CN208225850U - Novel adamantine line silicon wafer stripping machine - Google Patents
Novel adamantine line silicon wafer stripping machine Download PDFInfo
- Publication number
- CN208225850U CN208225850U CN201820735475.9U CN201820735475U CN208225850U CN 208225850 U CN208225850 U CN 208225850U CN 201820735475 U CN201820735475 U CN 201820735475U CN 208225850 U CN208225850 U CN 208225850U
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- CN
- China
- Prior art keywords
- rinse bath
- silicon wafer
- stripping machine
- cleaning
- machine according
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 60
- 239000010703 silicon Substances 0.000 title claims abstract description 60
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910001573 adamantine Inorganic materials 0.000 title claims abstract description 26
- 238000004140 cleaning Methods 0.000 claims abstract description 45
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000010926 purge Methods 0.000 claims abstract description 18
- 235000014655 lactic acid Nutrition 0.000 claims abstract description 14
- 239000004310 lactic acid Substances 0.000 claims abstract description 14
- 238000009875 water degumming Methods 0.000 claims abstract description 8
- 210000002421 cell wall Anatomy 0.000 claims abstract description 4
- 239000012459 cleaning agent Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 8
- 238000002604 ultrasonography Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 8
- 238000007654 immersion Methods 0.000 abstract description 2
- 239000007921 spray Substances 0.000 description 17
- 238000002791 soaking Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The utility model discloses a kind of novel adamantine line silicon wafer stripping machines, it is related to wafer cleaning technical, including purge chamber, purge chamber includes an inlet and an outlet, the first rinse bath, the second rinse bath, third rinse bath, hot water degumming tank and lactic acid degumming tank are disposed in purge chamber, first rinse bath corresponds to entrance, the corresponding outlet of lactic acid degumming tank, the first rinse bath, the second rinse bath, third rinse bath cell wall be equipped with ultrasonic plate.The utility model carries out immersion type cleaning to silicon wafer, reduces the pressure that silicon wafer is subject in the process of cleaning, and be less prone to dirty.
Description
Technical field
The utility model relates to wafer cleaning technicals, more particularly to a kind of novel adamantine line silicon wafer stripping machine.
Background technique
Existing silicon wafer stripping machine has spray chamber, is equipped with spray head in spray chamber by the way of spraying degumming in degumming machine
With Wafer Cleaning basket, Wafer Cleaning basket is detachable setting.
In use, opening spray chamber, silicon wafer is inserted into cleaning basket and is fixed, spray chamber is then shut off, opens spray head to silicon
Piece carries out spray cleaning.
The hydraulic pressure of spray is in 0.08MPa.
But fountain degumming machine, with the increase of the service life, the water supply pipe inner wall of spray head can casting accumulation scale
Or corrosion, cause water pipe channel to narrow, the hydraulic pressure for causing spray head to spray is got higher.The process that silicon wafer is sprayed be easy to happen crack or
Fragment.Also, the distance between adjacent hole for water spraying is 2mm on spray head, and silicon wafer thickness is 0.2mm, and portion is had during spray
Divide silicon wafer spray less than dirty of appearance.
Utility model content
The shortcomings that technical problem to be solved in the utility model is, overcomes the prior art provides a kind of novel adamantine line
Silicon wafer stripping machine carries out immersion type cleaning to silicon wafer, reduces the pressure that silicon wafer is subject in the process of cleaning, and be less prone to dirty
Piece.
In order to solve the above technical problems, the utility model provides a kind of novel adamantine line silicon wafer stripping machine, including cleaning
Room, purge chamber include an inlet and an outlet, and the first rinse bath, the second rinse bath, third rinse bath, heat are disposed in purge chamber
Water degumming tank and lactic acid degumming tank, the first rinse bath correspond to entrance, and the corresponding outlet of lactic acid degumming tank, the first rinse bath, second are clearly
Washing trough, third rinse bath cell wall be equipped with ultrasonic plate.
The technical solution that the utility model further limits is:
Further, it is equipped with the first ultrasonic plate in the first rinse bath, the second ultrasonic plate is equipped in the second rinse bath, the first is surpassed
Sound plate and the second ultrasonic plate are respectively facing the two sides of silicon wafer.
The preceding novel adamantine line silicon wafer stripping machine, third rinse bath is interior to be equipped with third ultrasound plate, third ultrasound plate court
To the bottom surface of silicon wafer.
The preceding novel adamantine line silicon wafer stripping machine, equipped with fixing device for silicon piece, fixing device for silicon piece packet in purge chamber
Include shaft, be provided with Wafer Cleaning basket in shaft, Wafer Cleaning basket is slided along shaft, and immerses or leave rinse bath, shaft by
It controls in motor rotation.
The preceding novel adamantine line silicon wafer stripping machine is extended with telescopic arm in shaft, and telescopic arm is parallel to rinse bath
Opening, Wafer Cleaning basket are set on telescopic arm, and cleaning basket is controlled by telescopic arm and stretches out or enter purge chamber.
The preceding novel adamantine line silicon wafer stripping machine, for telescopic arm by the fixed Wafer Cleaning basket of sunpender, cleaning basket is controlled
It is moved back and forth along the vertical direction in sunpender.
The preceding novel adamantine line silicon wafer stripping machine, the first rinse bath, the second rinse bath, third rinse bath, hot water are de-
Glue groove and lactic acid degumming tank are circumferentially distributed, and shaft is located at the center point.
The preceding novel adamantine line silicon wafer stripping machine, rinse bath and degumming tank are equipped with overflow water inlet pipe and overflow water outlet
The flow rates controlled of pipe, overflow water inlet pipe and overflow outlet pipe is in control valve.
The preceding novel adamantine line silicon wafer stripping machine, entrance and outlet are to pick and place mouth.
The preceding novel adamantine line silicon wafer stripping machine, further includes at least one cleaning agent case, is extended on cleaning agent case
Cleaning agent delivery pipe, the outlet of cleaning agent delivery pipe extend to above the first rinse bath or the second rinse bath, cleaning agent delivery pipe
It is controlled by valve body or pump housing intermittence and is dripped into the first rinse bath or the second rinse bath and send cleaning agent.
The beneficial effects of the utility model are:
(1) cleaning of existing spray is changed to ultrasonic soaking and washing, and point three steps difference emphasis cleaning by the utility model
The different sides of silicon wafer keep the cleaning of silicon wafer more thorough.And in the process of cleaning, silicon wafer impregnates in water, the pressure being subject to
Strong opposite fountain is smaller, therefore silicon wafer is not susceptible to crack, also reduces the probability of dirty appearance；
(2) the utility model rinse bath refers to that the first rinse bath, the second rinse bath and third rinse bath, degumming tank refer to that hot water is de-
Glue groove and lactic acid degumming tank, rinse bath and degumming tank are circumferentially distributed in around shaft, and Wafer Cleaning basket is controlled by shaft and stretches
Contracting arm successively immerses rinse bath and degumming tank, to complete a whole set of cleaning process；
(3) the utility model is when silicon wafer is located at and is cleaned in different rinse bath or degumming tank, other rinse baths or
Degumming tank can replace the solution of soaking and washing by overflow water inlet pipe and overflow outlet pipe, continue working, improve to realize
The efficiency of batch cleaning.
Detailed description of the invention
Fig. 1 is the utility model Cleaning principle schematic diagram；
Fig. 2 is the schematic diagram of the utility model structure；
Wherein: 1, purge chamber；11, overflow water inlet pipe；12, overflow outlet pipe；13, control valve；14, mouth is picked and placed；2, first
Rinse bath；21, the first ultrasonic plate；3, the second rinse bath；31, the second ultrasonic plate；4, third rinse bath；41, third ultrasound plate；5,
Hot water degumming tank；6, lactic acid degumming tank；7, fixing device for silicon piece；71, Wafer Cleaning basket；72, telescopic arm；73, shaft；74, it hangs
Bar.
Specific embodiment
A kind of novel adamantine line silicon wafer stripping machine provided in this embodiment, structure are as shown in Figs. 1-2.
The novel adamantine line silicon wafer stripping machine, including purge chamber 1, purge chamber 1 include an inlet and an outlet, in purge chamber 1 according to
It is secondary to be provided with the first rinse bath 2, the second rinse bath 3, third rinse bath 4, hot water degumming tank 5 and lactic acid degumming tank 6, the first cleaning
Slot 2 corresponds to entrance, the corresponding outlet of lactic acid degumming tank 6, the first rinse bath 2, the second rinse bath 3, third rinse bath 4 cell wall on set
There is ultrasonic plate.
Wherein, it is equipped with the first ultrasonic plate 21 in the first rinse bath 2, is equipped with the second ultrasonic plate 31 in the second rinse bath 3, first
Ultrasonic plate 21 and the second ultrasonic plate 31 are respectively facing the two sides of silicon wafer.Third ultrasound plate 41, third are equipped in third rinse bath 4
Ultrasonic plate 41 is towards the bottom surface of silicon wafer.Fixing device for silicon piece 7 is equipped in purge chamber 1, fixing device for silicon piece 7 includes shaft 73, is turned
Be provided with Wafer Cleaning basket 71 on axis 73, Wafer Cleaning basket 71 is slided along shaft 73, and immerses or leave rinse bath, shaft 73 by
It controls in motor rotation.
Wherein, telescopic arm 72 is extended in shaft 73, telescopic arm 72 is parallel to the opening of rinse bath, and Wafer Cleaning basket 71 is set
In on telescopic arm 72, cleaning basket is controlled by telescopic arm 72 and stretches out or enter purge chamber 1.Telescopic arm 72 passes through the fixed silicon wafer of sunpender 74
Basket 71 is cleaned, cleaning basket is controlled by sunpender 74 and moves back and forth along the vertical direction.First rinse bath 2, the second rinse bath 3, third are clear
Washing trough 4, hot water degumming tank 5 and lactic acid degumming tank 6 are circumferentially distributed, and shaft 73 is located at the center point.Rinse bath and degumming tank are all provided with
There are an overflow water inlet pipe 11 and overflow outlet pipe 12, the flow rates controlled of overflow water inlet pipe 11 and overflow outlet pipe 12 is in control valve 13.
Entrance and outlet are to pick and place mouth 14.
Further include at least one cleaning agent case, cleaning agent delivery pipe is extended on cleaning agent case, cleaning agent delivery pipe goes out
Mouth extends to 3 top of the first rinse bath 2 or the second rinse bath, and cleaning agent delivery pipe is controlled by valve body or pump housing intermittence to first
Drop send cleaning agent in rinse bath 2 or the second rinse bath 3.
The existing spray cleaning of this programme is changed to ultrasonic soaking and washing, and the difference of point three steps difference emphasis cleaning silicon chip
Side keeps the cleaning of silicon wafer more thorough.And in the process of cleaning, silicon wafer impregnates the opposite spray of the pressure being subject in water
Formula is smaller, therefore silicon wafer is not susceptible to crack, also reduces the probability of dirty appearance.
Wherein, rinse bath refers to that the first rinse bath 2, the second rinse bath 3 and third rinse bath 4, degumming tank refer to hot water degumming tank 5
With lactic acid degumming tank 6, rinse bath and degumming tank are circumferentially distributed in around shaft 73, and Wafer Cleaning basket 71 is controlled by 73 He of shaft
Telescopic arm 72 successively immerses rinse bath and degumming tank, to complete a whole set of cleaning process.When silicon wafer be located at different rinse bath or
When being cleaned in degumming tank, other rinse baths or degumming tank can be replaced by overflow water inlet pipe 11 and overflow outlet pipe 12
The solution of soaking and washing continues working to realize, improves the efficiency of batch cleaning.
In addition to the implementation, the utility model can also have other embodiments；It is all to use equivalent replacement or equivalent change
The technical solution to be formed is changed, the protection scope of the requires of the utility model is all fallen within.
Claims (10)
1. a kind of novel adamantine line silicon wafer stripping machine, including purge chamber (1), the purge chamber (1) is included an inlet and an outlet, special
Sign is: the first rinse bath (2), the second rinse bath (3), third rinse bath (4), heat are disposed in the purge chamber (1)
Water degumming tank (5) and lactic acid degumming tank (6), the corresponding entrance of first rinse bath (2), the lactic acid degumming tank (6) are right
Should export, first rinse bath (2), the second rinse bath (3), third rinse bath (4) cell wall be equipped with ultrasonic plate.
2. novel adamantine line silicon wafer stripping machine according to claim 1, it is characterised in that: in first rinse bath (2)
Equipped with the first ultrasonic plate (21), be equipped with the second ultrasonic plate (31) in second rinse bath (3), the described first ultrasonic plate (21) with
Described second ultrasonic plate (31) is respectively facing the two sides of the silicon wafer.
3. novel adamantine line silicon wafer stripping machine according to claim 2, it is characterised in that: in the third rinse bath (4)
Equipped with third ultrasound plate (41), the third ultrasound plate (41) is towards the bottom surface of the silicon wafer.
4. novel adamantine line silicon wafer stripping machine according to claim 3, it is characterised in that: be equipped in the purge chamber (1)
Fixing device for silicon piece (7), the fixing device for silicon piece (7) include shaft (73), are provided with Wafer Cleaning on the shaft (73)
Basket (71), the Wafer Cleaning basket (71) are slided along the shaft (73), and immerse or leave rinse bath, the shaft (73) by
It controls in motor rotation.
5. novel adamantine line silicon wafer stripping machine according to claim 4, it is characterised in that: be extended on the shaft (73)
Telescopic arm (72), the telescopic arm (72) are parallel to the opening of the rinse bath, and the Wafer Cleaning basket (71) is set to described stretch
On contracting arm (72), the cleaning basket (71) is controlled by the telescopic arm (72) and stretches out or enter the purge chamber.
6. novel adamantine line silicon wafer stripping machine according to claim 5, it is characterised in that: the telescopic arm (72) is by hanging
The fixed Wafer Cleaning basket (71) of bar (74), the cleaning basket (71) are controlled by the sunpender (74) reciprocal fortune along the vertical direction
It is dynamic.
7. novel adamantine line silicon wafer stripping machine according to claim 4, it is characterised in that: first rinse bath (2),
Two rinse baths (3), third rinse bath (4), hot water degumming tank (5) and lactic acid degumming tank (6) are circumferentially distributed, the shaft (73)
Positioned at the center point.
8. novel adamantine line silicon wafer stripping machine according to claim 6 or 7, it is characterised in that: the rinse bath and degumming
Slot is equipped with overflow water inlet pipe (11) and overflow outlet pipe (12), the overflow water inlet pipe (11) and the overflow outlet pipe (12)
Flow rates controlled in control valve (13).
9. novel adamantine line silicon wafer stripping machine according to claim 8, it is characterised in that: the entrance and the outlet connect
Lead to pick and place mouth (14).
10. novel adamantine line silicon wafer stripping machine according to claim 1, it is characterised in that: further include at least one cleaning
Agent case is extended with cleaning agent delivery pipe on the cleaning agent case, and it is clear that the outlet of the cleaning agent delivery pipe extends to described first
Above washing trough (2) or the second rinse bath (3), it is clear to described first that the cleaning agent delivery pipe is controlled by valve body or pump housing intermittence
Drop send cleaning agent in washing trough (2) or the second rinse bath (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820735475.9U CN208225850U (en) | 2018-05-17 | 2018-05-17 | Novel adamantine line silicon wafer stripping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820735475.9U CN208225850U (en) | 2018-05-17 | 2018-05-17 | Novel adamantine line silicon wafer stripping machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208225850U true CN208225850U (en) | 2018-12-11 |
Family
ID=64508267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820735475.9U Active CN208225850U (en) | 2018-05-17 | 2018-05-17 | Novel adamantine line silicon wafer stripping machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208225850U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447810A (en) * | 2018-05-17 | 2018-08-24 | 江苏高照新能源发展有限公司 | A kind of novel adamantine line silicon wafer stripping machine |
-
2018
- 2018-05-17 CN CN201820735475.9U patent/CN208225850U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447810A (en) * | 2018-05-17 | 2018-08-24 | 江苏高照新能源发展有限公司 | A kind of novel adamantine line silicon wafer stripping machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 968 GANGLONG Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU GAOZHAO NEW ENERGY DEVELOPMENT Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd. |