CN209044663U - Modified form dual platen IC card chip mould group - Google Patents

Modified form dual platen IC card chip mould group Download PDF

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Publication number
CN209044663U
CN209044663U CN201821718517.4U CN201821718517U CN209044663U CN 209044663 U CN209044663 U CN 209044663U CN 201821718517 U CN201821718517 U CN 201821718517U CN 209044663 U CN209044663 U CN 209044663U
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China
Prior art keywords
wafer
copper
stainless steel
mould group
contact chip
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CN201821718517.4U
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Chinese (zh)
Inventor
刘瑛
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Dongguan Three Smart Card Technology Co Ltd
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Dongguan Three Smart Card Technology Co Ltd
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Abstract

The utility model discloses a kind of modified form dual platen IC card chip mould group, the IC card chip mould group includes the FPC plate set on substrate upper surface, wafer on FPC plate and several the stainless steel on the FPC plate and being used as terminal or copper contact chip are fixed on by insulating cement water layer and several coppers for being fixed on substrate lower end surface connect foot, the first wafer slot is equipped in FPC plate and be set in the first wafer slot and size less than the first wafer slot the second wafer slot, the wafer is fixed in first wafer slot or the second wafer slot, every copper connects foot one end and extends to wafer side, and it is electrically connected with a pin of wafer by welding gold thread, and the every copper connecting plate other end is electrically connected with a piece of stainless steel or copper contact chip;Stainless steel or copper contact chip are in the same plane, and are formed with interval between adjacent two stainless steel or copper contact chip.

Description

Modified form dual platen IC card chip mould group
Technical field:
The utility model relates to fields of communication technology, refer in particular to a kind of modified form dual platen IC card chip mould group.
Background technique:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics Chip insertion meets in the card base of 7816 standard of ISO, is made into card form.Communication modes between IC card and reader can be with It is contact, is also possible to contactless.IC card is divided into Contact Type Ic Card, non-contact IC and double interfaces according to communication interface Block (being provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication, The fields such as bank, telecommunications, public transport, parking lot management are just more and more applied, such as the electricity of China second-generation identity card, bank Sub- wallet, the SIM cards of mobile phones of telecommunications, the bus card of public transport, subway card, parking card for collecting parking fee etc., all exist It plays an important role in people's daily life.
IC card chip mould group in the prior art, which is all made of copper sheet and carries out contact with the external world as terminal, to be connected, but copper sheet Material cost is high, and intensity is inadequate and wear-resisting property is not ideal enough, easy to wear, so that after long-term use due to wearing larger and shadow Pilot leads to quality, and then influences communication quality.In addition, IC card chip mould group is only capable of being applicable in a kind of wafer of size, compatibility Difference is unfavorable for improving the market competitiveness.
In view of this, the present inventor proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of modified form dual platen IC card band.
In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the modified form dual platen IC card Chip module includes the FPC plate for being set to substrate upper surface, the wafer being set on FPC plate and several by insulating cement water layer It is fixed on the FPC plate and is used as the stainless steel of terminal or copper contact chip and several coppers for being fixed on substrate lower end surface connect Foot is provided with the first wafer slot in the FPC plate and is set in the first wafer slot and second of size less than the first wafer slot Wafer slot, the wafer are fixed in first wafer slot or the second wafer slot, and every copper connects foot one end and extends to by wafer Side, and with a pin of wafer by weld gold thread be electrically connected, and the every copper connecting plate other end with it is a piece of stainless Steel or copper contact chip are electrically connected;The stainless steel or copper contact chip are in the same plane, and adjacent two stainless steel or copper connect Interval is formed between contact.
Furthermore, in above-mentioned technical proposal, the copper connects foot and includes connecting bridge and take shape in the connection The weld part of bridge one end, the connecting bridge surface are coated with insulating layer, which is in disk-shaped or strip, wherein strip Weld part both ends be used as pad, by welding gold thread connection between the pad and the pin of wafer, and form electrical property Conducting.
Furthermore, in above-mentioned technical proposal, the copper connecting plate, substrate, FPC plate are provided with corresponding blind Hole, and conduction material stock column is filled in the blind hole, which contacts and is connected with stainless steel or copper contact chip, makes copper Connecting plate electrically conducts with stainless steel or copper contact chip.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is conductive polymer rubber column gel column.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is tin cream column.
Furthermore, in above-mentioned technical proposal, the quantity of the stainless steel or copper contact chip is six or eight;Institute The quantity for the copper connecting plate stated is six or eight, and is corresponded with stainless steel or copper contact chip, and be connected.
The stainless steel or copper contact chip with a thickness of 0.02mm-0.07mm;The copper connecting plate with a thickness of 0.03mm-0.05mm。
After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art it is practical It is novel to distinguish composite stainless steel or copper contact chip and copper connecting plate in the upper surface of IC card chip mould group and lower end surface, it is big with this Enhance the structural strength of entire IC card chip mould group greatly, and IC card chip mould group is used as terminal and the external world using stainless steel contact chip It connecting, the cost of material is low for the stainless steel contact chip, and intensity is big and wear-resisting property is ideal, and it is wear-resisting, it will not after being used for a long time Larger abrasion is caused, so that can guarantee conducting quality, and then communication quality is improved, and the utility model structure is relatively simple, enables The utility model has the extremely strong market competitiveness.In addition, the weld part of every copper connecting plate extends to wafer side, and with One pin of integrated circuit is electrically connected by weldering gold thread, lowers gold thread degree significantly with this, and can guarantee welding quality, Enable the utility model that there is the extremely strong market competitiveness.Furthermore it is provided with the first wafer slot in the FPC plate and is set to first In wafer slot and size is less than the second wafer slot of the first wafer slot, which is fixed on first wafer slot or the second wafer slot In, so that the wafer of compatible two kinds of sizes, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have There is the extremely strong market competitiveness.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 be Fig. 1 along A-A to cross-sectional view.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
It is a kind of modified form dual platen IC card chip mould group as shown in Fig. 1-2, which includes being set to The FPC plate 21 of 1 upper surface of substrate, the wafer 22 being set on FPC plate 21 and several this is fixed on by insulating cement water layer 23 On FPC plate 21 and it is used as the stainless steel of terminal or copper contact chip 24 and several coppers for being fixed on 1 lower end surface of substrate connect foot 26, It is provided with the first wafer slot 211 in the FPC plate 21 and is set in the first wafer slot 211 and size is less than the first wafer slot 211 the second wafer slot 212, the wafer 22 are fixed in first wafer slot 212 or the second wafer slot 212, and every copper is led 26 one end of pin extends to 22 side of wafer, and is electrically connected with a pin of wafer 22 by welding gold thread, and every 26 other end of copper connecting plate and a piece of stainless steel or copper contact chip 24 are electrically connected;The stainless steel or copper contact chip 24 are located at On same plane, and interval is formed between adjacent two stainless steel or copper contact chip 24.The utility model is in IC card chip mould group 2 Upper surface and lower end surface difference composite stainless steel or copper contact chip 24 and copper connecting plate 26, entire IC card is greatly enhanced with this The structural strength of chip module 2, and IC card chip mould group 2 is used as terminal using stainless steel contact chip and connects with the external world, this is stainless The cost of material is low for steel contact chip, and intensity is big and wear-resisting property is ideal, wear-resisting, will not cause larger mill after being used for a long time Damage so that can guarantee conducting quality, and then improves communication quality, and the utility model structure is relatively simple, enables the utility model With the extremely strong market competitiveness.In addition, the weld part 261 of every copper connecting plate 26 extends to 22 side of wafer, and with collection It is electrically connected at a pin of circuit 22 by weldering gold thread, gold thread degree is lowered significantly with this, and can guarantee welding quality, Enable the utility model that there is the extremely strong market competitiveness.Furthermore the first wafer slot 211 and setting are provided in the FPC plate 21 In the first wafer slot 211 and size less than the first wafer slot 211 the second wafer slot 212, the wafer 22 be fixed on this first In wafer slot 212 or the second wafer slot 212, so that the wafer of compatible two kinds of sizes, adaptability is high, and good compatibility makes With more flexible, enable the utility model that there is the extremely strong market competitiveness.
The stainless steel or copper contact chip 24 with a thickness of 0.02mm-0.07mm;The copper connecting plate 26 with a thickness of 0.03mm-0.05mm。
The electric conductivity of the copper connecting plate 26 is more preferably.
It includes connecting bridge 262 and the weld part 261 for taking shape in 262 one end of connecting bridge that the copper, which connects foot 26, Weld part 261 can be extended at a distance from the pin of wafer by connecting bridge 262, so that shortening the length of gold thread, the company as far as possible 262 surface of bridge is connect coated with insulating layer, will not be influenced across the different stainless steel of at least two panels or copper contact chip 24 Electric conductivity.The weld part 261 is in disk-shaped or strip, wherein and 261 both ends of weld part of strip are used as pad, By welding gold thread connection between the pad and the pin of wafer 22, and is formed and electrically conducted.
The copper connecting plate 26, substrate 1, FPC plate 21 are provided with corresponding blind hole, and filled with conduction in the blind hole Column of material, the conduction material stock column are contacted and are connected with stainless steel or copper contact chip 24, make copper connecting plate 26 and stainless steel or copper Contact chip 24 electrically conducts.Wherein, the conduction material stock column is conductive polymer rubber column gel column.Either, the conduction material stock column is Tin cream column.
The quantity of the stainless steel or copper contact chip 24 is six or eight;The quantity of the copper connecting plate 26 is Six or eight, and corresponded with stainless steel or copper contact chip 24, and be connected.
In this present embodiment, the stainless steel or copper contact chip 24 use stainless steel or copper contact chip, without the use of copper Contact chip.
In conclusion the utility model is in the upper surface of IC card chip mould group 2 and lower end surface difference composite stainless steel or copper Contact chip 24 and copper connecting plate 26 greatly enhance the structural strength of entire IC card chip mould group 2, and IC card chip mould group with this 2 using stainless steel contact chips be used as terminal is connected with the external world, the cost of material is low for the stainless steel contact chip, intensity greatly and wear-resisting property Ideal, it is wear-resisting, larger abrasion will not be caused after being used for a long time, so that can guarantee conducting quality, and then improves communication matter Amount, and the utility model structure is relatively simple, and the utility model is enabled to have the extremely strong market competitiveness.In addition, every copper connects The weld part 261 of fishplate bar 26 extends to 22 side of wafer, and is electrically connected with a pin of integrated circuit 22 by weldering gold thread, Lower gold thread degree significantly with this, and can guarantee welding quality, enables the utility model that there is the extremely strong market competitiveness.Again Person is provided with the first wafer slot 211 in the FPC plate 21 and is set in the first wafer slot 211 and size is less than the first wafer Second wafer slot 212 of slot 211, the wafer 22 are fixed in first wafer slot 212 or the second wafer slot 212, so that compatible The wafer of two kinds of sizes, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have extremely strong city Field competitiveness.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap It includes in present utility model application the scope of the patents.

Claims (7)

1. modified form dual platen IC card chip mould group, it is characterised in that: the IC card chip mould group (2) includes being set to substrate (1) It the FPC plate (21) of upper surface, the wafer (22) being set on FPC plate (21) and several is fixed on by insulating cement water layer (23) On the FPC plate (21) and it is used as the stainless steel or copper contact chip (24) and several coppers for being fixed on substrate (1) lower end surface of terminal It connects foot (26), be provided with the first wafer slot (211) in the FPC plate (21) and be set in the first wafer slot (211) and ruler Very little the second wafer slot (212) less than the first wafer slot (211), the wafer (22) are fixed on first wafer slot (211) or In two wafer slots (212), every copper connects foot (26) one end and extends to wafer (22) side, and draws with one of wafer (22) Foot is electrically connected by welding gold thread, and every copper connects foot (26) other end and a piece of stainless steel or copper contact chip (24) It is electrically connected;The stainless steel or copper contact chip (24) are in the same plane, and adjacent two stainless steel or copper contact chip (24) Between be formed with interval.
2. modified form dual platen IC card chip mould group according to claim 1, it is characterised in that: the copper connects foot It (26) include connecting bridge (262) and the weld part (261) for taking shape in connecting bridge (262) one end, connecting bridge (262) table Face is coated with insulating layer, which is in disk-shaped or strip, wherein is made at weld part (261) both ends of strip It for pad, is connect between the pad and the pin of wafer (22) by welding gold thread, and is formed and electrically conducted.
3. modified form dual platen IC card chip mould group according to claim 1, it is characterised in that: the copper connects foot (26), substrate (1), FPC plate (21) are provided with corresponding blind hole, and conduction material stock column, the conduction material are filled in the blind hole Stock column is contacted and is connected with stainless steel or copper contact chip (24), and copper is made to connect foot (26) and stainless steel or copper contact chip (24) electricity Property conducting.
4. modified form dual platen IC card chip mould group according to claim 3, it is characterised in that: the conduction material stock column is Conductive polymer rubber column gel column.
5. modified form dual platen IC card chip mould group according to claim 3, it is characterised in that: the conduction material stock column is Tin cream column.
6. modified form dual platen IC card chip mould group described in -5 any one according to claim 1, it is characterised in that: described The quantity of stainless steel or copper contact chip (24) is six or eight;The quantity that the copper connects foot (26) is six or eight It is a, and corresponded with stainless steel or copper contact chip (24), and be connected.
7. modified form dual platen IC card chip mould group according to claim 6, it is characterised in that: the stainless steel or copper connect Contact (24) with a thickness of 0.02mm-0.07mm;The copper connect foot (26) with a thickness of 0.03mm-0.05mm.
CN201821718517.4U 2018-10-23 2018-10-23 Modified form dual platen IC card chip mould group Active CN209044663U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821718517.4U CN209044663U (en) 2018-10-23 2018-10-23 Modified form dual platen IC card chip mould group

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821718517.4U CN209044663U (en) 2018-10-23 2018-10-23 Modified form dual platen IC card chip mould group

Publications (1)

Publication Number Publication Date
CN209044663U true CN209044663U (en) 2019-06-28

Family

ID=67037048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821718517.4U Active CN209044663U (en) 2018-10-23 2018-10-23 Modified form dual platen IC card chip mould group

Country Status (1)

Country Link
CN (1) CN209044663U (en)

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