described protective film 1 press one layer of colored carrier film 2, and the top of the carrier film 2 is equipped with windowing 3, the protective film 1 and carrier film 2 for fitting in flexible circuit board together.
Further, 1 thickness range of protective film is 22um-100um.
Further, the high temperature of 2 resistance to 200 DEG C of the carrier film.
Further, the carrier film 2 with a thickness of 0.05-0.06mm, too thick, punching can be easy to produce flash, too Bao Liao does not have the effect of support.
Further, the top of the carrier film 2 and protective film 1 is drilled with hole, and the off-type force of carrier film will be controlled in 8g Left and right, it is too big to be not easy to remove, it is too small, it has been easy bubble between carrier film and protective film, has influenced quality.
It should be noted that the utility model is that a kind of FPC protects membrane stability bonding structure, in use, in protective film One layer of colored carrier film of upper pressure has following the most key requirement to carrier film, and carrier film will be resistant to 200 DEG C of high temperature, It is required that carrier film with a thickness of 0.05-0.06mm, too thick, punching can be easy to produce flash, too thin, not have the effect of support Fruit, the off-type force of carrier film will be controlled in 8g or so, too big to be not easy to remove, too small, be held between carrier film and protective film Bubble is tended to have, quality is influenced, colored carrier film and protective film drill together, drill out the hole of needs, carrier film and protection It is punched together, goes out the window for needing to open a window, carrier film and protective film are fitted in flexible circuit board together, high-temperature laminating is protected Cuticula and carrier film.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims (5)

1. a kind of FPC protects membrane stability bonding structure, including protective film (1), carrier film (2) and windowing (3), feature exists In: the upper surface of described protective film (1) presses one layer of colored carrier film (2), and the top of the carrier film (2) is equipped with windowing (3), The protective film (1) and carrier film (2) for fitting in flexible circuit board together.
2. a kind of FPC as described in claim 1 protects membrane stability bonding structure, it is characterised in that: the protective film (1) is thick Degree range is 22um-100um.
3. a kind of FPC as described in claim 1 protects membrane stability bonding structure, it is characterised in that: the carrier film (2) is resistance to 200 DEG C of high temperature.
4. a kind of FPC as described in claim 1 protects membrane stability bonding structure, it is characterised in that: the carrier film (2) With a thickness of 0.05-0.06mm.
5. a kind of FPC as described in claim 1 protects membrane stability bonding structure, it is characterised in that: the carrier film (2) and The top of protective film (1) is drilled with hole.
CN201821443868.9U 2018-09-05 2018-09-05 A kind of FPC protection membrane stability bonding structure Expired - Fee Related CN209057400U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821443868.9U CN209057400U (en) 2018-09-05 2018-09-05 A kind of FPC protection membrane stability bonding structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821443868.9U CN209057400U (en) 2018-09-05 2018-09-05 A kind of FPC protection membrane stability bonding structure

Publications (1)

Publication Number Publication Date
CN209057400U true CN209057400U (en) 2019-07-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821443868.9U Expired - Fee Related CN209057400U (en) 2018-09-05 2018-09-05 A kind of FPC protection membrane stability bonding structure

Country Status (1)

Country Link
CN (1) CN209057400U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111770634A (en) * 2020-06-08 2020-10-13 上达电子(深圳)股份有限公司 Manufacturing method of FPC
CN114523781A (en) * 2020-11-23 2022-05-24 伯恩光学(惠州)有限公司 Manufacturing process of electronic product shell
CN114900998A (en) * 2022-06-06 2022-08-12 盐城维信电子有限公司 Multilayer circuit board and processing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111770634A (en) * 2020-06-08 2020-10-13 上达电子(深圳)股份有限公司 Manufacturing method of FPC
CN111770634B (en) * 2020-06-08 2022-04-29 上达电子(深圳)股份有限公司 Manufacturing method of FPC
CN114523781A (en) * 2020-11-23 2022-05-24 伯恩光学(惠州)有限公司 Manufacturing process of electronic product shell
CN114900998A (en) * 2022-06-06 2022-08-12 盐城维信电子有限公司 Multilayer circuit board and processing method thereof

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190702

Termination date: 20200905