CN207723661U - Explosion-proof tin Cellphone Repairs fixture - Google Patents
Explosion-proof tin Cellphone Repairs fixture Download PDFInfo
- Publication number
- CN207723661U CN207723661U CN201721691380.3U CN201721691380U CN207723661U CN 207723661 U CN207723661 U CN 207723661U CN 201721691380 U CN201721691380 U CN 201721691380U CN 207723661 U CN207723661 U CN 207723661U
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- spring
- mainboard
- tin
- clamp button
- explosion
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Abstract
The utility model discloses a kind of explosion-proof tin mobile phone fixtures, it includes first explosion-proof block tin of mainboard back side auxiliary heat dissipation cooling etc., the first mainboard back side explosion-proof block tin of auxiliary heat dissipation cooling is connected with mainboard front slot, IC welds positioning auxiliary piece and the 4th clamp button of the spring is all located at the left side of mainboard front slot, IC welding positioning auxiliary pieces are located above the side of the 4th clamp button of the spring, mainboard reverse side slot is located above the right side of IC welding positioning auxiliary pieces, first clamp button of the spring is located at the top of mainboard reverse side slot, first plant tin cools down the lower section of explosion-proof block tin except glue groove is located at the first mainboard back side auxiliary heat dissipation, 5th clamp button of the spring is located at first and plants the right side that tin removes glue groove, mainboard layering welding groove is located at the right side of the 5th clamp button of the spring.The utility model can be suitable for different type of machines, solve that support plate, class support plate layered disassembling welding difficulty are big, and layering mainboard value tin difficulty is big, when reducing mainboard front sealing-off the problems such as back side component quick-fried tin, and can reduce damage, raising stability, raising heat dissipation effect.
Description
Technical field
The utility model is related to a kind of fixtures, more particularly to a kind of explosion-proof tin Cellphone Repairs fixture.
Background technology
Cell phone mainboard will carry out quality testing before manufacture, and being also required to special mainboard in cell phone mainboard repair fixes dress
It sets, other than the special mould clamp made for specific mainboard, a kind of fixture for detecting and repairing for cell phone mainboard existing at present
It is for blocking mainboard, still, with the progress of mobile phone technique, more and more cell phone manufacturers use support plate, class support plate technology
Polylith cell phone mainboard is spliced together so that welding difficulty bigger is dismantled when Cellphone Repairs, success rate is low.And it carries
Plate, class support plate technique cell phone mainboard plant tin welding be required for professional equipment, cost high.With cell phone mainboard element device IC's
Integrated level is higher and higher, and dismounting welding mainboard front causes the quick-fried tin of mainboard reverse side component, the probability of damage also very high.
Invention content
Technical problem to be solved in the utility model is that it provides a kind of explosion-proof tin Cellphone Repairs fixture, can be applicable in
In different type of machines, solution support plate, class support plate layered disassembling welding difficulty are big, and layering mainboard value tin difficulty is big, reduce mainboard front
When sealing-off the problems such as back side component quick-fried tin, and damage can be reduced, improve stability, improve heat dissipation effect.
The utility model is to solve above-mentioned technical problem by following technical proposals：A kind of explosion-proof tin mobile phone fixture,
It is characterized in that, it includes the explosion-proof block tin of the first mainboard back side auxiliary heat dissipation cooling, mainboard front slot, mainboard reverse side slot, mainboard
Layering plants molten tin bath, mainboard layering welding groove, the first plant tin except glue groove, second plant tin except glue groove, IC welding positioning auxiliaries piece, mainboard
Positioning pin, the first clamp button of the spring, second spring buckle, third clamp button of the spring, the 4th clamp button of the spring, the 5th clamp button of the spring, the 6th
Clamp button of the spring, the 7th clamp button of the spring, the first mainboard back side explosion-proof block tin of auxiliary heat dissipation cooling are connected with mainboard front slot, IC welding
Positioning auxiliary piece and the 4th clamp button of the spring are all located at the left side of mainboard front slot, and IC welding positioning auxiliary pieces are located at the 4th Spring Card
Above the side of button, mainboard reverse side slot is located above the right side of IC welding positioning auxiliary pieces, and the first clamp button of the spring is located at mainboard reverse side
The top of slot, the first plant tin cool down the lower section of explosion-proof block tin except glue groove is located at the first mainboard back side auxiliary heat dissipation, the 5th Spring Card
Button bit plants the right side that tin removes glue groove in first, and mainboard layering welding groove is located at the right side of the 5th clamp button of the spring, and second plants tin removing glue
Slot is located at the right side of mainboard layering welding groove, and the 7th Spring Card is located at the second side top for planting tin except glue groove, and tin is planted in mainboard layering
Slot is located at the top of mainboard layering welding groove, and mainboard positioning pin is fixed on mainboard layering and plants on the top of molten tin bath, second spring card
Button, third clamp button of the spring are all located at the left side that molten tin bath is planted in mainboard layering, and second spring buckle is located at the top of third clamp button of the spring,
6th clamp button of the spring is located above the side of mainboard positioning pin.
Preferably, IC welding positioning auxiliary on piece sets that there are four mounting holes.
Preferably, the first plant tin removes glue groove and the second plant tin except the bottom of glue groove is designed with multiple cooling fins.
Preferably, first clamp button of the spring, second spring buckle, third clamp button of the spring, the 4th clamp button of the spring, the 5th bullet
Spring buckle, the 6th clamp button of the spring, the 7th Spring Card are designed with a positioning pin.
Preferably, the explosion-proof block tin of first mainboard back side auxiliary heat dissipation cooling, mainboard front slot, mainboard reverse side slot, master
Plate layering plants molten tin bath, mainboard layering welding groove, the first plant tin except glue groove, second plant tin except glue groove, IC welding positioning auxiliaries piece, master
Plate positioning pin, the first clamp button of the spring, second spring buckle, third clamp button of the spring, the 4th clamp button of the spring, the 5th clamp button of the spring,
Six clamp button of the spring, the 7th clamp button of the spring are all located on a tablet.
The positive effect of the utility model is：The utility model can be suitable for different type of machines, solve support plate, class
Support plate layered disassembling welding difficulty is big, and layering mainboard value tin difficulty is big, quick-fried tin of back side component etc. when reducing mainboard front sealing-off
Problem.And damage can be reduced, and stability is improved, heat dissipation effect is improved, it is simple in structure, it is at low cost.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
The utility model preferred embodiment is provided below in conjunction with the accompanying drawings, the technical solution of the utility model is described in detail.
As shown in Figure 1, the explosion-proof tin Cellphone Repairs fixture of the utility model includes that the first mainboard back side auxiliary heat dissipation cooling is anti-
Quick-fried block tin 1, mainboard front slot 2, mainboard reverse side slot 3, molten tin bath 4 is planted in mainboard layering, mainboard layering welding groove 5, first plants tin removing glue
Slot 6, second plants tin except glue groove 7, IC welding positioning auxiliaries piece 8, mainboard positioning pin 9, the first clamp button of the spring 10, second spring buckle
11, third clamp button of the spring 12, the 4th clamp button of the spring 13, the 5th clamp button of the spring 14, the 6th clamp button of the spring 15, the 7th clamp button of the spring
16, the first mainboard back side auxiliary heat dissipation explosion-proof block tin 1 that cools down is connected with mainboard front slot 2, IC welding positioning auxiliaries piece 8 and the 4th
Clamp button of the spring 13 is all located at the left side of mainboard front slot 2, and IC welds positioning auxiliary piece 8 and is located on the side of the 4th clamp button of the spring 13
Side, mainboard reverse side slot 3 are located above the right side of IC welding positioning auxiliaries piece 8, and the first clamp button of the spring 10 is located at mainboard reverse side slot 3
Top, the first plant tin cool down the lower section of explosion-proof block tin 1 except glue groove 6 is located at the first mainboard back side auxiliary heat dissipation, the 5th clamp button of the spring
14, which are located at first, plants the right side that tin removes glue groove 6, and mainboard layering welding groove 5 is located at the right side of the 5th clamp button of the spring 14, and second plants tin
Except glue groove 7 is located at the right side that mainboard is layered welding groove 5, the 7th Spring Card 16 is located at the second side top for planting tin except glue groove 7, mainboard
The top that molten tin bath 4 is located at mainboard layering welding groove 5 is planted in layering, and mainboard positioning pin 9 is fixed on the top that molten tin bath 4 is planted in mainboard layering
On, second spring buckle 11, third clamp button of the spring 12 are all located at the left side that molten tin bath 4 is planted in mainboard layering, and second spring buckles 11
In the top of third clamp button of the spring 12, the 6th clamp button of the spring 15 is located above the side of mainboard positioning pin 9.
It is set there are four mounting hole 17 on IC welding positioning auxiliary piece 8 so that it is convenient to install, it is fixed.
The first plant tin plants tin except the bottom of glue groove 7 is designed with multiple cooling fins 18 except glue groove 6 and second, cools down in this way
Heat dissipation.
First clamp button of the spring 10, second spring buckle 11, third clamp button of the spring 12, the 4th clamp button of the spring the 13, the 5th
Clamp button of the spring 14, the 6th clamp button of the spring 15, the 7th Spring Card 16 are designed with a positioning pin 19 so that it is convenient to fixed.First master
Back auxiliary heat dissipation cools down, and explosion-proof block tin 1, mainboard front slot 2, mainboard reverse side slot 3, mainboard are layered plant molten tin bath 4, mainboard is layered
Welding groove 5, first plants tin except glue groove 6, second plants tin except glue groove 7, IC welding positioning auxiliaries piece 8, mainboard positioning pin 9, the first bullet
Spring buckle 10, second spring buckle 11, third clamp button of the spring 12, the 4th clamp button of the spring 13, the 5th clamp button of the spring 14, the 6th spring
The 15, the 7th clamp button of the spring 16 of buckle is all located on a tablet 20 so that it is convenient to use.
Radiating and cooling silica gel piece may be used in the first mainboard back side explosion-proof block tin of auxiliary heat dissipation cooling, reduces cost in this way.
The height of mainboard positioning pin is different, adapts to the engaging needs of different mainboards in this way.
The operation principle of the utility model is as follows：The first mainboard back side explosion-proof block tin of auxiliary heat dissipation cooling and mainboard front slot
Be connected, in this way can radiating and cooling, improve heat dissipation effect, prevent quick-fried tin；IC welds positioning auxiliary piece and the 4th Spring Card
Button is located at the left side of mainboard front slot, is positioned such that effect is more preferable；IC welding positioning auxiliary pieces are located at the 4th clamp button of the spring
One end, the 4th clamp button of the spring is located at the left side of fixture, and such class support plate layered disassembling welding difficulty reduces；Mainboard reverse side slot position
The right side of positioning auxiliary piece is welded in IC, the first clamp button of the spring is located at one end of mainboard reverse side slot, more beautiful in this way；First plants
Tin cools down the other end of explosion-proof block tin except glue groove is located at the first mainboard back side auxiliary heat dissipation, can reduce removing glue difficulty in this way, plant
Tin is easier；5th clamp button of the spring is located at first and plants the right side that tin removes glue groove, and mainboard layering welding groove is located at the 5th clamp button of the spring
Side, in this way welding be easier；Second plant tin is located at the other end of mainboard layering welding groove except glue groove, and the 7th Spring Card is located at
Second plants one end that tin removes glue groove, can reduce removing glue difficulty in this way；The upper left that molten tin bath is located at the 7th Spring Card is planted in mainboard layering
End reduces plant tin difficulty in this way；Mainboard positioning pin is fixed on mainboard layering and plants molten tin bath one end, and third clamp button of the spring is positioned at mainboard point
Layer plants the left side of molten tin bath, and such stablizing effect is more preferable；Second spring buckle is located at the upper right side that molten tin bath is planted in mainboard layering, the second bullet
Positioned at the top of third clamp button of the spring, the 6th clamp button of the spring is located at the right side of mainboard positioning pin, can accurately block in this way spring buckle
Firmly, it is accurately positioned, improves stability.In conclusion the utility model can be suitable for different type of machines, support plate, class support plate are solved
Layered disassembling welding difficulty is big, and layering mainboard value tin difficulty is big, when reducing mainboard front sealing-off the problems such as back side component quick-fried tin.
And damage can be reduced, stability is improved, heat dissipation effect is improved.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical solution and advantageous effect
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of explosion-proof tin mobile phone fixture, which is characterized in that it includes the explosion-proof block tin of the first mainboard back side auxiliary heat dissipation cooling, master
Plate front slot, mainboard reverse side slot, mainboard layering plant molten tin bath, mainboard layering welding groove, the first plant tin except glue groove, second plant tin removing glue
Slot, IC welding positioning auxiliaries piece, mainboard positioning pin, the first clamp button of the spring, second spring buckle, third clamp button of the spring, the 4th bullet
Spring buckle, the 5th clamp button of the spring, the 6th clamp button of the spring, the 7th clamp button of the spring, the first explosion-proof tin of mainboard back side auxiliary heat dissipation cooling
Block is connected with mainboard front slot, and IC welds positioning auxiliary piece and the 4th clamp button of the spring is all located at the left side of mainboard front slot, IC welderings
It connects positioning auxiliary piece to be located above the side of the 4th clamp button of the spring, mainboard reverse side slot is located on the right side of IC welding positioning auxiliary pieces
Side, the first clamp button of the spring are located at the top of mainboard reverse side slot, and first plants tin except glue groove is located at the first mainboard back side auxiliary heat dissipation drop
The lower section of the explosion-proof block tin of temperature, the 5th clamp button of the spring are located at first and plant the right side that tin removes glue groove, and mainboard is layered welding groove and is located at the 5th
The right side of clamp button of the spring, the second plant tin are located at the right side of mainboard layering welding groove except glue groove, and the 7th Spring Card is located at second and plants tin
Above the side of glue groove, the top that molten tin bath is located at mainboard layering welding groove is planted in mainboard layering, and mainboard positioning pin is fixed on mainboard point
Layer is planted on the top of molten tin bath, and second spring buckle, third clamp button of the spring are all located at the left side that molten tin bath is planted in mainboard layering, second spring
Positioned at the top of third clamp button of the spring, the 6th clamp button of the spring is located above the side of mainboard positioning pin buckle.
2. explosion-proof tin mobile phone fixture as described in claim 1, which is characterized in that the IC welding positioning auxiliary on piece is equipped with four
A mounting hole.
3. explosion-proof tin mobile phone fixture as described in claim 1, which is characterized in that described first plants tin except glue groove and second plant tin
Except the bottom of glue groove is designed with multiple cooling fins.
4. explosion-proof tin mobile phone fixture as described in claim 1, which is characterized in that first clamp button of the spring, second spring card
Button, third clamp button of the spring, the 4th clamp button of the spring, the 5th clamp button of the spring, the 6th clamp button of the spring, the 7th Spring Card, which are designed with one, to be determined
Position pin.
5. explosion-proof tin mobile phone fixture as described in claim 1, which is characterized in that first mainboard back side auxiliary heat dissipation cools down
Explosion-proof block tin, mainboard front slot, mainboard reverse side slot, mainboard layering plant molten tin bath, mainboard are layered welding groove, the first plant tin removes glue groove,
Second plants tin except glue groove, IC welding positioning auxiliaries piece, mainboard positioning pin, the first clamp button of the spring, second spring buckle, third spring
Buckle, the 4th clamp button of the spring, the 5th clamp button of the spring, the 6th clamp button of the spring, the 7th clamp button of the spring are all located on a tablet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721691380.3U CN207723661U (en) | 2017-12-07 | 2017-12-07 | Explosion-proof tin Cellphone Repairs fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721691380.3U CN207723661U (en) | 2017-12-07 | 2017-12-07 | Explosion-proof tin Cellphone Repairs fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207723661U true CN207723661U (en) | 2018-08-14 |
Family
ID=63097059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721691380.3U Expired - Fee Related CN207723661U (en) | 2017-12-07 | 2017-12-07 | Explosion-proof tin Cellphone Repairs fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207723661U (en) |
-
2017
- 2017-12-07 CN CN201721691380.3U patent/CN207723661U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180814 Termination date: 20211207 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |