CN208437651U - Die cooling structure - Google Patents

Die cooling structure Download PDF

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Publication number
CN208437651U
CN208437651U CN201821132283.5U CN201821132283U CN208437651U CN 208437651 U CN208437651 U CN 208437651U CN 201821132283 U CN201821132283 U CN 201821132283U CN 208437651 U CN208437651 U CN 208437651U
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China
Prior art keywords
groove
module bodies
module
plate body
refrigerant
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CN201821132283.5U
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Inventor
简伟文
王跃东
陈庆勋
张其强
李洪梅
李毅华
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Foshan Nanhai Superband Mould Co Ltd
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Foshan Nanhai Superband Mould Co Ltd
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Abstract

The utility model relates to a kind of die cooling structure, including module, module is for surrounding product type chamber;It is characterized in that, module includes module bodies and the cavity molding plate body being covered on the inside of module bodies, module bodies and cavity molding plate body split settings, the wall thickness of cavity molding plate body is less than the wall thickness of module bodies, there is insulating layer in at least partly region overlay of the inner sidewall of module bodies, it is formed with cooling duct between insulating layer and the lateral wall of cavity molding plate body, the refrigerant inlet and refrigerant exit of connection cooling duct are additionally provided in module bodies.In this way, trickling can be effectively reduced in the refrigerant in cooling duct and the heat transfer between module bodies in the setting of insulating layer, further slow down the heat loss of module bodies.

Description

Die cooling structure
Technical field
The present invention relates to a kind of die cooling structure, the cooling structure can be to the system formed in the mold cavity Part is effectively cooled down.
Background technique
During casting, Injection moulded part, the quality of cooling effect directly affects the quality of product.Cooling device becomes Important one of functional module in casting, injection mold.In order to improve production effect as best one can on the basis of guaranteeing parts quality Rate, efficient radiating efficiency are the indexs that people pursue always.In order to improve the cooling efficiency of cooling device, people come up with more The solution of kind.Such as the one kind disclosed in Chinese invention patent 20118023276.6 is for manufacturing coolable mould The method of tool and the mold manufactured by this method, mold includes upper mold section 5 and female die 7, in the upper mold section 5 and lower half There is die cavity 9, by injection molding so that product shapes in the die cavity 9 between mould 7.Wherein, the female die 7 includes basic 19 With the fission 13 with initial surface 17, it is provided with cooling duct 3 in the initial surface 17, on the initial surface 17 It also applies and is coated with coating 15.The mould rapidly to described seperated 13 and so can be formed in by the cooling duct 3 Product in chamber is cooled down.
Summary of the invention
Die cooling structure in above-mentioned patent 20118023276.6 is analyzed it can be found that the cooling duct 3 While being cooled down to described seperated 13, it can also be cooled down to described basic 19, so that the Mo Wenming of described matrix 19 Aobvious decline.In this way in molding manufacture product again, described matrix 19 can be absorbed in large quantities from described seperated 13 from high temperature original The heat that passes over of material melt, so that high temperature feedstock melt scatters and disappears excessive heat and occurs significantly flowing filling the type stage Resistance eventually leads to product and the defects of loose or incomplete occurs.In order to avoid there is above-mentioned phenomenon, common solution is, Prolonged the pre-heat treatment all is carried out to described matrix 19 before each injection molding.Obviously, this has seriously delayed production efficiency.
In view of the deficiencies of the prior art, one of goal of the invention of the invention is intended to make improvements the structure of cooling device, makes Obtaining the cooling device, not only there is ideal cooling effect maintain mold generally within a reasonable temperature range, Obvious undesirable influence is caused without the quality on product so as to rapidly be again introduced into next manufacture circulation.Mirror In this, the present invention proposes a kind of die cooling structure, including module, and the module is for surrounding product type chamber;It is characterized in that, The module includes module bodies and the cavity molding plate body being covered on the inside of the module bodies, the module bodies and institute Cavity molding plate body split settings are stated, the wall thickness of the cavity molding plate body is less than the wall thickness of the module bodies, in the mould At least partly region overlay of the inner sidewall of block main body has insulating layer, in the outside of the insulating layer and the cavity molding plate body It is formed with cooling duct between wall, the refrigerant inlet and refrigerant for being connected to the cooling duct are additionally provided in the module bodies Outlet.
Wherein, the product type chamber is the formingspace of product such as hub blank piece.In the fabrication process, to the system The intracavitary injection high temperature feedstock melt of part type, after the high temperature feedstock melt is filled the product type chamber and cooled down, i.e., described Intracavitary produce of product type has the product for being adapted to moulding with the product type chamber.
Wherein, the module includes module bodies and the cavity molding plate body being covered on the inside of the module bodies, institute State module bodies and the cavity molding plate body split settings.It includes two fissions, i.e. institute that features described above, which defines the module, State module bodies and the cavity molding plate body.The module bodies and the cavity molding plate body can be separately separately fabricated, It is connected again by the connection types such as welding or fastener connection.In addition, the cavity molding plate body is located at the module master The inside of body, i.e., for the described relatively described module bodies of cavity molding plate body closer to the type chamber, the cavity molding plate body is real Become the chamber side wall of the type chamber in matter.
Wherein, the wall thickness of the cavity molding plate body is less than the wall thickness of the module bodies.In this way, with the module bodies It compares, the cavity molding plate body is than relatively thin, so as to relatively quickly the heat taken shape on the intracavitary product of the type Amount is transmitted to trickling on the refrigerant in the cooling duct.And have the radiating rate of the module bodies of opposite thick wall opposite Slowly.
Wherein, have insulating layer in at least partly region overlay of the inner sidewall of the module bodies, the insulating layer with Cooling duct is formed between the lateral wall of the cavity molding plate body.In this way, the insulating layer can efficiently reduce trickling In the refrigerant in the cooling duct and the heat transfer between the module bodies, the heat for slowing down the module bodies dissipates It loses.In addition, at least partly region overlay in the inner sidewall of the module bodies has insulating layer, features described above defines the guarantor The coverage area of warm layer, the insulating layer can only be covered on partial region or the inner sidewall of the inner sidewall of the module bodies Whole region.It should be noted that the inner sidewall of the module bodies is in the module bodies towards type chamber side Side wall, the lateral wall of the cavity molding plate body refer to the side wall for deviating from type chamber side on the cavity molding plate body, institute The lateral wall for stating the inner sidewall and the cavity molding plate body of module bodies is oppositely arranged.
According to the above technical scheme it can be found that the beneficial technical effect of the present invention lies in: due to the module include point The module bodies and cavity molding plate body of body setting, the wall thickness of the cavity molding plate body are less than the wall thickness of the module bodies. In this way, the difference of wall thickness makes the relatively thin cavity molding plate body have relatively quick radiating rate, and the module Main body has relatively slow radiating rate.In addition, due at least partly region overlay of the inner sidewall in the module bodies There is insulating layer, is formed with cooling duct between the insulating layer and the lateral wall of the cavity molding plate body.In this way, the guarantor The setting of warm layer can be effectively reduced trickling and pass in the refrigerant in the cooling duct and the heat between the module bodies It passs, further slows down the heat loss of the module bodies.In this way, conveying refrigerant by the cooling duct, make refrigerant fast The heat being transmitted on the cavity molding plate body is taken away fastly, realizes the cooling to product.But the mould is not will lead to Block main body quickly, dissipated heat in large quantities, so as to avoid the module bodies described in molding manufacture product again from the type The heat passed over from high temperature feedstock melt is absorbed in large quantities on chamber moulding plate body, so that high temperature feedstock melt is filling the type stage Scatter and disappear excessive heat and form apparent flow resistance, thus also avoid due to fill type it is insufficient and occur product it is loose or The defects of incomplete.
In order to form the cooling duct, groove can be set on the lateral wall of the cavity molding plate body.But in this way The structural strength of the cavity molding plate body can be weakened.So present invention further propose that technical solution be the groove type In module bodies described in Cheng Yu.It is specific as follows, it is arranged on the inner sidewall of the module bodies fluted, fills out in the groove Filled with insulating layer, the vallecular cavity of the groove on the insulating layer becomes the cooling duct.The slot of the groove described in this way The lower space of chamber is used to collect the insulating layer and upper space becomes cooling duct.
Further technical solution is also possible that the insulating layer is heat-preservation cotton layer, is covered on the heat-preservation cotton layer Sheet metal.Wherein the sheet metal can be elastic steel sheet.
Further technical solution is also possible that the groove column for being provided with and being vertically arranged in the module bodies, described Groove column include multiple grooves spaced in a vertical direction, and the groove is laterally extended arrangement, adjacent two It is provided with the transition link slot being vertically arranged between a groove, the transition link slot is connected to wherein the one of the groove A end, the neighbouring transition link slot misplace arrangement in landscape mode.In this way, the groove and the transition connect Access slot combines and forms the cooling duct for capableing of guiding refrigerant circuitous flow, and refrigerant can flow to the other end from one end of the groove It is directed in next groove by the transition link slot again.As described refrigerant can substantially flow through the complete of the groove Portion region, the cooling blind area without forming large area in the groove, so as to the region covered to the groove Carry out relatively uniform cooling.
Further technical solution is also possible that the refrigerant inlet connection is located at the groove on top, the refrigerant Outlet is located at the groove of bottom end.In this way, refrigerant flows from top to bottom after refrigerant inlet inflow, finally from institute State refrigerant exit outflow.
Further technical solution is also possible that the refrigerant inlet includes the first refrigerant inlet and the second refrigerant inlet, First refrigerant inlet and the second refrigerant inlet are respectively communicated with the groove positioned at top and the groove positioned at bottom end, The refrigerant exit is connected to the centrally located groove and relatively close to one of refrigerant inlet.In this way, can be with Control the sequence and duration of first refrigerant inlet and the second refrigerant inlet conveying refrigerant respectively according to the condensation sequence of product, Realization sequence is cooling.In addition the temperature gradient between apex zone and bottom zone can also be reduced, is realized uniformly cooling.
In addition to above structure form, the groove can also be using another structure type, and further technical solution is also It can be, the groove is extended continuously in detour shape, and the refrigerant inlet is connected to the head end of the groove, and the refrigerant exit connects Lead to the tail end of the groove.
Due to the present invention have the advantages that These characteristics and, can be applied in die cooling structure thus.
Detailed description of the invention
Fig. 1 is the schematic perspective view using the side form 100 of inventive die cooling structure;
Fig. 2 is the decomposition texture schematic diagram of the side form 100;
Fig. 3 is the structural schematic diagram of the groove column;
Fig. 4 is the schematic diagram of the section structure of the side form 100;
Fig. 5 is the portion the A enlarged structure schematic diagram in Fig. 4;
Fig. 6 is the structural schematic diagram using the groove of second embodiment.
Specific embodiment
The structure for the cooling structure of application technical solution of the present invention being applied in mold is made into one with reference to the accompanying drawing The explanation of step.
As shown in Figures 1 to 5, a kind of die cooling structure (is not drawn including the type chamber for surrounding molded article in figure Module 100 out), the module 100 include module bodies 1 and the cavity molding plate for being covered on 1 inside of module bodies Body 2, the module bodies 1 and 2 split settings of cavity molding plate body, the wall thickness of the cavity molding plate body 2 are less than described The wall thickness of module bodies 1 has insulating layer 3 in at least partly region overlay of the inner sidewall of the module bodies 1, in the heat preservation It is formed with cooling duct 10 between layer 3 and the lateral wall of the cavity molding plate body 2, is additionally provided in the module bodies 1 It is connected to the refrigerant inlet (12,12a) and refrigerant exit 13 of the cooling duct 10.
The die cooling structure can be applied in multiple kinds of molds, such as injection mold, metal die-casting mold.Below with aluminium Make detailed discussion for alloy wheel hub casting mould.The aluminum alloy hub casting die include the upper mold split up and down, under The side form 100 mould (being not drawn into upper die and lower die figure) and be arranged between the upper die and lower die.The upper die and lower die and institute Side form 100 is stated for surrounding the type chamber of manufacture wheel hub blank.The die cooling structure is mainly used on the side form 100. As shown in Figures 1 to 5, the side form 100 includes the module bodies 1 and the cavity molding plate body 2, the module bodies 1 Can be separately separately fabricated with the cavity molding plate body 2, then connected by the connection types such as welding or fastener connection. Wherein it is arranged fluted 10 on the inner sidewall of the module bodies 1, insulating layer 3, the guarantor is filled in the groove 10 Warm layer 3 is heat-preservation cotton layer, is covered with sheet metal 4 on the heat-preservation cotton layer, the groove 10 on the sheet metal 4 Vallecular cavity becomes the cooling duct 10.The lower space of the vallecular cavity of the groove 10 described in this way for collecting the insulating layer 3 and Portion space becomes cooling duct 10.In order to carry out large area cooling to the region for corresponding to the type chamber on the side form 100, Be provided with the groove column that multiple row is vertically arranged on the side form 100, groove column described in each column include it is multiple in a vertical direction The spaced groove 10, the groove 10 are laterally extended arrangement, are provided between two adjacent grooves 10 The transition link slot 11 being vertically arranged, the transition link slot 11 are connected to one of end of the groove 10, up and down phase The adjacent transition link slot 11 misplaces arrangement in landscape mode.In this way, the groove 10 and 11 knot of transition link slot Close the cooling duct 10 for being formed and capableing of guiding refrigerant circuitous flow.Such as shown in figure 3, refrigerant can be from the groove 10a's One end, which flows to the other end and is directed in next groove 10b by the transition link slot 11 again, (is arranged in difference to distinguish The groove of different location has been respectively labeled as 10a, 10b ... by the groove 10 of position).As described refrigerant can be substantially The whole region for flowing through the groove 10, the cooling blind area without forming large area in the groove 10, so as to right The region that the groove 10 is covered carries out relatively uniform cooling.
The refrigerant inlet (12,12a) includes the first refrigerant inlet 12 and the second refrigerant inlet 12a, first refrigerant Import 12 and the second refrigerant inlet 12a are respectively communicated with the groove 10a positioned at the top and groove 10d positioned at bottom end, The refrigerant exit 13 is connected to the centrally located groove 10c and relatively close to the second refrigerant inlet 12a.This Sample can control first refrigerant inlet (12,12a) and the second refrigerant inlet according to the condensation sequence of wheel hub blank respectively (12,12a) convey the sequence and duration realization sequence cooling of refrigerant.In addition it can also reduce between apex zone and bottom zone Temperature gradient, realize uniformly cooling.Certainly in other implementations, a refrigerant inlet 12 can be only set, The connection of refrigerant inlet 12 at this time is located at the groove 10a on top, and the connection of refrigerant exit 13 is located at the described of bottom end Groove 10d.In this way, refrigerant flows from top to bottom after the refrigerant inlet 12 inflow, finally flowed out from the refrigerant exit 13.
In addition to above structure form, the groove 10 can also be using another structure type, as shown in fig. 6, described recessed Slot 10 ' is extended continuously in detour shape, and the refrigerant inlet 12 is connected to the head end of the groove 10, and the refrigerant exit 13 is connected to institute State the tail end of groove 10.
According to the above technical scheme it can be found that: due to the module bodies 1 and type chamber of the module 100 including split settings Moulding plate body 2, the wall thickness of the cavity molding plate body 2 are less than the wall thickness of the module bodies 1.In this way, the difference of wall thickness makes The relatively thin cavity molding plate body 2 has relatively quick radiating rate, and the module bodies 1 are with relatively slow Radiating rate.In addition, due to being covered with insulating layer 3 in the inner sidewall of the module bodies 1, in the insulating layer 3 and the type Cooling duct 10 is formed between the lateral wall of chamber moulding plate body 2.In this way, the setting of the insulating layer 3 can be effectively reduced It trickles in the refrigerant in the cooling duct 10 and the heat transfer between the module bodies 1, further slows down the mould The heat loss of block main body 1.In this way, convey refrigerant by the cooling duct 10, allow refrigerant rapidly take away be transmitted to it is described Heat on cavity molding plate body 2 realizes the cooling to product.But the module bodies 1 are not will lead to quickly, in large quantities Dissipated heat, it is a large amount of from the cavity molding plate body 2 so as to avoid the module bodies 1 described when molding manufactures product again Ground absorbs the heat that passes over from high temperature feedstock melt so that high temperature feedstock melt fill the type stage scatter and disappear excessive heat and Apparent flow resistance is formed, to also avoid the defects of product is loose or incomplete occur due to filling type deficiency.

Claims (7)

1. die cooling structure, including module, the module is for surrounding product type chamber;It is characterized in that, the module includes Module bodies and the cavity molding plate body being covered on the inside of the module bodies, the module bodies and the cavity molding plate Body split settings, the wall thickness of the cavity molding plate body is less than the wall thickness of the module bodies, in the inside of the module bodies At least partly region overlay of wall has insulating layer, is formed between the insulating layer and the lateral wall of the cavity molding plate body Cooling duct is additionally provided with the refrigerant inlet and refrigerant exit for being connected to the cooling duct in the module bodies.
2. die cooling structure according to claim 1, which is characterized in that be arranged on the inner sidewall of the module bodies It is fluted, it is filled with the insulating layer in the groove, the vallecular cavity of the groove on the insulating layer becomes described Cooling duct.
3. die cooling structure according to claim 2, which is characterized in that the insulating layer is heat-preservation cotton layer, described Sheet metal is covered on heat-preservation cotton layer.
4. die cooling structure according to claim 2, which is characterized in that be provided with vertical cloth in the module bodies The groove column set, the groove column include multiple grooves spaced in a vertical direction, and the groove is laterally extended Arrangement, is provided with the transition link slot being vertically arranged, the transition link slot is connected between two adjacent grooves One of end of the groove, the neighbouring transition link slot misplace arrangement in landscape mode.
5. die cooling structure according to any one of claims 1 to 4, which is characterized in that the refrigerant inlet is connected to position The groove in top, the refrigerant exit connection are located at the groove of bottom end.
6. die cooling structure according to any one of claims 1 to 4, which is characterized in that the refrigerant inlet includes the One refrigerant inlet and the second refrigerant inlet, first refrigerant inlet and the second refrigerant inlet are respectively communicated with positioned at described in top Groove and the groove positioned at bottom end, the refrigerant exit are connected to the centrally located groove and relatively close to them In a refrigerant inlet.
7. die cooling structure according to claim 2, which is characterized in that the groove is extended continuously in detour shape, institute The head end that refrigerant inlet is connected to the groove is stated, the refrigerant exit is connected to the tail end of the groove.
CN201821132283.5U 2018-07-17 2018-07-17 Die cooling structure Active CN208437651U (en)

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CN201821132283.5U CN208437651U (en) 2018-07-17 2018-07-17 Die cooling structure

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CN201821132283.5U CN208437651U (en) 2018-07-17 2018-07-17 Die cooling structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108672676A (en) * 2018-07-17 2018-10-19 佛山市南海奔达模具有限公司 die cooling structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108672676A (en) * 2018-07-17 2018-10-19 佛山市南海奔达模具有限公司 die cooling structure

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