CN209044665U - A kind of IC card chip mould group of modified form double-interface card - Google Patents

A kind of IC card chip mould group of modified form double-interface card Download PDF

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Publication number
CN209044665U
CN209044665U CN201821718546.0U CN201821718546U CN209044665U CN 209044665 U CN209044665 U CN 209044665U CN 201821718546 U CN201821718546 U CN 201821718546U CN 209044665 U CN209044665 U CN 209044665U
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copper
wafer
stainless steel
mould group
card
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CN201821718546.0U
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Chinese (zh)
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刘瑛
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Dongguan Three Smart Card Technology Co Ltd
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Dongguan Three Smart Card Technology Co Ltd
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Abstract

The utility model discloses a kind of IC card chip mould group of modified form double-interface card, the IC card chip mould group includes that FPC plate, wafer and stainless steel or copper contact chip and copper connect foot, the first wafer slot and the second wafer slot are equipped in FPC plate, the wafer is fixed in first wafer slot or the second wafer slot, every copper connects foot one end and extends to wafer side, and it is electrically connected with a pin of wafer by welding gold thread, and the every copper connecting plate other end and a piece of stainless steel or copper contact chip are electrically connected;Stainless steel or copper contact chip are in the same plane, and are formed with interval between adjacent two stainless steel or copper contact chip;FPC plate lower end surface is equipped with first day, the second antenna contacts, first, second antenna contacts are electrically connected with a pin of wafer respectively, and the respectively arranged first, second thickening conductive layer in the first, second antenna contacts lower end surface protrudes from the substrate lower end surface and copper connects outside the end face of underfooting.

Description

A kind of IC card chip mould group of modified form double-interface card
Technical field:
The utility model relates to fields of communication technology, refer in particular to a kind of IC card chip mould group of modified form double-interface card.
Background technique:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics Chip insertion meets in the card base of 7816 standard of ISO, is made into card form.Communication modes between IC card and reader can be with It is contact, is also possible to contactless.IC card is divided into Contact Type Ic Card, non-contact IC and double interfaces according to communication interface Block (being provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication, The fields such as bank, telecommunications, public transport, parking lot management are just more and more applied, such as the electricity of China second-generation identity card, bank Sub- wallet, the SIM cards of mobile phones of telecommunications, the bus card of public transport, subway card, parking card for collecting parking fee etc., all exist It plays an important role in people's daily life.
Double-interface card includes IC card chip mould group in the prior art, which is all made of the day of two planes Line contact is contacted with antenna, and needs to be fixed and be connected using scolding tin in the later period, this assembling structure is relatively complicated, and operates It is inconvenient, and the later period also needs to adhere to IC card chip mould group on card by glue.Furthermore IC card chip mould group is only It can be applicable in a kind of wafer of size, poor compatibility is unfavorable for improving the market competitiveness.
In view of this, the present inventor proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of IC card core of modified form double-interface card Piece mould group.
In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the modified form double-interface card IC card chip mould group includes substrate and at least two rows of IC card chip mould groups being set in the substrate, and the substrate two sides are all provided with Several location holes are equipped with, which is in rectangle;The IC card chip mould group includes the FPC plate for being set to substrate upper surface, sets The wafer that is placed on FPC plate and several the stainless steel or copper on the FPC plate and being used as terminal are fixed on by insulating cement water layer Contact chip and several coppers for being fixed on substrate lower end surface connect foot, and the first wafer slot is provided in the FPC plate and is set to In first wafer slot and size is less than the second wafer slot of the first wafer slot, which is fixed on first wafer slot or second brilliant In circular groove, every copper connects foot one end and extends to wafer side, and forms electrical property by welding gold thread with a pin of wafer Connection, and the every copper connecting plate other end and a piece of stainless steel or copper contact chip are electrically connected;The stainless steel or copper contact Piece is in the same plane, and is formed with interval between adjacent two stainless steel or copper contact chip;FPC plate lower end surface is also set up Have first antenna contact and the second antenna contacts, the first antenna contact and the second antenna contacts respectively with a pin of wafer It is electrically connected, and the first antenna contact and the second antenna contacts lower end surface are respectively arranged with the first thickening conductive layer and second and add Thick conductive layer, the first thickening conductive layer and the second thickening conductive layer protrude from the substrate lower end surface and copper connects underfooting end Outside face.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are plating Metal layer passes through plating mode and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are tin cream Layer, passes through a process of tin and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, the copper connects foot and includes connecting bridge and take shape in the connection The weld part of bridge one end, the connecting bridge surface are coated with insulating layer, which is in disk-shaped or strip, wherein strip Weld part both ends be used as pad, by welding gold thread connection between the pad and the pin of wafer, and form electrical property Conducting.
Furthermore, in above-mentioned technical proposal, the copper connecting plate, substrate, FPC plate are provided with corresponding blind Hole, and conduction material stock column is filled in the blind hole, which contacts and is connected with stainless steel or copper contact chip, makes copper Connecting plate electrically conducts with stainless steel or copper contact chip.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is conductive polymer rubber column gel column.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is tin cream column.
Furthermore, in above-mentioned technical proposal, the quantity of the stainless steel or copper contact chip is six or eight;Institute The quantity for the copper connecting plate stated is six or eight, and is corresponded with stainless steel or copper contact chip, and be connected.
Furthermore, in above-mentioned technical proposal, the stainless steel or copper contact chip with a thickness of 0.02mm-0.07mm; The copper connecting plate with a thickness of 0.03mm-0.05mm.
After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art it is practical It is novel to be additionally provided with the first thickening conduction in the first antenna contact of IC card chip mould group lower end surface setting and the second antenna contacts Layer and second thickeies conductive layer, and the first thickening conductive layer and the second thickening conductive layer protrude from the band body and stainless steel and connect Outside contact pin, so that the IC card chip mould group later period, after being installed on card, which thickeies conduction Layer difference directly contacts point contact with the antenna of card two, without being welded and fixed, only passes through glue for IC card chip mould Group adheres on card, and structure is more simple, and makes more convenient.The utility model is in IC card chip mould group Upper surface and lower end surface difference composite stainless steel or copper contact chip and copper connecting plate, entire IC card chip is greatly enhanced with this The structural strength of mould group, and IC card chip mould group is used as terminal using stainless steel contact chip and connects with the external world, stainless steel contact Sheet material is at low cost, and intensity is big and wear-resisting property is ideal, wear-resisting, will not cause larger abrasion after being used for a long time, so that It can guarantee conducting quality, and then improve communication quality, and the utility model structure is relatively simple, enable the utility model have extremely strong The market competitiveness.In addition, the weld part of every copper connecting plate extends to wafer side, and a pin with integrated circuit It is electrically connected by weldering gold thread, gold thread degree is lowered significantly with this, and can guarantee welding quality, enable the utility model that there is pole The strong market competitiveness.Furthermore it is provided with the first wafer slot in the FPC plate and is set in the first wafer slot and size is less than Second wafer slot of the first wafer slot, the wafer are fixed in first wafer slot or the second wafer slot, so that compatible two kinds of rulers The wafer of very little size, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have extremely strong market competition Power.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram in the utility model;
Fig. 2 be Fig. 1 along A-A to cross-sectional view.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
It is a kind of IC card chip mould group of modified form double-interface card as shown in Fig. 1-2, which includes setting The FPC plate 21 for being placed in 1 upper surface of substrate, the wafer 22 being set on FPC plate 21 and several to pass through insulating cement water layer 23 fixed In on the FPC plate 21 and being used as the stainless steel of terminal or copper contact chip 24 and several coppers for being fixed on 1 lower end surface of substrate connect Foot 26 is provided with the first wafer slot 211 in the FPC plate 21 and is set in the first wafer slot 211 and size is less than the first crystalline substance Second wafer slot 212 of circular groove 211, the wafer 22 are fixed in first wafer slot 212 or the second wafer slot 212, every copper Guidance 26 one end of pin extends to 22 side of wafer, and is electrically connected with a pin of wafer 22 by welding gold thread, and Every 26 other end of copper connecting plate and a piece of stainless steel or copper contact chip 24 are electrically connected;The stainless steel or copper contact chip 24 It is in the same plane, and interval is formed between adjacent two stainless steel or copper contact chip 24.21 lower end surface of FPC plate is also set Be equipped with first antenna contact 28 and the second antenna contacts 29, the first antenna contact 28 and the second antenna contacts 29 respectively with wafer 22 pin is electrically connected, and the first antenna contact 28 and 29 lower end surface of the second antenna contacts are respectively arranged with first and add Thick conductive layer 281 and second thickeies conductive layer 291, and the first thickening conductive layer 281 and the second thickening conductive layer 291 protrude from 1 lower end surface of substrate and copper connect outside 26 lower end surface of foot.The utility model be arranged in 2 lower end surface of IC card chip mould group first Antenna contacts 28 and the second antenna contacts 29 are additionally provided with the first thickening conductive layer 281 and second and thicken conductive layer 291, this first It thickeies conductive layer 281 and the second thickening conductive layer 291 protrudes from outside the band body 1 and stainless steel connection sheet 26, so that the IC 2 later period of card chip mould group, the first thickening conductive layer 281 and second thickeied conductive layer 291 respectively directly after being installed on card It connects and contacts point contact with the antenna two of card, without being welded and fixed, only adhered to IC card chip mould group 2 by glue On card, structure is more simple, and makes more convenient.In addition, the utility model is in IC card chip mould group 2 Upper surface and lower end surface difference composite stainless steel or copper contact chip 24 and copper connecting plate 26, greatly enhance entire IC card core with this The structural strength of piece mould group 2, and IC card chip mould group 2 is used as terminal using stainless steel contact chip and connects with the external world, the stainless steel The cost of material is low for contact chip, and intensity is big and wear-resisting property is ideal, wear-resisting, will not cause larger abrasion after being used for a long time, So that can guarantee conducting quality, and then communication quality is improved, and the utility model structure is relatively simple, and the utility model is enabled to have The extremely strong market competitiveness.In addition, the weld part 261 of every copper connecting plate 26 extends to 22 side of wafer, and with integrated electricity One pin on road 22 is electrically connected by weldering gold thread, is lowered gold thread degree significantly with this, and can guarantee welding quality, is enabled this Utility model has the extremely strong market competitiveness.Furthermore it is provided with the first wafer slot 211 in the FPC plate 21 and is set to the In one wafer slot 211 and size is less than the second wafer slot 212 of the first wafer slot 211, which is fixed on first wafer In slot 212 or the second wafer slot 212, so that the wafer of compatible two kinds of sizes, adaptability is high, good compatibility, using more Add flexibly, enables the utility model that there is the extremely strong market competitiveness.
The first thickening conductive layer 281 and the second thickening conductive layer 291 are electroplated metal layer, pass through plating side Formula is fixed on 29 lower end surface of the first antenna contact 28 and the second antenna contacts.Either, described first thickeies 281 He of conductive layer Second thickening conductive layer 291 is tin paste layer, passes through a process of tin and is fixed on the first antenna contact 28 and the second antenna 29 lower end surface of contact.
The stainless steel or copper contact chip 24 with a thickness of 0.02mm-0.07mm;The copper connecting plate 26 with a thickness of 0.03mm-0.05mm。
It includes connecting bridge 262 and the weld part 261 for taking shape in 262 one end of connecting bridge that the copper, which connects foot 26, Weld part 261 can be extended at a distance from the pin of wafer by connecting bridge 262, so that shortening the length of gold thread, the company as far as possible 262 surface of bridge is connect coated with insulating layer, will not be influenced across the different stainless steel of at least two panels or copper contact chip 24 Electric conductivity.The weld part 261 is in disk-shaped or strip, wherein and 261 both ends of weld part of strip are used as pad, By welding gold thread connection between the pad and the pin of wafer 22, and is formed and electrically conducted.
The copper connecting plate 26, substrate 1, FPC plate 21 are provided with corresponding blind hole, and filled with conduction in the blind hole Column of material, the conduction material stock column are contacted and are connected with stainless steel or copper contact chip 24, make copper connecting plate 26 and stainless steel or copper Contact chip 24 electrically conducts.Wherein, the conduction material stock column is conductive polymer rubber column gel column.Either, the conduction material stock column is Tin cream column.
The quantity of the stainless steel or copper contact chip 24 is six or eight;The quantity of the copper connecting plate 26 is Six or eight, and corresponded with stainless steel or copper contact chip 24, and be connected.
In this present embodiment, the stainless steel or copper contact chip 24 use stainless steel contact chip, without using copper contact chip.
In conclusion first antenna contact 28 that the utility model is arranged in 2 lower end surface of IC card chip mould group and second day Line contact 29 is additionally provided with the first thickening conductive layer 281 and second and thickeies conductive layer 291, this first thickeies conductive layer 281 and the Two thickening conductive layers 291 protrude from outside the band body 1 and stainless steel connection sheet 26, so that 2 later period of IC card chip mould group exists After being installed on card, the first thickening conductive layer 281 and the second thickening conductive layer 291 directly connect with the antenna of card two respectively Contact contact is only adhered to IC card chip mould group 2 on card by glue, structure without being welded and fixed It is more simple, and make more convenient.The utility model is compound in the upper surface of IC card chip mould group 2 and lower end surface difference Stainless steel or copper contact chip 24 and copper connecting plate 26 greatly enhance the structural strength of entire IC card chip mould group 2, and IC with this Card chip mould group 2 is used as terminal using stainless steel contact chip and connects with the external world, and the cost of material is low for the stainless steel contact chip, and intensity is big And wear-resisting property is ideal, and it is wear-resisting, larger abrasion will not be caused after being used for a long time, so that can guarantee conducting quality, in turn Communication quality is improved, and the utility model structure is relatively simple, enables the utility model that there is the extremely strong market competitiveness.In addition, The weld part 261 of every copper connecting plate 26 extends to 22 side of wafer, and passes through weldering gold with a pin of integrated circuit 22 Line is electrically connected, and lowers gold thread degree significantly with this, and can guarantee welding quality, the utility model is enabled to have extremely strong market Competitiveness.Furthermore it is provided with the first wafer slot 211 in the FPC plate 21 and is set in the first wafer slot 211 and size is less than Second wafer slot 212 of the first wafer slot 211, the wafer 22 are fixed in first wafer slot 212 or the second wafer slot 212, So that the wafer of compatible two kinds of sizes, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have The extremely strong market competitiveness.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap It includes in present utility model application the scope of the patents.

Claims (9)

1. the IC card chip mould group of modified form double-interface card, it is characterised in that: the IC card chip mould group (2) includes being set to substrate (1) the FPC plate (21) of upper surface, the wafer (22) that is set on FPC plate (21) and several solid by insulating cement water layer (23) Due on the FPC plate (21) and being used as stainless steel or copper contact chip (24) and several substrate (1) lower end surfaces be fixed on of terminal Copper connects foot (26), is provided with the first wafer slot (211) in the FPC plate (21) and is set in the first wafer slot (211) And size, less than the second wafer slot (212) of the first wafer slot (211), which is fixed on first wafer slot (211) Or second in wafer slot (212), every copper connects foot (26) one end and extends to wafer (22) side, and one with wafer (22) A pin is electrically connected by welding gold thread, and every copper connects foot (26) other end and a piece of stainless steel or copper contact chip (24) it is electrically connected;The stainless steel or copper contact chip (24) are in the same plane, and adjacent two stainless steel or copper contact chip (24) interval is formed between;FPC plate (21) lower end surface is additionally provided with first antenna contact (28) and the second antenna contacts (29), the first antenna contact (28) and the second antenna contacts (29) are electrically connected with a pin of wafer (22) respectively, and The first antenna contact (28) and the second antenna contacts (29) lower end surface are respectively arranged with the first thickening conductive layer (281) and second It thickeies conductive layer (291), first thickening conductive layer (281) and the second thickening conductive layer (291) protrude under the substrate (1) End face and copper connect outside foot (26) lower end surface.
2. the IC card chip mould group of modified form double-interface card according to claim 1, it is characterised in that: described first thickeies Conductive layer (281) and the second thickening conductive layer (291) are electroplated metal layer, pass through plating mode and are fixed on this first day Line contact (28) and the second antenna contacts (29) lower end surface.
3. the IC card chip mould group of modified form double-interface card according to claim 1, it is characterised in that: described first thickeies Conductive layer (281) and the second thickening conductive layer (291) are tin paste layer, pass through a process of tin and are fixed on first antenna touching Point (28) and the second antenna contacts (29) lower end surface.
4. the IC card chip mould group of modified form double-interface card according to claim 2 or 3, it is characterised in that: the copper Connecting foot (26) includes connecting bridge (262) and the weld part (261) for taking shape in connecting bridge (262) one end, the connecting bridge (262) surface is coated with insulating layer, which is in disk-shaped or strip, wherein the weld part (261) of strip Both ends are used as pad, are connect between the pad and the pin of wafer (22) by welding gold thread, and are formed and electrically conducted.
5. the IC card chip mould group of modified form double-interface card according to claim 1, it is characterised in that: the copper connects Foot (26), substrate (1), FPC plate (21) are provided with corresponding blind hole, and conduction material stock column, the conduction are filled in the blind hole Column of material is contacted and is connected with stainless steel or copper contact chip (24), and copper is made to connect foot (26) and stainless steel or copper contact chip (24) It electrically conducts.
6. the IC card chip mould group of modified form double-interface card according to claim 5, it is characterised in that: the conductive material Column is conductive polymer rubber column gel column.
7. the IC card chip mould group of modified form double-interface card according to claim 5, it is characterised in that: the conductive material Column is tin cream column.
8. the IC card chip mould group of modified form double-interface card according to claim 1, it is characterised in that: the stainless steel Or the quantity of copper contact chip (24) is six or eight;The quantity that the copper connects foot (26) is six or eight, and with Stainless steel or copper contact chip (24) correspond, and are connected.
9. the IC card chip mould group of modified form double-interface card according to claim 1, it is characterised in that: the stainless steel or Copper contact chip (24) with a thickness of 0.02mm-0.07mm;The copper connect foot (26) with a thickness of 0.03mm-0.05mm.
CN201821718546.0U 2018-10-23 2018-10-23 A kind of IC card chip mould group of modified form double-interface card Active CN209044665U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821718546.0U CN209044665U (en) 2018-10-23 2018-10-23 A kind of IC card chip mould group of modified form double-interface card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821718546.0U CN209044665U (en) 2018-10-23 2018-10-23 A kind of IC card chip mould group of modified form double-interface card

Publications (1)

Publication Number Publication Date
CN209044665U true CN209044665U (en) 2019-06-28

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