CN208788787U - A kind of flexible circuit board stamping die - Google Patents
A kind of flexible circuit board stamping die Download PDFInfo
- Publication number
- CN208788787U CN208788787U CN201721765246.3U CN201721765246U CN208788787U CN 208788787 U CN208788787 U CN 208788787U CN 201721765246 U CN201721765246 U CN 201721765246U CN 208788787 U CN208788787 U CN 208788787U
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- upper die
- stripper
- formed punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to circuit board stamping mould technical field more particularly to a kind of flexible circuit board stamping dies, the lower mold assemblies including upper die component and below upper die component；Upper die component is connected with lower mold assemblies by guiding mechanism；Stripper is equipped between upper die component and lower mold assemblies, stripper is slidably connected by discharging screw and upper die component, and elastic component is equipped between stripper and upper die component, and the surface of stripper is equipped with buffer layer；Upper die component is equipped with formed punch, and formed punch is equipped with mirror surface portion；Punching corresponding with formed punch is additionally provided on lower mold assemblies.When the flexible circuit board stamping die works, flexible circuit sheet feeding belt is placed on lower mold assemblies, upper die component pushes, formed punch and punching cooperation, flexible circuit board is punched out, formed punch is equipped with mirror surface portion, when punching press, mirror surface portion will not be bonded with flexible circuit board, to reduce the fraction defective of flexible circuit panel products.
Description
Technical field
The utility model relates to circuit board stamping mould technical field more particularly to a kind of flexible circuit board stamping dies.
Background technique
Flexible circuit board is the printed circuit made of insulating substrate flexible.In the production process of flexible circuit board,
It needs to be punched out process to flexible circuit board using stamping die.But traditional flexible circuit board stamping die, formed punch
Excessively coarse, after punching, formed punch be easy to cause circuit thread breakage, and formed punch is easy and product bonding, causes damage of product, product
Fraction defective is high.
Therefore, it is urgent to provide a kind of flexible circuit board stamping dies, so as to solve the deficiencies in the prior art.
Utility model content
The utility model aim is, for a kind of flexible circuit board stamping die that the prior art is insufficient and provides.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is as follows:
A kind of flexible circuit board stamping die, the lower die group including upper die component and below the upper die component
Part；The upper die component is connected with the lower mold assemblies by guiding mechanism；Between the upper die component and the lower mold assemblies
Equipped with stripper, the stripper is slidably connected by discharging screw and the upper die component, the stripper and the upper mold
Elastic component is equipped between component, the surface of the stripper is equipped with buffer layer；The upper die component is equipped with formed punch, the punching
Head is equipped with mirror surface portion；Punching corresponding with the formed punch is additionally provided on the lower mold assemblies.
More preferably, the mirror surface portion is set on the surface of the formed punch, and the surface roughness in the mirror surface portion is Ra0.1
~Ra1.0.
More preferably, the upper die component includes the fixed plate set gradually from the bottom to top, backing plate and cope plate, the formed punch
In the fixed plate；Upper guide post is additionally provided in the fixed plate, the stripper and the upper guide post are slidably connected.
More preferably, the lower mold assemblies include the cavity plate in lower template and the fixed lower die plate surface, the punching
On the cavity plate.
More preferably, the guiding mechanism includes guide-post of die-set and mold guide sleeve corresponding with the guide-post of die-set, institute
The one end for stating guide-post of die-set is fixedly arranged on the cope plate and sequentially passes through the backing plate, the fixed plate and the stripper；
The mold guide sleeve is set on the cavity plate.
More preferably, the buffer layer with a thickness of 0.1~1.0mm；The buffer layer is silica gel buffer layer.
More preferably, the elastic component is set between the stripper and the backing plate, and the elastic component is elastic rubber.
The utility model has the following beneficial effects: flexible circuit sheet feeding belt is placed when the flexible circuit board stamping die works
On lower mold assemblies, upper die component is pushed, and formed punch and punching cooperation are punched out flexible circuit board, formed punch is equipped with mirror surface
Portion, when punching press, mirror surface portion will not be bonded with flexible circuit board, the damage to flexible circuit board be reduced, to reduce flexible circuit
The fraction defective of panel products.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of flexible circuit board stamping die of the utility model；
Fig. 2 is the structural schematic diagram of the formed punch in the utility model.
Specific embodiment
The utility model is further described below with reference to embodiment, this is the preferred embodiment of the utility model.
As shown in Figs. 1-2, a kind of flexible circuit board stamping die, including upper die component 1 and be set to the upper die component 1
The lower mold assemblies 2 of lower section；The upper die component 1 connects 3 by guiding mechanism with the lower mold assemblies 2；1 He of upper die component
It is equipped with stripper 4 between the lower mold assemblies 2, is equipped with the discharging screw 41 being slidably connected with it, the discharging in upper die component 1
Plate 4 is slidably connected by discharging screw 41 and the upper die component 1, and bullet is equipped between the stripper 4 and the upper die component 1
Property part 42, the surface of the stripper 4 is equipped with buffer layer 43；The upper die component 1 is equipped with formed punch 11, the formed punch 11
It is equipped with mirror surface portion 111；Punching 21 corresponding with the formed punch 11 is additionally provided on the lower mold assemblies 2.
When the flexible circuit board stamping die works, flexible circuit sheet feeding belt is placed on lower mold assemblies 2, upper die component 1
It pushing, formed punch 11 and punching 21 cooperate, and are punched out to flexible circuit board, and formed punch 11 is equipped with mirror surface portion 111, when punching press, mirror
Face 111 will not be bonded with flexible circuit board, the damage to flexible circuit board be reduced, to reduce flexible circuit panel products not
Yield.And the surface of stripper 4 is equipped with buffer layer 43, buffer layer 43 plays buffer function, when reducing 4 punching press of stripper pair
The impact force of flexible circuit board.After completing punching press, upper die component 1 rises, and stripper 4 plays the role of discharging, prevents product from being rushed
Headband rises；Meanwhile waste material is fallen from punching 21 after punching.
Referring to Fig. 2, the mirror surface portion 111 is set on the surface of the formed punch 11, the surface in the mirror surface portion 111 is thick
Rugosity is Ra0.1~Ra1.0.
Referring to Fig. 1, the upper die component 1 includes fixed plate 12, backing plate 13 and the cope plate set gradually from the bottom to top
14, the formed punch 11 is fixedly arranged in the fixed plate 12 by bolt；Upper guide post 121, institute are fixedly provided in the fixed plate 12
Upper guide post 121 is stated through the stripper 4, the stripper 4 and the upper guide post 121 are slidably connected.Cope plate 14 plays peace
Dress and fixed effect.Backing plate 13 plays buffer function, resists impact force when punching press.Fixed plate 12 is used to fix formed punch 11,
Prevent formed punch 11 from deviating.The effect of upper guide post 121 is to play guiding role to stripper 4.
Referring to Fig. 1, the lower mold assemblies 2 include the cavity plate on lower template 22 and fixed 22 surface of the lower template
23, the punching 21 is set on the cavity plate 23.
Referring to Fig. 1, the guiding mechanism 3 includes guide-post of die-set 31 and mold corresponding with the guide-post of die-set 31
Guide sleeve 32, one end of the guide-post of die-set 31 are fixedly arranged on the cope plate 14 and sequentially pass through the backing plate 13, the fixation
Plate 12 and the stripper 4；The mold guide sleeve 32 is set on the cavity plate 23.Guide-post of die-set 31 and mold guide sleeve 32 cooperate,
Upper die component 1 and lower mold assemblies 2 is set to be closed well.
Referring to Fig. 1, the buffer layer 43 with a thickness of 0.1~1.0mm；The buffer layer 43 is silica gel buffer layer.
Referring to Fig. 1, the elastic component 42 is set between the stripper 4 and the backing plate 13, the elastic component 42 is
Elastic rubber.Elastic component 42 plays the role of elasticity extruding to stripper 4.
The utility model has the following beneficial effects: flexible circuit sheet feeding belt is placed when the flexible circuit board stamping die works
On lower mold assemblies, upper die component is pushed, and formed punch and punching cooperation are punched out flexible circuit board, formed punch is equipped with mirror surface
Portion, when punching press, mirror surface portion will not be bonded with flexible circuit board, the damage to flexible circuit board be reduced, to reduce flexible circuit
The fraction defective of panel products.
The utility model is not limited to the above embodiment, it is all using structure similar with the utility model and its method come real
All modes of existing the utility model aim, both are within the protection scope of the present invention.
Claims (7)
1. a kind of flexible circuit board stamping die, the lower mold assemblies including upper die component and below the upper die component；
The upper die component is connected with the lower mold assemblies by guiding mechanism；It is equipped between the upper die component and the lower mold assemblies
Stripper, the stripper are slidably connected by discharging screw and the upper die component, it is characterised in that: the stripper and institute
It states and is equipped with elastic component between upper die component, the surface of the stripper is equipped with buffer layer；The upper die component is equipped with formed punch,
The formed punch is equipped with mirror surface portion；Punching corresponding with the formed punch is additionally provided on the lower mold assemblies.
2. flexible circuit board stamping die according to claim 1, it is characterised in that: the mirror surface portion is set to the formed punch
Surface on, the surface roughness in the mirror surface portion is Ra0.1~Ra1.0.
3. flexible circuit board stamping die according to claim 1, it is characterised in that: the upper die component include by down toward
On the fixed plate, backing plate and the cope plate that set gradually, the formed punch is set in the fixed plate；It is additionally provided in the fixed plate
Guide post, the stripper and the upper guide post are slidably connected.
4. flexible circuit board stamping die according to claim 3, it is characterised in that: the lower mold assemblies include lower template
And the cavity plate in the fixed lower die plate surface, the punching are set on the cavity plate.
5. flexible circuit board stamping die according to claim 4, it is characterised in that: the guiding mechanism includes that mold is led
Column and mold guide sleeve corresponding with the guide-post of die-set, one end of the guide-post of die-set be fixedly arranged on the cope plate and according to
It is secondary to pass through the backing plate, the fixed plate and the stripper；The mold guide sleeve is set on the cavity plate.
6. flexible circuit board stamping die according to claim 1, it is characterised in that: the buffer layer with a thickness of 0.1
~1.0mm；The buffer layer is silica gel buffer layer.
7. flexible circuit board stamping die according to claim 3, it is characterised in that: the elastic component is set to the discharging
Between plate and the backing plate, the elastic component is elastic rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721765246.3U CN208788787U (en) | 2017-12-14 | 2017-12-14 | A kind of flexible circuit board stamping die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721765246.3U CN208788787U (en) | 2017-12-14 | 2017-12-14 | A kind of flexible circuit board stamping die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208788787U true CN208788787U (en) | 2019-04-26 |
Family
ID=66198258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721765246.3U Expired - Fee Related CN208788787U (en) | 2017-12-14 | 2017-12-14 | A kind of flexible circuit board stamping die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208788787U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111673836A (en) * | 2020-07-15 | 2020-09-18 | 赣州明高科技股份有限公司 | Anti-adhesion flexible circuit board stamping die |
-
2017
- 2017-12-14 CN CN201721765246.3U patent/CN208788787U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111673836A (en) * | 2020-07-15 | 2020-09-18 | 赣州明高科技股份有限公司 | Anti-adhesion flexible circuit board stamping die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190426 Termination date: 20201214 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |