CN208487425U - A kind of LED light - Google Patents

A kind of LED light Download PDF

Info

Publication number
CN208487425U
CN208487425U CN201820901194.6U CN201820901194U CN208487425U CN 208487425 U CN208487425 U CN 208487425U CN 201820901194 U CN201820901194 U CN 201820901194U CN 208487425 U CN208487425 U CN 208487425U
Authority
CN
China
Prior art keywords
chip
led light
lamp
pcb substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820901194.6U
Other languages
Chinese (zh)
Inventor
杜鹏
胡芬达
黄载存
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN GOYM OPTOELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN GOYM OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN GOYM OPTOELECTRONIC TECHNOLOGY Co Ltd filed Critical SHENZHEN GOYM OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201820901194.6U priority Critical patent/CN208487425U/en
Application granted granted Critical
Publication of CN208487425U publication Critical patent/CN208487425U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model provides a kind of LED light, the LED light includes Transparent lamp shade, at least one PCB substrate, lamp base component, and it is respectively welded at least one lamp bead in the PCB substrate, bridge heap chip and IC chip, the PCB substrate is sealed in the Transparent lamp shade by sealing technology, and pass through the lamp base component and external power supply circuit connection, pass through the implementation of the utility model, its circuit structure only needs to have can be achieved with the function of existing complicated circuit construction by two chips, simplest circuit is designed in limited substrate area to realize, more white space supply lamp beads are reserved to radiate, the circuit design in the application can also reduce the overall calorific value of LED light simultaneously, and it is also sealed by Transparent lamp shade, improve the protection to lamp bead, it is transparent simultaneously Design avoids the colour-change phenomena of lamp bead, and reduces the manufacturing cost of product.

Description

A kind of LED light
Technical field
The utility model relates to lighting technical field more particularly to a kind of LED light.
Background technique
With the fast development of illumination LED industry, especially for the lamp bead of G9 type, in setting for existing LED lamp bead In meter scheme, most of is all then to weld LED chip and various electronics devices on circuit boards using one piece of circuit board of design Part realizes high brightness, low-power drive, but when designing the circuit in circuit board, circuit structure too complex, and Electronic component is relatively more, although the requirement of low-power consumption original text brightness has may be implemented in circuit design in this way, for The heat dissipation of LED chip itself is really at problem, since circuit board is integrated with various electronic devices close and numerously, and electronic device Also heat is generated, it is also desirable to it radiates, so, the design of current LED lamp bead and is affected due to the complexity of circuit structure The heat dissipation effect of lamp bead itself, therefore, it is necessary to design a kind of LED light that not only can simplify circuit structure but also can effectively improve heat dissipation Structure is to solve the above problem.
Utility model content
The utility model provides a kind of LED light, solves excessively complexity of the existing LED light due to circuit, and influences The problem of heat dissipation effect of LED light itself.
The utility model provides a kind of LED light, comprising: Transparent lamp shade, at least one PCB substrate, lamp base component, and At least one lamp bead, bridge heap chip and the IC chip being respectively welded in the PCB substrate, the PCB substrate pass through sealing work Skill is sealed in the Transparent lamp shade, and passes through the lamp base component and external power supply circuit connection.
Further, the lamp bead includes bracket and LED chip, and the LED chip is set on the bracket, and by heavy The LED chip is packaged in the bracket by product technique dispensing.
Further, the PCB substrate includes insulating substrate and electronic circuit, and the electronic circuit passes through printing technology point It is not printed on two surfaces opposite on the insulating substrate;The lamp bead, bridge heap chip and IC chip are respectively welded in institute It states in electronic circuit in corresponding welding region.
Further, it is additionally provided at least one conductive hole on the insulating substrate, is printed in the insulating substrate Electronic circuit on two surfaces is realized by the conductive hole to be electrically connected.
Further, the insulating substrate is the substrate formed by ceramic material.
Further, if the particular number of at least one PCB substrate is one, the quantity of at least one lamp bead When being two, two lamp beads are respectively welded on two surfaces of the insulating substrate, the bridge heap chip and IC chip It is welded at least one surface in two surfaces of the insulating substrate.
Further, if the particular number of at least one PCB substrate is three, the quantity of at least one lamp bead When being three, three insulating substrates are interconnected to form triangle, and opposite on each insulating substrate two One lamp bead of a upper welding in surface, the bridge heap chip and IC chip are welded in two tables of the insulating substrate On at least one surface in face.
Further, the glass lamp shade that the Transparent lamp shade is integrally formed and accommodates cavity with one, the PCB substrate It is sealed in the accommodating cavity.
Further, inert gas is also filled in the accommodating cavity.
Further, the lamp base component includes conductive spacer, the first conductive pin and the second conductive pin, the conduction Gasket is embedded with the Transparent lamp shade, and first conductive pin and the PCB substrate are electrically connected, and pass through the conduction Gasket is electrically connected with second conductive pin being set to outside the Transparent lamp shade.
The utility model has the beneficial effects that
The utility model provides a kind of LED light, which includes Transparent lamp shade, at least one PCB substrate, lamp base group Part, and at least one lamp bead, bridge heap chip and the IC chip that are respectively welded in the PCB substrate, the PCB substrate pass through Sealing technology is sealed in the Transparent lamp shade, and by the lamp base component and external power supply circuit connection, passes through the utility model Implementation, circuit structure only needs to have can be achieved with the function of existing complicated circuit construction by two chips, thus real Show and designed simplest circuit in limited substrate area, has reserved more white space supply lamp beads and radiate, together When the application in circuit design can also reduce the overall calorific value of LED light, and be also sealed, mentioned by Transparent lamp shade The high protection to lamp bead, while transparent design avoids the colour-change phenomena of lamp bead, and reduces the manufacturing cost of product.
Detailed description of the invention
Fig. 1 is the first structural schematic diagram of LED light provided by the embodiment of the utility model;
Fig. 2 is second of structural schematic diagram of LED light provided by the embodiment of the utility model;
Fig. 3 is the third structural schematic diagram of LED light provided by the embodiment of the utility model;
Fig. 4 is the 4th kind of structural schematic diagram of LED light provided by the embodiment of the utility model;
Fig. 5 is the cross-sectional view of the structure for the LED light that Fig. 4 is provided;
Fig. 6 is the 5th kind of structural schematic diagram of LED light provided by the embodiment of the utility model;
Fig. 7 is the 6th kind of structural schematic diagram of LED light provided by the embodiment of the utility model;
Fig. 8 is the 7th kind of structural schematic diagram of LED light provided by the embodiment of the utility model.
Specific embodiment
Further annotation explanation now is made to the utility model by way of specific embodiment combination attached drawing.
First embodiment:
Referring to Figure 1, Fig. 1 is the first structural schematic diagram of LED light provided by the embodiment of the utility model, the LED light It specifically includes: Transparent lamp shade 11, PCB substrate 12, lamp base component 13, lamp bead 14, bridge heap chip 15 and IC chip 16, wherein lamp bead 14, bridge heap chip 15 and IC chip 16 are to be fixed in the PCB substrate 12, and can be and be electrically connected with PCB substrate 12 respectively It connects, is also possible to non-electric connection.
When lamp bead 14, bridge heap chip 15 and IC chip 16 with PCB substrate 12 by the way of being electrically connected, the PCB base The layers of copper for connecting lamp bead 14, bridge heap chip 15 and IC chip 16 should be printed on plate 12, the specific layers of copper can be set For electronic circuit.
When using non-electric connection, the PCB substrate 12 can be set to the circuit board with layers of copper, also can be set For insulate class substrate, but whether which kind of is set as, between lamp bead 14, bridge heap chip 15 and IC chip 16 and PCB substrate 12 Determined by sealant or the modes such as glue realize fixation, then by lamp bead 14, bridge heap chip 15 and IC by way of wire jumper Electrical connection is realized between chip 16.
The lamp base component 13 is electrically connected with the PCB substrate 12, and the PCB substrate 12 is described to be sealed in In Transparent lamp shade 11, lamp base group angle 13 seals PCB substrate 12 when connecting with PCB substrate 12, from the Transparent lamp shade 11 Interior location in extend to the outside of Transparent lamp shade 11, and be electrically connected when in use with external power supply circuit.
In practical applications, the quantity of the lamp bead 14 specifically can be set at least one, similarly, PCB substrate 12 Quantity specifically may be set to be at least one, when lamp bead 14 and PCB substrate 12 are disposed as one, the lamp bead 14, bridge Heap chip 15 and IC chip 16 can specifically be that is to say using predominate set-up mode setting by lamp bead 14, bridge heap chip 15 It is provided entirely on a surface of PCB substrate 12 with IC chip 16.
Further, lamp bead 14, bridge heap chip 15 and IC chip 16 can also be separately positioned in PCB substrate 12 relatively Two surfaces on, for example on a surface by the setting of lamp bead 14, bridge heap chip 15 and IC chip 16 are arranged in another table On face, or it is provided separately on both surfaces, it is specific as shown in Figure 2.
In the present embodiment, the lamp bead includes bracket and LED chip, and the LED chip is set on the bracket, and is led to Crossing depositing operation dispensing and the LED chip is packaged in lamp bead described in the bracket includes bracket and LED chip, the LED Chip is set on the bracket, and the LED chip is packaged in the bracket by depositing operation dispensing, then passes through weldering The mode connect is welded in PCB substrate 12, in practical applications, the PCB substrate 12 use with block insulating substrate, preferably , select the tile of ceramic-like, and on tile printing there are three pad area, the shape and leg of the pad area respectively with lamp bead 14, the shape and pin of bridge heap chip 15 and IC chip 16 are corresponding.And for lamp bead 14, bridge heap chip 15 and the IC core after welding Electric connection can be realized between piece 16 by way of lead.
In another embodiment of the utility model, the PCB substrate 12 is specifically configured to include insulating substrate and electronics Route, the electronic circuit are respectively printed on two surfaces opposite on the insulating substrate by printing technology;The lamp Pearl 14, bridge heap chip 15 and IC chip 16 are respectively welded in the electronic circuit in corresponding welding region.
In the present embodiment, due to being all printed with electronic circuit respectively on two surfaces of insulating substrate, exhausted At least one conductive hole is additionally provided on edge substrate, the electronic circuit being printed on two surfaces of the insulating substrate passes through institute It states conductive hole and realizes electric connection.
In the present embodiment, the insulating substrate is the substrate formed by ceramic material, be that is to say using existing Potsherd is processed to obtain, and pre-designed electronic circuit is printed on potsherd, due to the thermal conductivity of potsherd Energy and heat dissipation performance are all relatively good, so the chip and lamp bead that are designed PCB substrate 12 using potsherd and have greatly improved Heat dissipation emission efficiency extend the service life of LED light to improve the loss probability of chip.
In the present embodiment, if the particular number of at least one PCB substrate 12 is one, at least one described lamp bead When 14 quantity is two, two lamp beads 14 are respectively welded on two surfaces of the insulating substrate, the bridge reactor core Piece 15 and IC chip 16 are welded at least one surface in two surfaces of the insulating substrate, that is to say, that the bridge Heap chip 15 and IC chip 16 can be arranged simultaneously on a surface, can also be respectively set on both surfaces, tool Body is as shown in Figure 6,7.
In the present embodiment, if the particular number of at least one PCB substrate 12 is three, at least one described lamp bead When 14 quantity is three, three insulating substrates are interconnected to form triangle, and the phase on each insulating substrate Pair two surfaces in one it is upper weld a lamp bead, the bridge heap chip 15 and IC chip 16 are welded in the insulation On at least one surface in two surfaces of substrate.
As shown in figure 3, specifically including one first when the particular number of at least one PCB substrate 12 is three Circuit board and two second circuit boards, only with the electronic circuit for being provided with completion in a PCB substrate 12 in three PCB substrates 12 (that is to say first circuit board), it is so-called complete electronic circuit refer to include lamp bead 14 electronic circuit and bridge reactor core The electronic circuit of piece 15 and IC chip 16, and be only provided in other two PCB substrate 12 and the electronic circuit of lamp bead power supply is provided (that is to say second circuit board) is briefly exactly only to use the route of positive and negative anodes, and the two second circuit boards are separately positioned on It is provided on two symmetrical sides of the first circuit board of the electronic circuit of completion, and is electrically connected to each other, and two second circuits It is not electrically connected between plate, and the lamp bead 14 on second circuit board only passes through the bridge heap chip 15 and IC chip on first circuit board 16 realize driving.
In the present embodiment, the bridge heap chip 15 and IC chip 16 can also be arranged in three PCB substrates 12 and surround three On inner surface after angular, and lamp bead 14 is still arranged on the outer surface, such structure design so that the surface of lamp bead 14 more Add cleaning, specific structure is as shown in Figure 4,5.
In the present embodiment, optional three PCB substrates 12 can also be provided with independent circuit respectively, and exist simultaneously Also lamp bead 14, bridge heap chip 15 and IC chip 16, and the connection relationship of three PCB substrates 12 are separately provided in PCB substrate For connection relationship in parallel, in actual work, three PCB substrates 12 are powered simultaneously by a lamp base component 13, but three It works independently between person, when thering is one to burn in former three, both other work is not influenced, optionally, on each PCB Bridge heap chip 15 and IC chip 16 can be separately positioned on two surfaces of PCB substrate, also can be set in a table On face, but lamp bead 14 is then necessarily placed on the outer surface after three PCB substrates 12 surround triangle, specific as shown in Figure 8.
In the present embodiment, the glass lamp shade 11 that the Transparent lamp shade 11 is integrally formed and accommodates cavity 111 with one, The PCB substrate 12 is sealed in the accommodating cavity 111.
In practical applications, for the vacuum cavity of sealing, the bad heat dissipation of PCB substrate 12 in cavity is set, to understand The certainly problem is also also filled with inert gas in the accommodating cavity 111, passes through when sealing to Transparent lamp shade 11 The inert gas comes into full contact with PCB substrate 12, thus by lamp bead 14, bridge heap chip 15 and IC chip in PCB substrate 12 It is distributed on the 16 heat conducting transparent lampshades 11 generated, optionally, the Transparent lamp shade 11 uses high transparency, UV resistance spoke It penetrates equal glass materials to be process, so as to avoid the discoloration situation of lamp bead.
In the present embodiment, the lamp base component 13 can specifically be processed in the following ways, specifically by lamp base component 13 Be divided into 133 three parts of conductive spacer 131, the first conductive pin 132 and the second conductive pin, the conductive spacer 131 it is embedded with In the Transparent lamp shade 11, first conductive pin 132 is electrically connected with the PCB substrate 12, and is sealed in clear lamp In the accommodating cavity 111 of cover 11, one end is connect with the positive and negative anodes in PCB substrate 12, and the other end is embedded in the cover of Transparent lamp shade 11 Position that is internal and extending to conductive spacer 131 is contacted with conductive spacer, by the conductive spacer 131 and is set to described Second conductive pin 133 electrical connection outside bright lamp cover, and one end of second conductive pin 133 is embedded in clear lamp In the cover of cover 11, the other end is extended to outside Transparent lamp shade 11, and in practical applications, second conductive pin 133 is arranged One end and external power supply circuit connection outside Transparent lamp shade 11, so that being embodied as LED light provides working power.
In summary, by the implementation of the utility model, at least exist it is following the utility model has the advantages that
The utility model provides a kind of LED light, which includes Transparent lamp shade, at least one PCB substrate, lamp base group Part, and at least one lamp bead, bridge heap chip and the IC chip that are respectively welded in the PCB substrate, the PCB substrate pass through Sealing technology is sealed in the Transparent lamp shade, and by the lamp base component and external power supply circuit connection, passes through the utility model Implementation, circuit structure only needs to have can be achieved with the function of existing complicated circuit construction by two chips, thus real Show and designed simplest circuit in limited substrate area, has reserved more white space supply lamp beads and radiate, together When the application in circuit design can also reduce the overall calorific value of LED light, and be also sealed, mentioned by Transparent lamp shade The high protection to lamp bead, while transparent design avoids the colour-change phenomena of lamp bead, and reduces the manufacturing cost of product.
The above is only specific embodiment of the present utility model, not do limit in any form to the utility model System, all any simple modifications that embodiment of above is made according to the technical essence of the utility model, equivalent variations, combination Or modification, still fall within the protection scope of technical solutions of the utility model.

Claims (10)

1. a kind of LED light characterized by comprising Transparent lamp shade, at least one PCB substrate, lamp base component, and weld respectively At least one lamp bead, bridge heap chip and IC chip in the PCB substrate are connect, the PCB substrate is sealed by sealing technology In the Transparent lamp shade, and pass through the lamp base component and external power supply circuit connection.
2. LED light according to claim 1, which is characterized in that the lamp bead includes bracket and LED chip, the LED core Piece is set on the bracket, and the LED chip is packaged in the bracket by depositing operation dispensing.
3. LED light according to claim 1, which is characterized in that the PCB substrate includes insulating substrate and electronic circuit, The electronic circuit is respectively printed on two surfaces opposite on the insulating substrate by printing technology;The lamp bead, bridge Heap chip and IC chip are respectively welded in the electronic circuit in corresponding welding region.
4. LED light according to claim 3, which is characterized in that be additionally provided at least one on the insulating substrate and lead Electric hole, the electronic circuit being printed on two surfaces of the insulating substrate is realized by the conductive hole to be electrically connected.
5. LED light according to claim 3, which is characterized in that the insulating substrate is to be formed by ceramic material Substrate.
6. LED light according to claim 4, which is characterized in that if the particular number of at least one PCB substrate is one A, when the quantity of at least one lamp bead is two, two lamp beads are respectively welded at two tables of the insulating substrate On face, the bridge heap chip and IC chip are welded at least one surface in two surfaces of the insulating substrate.
7. LED light according to claim 4, which is characterized in that if the particular number of at least one PCB substrate is three A, when the quantity of at least one lamp bead is three, three insulating substrates are interconnected to form triangle, and each One lamp bead of a upper welding on the insulating substrate in two opposite surfaces, the bridge heap chip and IC chip weldering It is connected at least one surface in two surfaces of the insulating substrate.
8. LED light according to claim 1-7, which is characterized in that the Transparent lamp shade is integrally formed and has There is the glass lamp shade of an accommodating cavity, the PCB substrate is sealed in the accommodating cavity.
9. LED light according to claim 8, which is characterized in that be also filled with inert gas in the accommodating cavity.
10. LED light according to claim 1-7, which is characterized in that the lamp base component include conductive spacer, First conductive pin and the second conductive pin, the conductive spacer it is embedded in the Transparent lamp shade, first conductive pin It is electrically connected with the PCB substrate, and described second is led by the conductive spacer with what is be set to outside the Transparent lamp shade Electric pin electrical connection.
CN201820901194.6U 2018-06-11 2018-06-11 A kind of LED light Active CN208487425U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820901194.6U CN208487425U (en) 2018-06-11 2018-06-11 A kind of LED light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820901194.6U CN208487425U (en) 2018-06-11 2018-06-11 A kind of LED light

Publications (1)

Publication Number Publication Date
CN208487425U true CN208487425U (en) 2019-02-12

Family

ID=65251368

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820901194.6U Active CN208487425U (en) 2018-06-11 2018-06-11 A kind of LED light

Country Status (1)

Country Link
CN (1) CN208487425U (en)

Similar Documents

Publication Publication Date Title
CN100435362C (en) Light-emitting diode
CN102644867A (en) Thermoelectric separation power type light-emitting diode bulb with high integration and high lighting effect
CN103050602B (en) Light-emitting device
TW201003991A (en) Package structure of LED and light bar using the same
CN202513205U (en) Light emitting diode (LED) package structure
CN102364684B (en) LED (Light-Emitting Diode) module and manufacturing process thereof
CN2613054Y (en) Base plate structure of LED wafer
CN208487425U (en) A kind of LED light
CN201004460Y (en) A LED lamp based on COA technology
CN101093828A (en) Structure for packaging compact type large power light emitting diode
CN205177876U (en) AC flexible LED filament that gives off light
CN208735311U (en) A kind of LED light
CN202546668U (en) Lighting device and driving structure thereof
CN203686924U (en) LED (Light-Emitting Diode) integrally-encapsulated lamp
CN203477980U (en) Area light source module of white light LEDs
CN202691653U (en) LED (light emitting diode) module
CN203339225U (en) Non-encapsulation chip LED lighting illumination structure
CN201732811U (en) LED packaging structure of solderless gold wire
CN204632801U (en) LED encapsulation structure
CN201428943Y (en) Led lamp
CN204029869U (en) The loose heat conduction base plate for packaging of a kind of middle low power LED
CN202580724U (en) Thermoelectric separation power type light-emitting diode bulb with high integration and high photosynthetic efficiency
CN204144252U (en) The sub-LED light emission device of integration excess
CN201318563Y (en) Luminescence unit structure of light-emitting diode provided with aluminum circuit substrate
CN203607403U (en) High-voltage LED integration packaging light source and high-voltage LED light fixture

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant