CN207925802U - A kind of high-frequency test socket for integrated circuit - Google Patents

Abstract

The utility model discloses a kind of high-frequency test sockets for integrated circuit,Including jack body and chip,Chip is arranged in the upper end of jack body,The lower end of jack body is equipped with socket rear cover,Spring pin hole is equipped in jack body,Spring pin hole includes power supply signal pin hole,High-frequency signal pin hole and other signal pin holes,Other signal pin holes are arranged between power supply signal pin hole and high-frequency signal pin hole,Power supply signal pin hole is for being embedded in power supply signal probe,High-frequency signal pin hole is for being embedded in high-frequency signal probe,Other signal pin holes are for being embedded in other signal probes,Power supply signal probe,The upper surface of high-frequency signal probe and other signal probes is equipped with the pins contact slot of chip,The hole wall of high-frequency signal pin hole and other signal pin holes is equipped with insulating layer,Spring pin hole runs through jack body and socket rear cover,Solve crosstalk,Loss and problems of Signal Integrity.

Description

A socket for high-frequency testing of integrated circuits

technical field

The utility model relates to the technical field of printed circuit board testing, in particular to a socket for high-frequency testing of integrated circuits.

Background technique

In high-frequency testing, it is generally achieved by shortening the test height (pogo pin length) between the pins of the integrated circuit and the test PCB board, but this method can only solve part of the high-frequency testing, when the frequency exceeds a certain valve value, this solution no longer meets the requirements; in addition, with the high integration and miniaturization of integrated circuits, it is difficult to achieve ideal values in terms of the reliability and mechanical strength of the test fixture by reducing the test height.

Utility model content

In order to overcome the above disadvantages, the purpose of this utility model is to provide a socket for high-frequency testing of integrated circuits, relying on a completely closed coaxial structure to solve the problems of crosstalk, loss and signal integrity.

In order to achieve the above purpose, the technical solution adopted by the utility model is: a socket for high-frequency testing of integrated circuits, including a socket body and a chip, the chip is arranged on the upper end of the socket body, and the socket body The lower end is provided with a socket back cover, and a spring pinhole is provided in the socket body, and the spring pinhole includes a power signal pinhole, a high-frequency signal pinhole and other signal pinholes, and the other signal pinholes are set on the Between the power signal pinhole and the high-frequency signal pinhole, the power signal pinhole is used to embed a power signal probe, the high-frequency signal pinhole is used to embed a high-frequency signal probe, and the other signal pinholes are used for For embedding other signal probes, the upper end surfaces of the power signal probes, high-frequency signal probes and other signal probes are provided with pin contact grooves of the chip, and the high-frequency signal pinholes and other signal pinholes An insulating layer is provided on the wall of the hole, and the spring pin hole runs through the socket body and the socket rear cover.

Further, the power signal probes are in contact with the hole walls, the other signal probes are in contact with the hole walls, and there is a gap between the high-frequency signal probes and the hole walls.

Further, the high-frequency signal probes include a first probe, a second probe and a third probe, the first probe and the second probe are connected through a first connection block, and the second The probe and the third probe are connected through a second connection block, and both the first connection block and the second connection block abut against the hole wall of the high-frequency signal pinhole.

Further, the power signal probe and other signal probes are in the shape of a "cross", the first probe, the second probe and the first connection block are in the shape of a "cross" as a whole, and the third probe The diameter of the lower end is smaller than the diameter of the upper end.

Further, the power signal pinholes, other signal pinholes and high-frequency signal pinholes arranged in the socket body are all through holes whose upper end aperture is smaller than the lower end aperture, and the power signal pinholes arranged in the socket rear cover It is in the shape of "I", and the other signal pinholes and high-frequency signal pinholes are in the shape of "T".

Further, the socket rear cover and the socket body are connected by bolts.

The utility model provides a socket for high-frequency testing of integrated circuits. For the power signal: the power signal pogo pin is connected to the hole wall, and the hole wall maintains conductivity, so that the inside of the conductor of the entire socket body and the power spring The pins are the same power supply signal, and the pogo pins of each power signal are connected; other signals: other signal pogo pins are insulated from the socket body through the insulating layer on the hole wall; high-frequency signals: the pogo pins are connected to the socket body Insulation is maintained by the insulating layer on the hole wall, which solves crosstalk, loss and signal integrity problems.

Description of drawings

Fig. 1 is the explosion structure schematic diagram of the utility model;

Fig. 2 is the sectional structure schematic diagram of the utility model;

Fig. 3 is a partial enlarged view of part A in Fig. 2 .

In the picture:

1-socket body; 2-chip; 3-socket back cover; 4-power signal pinhole; 5-high frequency signal pinhole; 6-other signal pinhole; 7-power signal probe; 8-other signal probe 9-high-frequency signal probe; 91-first probe; 92-second probe; 93-third probe; 94-first connection block; 95-second connection block; .

Detailed ways

The preferred embodiments of the utility model will be described in detail below in conjunction with the accompanying drawings, so that the advantages and characteristics of the utility model can be more easily understood by those skilled in the art, so that the protection scope of the utility model can be defined more clearly .

Referring to accompanying drawings 1, 2 and 3, a socket for high-frequency testing of integrated circuits in this embodiment includes a socket body 1 and a chip 2, the chip 2 is arranged on the upper end of the socket body 1, and the socket The lower end of the body 1 is provided with a socket back cover 3, and a spring pinhole is provided in the socket body 1, and the spring pinhole includes a power signal pinhole 4, a high-frequency signal pinhole 5 and other signal pinholes 6, and other signal pinholes 6 are set Between the power signal pinhole 4 and the high frequency signal pinhole 5, the power signal pinhole 4 is used to embed the power signal probe 7, the high frequency signal pinhole 5 is used to embed the high frequency signal probe 9, and other signal pinholes 6 is used to embed other signal probes, the upper end surfaces of power signal probes 7, high-frequency signal probes 9 and other signal probes are provided with pin contact grooves 10 of chip 2, high-frequency signal pinholes 5 and other signal pins An insulating layer is provided on the hole wall of the hole 6 , and the spring pin hole runs through the socket body 1 and the socket rear cover 3 .

The power signal probe 7 is in contact with the hole wall, other signal probes are in contact with the hole wall, and there is a gap between the high frequency signal probe 9 and the hole wall.

The high-frequency signal probe 9 includes a first probe 91, a second probe 92 and a third probe 93, the first probe 91 and the second probe 92 are connected by a first connection block 94, and the second probe 92 and the third probe 93 are connected by a second connection block 95 , and both the first connection block 94 and the second connection block 95 abut against the hole wall of the high-frequency signal pinhole 5 .

The power signal probe 7 and other signal probes are all in the shape of a "cross", the first probe 91, the second probe 92 and the first connection block 94 are in the shape of a "cross" as a whole, and the diameter of the lower end of the third probe 93 is less than its upper diameter.

The power signal pinhole 4, other signal pinholes 6, and high-frequency signal pinholes 5 arranged in the socket body 1 are all through holes whose upper end aperture is smaller than the lower end aperture, and the power signal pinhole 4 arranged in the socket rear cover 3 is The other signal pinholes 6 and the high-frequency signal pinholes 5 are in the shape of "T".

The socket rear cover 3 and the socket body 1 are connected by bolts.

For the power signal: the power signal pogo pin is connected to its hole wall, and the hole wall remains conductive, so that the conductor inside of the entire socket body 1 and the power pogo pin are the same power supply signal, and the pogo pins of each power signal are connected of.

Other signals: the pogo pins of other signals are insulated from the socket body 1 through the insulating layer on the hole wall.

High-frequency signal: The high-frequency signal pogo pin is insulated from the socket body 1 through the insulating layer on the hole wall.

The above embodiments are only to illustrate the technical conception and characteristics of the present utility model. Equivalent changes or modifications made by the spirit of the utility model shall fall within the protection scope of the utility model.

Claims (6)

1. A socket for high-frequency testing of integrated circuits is characterized in that: it comprises a socket body (1) and a chip (2), and said chip (2) is arranged on the upper end of said socket body (1), so The lower end of the socket body (1) is provided with a socket back cover (3), and the socket body (1) is provided with a spring pinhole, and the spring pinhole includes a power signal pinhole (4), a high frequency signal pinhole (5) and other signal pinholes (6), the other signal pinholes (6) are arranged between the power signal pinholes (4) and the high frequency signal pinholes (5), the power signal pinholes (4) is used to embed the power signal probe (7), the high-frequency signal pinhole (5) is used to embed the high-frequency signal probe (9), and the other signal pinholes (6) are used to embed other signals Probes (8), the upper end surfaces of the power signal probes (7), high-frequency signal probes (9) and other signal probes (8) are provided with pin contact grooves (10) of the chip (2) ), the hole walls of the high-frequency signal pinholes (5) and other signal pinholes (6) are provided with an insulating layer, and the spring pinholes run through the socket body (1) and the socket back cover (3). 2. A socket for high-frequency testing of integrated circuits according to claim 1, characterized in that: the power signal probe (7) abuts against its hole wall, and the other signal probes There is a gap between the high-frequency signal probe (9) and the hole wall. 3. A kind of socket for high-frequency testing of integrated circuits according to claim 1, characterized in that: the high-frequency signal probes (9) include a first probe (91), a second probe ( 92) and the third probe (93), the first probe (91) and the second probe (92) are connected by a first connection block (94), and the second probe (92) and The third probes (93) are connected through a second connection block (95), and both the first connection block (94) and the second connection block (95) are connected to the high-frequency signal pinhole (5) The hole walls are in contact with each other. 4. A socket for high-frequency testing of integrated circuits according to claim 3, characterized in that: the power signal probe (7) and other signal probes (8) are in the shape of a "cross", The first probe (91), the second probe (92) and the first connection block (94) are overall in the shape of a "cross", and the diameter of the lower end of the third probe (93) is smaller than the diameter of the upper end. 5. A socket for high-frequency testing of integrated circuits according to claim 1, characterized in that: the power signal pinhole (4) and other signal pinholes ( 6) and the high-frequency signal pinhole (5) are both through holes with an upper aperture smaller than the lower aperture, and the power signal pinhole (4) arranged in the socket rear cover (3) is in the shape of an "I", and other signal pins Both the hole (6) and the high-frequency signal pinhole (5) are in the shape of a "T". 6. A socket for high-frequency testing of integrated circuits according to claim 1, characterized in that: the socket rear cover (3) and the socket body (1) are connected by bolts.