CN208992994U - A mobile phone connector injection mold - Google Patents

A mobile phone connector injection mold Download PDF

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Publication number
CN208992994U
CN208992994U CN201821454293.0U CN201821454293U CN208992994U CN 208992994 U CN208992994 U CN 208992994U CN 201821454293 U CN201821454293 U CN 201821454293U CN 208992994 U CN208992994 U CN 208992994U
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water
mold
movable mold
cover half
cooling
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CN201821454293.0U
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王荣启
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Dongguan Dahui Precision Plastic Cement Technology Co ltd
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Dongguan Dahui Precision Plastic Cement Technology Co ltd
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Abstract

The utility model discloses a cell-phone connector injection mold, including the movable mould base, the lower side wall fixedly connected with movable mould of movable mould base, the movable mould chamber has been seted up to the lower side wall of movable mould, be equipped with the cover half base under the movable mould base, the last side wall fixedly connected with cover half of cover half base. The utility model discloses mould plastics and accomplish the back, the suction pump will be taken out and carry to the ponding intracavity in the movable mould through the inlet tube from the water storage box by the refrigerated water of semiconductor refrigeration piece, the cooling water passes through the cooling water course on the movable mould, outside connecting pipe, the cooling water course in the cover half flows to the water storage box through the outlet pipe, continue recycling after the cooling of semiconductor refrigeration piece once more, water economy resource, the quick cooling of plastic component is accelerated in the heat-conduction effect through cooling movable mould cover half, can avoid the long-time work of movable mould cover half to lead to the condition of high temperature work to take place the internal damage on the one hand, on the other hand shortens plastic component's the cycle of moulding plastics, and the.

Description

A kind of mobile phone connector injection mold
Technical field
The utility model relates to mobile phone connector production equipment technology more particularly to a kind of mobile phone connector injection moulds Tool.
Background technique
Mobile phone connector is electronic component important in mobile phone, their quality be directly related to mobile phone quality and its The reliability used.The quality problems after sale of the mobile phone overwhelming majority are also mostly related to connector, and mobile phone connector is mostly metal With plastics mixture, it usually needs first produce plastic components, hardware is being filled to mobile phone could be completed in plastic components The production of connector.
The mode being molded to injection mold is generally taken to carry out the production of mobile phone connector plastic components, note in the prior art It also needs to wait its complete cooling that could take out out of cover half after the completion of modeling, causes injection cycle long, injection efficiency is low.
Utility model content
Purpose of the utility model is to solve the problems in background techniques, and a kind of mobile phone connector injection molding proposed Mold.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of mobile phone connector injection mold, including dynamic model pedestal, the lower wall of the dynamic model pedestal are fixedly connected with dynamic Mould, the lower wall of the dynamic model offer dynamic model chamber, and the dynamic model pedestal is arranged right below cover half pedestal, the cover half pedestal Upper side wall be fixedly connected with cover half, the upper side wall of the cover half offers cover half chamber, the dynamic model chamber and the common structure of cover half chamber At injection molding cavity, offer the first injection molding duct and the second injection molding duct in the dynamic model pedestal and dynamic model jointly, the dynamic model with Cooling body and guiding mechanism are equipped between cover half.
Preferably, the cooling body includes the ponding chamber being symmetrically provided in dynamic model and cover half, and the ponding chamber is adopted With spherical structure, the cooling water channel being obliquely installed, and cooling water are symmetrically offered about ponding chamber in the dynamic model and cover half Road is connected to ponding chamber, is communicated with and is connect jointly far from one end of ponding chamber with the cooling water channel in cover half positioned at dynamic model Pipe, the connecting tube are soft pipe, and the bottom of the ponding chamber in cover half is communicated with outlet pipe, and the outlet pipe is separate One end of ponding chamber is connected with water storage box, and the water storage box is communicated with water inlet pipe, and the water inlet pipe is passed through far from one end of water storage box It wears dynamic model pedestal and is connected to the ponding chamber in dynamic model, suction pump, the lateral wall of the water storage box are installed on the water inlet pipe Installing port is offered, the inner wall of the installing port is sealed and installed with multiple semiconductor chilling plates.
Preferably, the connecting tube, water inlet pipe and outlet pipe are all made of heat-resistant tube.
Preferably, the two sides outer wall of the cover half is symmetrically welded with fixed frame, the one end one of the fixed frame far from cover half It is body formed to have fixed ring, the fixed ring and connecting tube clearance fit.
Preferably, the chill surface of multiple semiconductor chilling plates is respectively positioned on the inside of water storage box, multiple semiconductors The heating surface of cooling piece is located at the outside of water storage box.
Preferably, the guiding mechanism includes multiple guide posts for being fixedly connected on dynamic model lower wall, the cover half it is upper Side wall offers the pilot hole with multiple guide post clearance fits, and the guide post and pilot hole are all made of cylindrical structure.
Compared with prior art, the advantages of this mobile phone connector injection mold, is:
1, the first injection molding duct of setting and the second injection molding duct, the single injection molding duct compared to traditional injection moulding are molded faster, Improve injection efficiency;
2, after the completion of being molded, the water to be freezed by semiconductor chilling plate is extracted out out of water storage box and passes through water inlet pipe by suction pump The ponding being delivered in dynamic model is intracavitary, and cooling water passes through the cooling water in the cooling water channel on dynamic model, external connecting tube, cover half Road is simultaneously flow in water storage box by outlet pipe, is continued to be recycled after semiconductor chilling plate is cooling again, is saved water resource, leads to The conduction of heat of supercooling dynamic model cover half accelerates the rapid cooling of plastic components, on the one hand can avoid dynamic model cover half long-time work Work leads to hot operation damage there is a situation where in, on the other hand shortens the injection cycle of plastic components, improves speed of production and effect Rate.
Detailed description of the invention
Fig. 1 be the utility model proposes a kind of mobile phone connector injection mold structural schematic diagram;
Fig. 2 be the utility model proposes a kind of mobile phone connector injection-moulded parts cross-sectional view;
Fig. 3 be the utility model proposes a kind of structure that is connect with fixed ring of mobile phone connector injection mold fixed frame show It is intended to.
In figure: 1 dynamic model pedestal, 2 dynamic models, 3 dynamic model chambers, 4 cover half pedestals, 5 cover half, 6 cover half chambers, 7 guide posts, 8 pilot holes, 9 ponding chambers, 10 cooling water channels, 11 connecting tubes, 12 fixed frames, 13 fixed rings, 14 first injection molding ducts, 15 second injection molding ducts, 16 water inlet pipes, 17 outlet pipes, 18 water storage boxes, 19 semiconductor chilling plates, 20 suction pumps.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.
Referring to Fig.1-3, a kind of mobile phone connector injection mold, including dynamic model pedestal 1, the lower wall of dynamic model pedestal 1 are fixed It is connected with dynamic model 2, the lower wall of dynamic model 2 offers dynamic model chamber 3, and dynamic model pedestal 1 is arranged right below cover half pedestal 4, cover half bottom The upper side wall of seat 4 is fixedly connected with cover half 5, and the upper side wall of cover half 5 offers cover half chamber 6, dynamic model chamber 3 and the common structure of cover half chamber 6 At injection molding cavity, the first injection molding duct 14 and the second injection molding duct 15, setting first are offered in dynamic model pedestal 1 and dynamic model 2 jointly Injection molding duct 14 single injection molding duct injection efficiency compared with the second injection molding duct 15 faster, between dynamic model 2 and cover half 5 is equipped with cold But mechanism and guiding mechanism.
More specifically, referring to Fig.1-2, cooling body includes the ponding chamber 9 being symmetrically provided in dynamic model 2 and cover half 5, product Water cavity 9 uses spherical structure, symmetrically offers the cooling water channel 10 being obliquely installed about ponding chamber 9 in dynamic model 2 and cover half 5, And cooling water channel 10 is connected to ponding chamber 9, is further illustrated, the cooling water channel 10 on dynamic model 2 is tilted far from one end of ponding chamber 9 Down-set, the cooling water channel 10 on cover half 5 tilts upward setting far from one end of ponding chamber 9, is arranged in this way, cooling water It will be flowed under the effect of gravity;
The one end of cooling water channel 10 far from ponding chamber 9 in dynamic model 2 and cover half 5 is communicated with connecting tube 11 jointly, even Adapter tube 11 is soft pipe, and the bottom of the ponding chamber 9 in cover half 5 is communicated with outlet pipe 17, and outlet pipe 17 is far from ponding chamber 9 One end is connected with water storage box 18, and water storage box 18 is communicated with water inlet pipe 16, and water inlet pipe 16 runs through dynamic model far from one end of water storage box 18 Pedestal 1 is simultaneously connected to the ponding chamber 9 in dynamic model 2, suction pump 20 is equipped on water inlet pipe 16, the lateral wall of water storage box 18 offers Installing port, the inner wall of installing port are sealed and installed with multiple semiconductor chilling plates 19.
Further, connecting tube 11, water inlet pipe 16 and outlet pipe 17 are all made of heat-resistant tube, connecting tube 11,16 and of water inlet pipe 17 heat resistance of outlet pipe is good.
Further, referring to Fig.1-2, the two sides outer wall of cover half 5 is symmetrically welded with fixed frame 12, and fixed frame 12 is far from cover half 5 one end is fixed since connecting tube 11 is hose integrally formed with fixed ring 13, fixed ring 13 and 11 clearance fit of connecting tube Ring 13 can avoid the bending of connecting tube 11 when dynamic model 2 is bonded with cover half 5 and enter the case where being damaged between dynamic model 2 and cover half 5.
Further, referring to Fig.1, the chill surface of multiple semiconductor chilling plates 19 is respectively positioned on the inside of water storage box 18, multiple The heating surface of semiconductor chilling plate 19 is located at the outside of water storage box 18, and chill surface freezes to the water in water storage box 18, generates Heat will be spread outside heat by heating surface.
More specifically, referring to Fig.1-2, guiding mechanism includes multiple guide posts 7 for being fixedly connected on 2 lower wall of dynamic model, it is fixed The upper side wall of mould 5 offers the pilot hole 8 with multiple 7 clearance fits of guide post, and guide post 7 and pilot hole 8 are all made of cylindrical type Structure realizes the positioning between dynamic model 2 and cover half 5 using the clearance fit between multiple guide posts 7 and multiple pilot holes 8.
It further illustrates, is above fixedly connected unless specifically defined or limited otherwise, otherwise it shall be understood in a broad sense, for example, It can be welding, be also possible to gluing, or be integrally formed the customary means well known to those skilled in the art such as setting.
In the utility model, realized between dynamic model 2 and cover half 5 first with guide post 7 and the clearance fit of pilot hole 8 The plastic high voltage of heated thawing is injected injection molding cavity by the first injection molding duct 14 and the second injection molding duct 15 by pre-determined bit, injection molding machine Interior, after the completion of injection molding, the water to be freezed by semiconductor chilling plate 19 is extracted out out of water storage box 18 and passes through water inlet pipe by suction pump 20 16 are delivered in the ponding chamber 9 in dynamic model 2, and cooling water passes through the cooling water channel 10 on dynamic model 2, external connecting tube 11, cover half 5 Interior cooling water channel 10 is simultaneously flow in water storage box 18 by outlet pipe 17, is continued cycling through after semiconductor chilling plate 19 is cooling again It uses.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model Within enclosing.

Claims (6)

1.一种手机连接器注塑模具,包括动模底座(1),其特征在于,所述动模底座(1)的下侧壁固定连接有动模(2),所述动模(2)的下侧壁开设有动模腔(3),所述动模底座(1)的正下方设有定模底座(4),所述定模底座(4)的上侧壁固定连接有定模(5),所述定模(5)的上侧壁开设有定模腔(6),所述动模腔(3)与定模腔(6)共同构成注塑腔,所述动模底座(1)与动模(2)内共同开设有第一注塑孔道(14)与第二注塑孔道(15),所述动模(2)与定模(5)之间设有冷却机构与导向机构。1. An injection mold for a mobile phone connector, comprising a movable mold base (1), characterized in that a movable mold (2) is fixedly connected to the lower side wall of the movable mold base (1), and the movable mold (2) A movable mold cavity (3) is opened on the lower side wall of the movable mold base (1), a fixed mold base (4) is arranged directly under the movable mold base (1), and a fixed mold is fixedly connected to the upper side wall of the fixed mold base (4). (5), the upper side wall of the fixed mold (5) is provided with a fixed mold cavity (6), the movable mold cavity (3) and the fixed mold cavity (6) together form an injection cavity, and the movable mold base ( 1) A first injection hole (14) and a second injection hole (15) are opened together with the movable mold (2), and a cooling mechanism and a guide mechanism are arranged between the movable mold (2) and the fixed mold (5). . 2.根据权利要求1所述的一种手机连接器注塑模具,其特征在于,所述冷却机构均包括对称开设在动模(2)与定模(5)内的积水腔(9),所述积水腔(9)采用球形结构,所述动模(2)与定模(5)内均关于积水腔(9)对称开设有倾斜设置的冷却水道(10),且冷却水道(10)与积水腔(9)连通,位于动模(2)与定模(5)内的所述冷却水道(10)远离积水腔(9)的一端共同连通有连接管(11),所述连接管(11)为软质管,位于定模(5)内的所述积水腔(9)的底部连通有出水管(17),所述出水管(17)远离积水腔(9)的一端连接有蓄水箱(18),所述蓄水箱(18)连通有进水管(16),所述进水管(16)远离蓄水箱(18)的一端贯穿动模底座(1)并与动模(2)内的积水腔(9)连通,所述进水管(16)上安装有抽水泵(20),所述蓄水箱(18)的外侧壁开设有安装口,所述安装口的内壁密封安装有多个半导体制冷片(19)。2 . The injection mold for a mobile phone connector according to claim 1 , wherein the cooling mechanism comprises a water accumulation cavity ( 9 ) symmetrically opened in the movable mold ( 2 ) and the fixed mold ( 5 ), 2 . The water accumulation cavity (9) adopts a spherical structure, and both the movable mold (2) and the fixed mold (5) are provided with cooling water channels (10) arranged symmetrically with respect to the water accumulation cavity (9), and the cooling water channels ( 10) is communicated with the water accumulation cavity (9), and the cooling water channel (10) located in the movable mold (2) and the fixed mold (5) is communicated with a connecting pipe (11) at one end away from the water accumulation cavity (9), The connecting pipe (11) is a soft pipe, and a water outlet pipe (17) is communicated with the bottom of the water accumulation cavity (9) in the fixed mold (5), and the water outlet pipe (17) is far away from the water accumulation chamber (17). 9) One end is connected with a water storage tank (18), the water storage tank (18) is connected with a water inlet pipe (16), and the end of the water inlet pipe (16) away from the water storage tank (18) penetrates through the movable mold base ( 1) and communicate with the water storage cavity (9) in the movable mold (2), the water inlet pipe (16) is installed with a suction pump (20), and the outer side wall of the water storage tank (18) is provided with an installation port , a plurality of semiconductor refrigeration chips (19) are sealed and installed on the inner wall of the installation port. 3.根据权利要求2所述的一种手机连接器注塑模具,其特征在于,所述连接管(11)、进水管(16)和出水管(17)均采用耐热管。3 . The injection mold for a mobile phone connector according to claim 2 , wherein the connecting pipe ( 11 ), the water inlet pipe ( 16 ) and the water outlet pipe ( 17 ) are all made of heat-resistant pipes. 4 . 4.根据权利要求2所述的一种手机连接器注塑模具,其特征在于,所述定模(5)的两侧外壁对称焊接有固定架(12),所述固定架(12)远离定模(5)的一端一体成型有固定环(13),所述固定环(13)与连接管(11)间隙配合。4. An injection mold for a mobile phone connector according to claim 2, characterized in that a fixing frame (12) is symmetrically welded on both outer walls of the fixed mold (5), and the fixing frame (12) is far away from the fixed frame (12). One end of the mold (5) is integrally formed with a fixing ring (13), and the fixing ring (13) is in clearance fit with the connecting pipe (11). 5.根据权利要求2所述的一种手机连接器注塑模具,其特征在于,多个所述半导体制冷片(19)的制冷面均位于蓄水箱(18)的内部,多个所述半导体制冷片(19)的发热面位于蓄水箱(18)的外部。5 . The injection mold for a mobile phone connector according to claim 2 , wherein the cooling surfaces of the plurality of semiconductor cooling sheets ( 19 ) are located inside the water storage tank ( 18 ), and the plurality of semiconductor cooling sheets ( 19 ) are located in the water storage tank ( 18 ). The heating surface of the refrigeration sheet (19) is located outside the water storage tank (18). 6.根据权利要求1所述的一种手机连接器注塑模具,其特征在于,所述导向机构包括多个固定连接在动模(2)下侧壁的导向柱(7),所述定模(5)的上侧壁开设有与多个导向柱(7)间隙配合的导向孔(8),所述导向柱(7)与导向孔(8)均采用圆柱型结构。6 . The injection mold for a mobile phone connector according to claim 1 , wherein the guide mechanism comprises a plurality of guide posts ( 7 ) fixedly connected to the lower side wall of the movable mold ( 2 ). The upper side wall of (5) is provided with guide holes (8) which are clearance-fitted with a plurality of guide columns (7), and the guide columns (7) and the guide holes (8) both adopt cylindrical structures.
CN201821454293.0U 2018-09-06 2018-09-06 A mobile phone connector injection mold Active CN208992994U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081602A (en) * 2019-10-29 2020-04-28 西安智强科技有限公司 Resin packaging device and method for electronic component
CN113059771A (en) * 2021-04-27 2021-07-02 深圳市恒大伟业塑胶有限公司 Injection mold with quick unloading function
CN115891054A (en) * 2022-11-04 2023-04-04 杨阳 A new type of plastic injection mold
CN116330601A (en) * 2023-05-26 2023-06-27 沈阳金杯李尔汽车座椅有限公司 Seat production forming device
CN116461065A (en) * 2023-05-05 2023-07-21 浙江巨丰模架有限公司 Injection molding die carrier with good heat dissipation performance and heat dissipation method thereof
CN118528500A (en) * 2024-07-23 2024-08-23 贵阳甬鑫塑管制造有限公司 Injection mold of plastic anticreep spare

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081602A (en) * 2019-10-29 2020-04-28 西安智强科技有限公司 Resin packaging device and method for electronic component
CN113059771A (en) * 2021-04-27 2021-07-02 深圳市恒大伟业塑胶有限公司 Injection mold with quick unloading function
CN115891054A (en) * 2022-11-04 2023-04-04 杨阳 A new type of plastic injection mold
CN116461065A (en) * 2023-05-05 2023-07-21 浙江巨丰模架有限公司 Injection molding die carrier with good heat dissipation performance and heat dissipation method thereof
CN116330601A (en) * 2023-05-26 2023-06-27 沈阳金杯李尔汽车座椅有限公司 Seat production forming device
CN118528500A (en) * 2024-07-23 2024-08-23 贵阳甬鑫塑管制造有限公司 Injection mold of plastic anticreep spare

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