CN207660239U - A kind of silicon wafer heating floor total system - Google Patents
A kind of silicon wafer heating floor total system Download PDFInfo
- Publication number
- CN207660239U CN207660239U CN201721102612.7U CN201721102612U CN207660239U CN 207660239 U CN207660239 U CN 207660239U CN 201721102612 U CN201721102612 U CN 201721102612U CN 207660239 U CN207660239 U CN 207660239U
- Authority
- CN
- China
- Prior art keywords
- layer
- silicon wafer
- arc
- main board
- decorative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 44
- 239000010703 silicon Substances 0.000 title claims abstract description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 238000010438 heat treatment Methods 0.000 title claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 16
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005034 decoration Methods 0.000 claims 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000004134 energy conservation Methods 0.000 abstract 1
- 206010037660 Pyrexia Diseases 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Central Heating Systems (AREA)
- Floor Finish (AREA)
Abstract
The utility model discloses a kind of silicon wafer heating floor total systems, it is followed successively by thermal insulation board layer from the bottom to top, balance layer and silicon wafer heating layer, splicing is equipped in several pieces of decorative layers and decorative layer and is equipped with wearing layer on the silicon wafer heating layer, the silicon wafer heater layer includes upper, it lower base material and is uniformly coated on, silicon wafer exothermic material on lower base material panel, the side of the silicon wafer heater layer be equipped with invisible joint and invisible joint successively with steel pipe buried in advance pipe, temperature controller connects, the inlet-outlet line of the silicon wafer heater layer passes sequentially through invisible joint, steel pipe buried in advance pipe is connected in temperature controller.A kind of silicon wafer heating floor total system provided by the utility model, heating is rapid, energy conservation and environmental protection, is unlikely to deform.
Description
Technical field
The utility model is related to heating floor technical field, especially a kind of silicon wafer heating floor total system.
Background technology
Silicon wafer floor heating fever tablet is a kind of New-type heating product, and compared to carbon crystal fever tablet, silicon wafer floor heating fever tablet is more
Heating is rapid, environmentally friendly, energy saving, can bring the heating experience that user is more comfortable, safe and healthy；Compared to air-conditioning, hot-water heating, electricity
The ground heating systems such as hotting mask, heating cable save operating cost；Silicon wafer floor heating fever tablet has fever fast, and thermal storage time is long, can
Dismounting recycles, and spends less and is not required to advantage to be repaired, and normal service life was up to 50 years or more, for floor fever field
With prodigious foreground.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of silicon wafer heating floor total system, heating is rapid, saves
Energy environmental protection is unlikely to deform.
The technical solution of the utility model is：A kind of silicon wafer heating floor total system, is followed successively by thermal insulation board from the bottom to top
Layer, balance layer and silicon wafer heating layer, splicing is resistance to equipped with being equipped in several pieces of decorative layers and decorative layer on the silicon wafer heating layer
Layer is ground, the silicon wafer heater layer includes upper and lower base material and the silicon wafer heating material that is uniformly coated on upper and lower base material panel
Material, the decorative layer positioned at both ends include main board and extend the arc protrusion being equipped with and arc along a side of main board
Arc seam allowance rank is constituted between shape protrusion and main board, each piece of centrally located decorative layer includes main board, Yi Jiyan
The two side ends for main board extend the arc protrusion being equipped with and constitute arc seam allowance rank between arc protrusion and main board, several
Arc seam allowance rank of the arc protrusion phase contract insertion of its adjacent right side decorative layer set on left side decorative layer when block decorative layer is spliced
It is several to realize in arc protrusion of the arc seam allowance rank phase contract insertion equipped with left side decorative layer of interior and adjacent right side decorative layer
Block decorative layer is spliced into the layer structure of surfacing, the side of the silicon wafer heater layer be equipped with invisible joint and invisible joint according to
Secondary to be connect with steel pipe buried in advance pipe, temperature controller, the inlet-outlet line of the silicon wafer heater layer passes sequentially through invisible joint, steel pipe buried in advance pipe
It is connected in temperature controller.
Preferably, the upper and lower base material is epoxy resin plate substrate.
Compared with prior art, the utility model has the advantages that：A kind of silicon wafer hair provided by the utility model
Heating floor total system uses silicon wafer heating layer so that the heating of this silicon wafer heating floor is rapid, effectively energy saving；Polylith simultaneously
Decorative layer agrees with filling between adjacent decorative layer when splicing using arc protrusion, arc seam allowance rank, avoids since decorative layer is spelled
It makes moist, deform caused by the presence of seam gap, splicing the formaldehyde that glue exhales, safer durable, service life increases.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the silicon wafer heater schematic diagram of a layer structure of the utility model.
Fig. 3 is the decorative layer structure schematic diagram of the utility model.
Specific implementation mode
Below in conjunction with the accompanying drawings and specific implementation mode, the utility model is described further.
As shown in Figure 1 to Figure 3, a kind of silicon wafer heating floor total system is followed successively by thermal insulation board layer 1, balance from the bottom to top
Layer 2 and silicon wafer heating layer 3, splicing in several pieces of decorative layers 4 and decorative layer 4 equipped with being equipped with wearing layer 5 on silicon wafer heating layer 3.
Specifically, 3 layers of silicon wafer heater includes upper and lower base material 31 and is uniformly coated on 31 panel of upper and lower base material
Silicon wafer exothermic material 32.Upper and lower base material 31 is epoxy resin plate substrate.The side of silicon wafer heater layer 3 be equipped with invisible joint 6 and
Invisible joint 6 is connect with steel pipe buried in advance pipe 7, temperature controller 8 successively, and the inlet-outlet line of silicon wafer heater layer 3 passes sequentially through invisible joint
6, steel pipe buried in advance pipe 7 is connected in temperature controller 8, convenient for artificial observation temperature and temperature control.
Decorative layer 4 positioned at both ends includes main board 41 and extends the arc being equipped with along a side of main board 41
Arc seam allowance rank 43, each piece of centrally located decorative layer are constituted between protrusion 42 and arc protrusion 42 and main board 41
4 include main board 41 and extend the arc protrusion 42 that is equipped with along the two side ends of main board 41 and arc protrusion 42 with it is main
Arc seam allowance rank 43 is constituted between body plate 41, the arc protrusion 42 of its adjacent right side decorative layer when several pieces of decorative layers 4 are spliced
Phase contract is embedded in the arc seam allowance rank 43 of left side decorative layer and the 43 phase contract of arc seam allowance rank of adjacent right side decorative layer is embedding
Enter to be equipped in the arc protrusion 42 of left side decorative layer to realize that several pieces of decorative layers 4 are spliced into the layer structure of surfacing.
A kind of silicon wafer heating floor total system provided by the utility model, uses silicon wafer heating layer so that this silicon wafer
Heating floor heating is rapid, effectively energy saving；Using arc protrusion, arc between adjacent decorative layer when polylith decorative layer splicing simultaneously
Seam allowance rank agrees with filling, avoids and is made moist, deformed caused by the presence that decorative layer splices gap, splice glue and exhale
Formaldehyde, it is safer durable, service life increase.
The above embodiments are only the preferred embodiment of the utility model, and the right of the utility model cannot be limited with this
Range, therefore, modification made according to the patent scope of the utility model, equivalent variations, improvement etc. still belong to the utility model institute
The range covered.
Claims (2)
1. a kind of silicon wafer heating floor total system, it is characterised in that：It is followed successively by thermal insulation board layer, balance layer and silicon wafer from the bottom to top
Heating layer, splicing is equipped with being equipped with wearing layer, the silicon wafer hair in several pieces of decorative layers and decorative layer on the silicon wafer heating layer
Hot body layer includes upper and lower base material and the silicon wafer exothermic material that is uniformly coated on upper and lower base material panel, is located at the decoration at both ends
Layer includes main board and extends the arc protrusion being equipped with and between arc protrusion and main board along a side of main board
Arc seam allowance rank is constituted, each piece of centrally located decorative layer includes main board and prolong along the two side ends of main board
It stretches the arc protrusion being equipped with and constitutes arc seam allowance rank between arc protrusion and main board, its phase when several pieces of decorative layers are spliced
The arc protrusion phase contract of adjacent right side decorative layer is embedded in right side decoration adjacent in the arc seam allowance rank of left side decorative layer
To realize that several pieces of decorative layers are spliced into surface in arc protrusion of the arc seam allowance rank phase contract insertion equipped with left side decorative layer of layer
Smooth layer structure, the side of the silicon wafer heater layer be equipped with invisible joint and invisible joint successively with steel pipe buried in advance pipe, temperature
Device connection is controlled, the inlet-outlet line of the silicon wafer heater layer passes sequentially through invisible joint, steel pipe buried in advance pipe is connected in temperature controller.
2. a kind of silicon wafer heating floor total system according to claim 1, it is characterised in that：The upper and lower base material is
Epoxy resin plate substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721102612.7U CN207660239U (en) | 2017-08-30 | 2017-08-30 | A kind of silicon wafer heating floor total system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721102612.7U CN207660239U (en) | 2017-08-30 | 2017-08-30 | A kind of silicon wafer heating floor total system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207660239U true CN207660239U (en) | 2018-07-27 |
Family
ID=62935775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721102612.7U Expired - Fee Related CN207660239U (en) | 2017-08-30 | 2017-08-30 | A kind of silicon wafer heating floor total system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207660239U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114872799A (en) * | 2020-12-25 | 2022-08-09 | 王辉 | Floor warms up car as a house |
-
2017
- 2017-08-30 CN CN201721102612.7U patent/CN207660239U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114872799A (en) * | 2020-12-25 | 2022-08-09 | 王辉 | Floor warms up car as a house |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180727 Termination date: 20210830 |