CN208534724U - Vehicle-mounted air conditioner compressor driver - Google Patents
Vehicle-mounted air conditioner compressor driver Download PDFInfo
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- CN208534724U CN208534724U CN201820917931.1U CN201820917931U CN208534724U CN 208534724 U CN208534724 U CN 208534724U CN 201820917931 U CN201820917931 U CN 201820917931U CN 208534724 U CN208534724 U CN 208534724U
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- bottom plate
- oxide
- radiating bottom
- air conditioner
- vehicle
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Abstract
The utility model discloses a kind of vehicle-mounted air conditioner compressor driver, wherein vehicle-mounted air conditioner compressor driver includes shell, radiating bottom plate, pcb board and heat carrier, wherein radiating bottom plate is set in shell, and is abutted against with the inner wall of shell；Pcb board interval is set to the side of radiating bottom plate, and pcb board has the mounting surface towards radiating bottom plate, and mounting surface is equipped with multiple metal-oxide-semiconductors；For heat carrier between radiating bottom plate and pcb board, heat carrier has the first thermal conductive surface and the second thermal conductive surface being oppositely arranged, and the first thermal conductive surface is abutted against with multiple metal-oxide-semiconductors, and the second thermal conductive surface is abutted against with the radiating bottom plate.The utility model vehicle-mounted air conditioner compressor driver is abutted the first thermal conductive surface of heat carrier with multiple metal-oxide-semiconductors by abutting radiating bottom plate with the inner wall of shell, and the second thermal conductive surface of heat carrier is abutted with radiating bottom plate.In this way, the heat of metal-oxide-semiconductor is directed at heat sink by heat carrier, then diffuses to the external world by shell, and whole device structure is simple, quick and easy for installation.
Description
Technical field
The utility model relates to field of drivers, in particular to a kind of vehicle-mounted air conditioner compressor driver.
Background technique
In existing vehicle-mounted air conditioner compressor driver, metal-oxide-semiconductor mostly uses more parallel technologies, and general metal-oxide-semiconductor reaches 20
Or more, every MOS requires to insulate with radiator, and so need a large amount of insulating trip and insulation grain to insulate with radiator,
Assembly technology is complicated, increases installation work-hour and difficulty, while increasing failure risk under the conditions of vehicle-mounted high vibration.And it drives
After dynamic device pcb board is installed into shell, radiator and drive enclosure by metal-oxide-semiconductor are fixed, to the installation position of the radiator of metal-oxide-semiconductor
It is high to set requirement, it not so can not be with drive enclosure close installation.
Utility model content
The main purpose of the utility model is to propose a kind of vehicle-mounted air conditioner compressor driver, it is desirable to provide a kind of structure letter
It is single, efficiently vehicle-mounted air conditioner compressor driver easier for installation.
To achieve the above object, the utility model proposes vehicle-mounted air conditioner compressor driver, including shell, wherein also
Including,
Radiating bottom plate is set in the shell, and the inner wall of the radiating bottom plate and the shell abuts against；
Pcb board, interval are set to the side of the radiating bottom plate, and the pcb board has the installation towards the radiating bottom plate
Face, the mounting surface are equipped with multiple metal-oxide-semiconductors；And
Heat carrier, between the radiating bottom plate and the pcb board, the heat carrier has be oppositely arranged first to lead
Hot face and the second thermal conductive surface, first thermal conductive surface are abutted against with multiple metal-oxide-semiconductors, second thermal conductive surface and the heat dissipation
Bottom plate abuts against.
Preferably, the heat carrier includes the first heat-conducting layer, and first heat-conducting layer includes multiple sub- thermally conductive sheets, Duo Gesuo
It states metal-oxide-semiconductor and forms multiple metal-oxide-semiconductor groups, multiple sub- thermally conductive sheets are arranged in a one-to-one correspondence with multiple metal-oxide-semiconductor groups.
Preferably, the heat carrier further includes the second heat-conducting layer, and multiple metal-oxide-semiconductor group spacing side by side are equipped with multirow, institute
The second heat-conducting layer is stated to be filled between the gap of adjacent rows metal-oxide-semiconductor group.
Preferably, the heat carrier is thermally conductive mud.
Preferably, installation part is convexly equipped on the radiating bottom plate, the pcb board is equipped with and is coupled with the installation part
Adapter, the installation part be adapted to the adapter it is fixed after, appearance is formed between the radiating bottom plate and the pcb board
Set the receiving gap of the heat carrier.
Preferably, stating shell includes:
It is open to be formed with the installation being packed into for the pcb board on the shell ontology for shell ontology；And
Lifting lug is installed, it is open to be detachably arranged at the installation.
Preferably, the shell further includes waterproof gasket, and the waterproof gasket is set to the installation lifting lug and the installation
Between opening.
Preferably, the shell ontology includes the bottom plate and top plate for being spaced and being oppositely arranged, and is set to the bottom plate and institute
State the first side plate and the second side plate of top plate two sides；The bottom plate, the first side plate of top plate and the second side plate enclose and set to form the shell
Ontology, it is open that the both ends of the shell ontology form two installations.
Preferably, the vehicle-mounted air conditioner compressor driver further includes connector, and the radiating bottom plate is equipped with the first peace
Fill hole, the bottom wall of the shell ontology is equipped with the second mounting hole, and the connector is arranged in first mounting hole and described the
Two mounting holes, to connect the radiating bottom plate and the shell ontology.
Preferably, multiple metal-oxide-semiconductors are encapsulated using patch.
The utility model vehicle-mounted air conditioner compressor driver makes to install by abutting radiating bottom plate with the inner wall of shell
There is the one side of the pcb board of multiple metal-oxide-semiconductors to be oppositely arranged with radiating bottom plate, and by the first thermal conductive surface of heat carrier and multiple metal-oxide-semiconductors
It abuts, the second thermal conductive surface of heat carrier is abutted with radiating bottom plate.In this way, the heat of metal-oxide-semiconductor successively imports heat dissipation by thermally conductive mud
Then bottom plate and shell are distributed to the external world, without so that each metal-oxide-semiconductor be both needed to patch insulating trip and cladding insulation grain, then and dissipate
Hot device connection, under the premise of meeting radiating requirements, while making whole device structure simple, and entirety is easier for installation
Fast.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model vehicle-mounted air conditioner compressor driver；
Fig. 2 is the decomposition texture schematic diagram that vehicle-mounted air conditioner compressor driver tilts an angle in Fig. 1；
Fig. 3 is the structural schematic diagram after pcb board and radiating bottom plate install in Fig. 1；
Fig. 4 is the structural schematic diagram of one embodiment of pcb board of the utility model vehicle-mounted air conditioner compressor driver；
Fig. 5 is the structural schematic diagram of one embodiment of heat carrier of the utility model vehicle-mounted air conditioner compressor driver；
Fig. 6 is the structural schematic diagram of one embodiment of radiating bottom plate of the utility model vehicle-mounted air conditioner compressor driver.
Drawing reference numeral explanation:
| Label | Title | Label | Title | Label | Title |
| 1 | Shell | 12 | Lifting lug is installed | 32 | Adapter |
| 11 | Shell ontology | 13 | Waterproof gasket | 4 | Heat carrier |
| 111 | Installation is open | 2 | Radiating bottom plate | 41 | First thermal conductive surface |
| 112 | Bottom plate | 21 | Installation part | 42 | Second thermal conductive surface |
| 113 | Top plate | 22 | First mounting hole | 43 | First heat-conducting layer |
| 114 | First side plate | 3 | Pcb board | 431 | Sub- thermally conductive sheet |
| 115 | Second side plate | 31 | Metal-oxide-semiconductor group | 44 | Second heat-conducting layer |
| 116 | Second mounting hole | 311 | Metal-oxide-semiconductor | 5 | Accommodate gap |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction is only used for explaining opposite between each component under a certain particular pose (as shown in the picture)
Positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.It in addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill
Based on personnel can be realized, this technical side will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of case is not present, also not within the protection scope of the requires of the utility model.
The utility model proposes a kind of vehicle-mounted air conditioner compressor drivers.
In the utility model embodiment, as shown in Figures 1 and 2, the vehicle-mounted air conditioner compressor driver, including shell 1,
Radiating bottom plate 2, pcb board 3 and heat carrier 4, wherein radiating bottom plate 2 is set in shell 1, and the inner wall of radiating bottom plate 2 and shell 1
It abuts against；The interval of pcb board 3 is set to the side of radiating bottom plate 2, and pcb board 3 has the mounting surface towards radiating bottom plate 2, on mounting surface
Equipped with multiple metal-oxide-semiconductors 311；For heat carrier 4 between radiating bottom plate 2 and pcb board 3, heat carrier 4 has be oppositely arranged first to lead
Hot face 41 and the second thermal conductive surface 42, the first thermal conductive surface 41 are abutted against with multiple metal-oxide-semiconductors 311, the second thermal conductive surface 42 and radiating bottom plate 2
It abuts against.
Here, the shape of shell 1 is without limitation, can be set to it is any needed for shape, only need can to accommodate pcb board 3 and
Radiating bottom plate 2, while shell 1 is that pcb board 3 and radiating bottom plate 2 disposed within provide basic insulation and water proof environment.
It is understood that the effect of radiating bottom plate 2 is radiated for metal-oxide-semiconductor 311, the heat of metal-oxide-semiconductor 311 is imported by heat carrier 4
It distributes on heat sink, then after being contacted by heat sink with shell 1 to the external world.The shape of radiating bottom plate 2 can be needed only without limitation
It abuts with 1 inner wall of shell, is abutted on one side with heat carrier 4 on one side.Pcb board 3 and the interval of radiating bottom plate 2 are arranged, metal-oxide-semiconductor 311
Then between pcb board 3 and the two opposite faces of radiating bottom plate 2.Metal-oxide-semiconductor 311 can be fixed on pcb board 3 by welding
On, it can also be inserted by using contact pin metal-oxide-semiconductor 311 in the jack of pcb board 3, or use patch type metal-oxide-semiconductor 311 by metal-oxide-semiconductor
311 are fixed on pcb board 3.
Can by pcb board 3 and metal-oxide-semiconductor 311 corresponding position punch, connected using connector such as screw, can also be with
Installation part 21 is set on pcb board 3 and on metal-oxide-semiconductor 311 and adapter 32 is directly installed.Heat carrier 4 is arranged in pcb board 3
And between radiating bottom plate 2, the heat of metal-oxide-semiconductor 311 is directed into radiating bottom plate 2 and is radiated.The shape of heat carrier 4 does not limit
It is fixed, it can be flake, strip or the other shapes of monolith, it is only necessary to have first abutted with multiple metal-oxide-semiconductors 311 thermally conductive
Face 41 and the second thermal conductive surface 42 abutted with radiating bottom plate 2.
The utility model vehicle-mounted air conditioner compressor driver makes to pacify by abutting radiating bottom plate 2 with the inner wall of shell 1
The one side of pcb board 3 equipped with multiple metal-oxide-semiconductors 311 is oppositely arranged with radiating bottom plate 2, and by the first thermal conductive surface 41 of heat carrier 4 with
Multiple metal-oxide-semiconductors 311 abut, and the second thermal conductive surface 42 of heat carrier 4 is abutted with radiating bottom plate 2.In this way, the heat of metal-oxide-semiconductor 311 passes through
Thermally conductive mud successively imports radiating bottom plate 2 and shell 1, then distributes to the external world, without so that each metal-oxide-semiconductor 311 is both needed to patch insulation
Piece and cladding insulation grain, then connected with radiator, under the premise of meeting radiating requirements, while making whole device structure simple
It is single, so that whole is easier for installation quick.
Further, please with reference to Fig. 4 and Fig. 5, heat carrier 4 includes the first heat-conducting layer 43, and the first heat-conducting layer 43 includes
Multiple sub- thermally conductive sheets 431, multiple metal-oxide-semiconductors 311 form multiple metal-oxide-semiconductor groups 31, multiple sub- thermally conductive sheets 431 and multiple metal-oxide-semiconductor groups 31
It is arranged in a one-to-one correspondence.In the present embodiment, the first heat-conducting layer 43 is divided into multiple sub- thermally conductive sheets 431, and every height is thermally conductive
In the covering to corresponding metal-oxide-semiconductor group 31 of piece 431, such first heat-conducting layer 43 only needs to cover the surface of metal-oxide-semiconductor group 31, no
The gap between adjacent metal-oxide-semiconductor group 31 must be covered, material is so not only saved, but also metal-oxide-semiconductor group 31 can be led by first
The all coverings of thermosphere 43, so that the heat dissipation effect of metal-oxide-semiconductor 311 is more preferable.
Further, heat carrier 4 further includes the second heat-conducting layer 44, multiple 31 spacing side by side of metal-oxide-semiconductor group be equipped with multirow, second
Heat-conducting layer 44 is filled between the gap of adjacent rows metal-oxide-semiconductor group 31.In the present embodiment, so that metal-oxide-semiconductor group 31 side by side and at
It is arranged at intervals with multirow, MOS can not only be made by the second heat-conducting layer 44 being filled between the gap of two adjacent two row metal-oxide-semiconductor groups 31
The heat dissipation of pipe 311 is more abundant, and can play the role of damping to a certain extent, so that the connection of metal-oxide-semiconductor 311 is more
It is reliable and stable.It is understood that the second heat-conducting layer 44 can be strip, it is arranged between adjacent rows metal-oxide-semiconductor 311, simultaneously
Second heat-conducting layer 44 has certain thickness, it is preferable that the thickness of the second heat-conducting layer 44 is concordant with the height of metal-oxide-semiconductor 311, so
So that the surface of the first heat-conducting layer 43 and the second heat-conducting layer 44 substantially on a horizontal plane, so that entirety is more smooth, is installed
It is more convenient.
Further, heat carrier 4 is thermally conductive mud.Using thermally conductive mud as heat carrier 4, thermally conductive work can be not only played
With, but also insulation can be played the role of, simultaneously as the particularity of the material of thermally conductive mud, additionally it is possible to play the work of damping
With so that whole stability more preferably, connects relatively reliable.
Further, please with reference to Fig. 3 and Fig. 6, be convexly equipped with installation part 21 on radiating bottom plate 2, pcb board 3 be equipped with
The adapter 32 that installation part 21 is coupled, after installation part 21 is adapted to fixation with adapter 32, between radiating bottom plate 2 and pcb board 3
It is formed with the receiving gap 5 of accommodating heat carrier 4.
In the present embodiment, installation part 21 can be wholely set with radiating bottom plate 2, can also be provided separately, radiating bottom plate 2
When being installed with pcb board 3, directly installation part 21 and adapter 32 are cooperated, so that whole is easier for installation quick.Peace
Support is played the role of in piece installing 21 to a certain extent, so that forming receiving gap 5 between pcb board 3 and radiating bottom plate 2 to accommodate
Heat carrier 4.
Specifically, installation part 21 is the installation sleeve for being convexly equipped in radiating bottom plate 2, and adapter 32 is inserted in for installation sleeve
Hole passes through the hole using screw and is threadedly engaged with installation sleeve when installation sleeve is inserted in into hole.In this way, just by PCB
The installation of plate 3 is on radiating bottom plate 2, and it is whole easier for installation to use the cooperation in installation sleeve and hole not only to make, and
The effect of positioning is also acted as, so that installation site is more accurate.In one embodiment, installation part 21 is pillar, and adapter 32 is
Mounting hole can be interference fit or transition fit between pillar and mounting hole, when so installing, it is only necessary to by pillar
Pcb board 3 can be installed to radiating bottom plate 2 after being installed in place with mounting hole, so that whole is easier for installation quick.
Further, Fig. 1 and Fig. 2 is please referred to, shell 1 includes: shell ontology 11 and installation lifting lug 12, is formed on shell ontology 11
There is the installation opening 111 being packed into for pcb board 3；Installation lifting lug 12 is detachably arranged at installation opening 111.Here, installation is open
111 install for pcb board 3 and radiating bottom plate 2 to shell ontology 11, after pcb board 3 and radiating bottom plate 2 are installed in place, use peace
The installation of lifting lug 12 is filled to opening 111 is installed, so that whole device installs.It is understood that installation opening 111 can be
One or two, accordingly, the quantity for installing lifting lug 12 can be one or two.
Further, shell 1 further includes waterproof gasket 13, and waterproof gasket 13 is set to installation lifting lug 12 and installation opening 111
Between.In installation lifting lug 12 and open 111 brackets are installed add waterproof gasket 13 can be to avoid steam from installation lifting lug 12 and installation
The installation place of opening 111 enters the inside of shell ontology 11, so that whole waterproof performance is more preferable.
Further, shell ontology 11 includes the bottom plate 112 and top plate 113 for being spaced and being oppositely arranged, and is set to bottom plate 112
With the first side plate 114 and the second side plate 115 of 113 two sides of top plate；Bottom plate 112, top plate 113, the first side plate 114 and the second side plate
115 enclose and set to form shell ontology 11, and the both ends of shell ontology 11 form two installation openings 111.
In the present embodiment, shell ontology 11 can use the shell 1 of monoblock type, by stretching, punching press or can be molded into
The mode of type is integrally formed, and shell ontology 11 is more preferable using the waterproof performance of monoblock type, and is easily installed.Certainly, shell ontology 11
Can be using seperated form, it can be by two pieces of top plates being oppositely arranged 113 and bottom plate 112 and the first side plate 114 and second
Side plate 115 is spliced.
Preferably, shell ontology 11 uses the technological forming stretched, shell ontology 11 needed for interception that so can be easy
Length.Meanwhile the stretched installation opening 111 positioned at both ends, in this way, allowing when installing from the installation opening 111 of two sides
In optional one, thus it is easier for installation quickly.And during installation, multiple metal-oxide-semiconductors 311 are fixed on pcb board 3 first,
Then pcb board 3 is fixed on radiating bottom plate 2, then the entirety that pcb board 3 and radiating bottom plate 2 are formed passes through shell ontology 11 together
The inside that are installed into shell ontology 11 of installation opening 111, reuse installation lifting lug 12 and be mounted at installation opening 111, it is entire to fill
It sets and installs.So that easier for installation quick, the installation effectiveness height of pcb board 3 and radiating bottom plate 2, and be easy to implement automatic
Change installation.
Further, the utility model vehicle-mounted air conditioner compressor driver further includes connector (not shown), radiating bottom plate 2
It is equipped with the first mounting hole 115, the bottom wall of shell ontology 11 is equipped with the second mounting hole 116, and connector is arranged in the first mounting hole
115 and second mounting hole 116, to connect radiating bottom plate 2 and shell ontology 11.Connector can be screw or bolt, work as connection
When part is screw, threaded hole can be set by the first mounting hole 115 and the second mounting hole 116, in this way, when installation, it is only necessary to
Screw is successively screwed in the second mounting hole 116 and the first mounting hole 115 to connect the radiating bottom plate 2 and shell ontology 11.From shell sheet
11 external connection radiating bottom plate 2 of body and shell 1, so that operation is more convenient.In one embodiment, the side of the first mounting hole 115
The flange towards pcb board 3 is convexly equipped at edge, the inner wall of the flange is equipped with internal screw thread.The flange for being provided with internal screw thread can be with
Increase threaded connection length when screw is connect with radiating bottom plate 2, so that radiating bottom plate 2 and the installation of shell 1 are more firm.
Further, multiple metal-oxide-semiconductors 311 are all made of patch encapsulation.In the present embodiment, multiple metal-oxide-semiconductors 311 are all made of patch
Piece encapsulation when installation, directly carries out patch operation using SMT machine, is not necessarily to after manually installed a lot of MOS plug-in unit again, avoids
Production process is complicated, so that whole mounting process is simpler.Peace relative to the metal-oxide-semiconductor 311 and radiator for using plug-in unit
311 pin of metal-oxide-semiconductor is easy by stress damage under the conditions of long-term vehicle-mounted vibration, and make vehicle-mounted air conditioner compressor driver can
It is reduced by property, metal-oxide-semiconductor 311 uses surface-mounted device, and after surface-mounted device is fixed on pcb board 3, pcb board 3 and radiating bottom plate 2 are also solid
After setting, metal-oxide-semiconductor 311 will not be influenced by vehicle-mounted high vibration environment, and anti-vibration effect is good, thus entire on-board air conditioner driver
Reliability it is higher.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of vehicle-mounted air conditioner compressor driver characterized by comprising
Shell；
Radiating bottom plate is set in the shell, and the inner wall of the radiating bottom plate and the shell abuts against；
Pcb board, interval are set to the side of the radiating bottom plate, and the pcb board has the mounting surface towards the radiating bottom plate, institute
Mounting surface is stated equipped with multiple metal-oxide-semiconductors；And
Heat carrier, between the radiating bottom plate and the pcb board, the heat carrier has the first thermal conductive surface being oppositely arranged
With the second thermal conductive surface, first thermal conductive surface is abutted against with multiple metal-oxide-semiconductors, second thermal conductive surface and the radiating bottom plate
It abuts against.
2. vehicle-mounted air conditioner compressor driver as described in claim 1, which is characterized in that the heat carrier includes first thermally conductive
Layer, first heat-conducting layer includes multiple sub- thermally conductive sheets, and multiple metal-oxide-semiconductors form multiple metal-oxide-semiconductor groups, and multiple sons are thermally conductive
Piece is arranged in a one-to-one correspondence with multiple metal-oxide-semiconductor groups.
3. vehicle-mounted air conditioner compressor driver as claimed in claim 2, which is characterized in that the heat carrier further includes second leading
Thermosphere, multiple metal-oxide-semiconductor group spacing side by side are equipped with multirow, and second heat-conducting layer is filled between adjacent rows metal-oxide-semiconductor group
Between gap.
4. vehicle-mounted air conditioner compressor driver as described in any one of claims 1-3, which is characterized in that the heat carrier is to lead
Warm sludge.
5. vehicle-mounted air conditioner compressor driver as described in any one of claims 1-3, which is characterized in that on the radiating bottom plate
It is convexly equipped with installation part, the pcb board is equipped with the adapter being coupled with the installation part, and the installation part is adapted to described
After part adaptation is fixed, the receiving gap for accommodating the heat carrier is formed between the radiating bottom plate and the pcb board.
6. vehicle-mounted air conditioner compressor driver as described in claim 1, which is characterized in that the shell includes:
It is open to be formed with the installation being packed into for the pcb board on the shell ontology for shell ontology；And
Lifting lug is installed, it is open to be detachably arranged at the installation.
7. vehicle-mounted air conditioner compressor driver as claimed in claim 6, which is characterized in that the shell further includes collision mat
Piece, the waterproof gasket are set between the installation lifting lug and installation opening.
8. vehicle-mounted air conditioner compressor driver as claimed in claims 6 or 7, which is characterized in that the shell ontology includes interval
And the bottom plate and top plate being oppositely arranged, and the first side plate and the second side plate set on the bottom plate and the top plate two sides；Institute
It states bottom plate, top plate, the first side plate and the second side plate and encloses and set to form the shell ontology, the both ends of the shell ontology form two peaces
Dress is open.
9. vehicle-mounted air conditioner compressor driver as claimed in claims 6 or 7, which is characterized in that the vehicle-mounted air conditioner compressor
Driver further includes connector, and the radiating bottom plate is equipped with the first mounting hole, and the bottom wall of the shell ontology is equipped with the second peace
Hole is filled, the connector is arranged in first mounting hole and second mounting hole, to connect the radiating bottom plate and described
Shell ontology.
10. such as the described in any item vehicle-mounted air conditioner compressor drivers of claim 1-3 and 6, which is characterized in that multiple described
Metal-oxide-semiconductor is encapsulated using patch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820917931.1U CN208534724U (en) | 2018-06-13 | 2018-06-13 | Vehicle-mounted air conditioner compressor driver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820917931.1U CN208534724U (en) | 2018-06-13 | 2018-06-13 | Vehicle-mounted air conditioner compressor driver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208534724U true CN208534724U (en) | 2019-02-22 |
Family
ID=65391344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820917931.1U Active CN208534724U (en) | 2018-06-13 | 2018-06-13 | Vehicle-mounted air conditioner compressor driver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208534724U (en) |
-
2018
- 2018-06-13 CN CN201820917931.1U patent/CN208534724U/en active Active
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