Electronic device needs to work within the scope of certain temperature, can be only achieved optimal performance.It is existing various to set
In standby, circuit part often concentrates design on PCB (Printed Circuit Board, printed circuit board) plate, with to electricity
The requirement of road partial function, computing capability etc. is constantly increased, and the electronic device on pcb board is more and more, and density is increasingly
Greatly, to which the heat generated is also higher and higher.How effectively to be radiated to the circuit on pcb board, so that circuit being capable of work
Make in most ideal temperature section, already becomes an indispensable considerations in circuit design field.
Currently, with CPU (Central Processing Unit, central processing unit), GPU (Graphics
Processing Unit, graphics processor) etc. ASIC (Application Specific Integrated Circuits, specially
With integrated circuit) the continuous promotion of the calculated performance, the speed of service of chip, calorific value is also constantly soaring.
Currently, the calculation power plate calculated using asic chip has been widely used, especially in recent years with
Bit coin is the generation of the ideal money of representative, more promotes a large amount of uses for calculating power plate.Calculating power plate with bit coin mine machine is
In general example is calculated in power plate for one piece and is integrated with dozens or even hundreds of asic chip, these chips arrange in an array manner
On one piece of pcb board.It well imagines, when calculation power plate is in work, a large amount of asic chip is in state of operating at full capacity,
Necessarily lead to amount of heat.Existing calculation power plate is that several asic chips is used to be laid out in a manner of in series or in parallel
On pcb board, every ASIC power consumptions nearly 10W generates heat very big.Common radiating mode is all to add radiator up and down in asic chip
Again plus one or two violence fan radiates.This radiating mode causes pcb board air-intake side nearby and outlet air side edges
Up to 30 degree of the temperature difference, and the power consumption of asic chip and performance have direct relation, temperature difference that can cause asic chip with temperature
Performance difference to influence the stability of system.
Utility model content
In view of this, a kind of circuit board arrangement of the utility model offer and computing device, with the temperature of equalizing circuit plate everywhere
Difference is spent, to promote the stability of circuit.
What the technical solution of the application was realized in：
A kind of circuit board arrangement, including：
Pcb board with air-intake side and outlet air side；
It is installed on the pcb board, and runs through institute between the air-intake side of the pcb board and the outlet air side
State the spaced multiple rows of heater in central area of pcb board；Wherein,
Multiple rows of heater exists at the interval formed close to the region of the air-intake side less than multiple rows of heater
The central area and the interval formed close to the region of the outlet air side.
Further, the interval that multiple rows of heater is formed in the region close to the outlet air side is less than multiple rows of hair
The interval that hot body is formed in the central area.
Further, the heater is computing chip.
Further, the computing chip surface is equipped with radiator.
Further, the pcb board is aluminum substrate.
Further, the circuit board arrangement is to calculate power plate.
Further, the circuit board arrangement is that ideal money mine machine calculates power plate.
A kind of computing device, including：
Cabinet, the cabinet have air inlet and air outlet；
Any one of them circuit board arrangement as above being installed in the cabinet, wherein the air-intake side is towards institute
State air inlet, the outlet air side is towards the air outlet；
First fan, first fan are installed on the air inlet, to be blown into the cabinet by the air inlet
Enter radiating airflow.
Further, the computing device further includes：
Second fan, second fan are installed on the air outlet, with will be in the cabinet by the air outlet
Thermal current is blown out outside cabinet.
Further, the circuit board arrangement is at least one；
When the circuit board arrangement is at least two, each circuit board arrangement is equidistantly stacked in the air inlet and goes out
Between air port.
Further, the computing device is ideal money mine machine.
From said program as can be seen that in the circuit board arrangement and computing device of the utility model, multiple rows of heater by
The interval that the region of the nearly air-intake side is formed is less than multiple rows of heater in the central area and close to the outlet air
The interval that the region of side is formed, and then in actual use, being capable of the temperature of balancing circuitry panel assembly everywhere so that circuit board
The temperature difference of device everywhere reaches minimum, to ensure the stability of circuit.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, develop simultaneously reality referring to the drawings
Example is applied, the utility model is described in further detail.
The utility model embodiment provides a kind of circuit board arrangement, as shown in Figure 1, the circuit board arrangement includes PCB
Plate 11 and the multiple rows of heater 12 being installed on the pcb board 11.Wherein, the pcb board 11 has air-intake side 111 and goes out
Wind side 112.The heater 12 is between the air-intake side 111 and the outlet air side 112 of the pcb board 11 through described
The central area of pcb board 11 is alternatively arranged, and is interval 13 between adjacent two rows heater 12.Wherein, multiple rows of heater 12
It in the central area and is leaned on less than multiple rows of heater 12 at the interval 13 formed close to the region of the air-intake side 111
The interval 13 that the region of the nearly outlet air side 112 is formed.
Wherein, the chip to give off heat under the state that is powered on that the heater 12 is for example installed on pcb board 11,
Such as asic chip.Since asic chip will produce a large amount of heat during the work time, and peace can be arranged on pcb board 11
Multiple asic chips are filled, if heat dissipation effect is undesirable, can so that temperature distribution is non-uniform everywhere for circuit in pcb board 11, from
And influence the stability of circuit.
In the utility model embodiment, multiple rows of heater 12 is close to the formation of the region of the air-intake side 111
Interval 13 is less than multiple rows of heater 12 in the central area and the interval formed close to the region of the outlet air side 112
13.This structure enables to the uniformity of temperature profile of circuit everywhere in pcb board 11, to promote the stability of circuit.Because
For the circuit that needs radiate, it is necessary to corresponding radiating element is installed, for using the heat dissipation of air-cooled form, heat transmission gas
Stream be blown into from a side (air-intake side 111) of pcb board 11 and along the surface of pcb board 11 after each row's heater 12 from
Another side (outlet air side 112) of pcb board 11 is blown out, to take away the heat of each row's heater 12.By installation pcb board
11 cabinet space limitation and the influence of the position of radiator fan so that the region of the close air-intake side 111 of pcb board 11
Air velocity is faster than the air velocity of the central area of pcb board 11 and the region close to the outlet air side 112, therefore compares
In the central area of pcb board 11 and the region of the close outlet air side 112, the area of the close air-intake side 111 of pcb board 11
The heat in domain can more be taken away, in this way, by the central area of pcb board 11 and the area of the close outlet air side 112
The density design of the heater 12 in domain is at the density of the heater 12 in the region of the close air-intake side 111 less than pcb board 11, energy
The Temperature Distribution of enough balance PCB plates 11 everywhere so that the temperature of pcb board 11 everywhere reaches unanimity, and then promotes the electricity of pcb board 11
On the basis of the above embodiments, multiple rows of heater 12 is formed close to the region of the outlet air side 112
Interval 13 be less than the interval 13 that is formed in the central area of multiple rows of heater 12.This arrangement architecture, which can reduce, to be leaned on
Between the heater 12 in the region of the nearly outlet air side 112 and the heater 12 in the region close to the outlet air side 112
Temperature difference.This is the outlet air for being primarily due to the babinet in the region distance installation pcb board 11 close to the outlet air side 112
Mouth is closer, while babinet is also not fully sealed other than air inlet and air outlet, due to body inside and outside air pressure difference, leads
The lower air of least a portion of external temperature has been caused to flow through the area close to the outlet air side 112 through babinet near air outlet
The heater 12 in domain, and flowed out from air outlet, and then the heater 12 in the region close to the outlet air side 112 can be taken away
More heats.Therefore, the density design of the heater 12 in the region of the outlet air side 112 is will be close at higher than pcb board 11
Central area heater 12 density, can further balance PCB plate 11 close to the outlet air side 112 region and in
Heart district domain Temperature Distribution so that the temperature of pcb board 11 everywhere more reaches unanimity, steady with the circuit for further promoting pcb board 11
It is qualitative.
In the utility model embodiment, the heater 12 is computing chip, further, the computing chip surface peace
Equipped with radiator to enhance the heat dissipation effect of each computing chip.In addition, the pcb board 11 is aluminum substrate, aluminum substrate is depended on
The characteristic of quick conductive can even up the temperature of entire pcb board 11.
As a specific embodiment, the circuit board arrangement is to calculate power plate, and further, the circuit board arrangement is void
Quasi- currency mine machine calculates power plate, such as bit coin mine machine calculates power plate, Lay spy's coin mine machine calculates power plate etc..Because ideal money mine machine needs
High calculation power, and high-speed computation will produce a large amount of heat, therefore, the utility model embodiment is highly suitable for ideal money
Mine machine calculates power plate, and ideal money mine machine is enable more steadily to run on the whole, to ensure that digging mine uninterruptedly carries out.
In the utility model, the heater 12 in attached drawing, i.e. computing chip are only for being aided in illustrating, and every discharge
12 quantity of heater in hot body 12 can be 1 at most, such as 6 shown in Fig. 1, naturally it is also possible to according to circuit design
The requirement of structure, body structure etc. and change often go in heater 12 quantity, such as often arrange heater 12 in heater number
Amount can also be for 1,2,3,4,5,6,7,8,9,10 or more.Certainly, according to circuit design
Demand etc., the quantity of heater 12 is also not necessarily required to exactly the same between each row row heater 12, such as in view of calculating power
Plate also needs to other components such as other control chips, input/output interface in addition to computing chip and occupies pcb board 11
Space, then with regard to needing to reserve corresponding other occupied spaces of component, such as when other components occupy the close of pcb board 11
When a part in the region of certain a side, then the heater number often arranged in heater 12 in the region close to the side
Amount may be less than the quantity of heater 12 in other rows, such as when the heater 12 in most row's heaters 12 in pcb board 12
Quantity be 6 when, close to the side region in often arrange heater 12 in heater quantity can be set as 5
, 4 or 3 etc..
The utility model embodiment additionally provides a kind of computing device, as shown in Fig. 2, including：Cabinet 21, circuit board arrangement
22 and first fan 23.Wherein, the cabinet 21 has air inlet (left side of cabinet 21 in such as Fig. 2) and air outlet (in such as Fig. 2
The right side of cabinet 21).Circuit board arrangement 22 is installed in the cabinet 21, which is the circuit board of above description
Device.Wherein, the air-intake side is towards the air inlet, and the outlet air side is towards the air outlet.First fan
23 are installed on the air inlet, to be blown into radiating airflow into the cabinet 21 by the air inlet.
It can be realized to the heat dissipation in cabinet 21 in the air inlet when the first fan 23 is only arranged.However, in order to reach
Better heat dissipation effect, the computing device also need to further comprise that the second fan 24, second fan 24 are installed on described
Air outlet, to be blown out the thermal current in the cabinet 21 outside cabinet by the air outlet.In this way, existing first fan 23 will
The lower cold air of temperature outside cabinet 21 blows into cabinet 21, and has the second fan 24 that the higher heat of the temperature in cabinet 21 is empty
Air-blowing goes out cabinet 21, the heat dissipation in realization cabinet 21 that can be more efficient.
In the utility model embodiment, the circuit board arrangement 22 is at least one, when the circuit board arrangement 22 is extremely
When two few, each circuit board arrangement 22 is equidistantly stacked between the air inlet and air outlet.It is described such as shown in Fig. 2
Circuit board arrangement 22 is three, and three circuit board arrangements 22 are equidistantly stacked between the air inlet and air outlet.
As a specific embodiment, computing device shown in Fig. 2 is, for example, ideal money mine machine.
It should be noted that being only a kind of structural description, not real circuits panel assembly and meter shown in Fig. 1 and Fig. 2
Device is calculated, wherein should also include for example various auxiliary circuits and mechanical structure, such as electricity other than content shown in Fig. 1 and Fig. 2
Source module, control unit, radiator module etc., which are combined, realizes that circuit board arrangement and computing device finally calculate purposes
Various component contents.
In the circuit board arrangement and computing device of the utility model, multiple rows of heater is close to the region of the air-intake side
The interval of formation is less than the interval that multiple rows of heater is formed in the region of the central area and the close outlet air side,
It and then in actual use, being capable of the temperature of balancing circuitry panel assembly everywhere so that the temperature difference of circuit board arrangement everywhere reaches most
It is small, to ensure the stability of circuit.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent substitution, improvement and etc. done should be included in the utility model
Within the scope of protection.