CN208509406U - A kind of set mold device improving pressing rivet bits - Google Patents

Abstract

The utility model discloses a die set device for improving the pressing of rivet chips, which comprises a template and a fixing pin module. The two longitudinal directions of the template are provided with three evenly opened operation ports for the convenience of the operator to take the plate. The surface of the template is uniformly provided with a plurality of pin positioning holes, and the surface of the fixed pin module is provided with fixed pin module positioning holes corresponding to the pin positioning holes. The utility model can effectively prevent the cross-contamination caused by copper scraps adhered to gloves and finger cots, thereby causing the problem of micro-short or short-circuit of the inner layer, and can adapt to plates of different thicknesses and sizes. The quality is significantly improved, and the production efficiency of the riveting machine is significantly improved.

Description

A die set device for improving the pressing of rivet chips

technical field

The utility model relates to the technical field of PCB multi-layer boards, in particular to a die set device for improving the pressing of rivet chips.

Background technique

Press-fit rivet chips are the largest source of foreign bodies and short-circuits in the press-fit inner layer. With the development of multi-layer boards produced in the PCB industry to high-level, high-performance and high-security, especially the production of automobiles, medical, aerospace Safety components such as aviation and power supply put forward higher requirements on the quality requirements of multi-layer boards.

At present, there is no more economical and reliable method and measure in the industry to effectively solve the problem of micro-short and short-circuit in the inner layer. It is a general direction to control the source of micro-short and inner-short from the production source, and to improve the rivet chips for pressing. To reduce the generation of rivet chips and copper chips, the most urgent task is to find a control technology to control the rivet chips and copper chips falling into the inner core board. Therefore, the existing technology of pressing and riveting needs to be improved and developed. The existing testing technology It is impossible to measure 100% of the laminated board with six or more layers. After the electrical test, the micro-short, especially the micro-short problem, has the risk of leakage and seriously affects the safety of the PCB. The existing short-pressing control technology usually uses manual cleaning of the board surface and cleaning equipment to prevent rivet chips from falling into the board. Using manual cleaning of the board surface not only has low production efficiency, is easy to clean and is not in place, but also has foreign objects such as rivet copper scraps. The phenomenon of anti-sticking of the board surface is easy to occur.

Utility model content

The purpose of this utility model is to solve the control technology of the short inside of pressing in the prior art, and the way of manually cleaning the board surface and cleaning equipment is usually used to prevent the rivet chips from falling into the board. Using manual cleaning of the board surface not only has low production efficiency, but also The cleaning is not in place, and foreign objects such as rivet copper scraps are prone to the problem of anti-sticking to the board surface, and a sleeve die device for improving the pressing of rivet scraps is proposed.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

A die set device for improving the pressing of rivet chips, comprising a template and a fixed pin module, the template has three evenly opened operation ports for easy access to the plate by two long sides of the template, and the template has a uniform surface. A plurality of pin positioning holes are provided, and the surface of the fixing pin module is provided with fixing pin module positioning holes corresponding to the pin positioning holes.

Preferably, the size of the operation port is 100mm*100mm.

Preferably, the position design of the pin positioning hole is consistent with the position of the OPE punching hole, the minimum positioning size is 15 inches, and each specification increases by 1 inch.

Preferably, the size of the template is 545mm*700mm, and the thickness of the template is 3.0mm.

Preferably, the size of the fixing pin module is 5mm*20mm, and the thickness is 3.0mm.

Preferably, the size of the positioning hole of the fixing pin module is Φ3.1 mm.

Preferably, the template is specifically a PCB board.

Compared with the prior art, the utility model provides a die set device for improving the pressing of rivet chips, which has the following beneficial effects:

1. The die set device for improving the pressing of rivet chips adopts the method of pre-set die during riveting, continuous operation in the production operation, one person sets the die, and one person rives to prevent the operator's gloves or finger cots from being cross-contaminated. Machine design Two sets of molds, the pin positioning hole design of the mold is consistent with the punching position of the inner OPE punching machine, which can realize any switching of the OPE punching size board, and can meet the current 0.4-10mm thickness of the multi-layer board in the PCB industry. Use, the precision of the mold can be adjusted to 0.075mm. The mold of the device adopts the PCB board surface to etch the copper surface and then drill the positioning holes. The bottom of the mold is fixed with pins. The first piece is to check whether the inner OPE punching is biased, and whether the rivet holes are defective. , According to the size of the positioning hole of the inner core plate, select the corresponding positioning hole of the die set, and fix it with the bottom pin, confirm the X-ray of the first plate to check whether the riveted plate has layer deviation, the height of the rivet, and the rivet blooming evenly, and the first piece is confirmed to be qualified After mass production, the pre-sleeve operator and the rivet operator work alone, and the die-sleeve operator and the rivet operator cannot cross each other, which can effectively prevent the gloves and finger cots from sticking to the copper chips to cause cross-contamination and cause the inner layer to be slightly short or short-circuited. Problems, and can adapt to plates of different thicknesses and sizes, the riveting sleeve adopts continuous operation mode, the quality is significantly improved, and the production efficiency of the riveting machine is significantly improved.

In addition, the parts not involved in the device are the same as the existing technology or can be realized by using the existing technology. The utility model can effectively prevent the cross-contamination of the copper scraps on the gloves and finger cots, thereby causing the inner layer to be slightly short or short-circuited. Problems, and can adapt to plates of different thicknesses and sizes, the riveting sleeve adopts continuous operation mode, the quality is significantly improved, and the production efficiency of the riveting machine is significantly improved.

Description of drawings

Fig. 1 is a kind of structural schematic diagram of the sleeve die device for improving the pressing of rivet chips proposed by the utility model;

FIG. 2 is a schematic structural diagram of a fixing pin module of a die set device for improving pressing of rivet chips proposed by the utility model.

In the picture: 1 template, 2 fixed pin module, 3 operation port, 4 pin positioning hole, 5 fixed pin module positioning hole.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inside", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation , are constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

Referring to Fig. 1-2, a die set device for improving the pressing of rivet chips includes a template 1 and a fixing pin module 2. The template 1 is provided with three evenly opened operation ports on the two long sides for the convenience of the operator to take the plate. 3. A plurality of pin positioning holes 4 are evenly opened on the surface of the template 1, and a fixed pin module positioning hole 5 corresponding to the pin positioning holes 4 is opened on the surface of the fixed pin module 2.

The size of the operation port 3 is 100mm*100mm.

The position design of pin positioning hole 4 is the same as the punching position of OPE. The minimum positioning size is 15 inches, and each specification increases by 1 inch.

The size of the template 1 is 545mm*700mm, and the thickness of the template 1 is 3.0mm.

The size of the fixing pin module 2 is 5mm*20mm, and the thickness is 3.0mm.

The size of the positioning hole 5 of the fixing pin module is Φ3.1mm.

Template 1 is specifically a PCB board.

In the utility model, when used, the method of pre-sleeping the die during riveting is adopted, continuous operation in the production operation, one person sets the die, and one person rives, so as to prevent the cross-contamination of the operator's gloves or finger cots, and each riveting machine is designed with two sets of molds , The design of pin positioning hole 4 of the mold is consistent with the punching position of the inner OPE punching machine, which can realize any switching of the OPE punching size board, and can meet the current thickness of 0.4-10mm in the PCB industry. The precision can be adjusted to 0.075mm. The set mold is etched on the copper surface of the PCB board, and then the positioning holes are drilled. The bottom of the mold is fixed with pins. The first piece is to check whether the inner OPE punching is biased, and whether the rivet holes are defective. According to the inner layer The size of the positioning hole of the core plate, select the corresponding positioning hole of the die set, fix it with the bottom pin, confirm the X-ray of the first plate to check whether the rivet plate has layer deviation, the height of the rivet, and the rivet blooming evenly. After the first piece is confirmed to be qualified, mass production, The pre-sleeve operator and the rivet operator work alone, and the sleeve operator and the rivet operator cannot cross work, which can effectively prevent the cross-contamination of gloves and finger cots from sticking copper chips and cause the inner layer to be short or short-circuited. Adapt to plates of different thicknesses and sizes, the riveting sleeve adopts continuous operation mode, the quality is significantly improved, and the production efficiency of the riveting machine is significantly improved.

The above description is only a preferred embodiment of the present invention, but the protection scope of the present invention is not limited to this. Equivalent replacement or modification of the new technical solution and its utility model concept shall be included within the protection scope of the present utility model.

Claims (7)

1. a kind of set mold device for improving pressing rivet bits, including template (1) and fixing pin module (2), which is characterized in that institute Two longitudinal directions for stating template (1) open up that there are three the operation port (3) that the convenient working person that uniformly opens up takes plate, the moulds The surface of plate (1) is uniformly provided with multiple pin locating holes (4), and the surface of the fixing pin module (2) offers and pin The corresponding fixing pin module location hole (5) of location hole (4).

2. a kind of set mold device for improving pressing rivet bits according to claim 1, which is characterized in that the operation port (3) size is 100mm*100mm.

3. a kind of set mold device for improving pressing rivet bits according to claim 1, which is characterized in that the pin positioning The Position Design in hole (4) is consistent with OPE punching position, 15 inches of minimum location dimension, and each specification increases by 1 inch.

4. a kind of set mold device for improving pressing rivet bits according to claim 1, which is characterized in that the template (1) Size be 545mm*700mm, the template (1) with a thickness of 3.0mm.

5. a kind of set mold device for improving pressing rivet bits according to claim 1, which is characterized in that the fixing pin The size of module (2) is 5mm*20mm, and with a thickness of 3.0mm.

6. a kind of set mold device for improving pressing rivet bits according to claim 1, which is characterized in that the fixing pin The size of module location hole (5) is Φ 3.1mm.

7. a kind of set mold device for improving pressing rivet bits according to claim 1, which is characterized in that the template (1) Specially pcb board.