CN208752658U - A kind of double-interface card - Google Patents
A kind of double-interface card Download PDFInfo
- Publication number
- CN208752658U CN208752658U CN201821399225.9U CN201821399225U CN208752658U CN 208752658 U CN208752658 U CN 208752658U CN 201821399225 U CN201821399225 U CN 201821399225U CN 208752658 U CN208752658 U CN 208752658U
- Authority
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- China
- Prior art keywords
- card
- antenna
- conductive layer
- guide
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003292 glue Substances 0.000 claims abstract description 11
- 239000004568 cement Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances data:image/svg+xml;base64,PD94bWwgdmVyc2lvbj0nMS4wJyBlbmNvZGluZz0naXNvLTg4NTktMSc/Pgo8c3ZnIHZlcnNpb249JzEuMScgYmFzZVByb2ZpbGU9J2Z1bGwnCiAgICAgICAgICAgICAgeG1sbnM9J2h0dHA6Ly93d3cudzMub3JnLzIwMDAvc3ZnJwogICAgICAgICAgICAgICAgICAgICAgeG1sbnM6cmRraXQ9J2h0dHA6Ly93d3cucmRraXQub3JnL3htbCcKICAgICAgICAgICAgICAgICAgICAgIHhtbG5zOnhsaW5rPSdodHRwOi8vd3d3LnczLm9yZy8xOTk5L3hsaW5rJwogICAgICAgICAgICAgICAgICB4bWw6c3BhY2U9J3ByZXNlcnZlJwp3aWR0aD0nMzAwcHgnIGhlaWdodD0nMzAwcHgnIHZpZXdCb3g9JzAgMCAzMDAgMzAwJz4KPCEtLSBFTkQgT0YgSEVBREVSIC0tPgo8cmVjdCBzdHlsZT0nb3BhY2l0eToxLjA7ZmlsbDojRkZGRkZGO3N0cm9rZTpub25lJyB3aWR0aD0nMzAwLjAnIGhlaWdodD0nMzAwLjAnIHg9JzAuMCcgeT0nMC4wJz4gPC9yZWN0Pgo8dGV4dCB4PScxMDAuNScgeT0nMTcwLjAnIGNsYXNzPSdhdG9tLTAnIHN0eWxlPSdmb250LXNpemU6NDBweDtmb250LXN0eWxlOm5vcm1hbDtmb250LXdlaWdodDpub3JtYWw7ZmlsbC1vcGFjaXR5OjE7c3Ryb2tlOm5vbmU7Zm9udC1mYW1pbHk6c2Fucy1zZXJpZjt0ZXh0LWFuY2hvcjpzdGFydDtmaWxsOiNFODQyMzUnID5IPC90ZXh0Pgo8dGV4dCB4PScxMjYuMScgeT0nMTg2LjAnIGNsYXNzPSdhdG9tLTAnIHN0eWxlPSdmb250LXNpemU6MjZweDtmb250LXN0eWxlOm5vcm1hbDtmb250LXdlaWdodDpub3JtYWw7ZmlsbC1vcGFjaXR5OjE7c3Ryb2tlOm5vbmU7Zm9udC1mYW1pbHk6c2Fucy1zZXJpZjt0ZXh0LWFuY2hvcjpzdGFydDtmaWxsOiNFODQyMzUnID4yPC90ZXh0Pgo8dGV4dCB4PScxMzguMCcgeT0nMTcwLjAnIGNsYXNzPSdhdG9tLTAnIHN0eWxlPSdmb250LXNpemU6NDBweDtmb250LXN0eWxlOm5vcm1hbDtmb250LXdlaWdodDpub3JtYWw7ZmlsbC1vcGFjaXR5OjE7c3Ryb2tlOm5vbmU7Zm9udC1mYW1pbHk6c2Fucy1zZXJpZjt0ZXh0LWFuY2hvcjpzdGFydDtmaWxsOiNFODQyMzUnID5PPC90ZXh0Pgo8L3N2Zz4K data:image/svg+xml;base64,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 O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound 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[Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
Abstract
The utility model discloses a kind of double-interface card, it includes card, the IC card chip structure for being installed on antenna that is in card and being spirally distributed and being fixedly installed in by glue in card, the IC card chip structure and antenna are electrically connected, the IC card chip structure includes the flexible circuit board positioned at bottom, integrated circuit and several terminal contacts being fixed on the flexible circuit board by insulating cement water layer on flexible circuit board, one pin of a piece of terminal contacts and integrated circuit electrically conducts, and flexible circuit board lower end surface is additionally provided with first, second antenna contacts, this first, second antenna contacts are electrically connected with a pin of integrated circuit respectively, the antenna ends are respectively equipped with first, second guide-joining plate, this first, the end face of second guide-joining plate is respectively arranged with first, second thickeies conductive layer, this One, the second thickening conductive layer is compressed with the first, second antenna contacts respectively contacts, and makes to be electrically connected for IC card chip structure and antenna.
Description
Technical field:
The utility model relates to fields of communication technology, refer in particular to a kind of double-interface card.
Background technique:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom
Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics
Chip insertion meets in the card base of 7816 standard of ISO, is made into card form.Communication modes between IC card and reader can be with
It is contact, is also possible to contactless.IC card is divided into Contact Type Ic Card, non-contact IC and Shuan Jie according to communication interface
Face card (is provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication,
The fields such as bank, telecommunications, public transport, parking lot management are just more and more applied, such as the electricity of China second-generation identity card, bank
Sub- wallet, the SIM cards of mobile phones of telecommunications, the bus card of public transport, subway card, parking card for collecting parking fee etc., all exist
It plays an important role in people's daily life.
The IC card chip structure of double-interface card is all made of the antenna contacts and antenna ends of two planes in the prior art
Guide-joining plate contact, and needing to fix and be connected using scolding tin, this assembling structure is relatively complicated, and operates and be inconvenient,
It also needs to adhere to IC card chip structure on card by glue in the later period.
In view of this, the present inventor proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of double-interface card.
In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the double-interface card includes card
Piece, be installed in card and the antenna being spirally distributed and the IC card chip knot being fixedly installed in by glue in card
Structure, the IC card chip structure and antenna are electrically connected, and the IC card chip structure includes the flexible circuit board for being located at bottom, setting
In on flexible circuit board integrated circuit and several terminal contacts being fixed on the flexible circuit board by insulating cement water layer,
One pin of a piece of terminal contacts and integrated circuit electrically conducts, and the flexible circuit board lower end surface is additionally provided with first antenna
Contact and the second antenna contacts, the first antenna contact and the second antenna contacts electrically connect with a pin of integrated circuit respectively
It connects, the antenna ends are respectively arranged with the first guide-joining plate and the second guide-joining plate, the end of first guide-joining plate and the second guide-joining plate
Face is respectively arranged with the first thickening conductive layer and second and thickeies conductive layer, which thickeies conductive layer point
It does not compress and contacts with the first antenna contact and the second antenna contacts, make to be electrically connected for IC card chip structure and antenna.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are plating
Metal layer passes through plating mode and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are tin cream
Layer, passes through a process of tin and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, a window, first guide-joining plate and second are provided in the card
Guide-joining plate is placed in the window；The IC card chip structure is fixed in the window by glue.
Furthermore, in above-mentioned technical proposal, the card is provided with insulation spacer in window, on the insulation spacer
End face and IC card chip structure lower end face contact.
After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art due to
The end face of first guide-joining plate and the second guide-joining plate is respectively set the first thickening conductive layer and second and thickeies conductive layer, first thickening
Conductive layer and the second thickening conductive layer can be supported directly with the first antenna contact and the second antenna contacts respectively in assembly
Press contacts make to be electrically connected for IC card chip structure and antenna, without being connected using welding procedure fixation, in the IC card chip
The structure later period after being installed on card, is directly adhered to IC card chip structure on card by glue, structure is more
To be simple, and make get up it is more convenient, enable the utility model have the extremely strong market competitiveness.
Detailed description of the invention:
Fig. 1 is the perspective view of the utility model；
Fig. 2 is the stereogram exploded view of the utility model；
Fig. 3 is the perspective view of IC card chip structure in the utility model；
Fig. 4 be Fig. 3 along A-A to cross-sectional view.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
As shown in Fig. 1-4, be a kind of double-interface card comprising have card 1, be installed in card 1 and divide in the shape of a spiral
The antenna 3 of cloth and the IC card chip structure 2 in card 1 is fixedly installed in by glue, the IC card chip structure 2 and antenna 3
It is electrically connected, the IC card chip structure 2 includes the flexible circuit board 21 for being located at bottom, the collection being set on flexible circuit board 21
At circuit 22 and several terminal contacts 24 being fixed on the flexible circuit board 21 by insulating cement water layer 23, a piece of terminal
Contact 24 and a pin of integrated circuit 22 electrically conduct, and 21 lower end surface of flexible circuit board is additionally provided with first antenna touching
Point 25 and the second antenna contacts 26, the first antenna contact 25 and the second antenna contacts 26 are drawn with one of integrated circuit 22 respectively
Foot is electrically connected, and 3 both ends of antenna are respectively arranged with the first guide-joining plate 31 and the second guide-joining plate 32,31 He of the first guide-joining plate
The end face of second guide-joining plate 32 is respectively arranged with the first thickening conductive layer 311 and second and thickeies conductive layer 321, which leads
Electric layer 311 and the second thickening conductive layer 321 are compressed and are contacted with the first antenna contact 25 and the second antenna contacts 26 respectively,
Make to be electrically connected for IC card chip structure 2 and antenna 3.Due to being set respectively in the end face of the first guide-joining plate 31 and the second guide-joining plate 32
It sets the first thickening conductive layer 311 and second and thickeies conductive layer 321, which thickeies conductive layer
321 directly can compress and contact with the first antenna contact 25 and the second antenna contacts 26 respectively in assembly, make for IC card
Chip structure 2 and antenna 3 are electrically connected, and without being connected using welding procedure fixation, are being pacified in 2 later period of IC card chip structure
After on card, directly IC card chip structure 2 is adhered on card by glue, structure is more simple, and makes
Make to get up more convenient, enables the utility model that there is the extremely strong market competitiveness.
The first thickening conductive layer 311 and the second thickening conductive layer 321 are electroplated metal layer, pass through plating side
Formula is fixed on 32 lower end surface of the first antenna contact 31 and the second antenna contacts.Either, described first thickeies 311 He of conductive layer
Second thickening conductive layer 321 is tin paste layer, passes through a process of tin and is fixed on the first antenna contact 31 and the second antenna
32 lower end surface of contact.
A window 11 is provided in the card 1, first guide-joining plate 31 and the second guide-joining plate 32 are placed in the window
In 11；The IC card chip structure 2 is fixed in the window 11 by glue.The card 1 is provided with insulation in window 11
Gasket 12,12 upper surface of insulation spacer and 2 lower end face contact of IC card chip structure.
In conclusion since the first thickening conductive layer is respectively set in the end face of the first guide-joining plate 31 and the second guide-joining plate 32
311 and second thicken conductive layer 321, and the first thickening conductive layer 311 and the second thickening conductive layer 321 can be direct in assembly
It compresses and contacts with the first antenna contact 25 and the second antenna contacts 26 respectively, make for 3 electricity of IC card chip structure 2 and antenna
Property connection, without using welding procedure fixation connecting, in 2 later period of IC the core of the card chip architecture after being installed on card, directly
IC card chip structure 2 is adhered on card by glue, structure is more simple, and makes more convenient, order
The utility model has the extremely strong market competitiveness.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model
Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap
It includes in present utility model application the scope of the patents.
Claims (5)
1. a kind of double-interface card comprising have card (1), be installed in card (1) and the antenna (3) that is spirally distributed with
And the IC card chip structure (2) in card (1) is fixedly installed in by glue, the IC card chip structure (2) and antenna (3) are electrically
Connection,
It is characterized by: the IC card chip structure (2) includes the flexible circuit board (21) for being located at bottom, is set to flexible circuit
Integrated circuit (22) and several ends being fixed on the flexible circuit board (21) by insulating cement water layer (23) on plate (21)
Sub- contact (24), a piece of terminal contacts (24) and a pin of integrated circuit (22) electrically conduct, and the flexible circuit board
(21) lower end surface is additionally provided with first antenna contact (25) and the second antenna contacts (26), the first antenna contact (25) and second
Antenna contacts (26) are electrically connected with a pin of integrated circuit (22) respectively, and antenna (3) both ends are respectively arranged with the
The end face of one guide-joining plate (31) and the second guide-joining plate (32), first guide-joining plate (31) and the second guide-joining plate (32) is respectively arranged with
First, which thickeies conductive layer (311) and second, thickeies conductive layer (321), which thickeies conduction
Layer (321) is compressed and is contacted with the first antenna contact (25) and the second antenna contacts (26) respectively, is made for IC card chip knot
Structure (2) and antenna (3) are electrically connected.
2. a kind of double-interface card according to claim 1, it is characterised in that: described first thickeies conductive layer (311) and the
Two to thicken conductive layer (321) be electroplated metal layer, passes through plating mode and is fixed on the first antenna contact (31) and the
Two antenna contacts (32) lower end surface.
3. a kind of double-interface card according to claim 1, it is characterised in that: described first thickeies conductive layer (311) and the
Two thickenings conductive layer (321) are tin paste layer, pass through a process of tin and are fixed on the first antenna contact (31) and second day
Line contact (32) lower end surface.
4. a kind of double-interface card according to claim 1 to 3, it is characterised in that: setting in the card (1)
Have a window (11), first guide-joining plate (31) and the second guide-joining plate (32) are placed in the window (11)；The IC card core
Chip architecture (2) is fixed in the window (11) by glue.
5. a kind of double-interface card according to claim 4, it is characterised in that: the card (1) setting in window (11)
There are insulation spacer (12), insulation spacer (12) upper surface and IC card chip structure (2) lower end face contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821399225.9U CN208752658U (en) | 2018-08-28 | 2018-08-28 | A kind of double-interface card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821399225.9U CN208752658U (en) | 2018-08-28 | 2018-08-28 | A kind of double-interface card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208752658U true CN208752658U (en) | 2019-04-16 |
Family
ID=66082208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821399225.9U Active CN208752658U (en) | 2018-08-28 | 2018-08-28 | A kind of double-interface card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208752658U (en) |
-
2018
- 2018-08-28 CN CN201821399225.9U patent/CN208752658U/en active Active
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