CN209044662U - A kind of modified form double-interface card band - Google Patents

A kind of modified form double-interface card band Download PDF

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Publication number
CN209044662U
CN209044662U CN201821718499.XU CN201821718499U CN209044662U CN 209044662 U CN209044662 U CN 209044662U CN 201821718499 U CN201821718499 U CN 201821718499U CN 209044662 U CN209044662 U CN 209044662U
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China
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copper
wafer
stainless steel
conductive layer
strip
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CN201821718499.XU
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Chinese (zh)
Inventor
刘瑛
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Dongguan Three Smart Card Technology Co Ltd
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Dongguan Three Smart Card Technology Co Ltd
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Abstract

The utility model discloses a kind of modified form double-interface card band comprising strip-like body and at least two rows of IC card chip mould groups;IC card chip mould group includes that FPC plate, wafer and stainless steel or copper contact chip and copper connect foot, the first wafer slot and the second wafer slot are equipped in FPC plate, the wafer is fixed in first wafer slot or the second wafer slot, every copper connects foot one end and extends to wafer side, and it is electrically connected with a pin of wafer by welding gold thread, and the every copper connecting plate other end and a piece of stainless steel or copper contact chip are electrically connected;Stainless steel or copper contact chip are in the same plane, and are formed with interval between adjacent two stainless steel or copper contact chip;FPC plate lower end surface is equipped with first day, the second antenna contacts, first, second antenna contacts are electrically connected with a pin of wafer respectively, and the respectively arranged first, second thickening conductive layer in the first, second antenna contacts lower end surface protrudes from the strip-like body lower end surface and copper connects outside the end face of underfooting.

Description

A kind of modified form double-interface card band
Technical field:
The utility model relates to fields of communication technology, refer in particular to a kind of modified form double-interface card band.
Background technique:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics Chip insertion meets in the card base of 7816 standard of ISO, is made into card form.Communication modes between IC card and reader can be with It is contact, is also possible to contactless.IC card is divided into Contact Type Ic Card, non-contact IC and double interfaces according to communication interface Block (being provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication, The fields such as bank, telecommunications, public transport, parking lot management are just more and more applied, such as the electricity of China second-generation identity card, bank Sub- wallet, the SIM cards of mobile phones of telecommunications, the bus card of public transport, subway card, parking card for collecting parking fee etc., all exist It plays an important role in people's daily life.
Double-interface card includes IC card chip mould group in the prior art, which is all made of the day of two planes Line contact is contacted with antenna, and needs to be fixed and be connected using scolding tin in the later period, this assembling structure is relatively complicated, and operates It is inconvenient, and the later period also needs to adhere to IC card chip mould group on card by glue.In addition, double boundaries in the prior art The IC card chip mould group of face card, which is all made of copper sheet and carries out contact with the external world as terminal, to be connected, but copper sheet material is at high cost, by force Degree is not enough and wear-resisting property is not ideal enough, easy to wear, so that conducting quality is influenced due to wearing larger after long-term use, into And influence communication quality.Furthermore IC card chip mould group is only capable of being applicable in a kind of wafer of size, and poor compatibility is unfavorable for improving The market competitiveness.
In view of this, the present inventor proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of modified form double-interface card band.
In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the modified form double-interface card item Band includes that strip-like body and at least two rows of IC card chip mould groups being set in the strip-like body, the strip-like body two sides are equal Several location holes are provided with, which is in rectangle;The IC card chip mould group includes the FPC for being set to strip-like body upper surface Plate, the wafer being set on FPC plate and several stainless steels for being fixed on the FPC plate and being used as terminal by insulating cement water layer Or copper contact chip and several coppers for being fixed on strip-like body lower end surface connect foot, are provided with the first wafer slot in the FPC plate Be set in the first wafer slot and size is less than the second wafer slot of the first wafer slot, which is fixed on first wafer slot Or second in wafer slot, every copper connects foot one end and extends to wafer side, and passes through weldering gold thread with a pin of wafer It is electrically connected, and the every copper connecting plate other end and a piece of stainless steel or copper contact chip are electrically connected;The stainless steel Or copper contact chip is in the same plane, and is formed with interval between adjacent two stainless steel or copper contact chip;FPC plate lower end Face is additionally provided with first antenna contact and the second antenna contacts, the first antenna contact and the second antenna contacts respectively with wafer One pin is electrically connected, and the first antenna contact and the second antenna contacts lower end surface are respectively arranged with the first thickening conductive layer Conductive layer is thickeied with second, the first thickening conductive layer and the second thickening conductive layer protrude from the strip-like body lower end surface and copper It guides outside pin lower end surface.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are plating Metal layer passes through plating mode and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are tin cream Layer, passes through a process of tin and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, the copper connects foot and includes connecting bridge and take shape in the connection The weld part of bridge one end, the connecting bridge surface are coated with insulating layer, which is in disk-shaped or strip, wherein strip Weld part both ends be used as pad, by welding gold thread connection between the pad and the pin of wafer, and form electrical property Conducting.
Furthermore, in above-mentioned technical proposal, the copper connecting plate, strip-like body, FPC plate are provided with corresponding Blind hole, and conduction material stock column is filled in the blind hole, which contacts and is connected with stainless steel or copper contact chip, makes copper Connecting plate processed electrically conducts with stainless steel or copper contact chip.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is conductive polymer rubber column gel column.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is tin cream column.
Furthermore, in above-mentioned technical proposal, the quantity of the stainless steel or copper contact chip is six or eight;Institute The quantity for the copper connecting plate stated is six or eight, and is corresponded with stainless steel or copper contact chip, and be connected.
After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art it is practical It is novel to be additionally provided with the first thickening conduction in the first antenna contact of IC card chip mould group lower end surface setting and the second antenna contacts Layer and second thickeies conductive layer, and the first thickening conductive layer and the second thickening conductive layer protrude from the band body and stainless steel and connect Outside contact pin, so that the IC card chip mould group later period, after being installed on card, which thickeies conduction Layer difference directly contacts point contact with the antenna of card two, without being welded and fixed, only passes through glue for IC card chip mould Group adheres on card, and structure is more simple, and makes more convenient.The utility model is in IC card chip mould group Upper surface and lower end surface difference composite stainless steel or copper contact chip and copper connecting plate, entire IC card chip is greatly enhanced with this The structural strength of mould group, and IC card chip mould group is used as terminal using stainless steel contact chip and connects with the external world, stainless steel contact Sheet material is at low cost, and intensity is big and wear-resisting property is ideal, wear-resisting, will not cause larger abrasion after being used for a long time, so that It can guarantee conducting quality, and then improve communication quality, and the utility model structure is relatively simple, enable the utility model have extremely strong The market competitiveness.In addition, the weld part of every copper connecting plate extends to wafer side, and a pin with integrated circuit It is electrically connected by weldering gold thread, gold thread degree is lowered significantly with this, and can guarantee welding quality, enable the utility model that there is pole The strong market competitiveness.Furthermore it is provided with the first wafer slot in the FPC plate and is set in the first wafer slot and size is less than Second wafer slot of the first wafer slot, the wafer are fixed in first wafer slot or the second wafer slot, so that compatible two kinds of rulers The wafer of very little size, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have extremely strong market competition Power.
Detailed description of the invention:
Fig. 1 is the main view of the utility model;
Fig. 2 is the rearview of the utility model;
Fig. 3 is the structural schematic diagram of IC card chip mould group in the utility model;
Fig. 4 be Fig. 3 along A-A to cross-sectional view.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
It is a kind of modified form double-interface card band as shown in Fig. 1-4 comprising strip-like body 1 and at least two rows of settings IC card chip mould group 2 in the strip-like body 1.
1 two sides of strip-like body are provided with several location holes 11, which is in rectangle, which is same as It is positioned with extraneous positioning mold, so as to the working process in later period.
The IC card chip mould group 2 includes the FPC plate 21 for being set to 1 upper surface of strip-like body, is set on FPC plate 21 Wafer 22 and several stainless steels or copper contact chip 24 for being fixed on the FPC plate 21 and being used as terminal by insulating cement water layer 23 Foot 26 is connected with several coppers for being fixed on 1 lower end surface of strip-like body, 211 He of the first wafer slot is provided in the FPC plate 21 It is set in the first wafer slot 211 and size is less than the second wafer slot 212 of the first wafer slot 211, which is fixed on this In first wafer slot 212 or the second wafer slot 212, every copper connects 26 one end of foot and extends to 22 side of wafer, and and wafer 22 pin is electrically connected by welding gold thread, and every 26 other end of copper connecting plate connects with a piece of stainless steel or copper Contact 24 is electrically connected;The stainless steel or copper contact chip 24 are in the same plane, and adjacent two stainless steel or copper contact chip Interval is formed between 24.21 lower end surface of FPC plate is additionally provided with first antenna contact 28 and the second antenna contacts 29, this One antenna contacts 28 and the second antenna contacts 29 are electrically connected with a pin of wafer 22 respectively, and the first antenna contact 28 Be respectively arranged with the first thickening conductive layer 281 and second with 29 lower end surface of the second antenna contacts and thicken conductive layer 291, this first plus Thick conductive layer 281 and the second thickening conductive layer 291 protrudes from 1 lower end surface of strip-like body and copper connects 26 lower end surface of foot Outside.The first antenna contact 28 and the second antenna contacts 29 that the utility model is arranged in 2 lower end surface of IC card chip mould group are also set up There is the first thickening conductive layer 281 and second to thicken conductive layer 291, which thickeies conductive layer 291 Protrude from outside the band body 1 and stainless steel connection sheet 26, thus 2 later period of IC card chip mould group after being installed on card, The first thickening conductive layer 281 and second thickeies conductive layer 291 respectively directly with the contact point contact of the antenna of card two, is not necessarily to Using being welded and fixed, only IC card chip mould group 2 is adhered on card by glue, structure is more simple, and makes Get up more convenient.In addition, the utility model is in the upper surface of IC card chip mould group 2 and lower end surface difference composite stainless steel or copper Contact chip 24 and copper connecting plate 26 greatly enhance the structural strength of entire IC card chip mould group 2, and IC card chip mould group with this 2 using stainless steel contact chips be used as terminal is connected with the external world, the cost of material is low for the stainless steel contact chip, intensity greatly and wear-resisting property Ideal, it is wear-resisting, larger abrasion will not be caused after being used for a long time, so that can guarantee conducting quality, and then improves communication matter Amount, and the utility model structure is relatively simple, and the utility model is enabled to have the extremely strong market competitiveness.In addition, every copper connects The weld part 261 of fishplate bar 26 extends to 22 side of wafer, and is electrically connected with a pin of integrated circuit 22 by weldering gold thread, Lower gold thread degree significantly with this, and can guarantee welding quality, enables the utility model that there is the extremely strong market competitiveness.Again Person is provided with the first wafer slot 211 in the FPC plate 21 and is set in the first wafer slot 211 and size is less than the first wafer Second wafer slot 212 of slot 211, the wafer 22 are fixed in first wafer slot 212 or the second wafer slot 212, so that compatible The wafer of two kinds of sizes, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have extremely strong city Field competitiveness.
The first thickening conductive layer 281 and the second thickening conductive layer 291 are electroplated metal layer, pass through plating side Formula is fixed on 29 lower end surface of the first antenna contact 28 and the second antenna contacts.Either, described first thickeies 281 He of conductive layer Second thickening conductive layer 291 is tin paste layer, passes through a process of tin and is fixed on the first antenna contact 28 and the second antenna 29 lower end surface of contact.
It includes connecting bridge 262 and the weld part 261 for taking shape in 262 one end of connecting bridge that the copper, which connects foot 26, Weld part 261 can be extended at a distance from the pin of wafer by connecting bridge 262, so that shortening the length of gold thread, the company as far as possible 262 surface of bridge is connect coated with insulating layer, will not be influenced across the different stainless steel of at least two panels or copper contact chip 24 Electric conductivity.The weld part 261 is in disk-shaped or strip, wherein and 261 both ends of weld part of strip are used as pad, By welding gold thread connection between the pad and the pin of wafer 22, and is formed and electrically conducted.
The copper connecting plate 26, strip-like body 1, FPC plate 21 are provided with corresponding blind hole, and are filled in the blind hole Conduction material stock column, the conduction material stock column are contacted and are connected with stainless steel or copper contact chip 24, make copper connecting plate 26 and stainless steel Or copper contact chip 24 electrically conducts.Wherein, the conduction material stock column is conductive polymer rubber column gel column.Either, the conductive material Column is tin cream column.
The quantity of the stainless steel or copper contact chip 24 is six or eight;The quantity of the copper connecting plate 26 is Six or eight, and corresponded with stainless steel or copper contact chip 24, and be connected.
In this present embodiment, the stainless steel or copper contact chip 24 use stainless steel or copper contact chip, without the use of copper Contact chip.
In conclusion first antenna contact 28 that the utility model is arranged in 2 lower end surface of IC card chip mould group and second day Line contact 29 is additionally provided with the first thickening conductive layer 281 and second and thickeies conductive layer 291, this first thickeies conductive layer 281 and the Two thickening conductive layers 291 protrude from outside the band body 1 and stainless steel connection sheet 26, so that 2 later period of IC card chip mould group exists After being installed on card, the first thickening conductive layer 281 and the second thickening conductive layer 291 directly connect with the antenna of card two respectively Contact contact is only adhered to IC card chip mould group 2 on card by glue, structure without being welded and fixed It is more simple, and make more convenient.The utility model is compound in the upper surface of IC card chip mould group 2 and lower end surface difference Stainless steel or copper contact chip 24 and copper connecting plate 26 greatly enhance the structural strength of entire IC card chip mould group 2, and IC with this Card chip mould group 2 is used as terminal using stainless steel contact chip and connects with the external world, and the cost of material is low for the stainless steel contact chip, and intensity is big And wear-resisting property is ideal, and it is wear-resisting, larger abrasion will not be caused after being used for a long time, so that can guarantee conducting quality, in turn Communication quality is improved, and the utility model structure is relatively simple, enables the utility model that there is the extremely strong market competitiveness.In addition, The weld part 261 of every copper connecting plate 26 extends to 22 side of wafer, and passes through weldering gold with a pin of integrated circuit 22 Line is electrically connected, and lowers gold thread degree significantly with this, and can guarantee welding quality, the utility model is enabled to have extremely strong market Competitiveness.Furthermore it is provided with the first wafer slot 211 in the FPC plate 21 and is set in the first wafer slot 211 and size is less than Second wafer slot 212 of the first wafer slot 211, the wafer 22 are fixed in first wafer slot 212 or the second wafer slot 212, So that the wafer of compatible two kinds of sizes, adaptability is high, and good compatibility, use is more flexible, and the utility model is enabled to have The extremely strong market competitiveness.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap It includes in present utility model application the scope of the patents.

Claims (8)

1. modified form double-interface card band comprising strip-like body (1) and at least two rows are set in the strip-like body (1) IC card chip mould group (2), strip-like body (1) two sides are provided with several location holes (11), which is in rectangle;
It is characterized by: the IC card chip mould group (2) includes the FPC plate (21) for being set to strip-like body (1) upper surface, setting It several are fixed in the wafer (22) on FPC plate (21) and by insulating cement water layer (23) on the FPC plate (21) and are used as end The stainless steel or copper contact chip (24) of son and several coppers for being fixed on strip-like body (1) lower end surface connect foot (26), the FPC It is provided with the first wafer slot (211) in plate (21) and is set in the first wafer slot (211) and size is less than the first wafer slot (211) the second wafer slot (212), the wafer (22) are fixed in first wafer slot (211) or the second wafer slot (212), Every copper connects foot (26) one end and extends to wafer (22) side, and is formed with a pin of wafer (22) by welding gold thread It is electrically connected, and every copper connects foot (26) other end and a piece of stainless steel or copper contact chip (24) is electrically connected;It is described not Rust steel or copper contact chip (24) are in the same plane, and are formed with interval between adjacent two stainless steel or copper contact chip (24); FPC plate (21) lower end surface is additionally provided with first antenna contact (28) and the second antenna contacts (29), the first antenna contact (28) with the second antenna contacts (29) respectively with a pin of wafer (22) be electrically connected, and the first antenna contact (28) and Second antenna contacts (29) lower end surface is respectively arranged with the first thickening conductive layer (281) and second and thickeies conductive layer (291), this One thickeies conductive layer (281) and the second thickening conductive layer (291) protrudes from strip-like body (1) lower end surface and copper connects foot (26) outside lower end surface.
2. modified form double-interface card band according to claim 1, it is characterised in that: described first thickeies conductive layer (281) and the second thickening conductive layer (291) is electroplated metal layer, passes through plating mode and is fixed on the first antenna contact (28) and the second antenna contacts (29) lower end surface.
3. modified form double-interface card band according to claim 1, it is characterised in that: described first thickeies conductive layer (281) and the second thickening conductive layer (291) is tin paste layer, passes through a process of tin and is fixed on the first antenna contact (28) With the second antenna contacts (29) lower end surface.
4. modified form double-interface card band according to claim 2 or 3, it is characterised in that: the copper connects foot (26) It include connecting bridge (262) and the weld part (261) for taking shape in connecting bridge (262) one end, which applies It is covered with insulating layer, which is in disk-shaped or strip, wherein weld part (261) both ends of strip are as weldering Contact is connect between the pad and the pin of wafer (22) by welding gold thread, and is formed and electrically conducted.
5. modified form double-interface card band according to claim 1, it is characterised in that: the copper connects foot (26), band Shape main body (1), FPC plate (21) are provided with corresponding blind hole, and conduction material stock column, the conduction material stock column are filled in the blind hole It contacts and is connected with stainless steel or copper contact chip (24), so that copper is connected foot (26) and electrically led with stainless steel or copper contact chip (24) It is logical.
6. modified form double-interface card band according to claim 5, it is characterised in that: the conduction material stock column is macromolecule Conductive rubber column gel column.
7. modified form double-interface card band according to claim 5, it is characterised in that: the conduction material stock column is tin cream Column.
8. modified form double-interface card band according to claim 1, it is characterised in that: the stainless steel or copper contact chip (24) quantity is six or eight;The copper connect foot (26) quantity be six or eight, and with stainless steel or copper Contact chip (24) corresponds, and is connected.
CN201821718499.XU 2018-10-23 2018-10-23 A kind of modified form double-interface card band Active CN209044662U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821718499.XU CN209044662U (en) 2018-10-23 2018-10-23 A kind of modified form double-interface card band

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821718499.XU CN209044662U (en) 2018-10-23 2018-10-23 A kind of modified form double-interface card band

Publications (1)

Publication Number Publication Date
CN209044662U true CN209044662U (en) 2019-06-28

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Application Number Title Priority Date Filing Date
CN201821718499.XU Active CN209044662U (en) 2018-10-23 2018-10-23 A kind of modified form double-interface card band

Country Status (1)

Country Link
CN (1) CN209044662U (en)

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