CN208230747U - The automatic cutting molding die of semiconductor product - Google Patents
The automatic cutting molding die of semiconductor product Download PDFInfo
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- CN208230747U CN208230747U CN201820724080.9U CN201820724080U CN208230747U CN 208230747 U CN208230747 U CN 208230747U CN 201820724080 U CN201820724080 U CN 201820724080U CN 208230747 U CN208230747 U CN 208230747U
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Abstract
The utility model relates to a kind of automatic cutting molding dies of semiconductor product, including a upper mold and a lower die, and the upper die and lower die, which are worked in coordination, processes workpiece to be processed, and the upper mold includes a molding mold insert, a punch-pin and a Forming press；Punch-pin is nested in molding mold insert, and Forming press is nested in the center slot of molding mold insert；The lower die includes a cavity plate and the molding buoyant item for being nested in cavity plate inside center, the inside center of the cavity plate is provided with workpiece slot, receiving is placed on the workpiece to be processed on molding buoyant item in the workpiece slot, and when processing, the upper end of workpiece slot is resisted against in the main body of molding mold insert.The automatic cutting molding die of the semiconductor product of the utility model compared with prior art, can be with the labor intensity of reduction operation worker；Operator is reduced, a people can operate multiple devices, improve production efficiency；The wearing detail cost that mold uses is reduced, product cost is improved.
Description
[technical field]
The utility model relates to semiconductor processing technology field more particularly to a kind of semiconductor pin once bind foot it is molding
The automatic cutting molding die of semiconductor product.
[background technique]
The pin of the products such as patch products or capacitor in semiconductor be all to bind foot it is molding.The art at present
In common technique be with manual punch die punching production, the danger again of such processing method operating difficulties, production efficiency is low, quality
Also low.Another processing technology is using automatic cutting mold, and this mold requires while compatible two or more works
To complete, it is very expensive to process the die manufacturing cost used for position, due to wanting multiple station Combined process, production operation very not side
Just.Moreover, after encountering cancel closedown in process of manufacture, bad exclusion handling failure, very influence production efficiency, to operation
The technology of worker also requires relatively high, and the product of production is difficult to quantify.Also quality requirements needed for actual product being not achieved at all.
In view of the above deficiency, in order to be bound foot place with high efficiency, high-quality, safety, automation to the pin of semiconductor
Reason, it is necessary to which the automatic cutting molding die that the completely new semiconductor pin of one kind once binds foot molding semiconductor product is provided.
[utility model content]
For the problems for overcoming existing semiconductor pin processing technology, the utility model provides a kind of semiconductor product
Automatic cutting molding die.
The scheme that the utility model solves technical problem is to provide a kind of automatic cutting molding die of semiconductor product, packet
A upper mold and a lower die are included, the upper die and lower die, which are worked in coordination, processes workpiece to be processed, and the upper mold includes a molding
Mold insert, a punch-pin and a Forming press；Punch-pin is nested in molding mold insert, and Forming press is nested in the center slot of molding mold insert
It is interior；The lower die includes a cavity plate and the molding buoyant item for being nested in cavity plate inside center, the inside center setting of the cavity plate
There is a workpiece slot, receiving is placed on the workpiece to be processed on molding buoyant item in the workpiece slot, when processing, the upper end of workpiece slot
Face is resisted against in the main body of molding mold insert.
Preferably, the bottom of workpiece slot is set as edge of a knife limiting stand, and the lower part of edge of a knife limiting stand is additionally provided with binder head limit
Position platform, the internal diameter of workpiece slot are greater than the internal diameter of edge of a knife limit dais, and the internal diameter of edge of a knife limit dais is greater than pressure
The internal diameter of material head limiting stand.
Preferably, the workpiece to be processed includes workpiece body and the pin for being symmetricly set on workpiece body both sides, and two
Pin is connected in parallel at the both sides of workpiece body.
Preferably, the workpiece body of the workpiece to be processed is placed on molding buoyant item, and two pins are placed on cavity plate
Upper end on.
Preferably, the molding mold insert, punch-pin and Forming press are moved up and down by driving independently of one another.
Preferably, the lower central of the molding mold insert extends a binder head from the main part of molding mold insert, described
Binder head is sheet type knife edge structure, is pressed at the pin positions of workpiece to be processed.
Preferably, the lower central of the punch-pin extends a cutter head from the main part of punch-pin, and the cutter head is for cutting
The pin of disconnected workpiece to be processed.
Preferably, the lower end center of the Forming press is set as a T shape briquetting head, and the T shape briquetting head is pressed in be added
In the workpiece body of work workpiece.
Preferably, the binder head, cutter head, T shape briquetting head are respectively positioned on the lower half of upper mold, under original state, binder head,
Cutter head is adjacent to each other and bottom flushes, and T shape briquetting head bottom is slightly above the bottom of binder head, cutter head.
Compared with prior art, former technique is that four steps of work pieces process will be divided into two or more stations
It could complete, the station of mold is more, and shape is naturally also bigger, the bad control of precision, and manufacturing cost is relatively high.And this is practical new
This four steps of type are integrated on a station, firstly, a series of multistation cooperation precision problem avoided.Secondly, by
Then the work that a station is completed, so mold is more brief, front and rear width is smaller, and cleaning mold and debugging are compared
It is convenient.Again, easy to operate since mold is simple, the labor intensity of operator is reduced, technical requirements reduce, to personnel
Mobility also have bigger adaptability.
In addition, punch-pin and Die Design are replaced simply, cost is also relatively low at Embedded structure after abrasion.Primary folding
Roll forming workpiece pin and horizontal plane are designed to the acute angle less than 90 degree, it can be ensured that two curved rear pins do not upwarp.
Generally speaking, the automatic cutting molding die of the semiconductor product of the utility model and processing method and the prior art
It compares, it can be with the labor intensity of reduction operation worker；Operator is reduced, a people can operate multiple devices, improve production effect
Rate；The wearing detail cost that mold uses is reduced, product cost is improved；Working service equipment is fairly simple, fast, replaces accessory
It is convenient；It can preferably realize production automation.
[Detailed description of the invention]
Fig. 1 is the cross-sectional view of the automatic cutting molding die of the utility model semiconductor product；
Fig. 2 is the enlarged structure schematic diagram in Fig. 1 at A；
Fig. 3 is the processed process schematic of the utility model workpiece to be processed；
Fig. 4 is the method stream processed using the automatic cutting molding die of the utility model semiconductor product to workpiece
Cheng Tu；
Fig. 5 is the structural schematic diagram of step S1 in Fig. 4；
Fig. 6 is the structural schematic diagram of step S2 in Fig. 4；
Fig. 7 is the structural schematic diagram of step S3 in Fig. 4；
Fig. 8 is the structural schematic diagram of step S4 in Fig. 4.
[specific embodiment]
In order to make the purpose of this utility model, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to solve
The utility model is released, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
It is only each other relatively it should also be noted that, the positional terms such as left and right, upper and lower in the utility model embodiment
Concept or be reference with the normal operating condition of product, and should not be regarded as restrictive.
Referring to Fig. 1, the automatic cutting molding die 10 of the semiconductor product of the utility model includes a upper mold 101 and one
Lower die 102, the upper mold 101, lower die 102 are worked in coordination and are processed to workpiece to be processed.It is alternatively possible to drive upper mold
101 move downward and are cooperated with lower die 102, and lower die 102 can also be driven to move upwards and cooperated with upper mold 101, can also be same
When driving upper mold 101 moves downward, lower die 102 is moved upwards to be cooperated and be processed to workpiece.
The upper mold 101 includes a molding mold insert 1011, a punch-pin 1013 and a Forming press 1015；Three is nested one by one
Setting.Punch-pin 1013 is nested in molding mold insert 1011, and Forming press 1015 is nested in the center slot of molding mold insert 1011.
When upper mold 101 moves up and down, the three is moved up and down by driving independently of one another.
The lower central of the molding mold insert 1011 extends a binder head 1012 from the main part of molding mold insert 1011,
The binder head 1012 is sheet type knife edge structure, is pressed at the pin positions of workpiece to be processed, but not cuts off pin.
The lower central of the punch-pin 1013 extends a cutter head 1014, the cutter head from the main part of punch-pin 1013
1014 for cutting off the pin of workpiece to be processed.
The lower end center of the Forming press 1015 is set as a T shape briquetting head 1016, and the T shape briquetting head 1016 is pressed in
In the workpiece body of workpiece to be processed.
The binder head 1012, cutter head 1014, T shape briquetting head 1016 are respectively positioned on the lower half of upper mold 101, and the three protects
Hold nest relation identical with molding mold insert 1011, punch-pin 1013 and Forming press 1015.Under original state, binder head 1012,
Cutter head 1014 is adjacent to each other and bottom flushes, and since workpiece body has certain thickness, 1016 bottom of T shape briquetting head is slightly above
The bottom of binder head 1012, cutter head 1014.
Further referring to Fig. 2, the lower die 102 include a cavity plate 1023 and be nested in 1023 inside center of cavity plate at
Type buoyant item 1021.The molding buoyant item 1021 is a strip structure, can be moved up and down inside cavity plate 1023.Initial shape
Under state, the workpiece body of workpiece to be processed is just placed on molding buoyant item 1021.And two pins of workpiece are placed on cavity plate
In 1023 upper end.
The inside center of the cavity plate 1023 is provided with workpiece slot 1024, and the bottom of workpiece slot 1024 is set as edge of a knife limit
Platform 1025, the lower part of edge of a knife limiting stand 1025 are additionally provided with binder head limiting stand 1026.The internal diameter of workpiece slot 1024 is greater than
Internal diameter at edge of a knife limiting stand 1025, the internal diameter at edge of a knife limiting stand 1025 are greater than the interior of binder head limiting stand 1026
Diameter size.
Receiving is placed on the workpiece to be processed on molding buoyant item 1021 in the workpiece slot 1024.When processing, workpiece slot
1024 upper end is resisted against in the main body of molding mold insert 1011, is limited it and is continued to move downward.1023 bottom of workpiece slot
Edge of a knife limiting stand 1025 is resisted against on the cutter head 1014 of punch-pin 1013, is limited it and is continued to move downward.Binder head limiting stand 1026
It is resisted against on the binder head 1012 of molding 1011 bottom of mold insert, limits it and continue to move downward.
Referring to Fig. 3, the workpiece to be processed 103 includes workpiece body 1031 and is symmetricly set on workpiece body both sides
Pin 1033.Under original state, two pins 1033 are connected in parallel at the both sides of workpiece body 1031；The first step adds man-hour requirement
The pin 1033 on both sides is cut by the automatic cutting molding die 10 of semiconductor product, according to the cutting ruler of setting when cutting
The shearing of little progress row, both sides pin 1033 slightly tilts down after cutting, not parallel with the horizontal plane of workpiece body 1031；Second step needs
Will by the automatic cutting molding die 10 of semiconductor product by the pin 1033 on both sides in the junction with workpiece body 1031
Upward bending (once bending), the end of pin 1033 is bent into vertically upward after bending, and pin 1033 when due to cutting
It slightly tilts downwards, the pin part of pin part and edge now close to workpiece body 1031 is in be slightly less than 90 ° after bending
Acute angle, it is ensured that pin 1033 does not upwarp when next step bending；Third step needs to form by the automatic cutting of semiconductor product
The pin 1033 on both sides bending (secondary to bend) again up is adjacent to the pin part close to workpiece body 1031 by mold 10
The side of workpiece body 1031, the pin part at edge are adjacent to the upper surface of workpiece body 1031.
Fig. 4 please be participate in, according to the above-mentioned processing request to workpiece 103, using semiconductor product provided by the utility model
The method that workpiece 103 is processed of automatic cutting molding die 10, comprising:
Workpiece 103 is placed on the molding buoyant item 1021 of lower die 102 by step S1.Referring to Fig. 5, placing workpiece
After 103, workpiece body 1031 is housed in the workpiece slot 1024 of cavity plate 1023, and two pins 1033 lie in a horizontal plane in workpiece slot
On the end face on 1024 tops.Upper mold 101 is whole to be moved downward, and after movement, the T shape briquetting head 1016 of Forming press 1015 is pressed in work
On the upper surface of part ontology 1031, workpiece body 1031 is fixedly clamped together with molding buoyant item 1021.1012 He of binder head
Cutter head 1014 or so is pressed against on pin 1033 side by side.
Step S2, molding mold insert 1011 moves downwardly together with Forming press 1015 cuts pin 1033.Please refer to figure
6, when molding mold insert 1011 and Forming press 1015 move downwardly together, cutter head 1014 is directly in the position contacted with pin 1033
Pin 1033 is cut at place, simultaneously because molding mold insert 1011 drives binder head 1012 also to move downwardly together, so that after cutting
Pin 1033 slightly tilt down it is in a certain angle with 1031 horizontal plane of workpiece body.
Step S3, molding buoyant item 1021 continues to move downward with Forming press 1015 once beats pin 1033
It is curved.Referring to Fig. 7, when the pin 1033 that the T shape briquetting head 1016 of Forming press 1015 abuts against after cutting continues to move downward,
Since the edge of pin 1033 is stopped and bending by edge of a knife limiting stand 1025, T shape briquetting head 1016 will continue to be pressed downward after bending
Pin 1033 move downward until stopping at briquetting head limiting stand 1026.
Step S4, Forming press 1015, which continues to press on workpiece 103 and moves downward, carries out secondary bend to pin 1033.It please join
Fig. 8 is read, 1033 end vertical of pin after once bending is upward, when T shape briquetting head 1016 pushes workpiece to move downward, pin
1033 can touch binder head limiting stand 1026 and upwards bending be adjacent on the upper surface of workpiece body 1031.
So far, work of bending entirely is cut off to be completed.Last workpiece 103 is to exit mold by push rod.
Compared with prior art, former technique is that four steps of work pieces process will be divided into two or more stations
It could complete, the station of mold is more, and shape is naturally also bigger, the bad control of precision, and manufacturing cost is relatively high.And this is practical new
This four steps of type are integrated on a station, firstly, a series of multistation cooperation precision problem avoided.Secondly, by
Then the work that a station is completed, so mold is more brief, front and rear width is smaller, and cleaning mold and debugging are compared
It is convenient.Again, easy to operate since mold is simple, the labor intensity of operator is reduced, technical requirements reduce, to personnel
Mobility also have bigger adaptability.
In addition, punch-pin 1013 and cavity plate 1023 are designed to Embedded structure, replaced simply after abrasion, cost also compares
It is low.Bending and molding workpiece pin 1033 and horizontal plane are designed to the acute angle less than 90 degree, it can be ensured that two curved rear pins
1033 do not upwarp.
Generally speaking, the automatic cutting molding die 10 of the semiconductor product of the utility model and processing method and existing skill
Art is compared, can be with the labor intensity of reduction operation worker；Operator is reduced, a people can operate multiple devices, improve production
Efficiency；The wearing detail cost that mold uses is reduced, product cost is improved；Working service equipment is fairly simple, and fast, replacement is matched
Part is convenient；It can preferably realize production automation.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modification within the principle of utility model, equivalent replacement and improvement etc. should all include the protection scope of the utility model
Within.
Claims (9)
1. a kind of automatic cutting molding die of semiconductor product, including a upper mold and a lower die, the upper die and lower die mutually match
Workpiece to be processed is processed in conjunction, it is characterised in that:
The upper mold includes a molding mold insert, a punch-pin and a Forming press；Punch-pin is nested in molding mold insert, and Forming press is embedding
It covers in the center slot of molding mold insert；
The lower die includes a cavity plate and the molding buoyant item for being nested in cavity plate inside center, the inside center setting of the cavity plate
There is a workpiece slot, receiving is placed on the workpiece to be processed on molding buoyant item in the workpiece slot, when processing, the upper end of workpiece slot
Face is resisted against in the main body of molding mold insert.
2. the automatic cutting molding die of semiconductor product as described in claim 1, it is characterised in that: the bottom of workpiece slot is arranged
For edge of a knife limiting stand, the lower part of edge of a knife limiting stand is additionally provided with binder head limiting stand, and the internal diameter of workpiece slot is limited greater than the edge of a knife
Internal diameter at the platform of position, the internal diameter of edge of a knife limit dais are greater than the internal diameter of binder head limiting stand.
3. the automatic cutting molding die of semiconductor product as described in claim 1, it is characterised in that: the workpiece to be processed packet
Workpiece body and the pin for being symmetricly set on workpiece body both sides are included, two pins are connected in parallel at the both sides of workpiece body.
4. the automatic cutting molding die of semiconductor product as claimed in claim 3, it is characterised in that: the workpiece to be processed
Workpiece body is placed on molding buoyant item, and two pins are placed in the upper end of cavity plate.
5. the automatic cutting molding die of semiconductor product as described in claim 1, it is characterised in that: the molding mold insert, convex
Mould and Forming press are moved up and down by driving independently of one another.
6. the automatic cutting molding die of semiconductor product as claimed in claim 3, it is characterised in that: under the molding mold insert
A binder head is extended from the main part of molding mold insert in portion center, and the binder head is sheet type knife edge structure, is pressed in be added
At the pin positions of work workpiece.
7. the automatic cutting molding die of semiconductor product as claimed in claim 6, it is characterised in that: in the lower part of the punch-pin
The heart extends a cutter head from the main part of punch-pin, and the cutter head is used to cut off the pin of workpiece to be processed.
8. the automatic cutting molding die of semiconductor product as claimed in claim 7, it is characterised in that: under the Forming press
End center is set as a T shape briquetting head, and the T shape briquetting head is pressed in the workpiece body of workpiece to be processed.
9. the automatic cutting molding die of semiconductor product as claimed in claim 8, it is characterised in that: the binder head, cutter head,
T shape briquetting head is respectively positioned on the lower half of upper mold, and under original state, binder head, cutter head are adjacent to each other and bottom flushes, T shape briquetting
Head bottom is slightly above the bottom of binder head, cutter head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820724080.9U CN208230747U (en) | 2018-05-16 | 2018-05-16 | The automatic cutting molding die of semiconductor product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820724080.9U CN208230747U (en) | 2018-05-16 | 2018-05-16 | The automatic cutting molding die of semiconductor product |
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| Publication Number | Publication Date |
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| CN208230747U true CN208230747U (en) | 2018-12-14 |
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| CN201820724080.9U Active CN208230747U (en) | 2018-05-16 | 2018-05-16 | The automatic cutting molding die of semiconductor product |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108421935A (en) * | 2018-05-16 | 2018-08-21 | 深圳市华龙精密模具有限公司 | A kind of the automatic cutting molding die and its processing method of semiconductor product |
-
2018
- 2018-05-16 CN CN201820724080.9U patent/CN208230747U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108421935A (en) * | 2018-05-16 | 2018-08-21 | 深圳市华龙精密模具有限公司 | A kind of the automatic cutting molding die and its processing method of semiconductor product |
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