CN208298867U - A kind of LED component of fluorescent glue overlay film - Google Patents
A kind of LED component of fluorescent glue overlay film Download PDFInfo
- Publication number
- CN208298867U CN208298867U CN201820702583.6U CN201820702583U CN208298867U CN 208298867 U CN208298867 U CN 208298867U CN 201820702583 U CN201820702583 U CN 201820702583U CN 208298867 U CN208298867 U CN 208298867U
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- fluorescent glue
- overlay film
- led
- led chip
- led component
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Abstract
The utility model provides a kind of LED component of fluorescent glue overlay film, including substrate, crystal bonding area is provided in the base of the substrate, insulating layer is provided in the base, it is provided with line layer on the insulating layer, and offers die bond mouth, the LED chip is fixed on the die bond mouth of crystal bonding area, the LED chip surface, which applies, is covered with fluorescent glue, and the encapsulation glue-line that the fluorescent glue is formed covers the substrate surface and LED chip periphery.The LED component of fluorescent glue overlay film provided by the utility model, with high-heat conductive efficency and heat dissipation effect, LED chip light decay is reduced, the characteristics of prolonging the service life, and the utility model uses monoblock type encapsulating structure, reduce the production technology that LED chip is individually first packaged into LED lamp bead, production cost is reduced, yellow circle is reduced, reduces colloid surface temperature, the launching efficiency of fluorescent powder is improved, the consistency of uniformity and colour temperature to light distribution out has preferable promotion effect.
Description
Technical field
The utility model belongs to LED component field, is specifically related to a kind of LED component of fluorescent glue overlay film.
Background technique
LED as light source of new generation, have energy-saving and environmental protection, safety, service life length, low-power consumption, low-heat, high brightness, waterproof,
The features such as miniature, shockproof, easy light modulation, light beam concentration, easy maintenance, it can be widely applied to various instructions, display, decoration, back
The fields such as light source, general lighting.Existing encapsulation reaches this light source effect mode and mainly uses external more SMD low-power devices
Grouping circuits, wherein there are two types of packaged types for current mainstream:
1, using the conventional full-color product of small-power 3528, LED thickness is excessive, can not be applied to ultrathin products, finished product body
Product is huge, and design operation space is small, can only use reflow soldering；
2, in size 5050 0.2W product of small-power, same power is relatively low, and light extraction efficiency is low, required design
Occasion emitting brightness is insufficient, can not highlight landscape effect, can only use reflow soldering.
There is the problems such as flexible design degree is low, and brightness is relatively low, and product reliability is low in both the above mode, terminal is caused to make
It is big with hidden danger.Therefore how to provide a kind of has that brightness height, high production efficiency, low thermal resistance, unfailing performance be good, flexible design degree
The problem of three-in-one packaging of RGB product of the features such as height, welding manner is various is those skilled in the art's urgent need to resolve.
Utility model content
The utility model provides a kind of LED component of fluorescent glue overlay film, and fluorescent powder precipitates and is uniformly covered on chip list
On face and substrate, yellow circle can be reduced, colloid surface temperature is reduced, overcomes the above-mentioned shortcoming of the prior art.
A kind of LED component of fluorescent glue overlay film, including substrate are provided with crystal bonding area, the base in the base of the substrate
It is provided with insulating layer on layer, line layer is provided on the insulating layer, and offer die bond mouth, the LED chip is fixed on
On the die bond mouth of crystalline region, the LED chip surface, which applies, is covered with fluorescent glue, and the encapsulation glue-line that the fluorescent glue is formed covers the base
Plate surface and LED chip periphery.
Wherein, it is provided with multipair circuit node on the line layer, LED chip is being separately connected on each circuit node just
Cathode.
Wherein, the LED chip is flip-chip, and the electrode direction of chip downward, can be directly welded on line layer.
Wherein, the substrate point has 2 pins, wherein positive pin is linked into the anode of line layer, negative pin connection
To the cathode of line layer.
Wherein, Open Side Down for the die bond mouth.
Wherein, the fluorescent glue includes fluorescent powder, nano powder and silica gel.
Wherein, the circuit node connects chip positive and negative anodes using gold thread.
Wherein, the anode of the circuit node and cathode are exposed at outside encapsulation glue-line.
The utility model has the following beneficial effects:
The LED component of fluorescent glue overlay film described in the utility model, LED light source is due to being using LED crystal covered chip, chip
Electrode direction downward, can be directly welded on wiring board, exempt from gold thread welding, reduce the investment of production equipment, and LED falls
Heat-conducting area between cartridge chip and bar shaped substrate increases, and is conducive to improve heat transfer efficiency and heat dissipation effect, reduces LED chip light
It declines, prolongs the service life.And the utility model uses monoblock type encapsulating structure, reduces and is individually first packaged into LED chip
The production technology of LED lamp bead reduces production cost, reduces yellow circle, reduces colloid surface temperature, improves the excitation effect of fluorescent powder
Rate, the consistency of uniformity and colour temperature to light distribution out have preferable promotion effect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the LED component of fluorescent glue overlay film described in the utility model；
Fig. 2 is the LED component line layer of fluorescent glue overlay film described in the utility model and the structural schematic diagram of substrate surface；
Wherein 1- substrate, 2-LED chip, 3- fluorescent glue, 4- encapsulate glue-line, 5- insulating layer, 6- line layer, 7- gold thread, 11-
Base, the crystal bonding area 12-, 13- die bond mouth, 14- anode pin, 15- negative pin, 61- circuit node, 62- circuit node are just
Pole, 63- circuit node cathode.
Specific embodiment
Be described further below the technical solution of the utility model, but claimed range be not limited to it is described.
Embodiment 1
A kind of LED component of fluorescent glue overlay film such as Fig. 1 and as described in 2, including substrate 1, the substrate 1 are located at bottom
Base 11 on be provided with the crystal bonding area 13 that LED chip is fixedly mounted, 5 layers of insulation, the insulation are provided in the base 11
It is provided with line layer 6 on layer 5, and offers the die bond mouth 13 that Open Side Down, multipair circuit node 61 is provided on line layer 6,
The positive and negative anodes of LED chip 2 are separately connected on each circuit node 61, circuit node 61 connects chip positive and negative anodes, institute using gold thread 7
Stating LED chip 2 is LED blue light flip-chip, and the electrode direction of chip downward, can be directly welded on line layer, in LED core
The surface of piece 2, which applies, is covered with fluorescent glue 3, and the encapsulation glue-line 4 that fluorescent glue 3 is formed covers 2 periphery of 1 surface of substrate and LED chip, institute
The both ends for stating substrate 1 are provided with 2 pins, wherein positive pin 14 is linked into the anode 62 of circuit node, negative pin 15 connects
It is connected to the cathode 63 of circuit node, the anode 62 and cathode 63 of the circuit node are exposed at outside encapsulation glue-line 4.
It is electrically connected between each flip LED chip to be attached by the route printed, improves connection
Stability and fastness avoid overheat and glue stress from leading to product electrical property failure；
The fluorescent glue includes fluorescent powder, nano powder and silica gel, during encapsulating the formation of glue-line 4, to the LED
The fluorescent glue of blue light wafer surface coating carries out heating cure, first becomes the viscosity of its fluorescent glue with 90 °/1.5H baking baking
It is dilute, so that fluorescent powder is precipitated and is uniformly covered on chip surface and substrate, then turn 150 °/4H carry out baking make, fluorescent glue
The encapsulation glue-line 4 being formed by curing covers substrate surface and LED chip periphery, and overall structure is uniformly beautiful, easy to make；
It, cannot the above content is specific preferred embodiment further detailed description of the utility model is combined
Assert that the specific implementation of the utility model is only limited to these instructions.For those skilled in the art of the present invention
For, without departing from the concept of the premise utility, several equivalent substitute or obvious modifications, and performance can also be made
Or purposes is identical, all shall be regarded as belonging to the protection scope of the utility model.
Claims (8)
1. a kind of LED component of fluorescent glue overlay film, including substrate, which is characterized in that be provided with die bond in the base of the substrate
Area is provided with insulating layer in the base, line layer is provided on the insulating layer, and offer die bond mouth, the LED chip
It is fixed on the die bond mouth of crystal bonding area, the LED chip surface, which applies, is covered with fluorescent glue, and the encapsulation glue-line that the fluorescent glue is formed covers
Cover the substrate surface and LED chip periphery.
2. the LED component of fluorescent glue overlay film according to claim 1, which is characterized in that be provided on the line layer multipair
Circuit node is separately connected the positive and negative anodes of LED chip on each circuit node.
3. the LED component of fluorescent glue overlay film according to claim 1, which is characterized in that the LED chip is flip-chip,
The electrode direction of chip downward, can be directly welded on line layer.
4. the LED component of fluorescent glue overlay film according to claim 1, which is characterized in that the substrate point has 2 pins,
Middle anode pin is linked into the anode of line layer, and negative pin is connected to the cathode of line layer.
5. the LED component of fluorescent glue overlay film according to claim 1, which is characterized in that Open Side Down for the die bond mouth.
6. the LED component of fluorescent glue overlay film according to claim 1, which is characterized in that the fluorescent glue includes fluorescent powder, receives
Rice flour and silica gel.
7. the LED component of fluorescent glue overlay film according to claim 2, which is characterized in that the circuit node is connected using gold thread
Connect chip positive and negative anodes.
8. the LED component of fluorescent glue overlay film according to claim 2, which is characterized in that the circuit node anode and it is negative
Pole is exposed at outside encapsulation glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820702583.6U CN208298867U (en) | 2018-05-11 | 2018-05-11 | A kind of LED component of fluorescent glue overlay film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820702583.6U CN208298867U (en) | 2018-05-11 | 2018-05-11 | A kind of LED component of fluorescent glue overlay film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208298867U true CN208298867U (en) | 2018-12-28 |
Family
ID=64704422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820702583.6U Active CN208298867U (en) | 2018-05-11 | 2018-05-11 | A kind of LED component of fluorescent glue overlay film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208298867U (en) |
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2018
- 2018-05-11 CN CN201820702583.6U patent/CN208298867U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190701 Address after: 518000 Floor 1-3, Hualian Industrial Zone, New Stone Community, Dalang Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen City Rui Ling photoelectric Co., Ltd. Address before: 518000 Dongxiao Road, Dongxiao Street, Luohu District, Shenzhen City, Guangdong Province, No. 3001 Buxinteli Industrial Park, 9 Blocks 118 Patentee before: Shenzhen way Technology Co., Ltd. |