CN207541648U

CN207541648U - Wireless IC equipment, the resin-formed body and communication terminal for having the wireless IC equipment

Info

Publication number: CN207541648U
Application number: CN201690000542.1U
Authority: CN
Inventors: 池田直徒
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2015-03-06
Filing date: 2016-02-04
Publication date: 2018-06-26
Anticipated expiration: 2026-02-04
Also published as: WO2016143426A1; JPWO2016143426A1; JP6222398B2

Abstract

The utility model provides a kind of wireless IC equipment that can realize miniaturization in simple structure, the resin-formed body and communication terminal that have the wireless IC equipment.The wireless IC equipment of the utility model has：Resin component has the 1st interarea and 2nd interarea opposite with the 1st interarea；Magnetic substance circuit board, with wiring conductor pattern；RFIC elements are mounted on the wiring conductor pattern of the magnetic substance circuit board, have the 1st input and output terminal and the 2nd input and output terminal；And aerial coil, it is set to the resin component, and one end is connected to the 1st input and output terminal, and the other end is connected to the 2nd input and output terminal, and at least part of the magnetic substance circuit board is configured at the inside of the aerial coil as the magnetic core of the aerial coil.

Description

Wireless IC equipment, the resin-formed body and communication terminal for having the wireless IC equipment Device

Technical field

The utility model is related to a kind of wireless IC equipment, are used for RFID (Radio Frequency Identification：Radio frequency identification) label is near field communication device etc. of representative.

Background technology

The RFID label tag of HF frequency ranges is generally card sizes, but in order to use it for merchandise control etc., it is sometimes desirable to it accounts for With the smaller small-sized RFID label tag of area.RFID label tag about HF frequency ranges, it is known to be equipped with the RFID label tag (example of magnetic core Such as, referring to patent document 1,2).

RFIC elements and magnetic core are mounted in circuit board by the RFID label tag of 1 publicity of patent document, are embedded in resin In insulating layer.In addition, the RFID label tag of 1 publicity of patent document is formed with antenna line in circuit board and resin insulating barrier Circle.

The RFID label tag of 2 publicities of patent document forms aerial coil by resin multilayer substrate, and in resin multi-layer base Hole is formed in plate, magnetic core is configured in the hole.

Existing technical literature

Patent document

【Patent document 1】No. 5573937 specifications of Japanese Patent No.

【Patent document 2】Japanese Patent Laid-Open 2014-161003 bulletins

Utility model content

Utility model technical problem to be solved

RFIC elements, aerial coil and magnetic core are configured in circuit board the RFID label tag of 1 publicity of patent document, because This presence can not realize the problem of RFID label tag is compact in size.

The RFID label tag of 2 publicities of patent document is by that will have multiple insulation of conducting pass interlayer connection conductor Resin layer is laminated, and forms connecting portion in the thickness direction of resin multilayer substrate, aerial coil is consequently formed.2 institute of patent document is public The RFID label tag shown is in order to realize the promotion of the raising of aerial coil L values and antenna performance, by increasing insulating resin substrate Lamination number, increase the coil diameter of aerial coil.But the RFID label tag of patent document 2, which exists, increases insulating resin substrate Lamination number the problem of structure is complicated.

The utility model is completed to solve the above subject, its purpose is to provide a kind of wireless IC equipment, has the nothing The resin-formed body of line IC equipment and the manufacturing method of communication terminal and the wireless IC equipment, the wireless IC equipment energy It is enough to realize miniaturization in simple structure.

Technical scheme applied to solve the technical problem

A kind of wireless IC equipment of embodiment of the utility model has：

Resin component has the 1st interarea and 2nd interarea opposite with the 1st interarea；

Magnetic substance circuit board, with wiring conductor pattern；

RFIC elements are mounted on the wiring conductor pattern of the magnetic substance circuit board, and it is defeated to have the 1st input Go out terminal and the 2nd input and output terminal；And

Aerial coil is set to the resin component, and one end is connected to the 1st input and output terminal, another End is connected to the 2nd input and output terminal,

At least part of the magnetic substance circuit board is configured at the antenna line as the magnetic core of the aerial coil The inside of circle.

A kind of resin-formed body of embodiment of the utility model is the resin-formed body for having wireless IC equipment, In,

The wireless IC equipment has：

Magnetic substance circuit board, with wiring conductor pattern；

A kind of communication terminal of embodiment of the utility model is the communication terminal for having wireless IC equipment, Wherein,

The wireless IC equipment has：

Magnetic substance circuit board, with wiring conductor pattern；

A kind of wireless IC device manufacturing method of embodiment of the utility model includes：

The process of magnetic substance circuit board is configured on adhered layer on pedestal is set to, which will have There are the RFIC elements of the 1st input and output terminal and the 2nd input and output terminal to be mounted on wiring conductor pattern；

The process that the 1st metallic object of configuration and the 2nd metallic object are erect on the adhered layer；

Be configured at resin component coating the magnetic substance circuit board on the adhered layer, the 1st metallic object, The process of 2nd metallic object；

In the 2nd cloth that the 1st interarea formation of the resin component is connect with the 1st metallic object and the 2nd metallic object The process of line pattern；And

The pedestal for being provided with the adhered layer is removed, the 1st metallic object is connected with the 2nd metallic object, and In the process that the 2nd interarea of the resin component forms the 1st wiring pattern, the 1st wiring pattern is by the 1st of the RFIC elements the Input and output terminal is connected with the 1st metallic object, by the 2nd input and output terminal of the RFIC elements and the 2nd metal Body connects.

Utility model effect

By the utility model, it is capable of providing a kind of wireless IC equipment that can realize miniaturization in simple structure, tool The standby resin-formed body of the wireless IC equipment and the manufacturing method of communication terminal and the wireless IC equipment.

Description of the drawings

Fig. 1 is the stereogram of the wireless IC equipment of embodiment 1 described in the utility model.

Fig. 2 is the vertical view of the wireless IC equipment of embodiment 1 described in the utility model.

Fig. 3 is the bottom view of the wireless IC equipment of embodiment 1 described in the utility model.

Fig. 4 is the schematic structural diagram of the wireless IC equipment of embodiment 1 described in the utility model.

Fig. 5 is the vertical view of circuit board in embodiment 1 described in the utility model.

Fig. 6 is the circuit diagram of the wireless IC equipment of embodiment 1 described in the utility model.

Fig. 7 is the drawing in side sectional elevation of the wireless IC equipment of embodiment 1.

Fig. 8 is the drawing in side sectional elevation of the wireless IC equipment of embodiment 2.

Fig. 9 A are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 B are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 C are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 D are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 E are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 F are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 G are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Fig. 9 H are the figures for the wireless IC equipment manufacturing operation for representing embodiment 1 described in the utility model.

Figure 10 is the schematic structural diagram of the wireless IC equipment of embodiment 2 described in the utility model.

Figure 11 is the bottom view of the wireless IC equipment of embodiment 2 described in the utility model.

Figure 12 A are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 B are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 C are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 D are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 E are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 F are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 G are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 H are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 I are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 12 J are the figures for the wireless IC equipment manufacturing operation for representing embodiment 2 described in the utility model.

Figure 13 is the schematic structural diagram of the wireless IC equipment of embodiment 3 described in the utility model.

Figure 14 is the bottom view of the wireless IC equipment of embodiment 3 described in the utility model.

Figure 15 is the schematic structural diagram of the wireless IC equipment of embodiment 4 described in the utility model.

Figure 16 is the schematic structural diagram of the wireless IC equipment of embodiment 5 described in the utility model.

Figure 17 is the bottom view of the wireless IC equipment of embodiment 5 described in the utility model.

Figure 18 is the circuit diagram of the wireless IC equipment of embodiment 5 described in the utility model.

Figure 19 is the schematic structural diagram of the wireless IC equipment of embodiment 6 described in the utility model.

Figure 20 is the stereogram of the subsidiary RFID label tag article of embodiment 7 described in the utility model.

Figure 21 is the front view of the subsidiary RFID label tag article of embodiment 7 described in the utility model.

Figure 22 is the injection molding manufacturing process for the subsidiary RFID label tag article for representing embodiment 7 described in the utility model Figure.

Figure 23 is the stereogram of the subsidiary RFID label tag article of embodiment 8 described in the utility model.

Figure 24 is the sectional view of the subsidiary RFID label tag article of embodiment 8 described in the utility model.

Figure 25 is the magnified partial view of the subsidiary RFID label tag article of Figure 24.

Figure 26 is the stereogram of amplification antenna in embodiment 8 described in the utility model.

Figure 27 is the circuit diagram of amplification antenna in embodiment 8 described in the utility model.

Specific embodiment

A kind of wireless IC equipment of embodiment of the utility model has：

Magnetic substance circuit board, with wiring conductor pattern；

At least part of the magnetic substance circuit board can be configured at the day as the magnetic core of the aerial coil The inside of line coil.

According to such structure, by installing RFIC elements etc. in magnetic substance circuit board, space can be saved, with simple Structure realize device miniaturization.In addition, magnetic substance circuit board is configured at the inside of aerial coil, therefore as aerial coil Magnetic core play a role.The L values of aerial coil can be improved by magnetic substrate as a result, and promote antenna performance, therefore It can realize the antenna size maximization relative to instrument size.

In the wireless IC equipment, the aerial coil can have：

1st wiring pattern is formed in the 2nd interarea of the resin component, connects the described 1st of the RFIC Input and output terminal and the 2nd input and output terminal；

2nd wiring pattern is formed in the 1st interarea of the resin component；

1st metallic object connects the 1st wiring pattern and the 2nd wiring pattern；And

2nd metallic object connects the 1st wiring pattern and the 2nd wiring pattern.

By such structure, can be formed by the 1st metallic object and the 2nd metallic object has larger height dimension in aerial coil Part, therefore the electrical reliability of aerial coil can be improved.

1st metallic object and the 2nd metallic object can be columnar metallic pins.

By such structure, just without carrying out complicated wiring on multilager base plate.In addition, by using metallic pin conduct Metallic object can reduce the D.C. resistance of the 1st metallic object and the 2nd metallic object, promote electrical characteristic.

The magnetic substance circuit board may exit off the aerial coil configuration,

The 1st input and output terminal of the RFIC elements and the magnetic of the 2nd input and output terminal are installed The mounting surface of property body circuit board can in opposite directions be configured with the 2nd interarea of the resin component,

The 1st input and output terminal of the RFIC elements can connect via the 1st conductor and the 1st wiring pattern It connecing, the 1st conductor extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component,

The 2nd input and output terminal of the RFIC elements can connect via the 2nd conductor and the 1st wiring pattern It connects, the 2nd conductor extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component.

By such structure, the 2nd face of magnetic substance circuit board and the 2nd interarea of resin component equipped with RFIC elements Opposite configuration, therefore it is not easy to hinder the magnetic field of aerial coil to be formed.In addition, antenna line is left in the 2nd face of magnetic substance circuit board Circle configuration, therefore, RFIC elements are not easy to hinder the magnetic flux line by near aerial coil.

The magnetic substance circuit board can have the 1st face and the 2nd face, and the 1st face is towards described in the resin component 1st interarea, the 2nd face towards the resin component the 2nd interarea,

The RFIC elements may be mounted at the 2nd face of the magnetic substance circuit board.

It, can towards the 2nd surface side of the 2nd interarea side of resin component in magnetic substance circuit board by such structure Space is formed between magnetic substance circuit board and resin component.Therefore, by the way that RFIC elements are installed on the of circuit board 2 faces can reduce the height of wireless IC equipment.

The magnetic substance circuit board can have the 1st face and 2nd face opposite with the 1st face,

The 2nd face of the magnetic substance circuit board forms at least one of the 2nd interarea of the resin component Point,

The RFIC element mountings in the 1st face of the magnetic substance circuit board,

The 1st input and output terminal of the RFIC elements can connect via the 3rd conductor and the 1st wiring pattern It connecing, the 3rd conductor extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component,

The 2nd input and output terminal of the RFIC elements can connect via the 4th conductor and the 1st wiring pattern It connecing, the 4th conductor extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component,

3rd conductor and the 4th conductor can be arranged on the inside of the magnetic substance circuit board.

By such structure, magnetic substance circuit board can be configured to the 2nd interarea in resin component, therefore can realize The raising of aerial coil L values, the promotion of antenna performance, and the height of aerial coil can be reduced.It is wireless thereby, it is possible to realize IC equipment miniaturises.

The 1st wiring pattern is formed on the 2nd face of the magnetic substance circuit board,

1st metallic object is connect with the 1st connection terminal that can be in the magnetic substance circuit board, via being set to The in magnetic substance circuit board the 1st connection conductor is stated to connect with the 1st wiring pattern,

2nd metallic object can be connect with the 2nd connection terminal in the magnetic substance circuit board, via being set to The in magnetic substance circuit board the 2nd connection conductor is stated to connect with the 1st wiring pattern.

By such structure, the L values of aerial coil can be further improved, promote antenna performance.In addition, wireless IC equipment Even if reducing the height of aerial coil, defined inductance value can be also obtained, therefore equipment can be miniaturised.

The magnetic substance circuit board can include：

Magnetic substance substrate layer, substantially all is polycrystalline phase；And

Magnetic substance auxiliary layer is configured at least one face of the magnetic substance substrate layer, and substantially all is more Crystalline phase,

The polycrystalline of the polycrystalline phase of the magnetic substance substrate layer and the magnetic substance auxiliary layer can mutually have substantive each other Identical crystal structure,

The linear expansion coefficient of the magnetic substance auxiliary layer can be less than the linear expansion coefficient of the magnetic base material layer.

By such structure, the mechanical strength of magnetic substance circuit board can be improved.

1st wiring pattern and the 2nd wiring pattern can be respectively provided with multiple wiring patterns,

1st metallic object and the 2nd metallic object are respectively provided with multiple metallic objects,

The aerial coil can be by the 1st wiring pattern, the 2nd wiring pattern, the 1st metallic object and institute It states the 2nd metallic object and is formed as the helical form with multiple rings.

By such structure, becoming large-sized for wireless IC equipment will not be made, and it is more to be easily configured the number of turn Aerial coil.

1st metallic object and the 2nd metallic object can be respectively provided with the metallic pin of 3 or more,

1st metallic object and the 2nd metallic object can be arranged separately on the Y direction, and from the Z axis side To the configuration that is serrated during observation.

By such structure, even if increasing the number of turn of coil, it can also reduce the size of wireless IC equipment Y direction.

When the aerial coil is from the Y direction, the different multiple rings of internal-and external diameter can be included,

Ring positioned at aerial coil opening face can be the ring of the internal-and external diameter maximum in the multiple ring.

Pass through such structure, compared to the aerial coil of rectangular coil shape, the actual coil opening that can pass in and out magnetic flux line Area becomes larger.

The wireless IC equipment has：

Magnetic substance circuit board, with wiring conductor pattern；

By such structure, space can be saved, a kind of nothing for having and can realizing miniaturization in simple structure is provided The resin-formed body of line IC equipment.

In the resin-formed body, the aerial coil can have：

2nd wiring pattern is formed in the 1st interarea of the resin component；

2nd metallic object connects the 1st wiring pattern and the 2nd wiring pattern.

The wireless IC equipment has：

Magnetic substance circuit board, with wiring conductor pattern；

By such structure, space can be saved, a kind of nothing for having and can realizing miniaturization in simple structure is provided The communication terminal of line IC equipment.

In the communication terminal, the aerial coil can have：

2nd wiring pattern is formed in the 1st interarea of the resin component；

2nd metallic object connects the 1st wiring pattern and the 2nd wiring pattern.

By such structure, space can be saved, easily produces the nothing that can realize miniaturization in simple structure Line IC equipment.In addition, by using the pedestal with adhered layer, metallic object can be firmly fixed, therefore can be in antenna A part for coil manufactures wireless IC equipment using the small metallic object of width.Have more than the number of turn and inductance therefore, it is possible to manufacture It is worth the wireless IC equipment of high aerial coil.

Hereinafter, refer to the attached drawing illustrates embodiment described in the utility model.In addition, in order to illustrate with being easily understood, Each element is amplified in the various figures and is shown.

(embodiment 1)

[overall structure]

Fig. 1 is the stereogram of the wireless IC equipment 101 of embodiment 1 described in the utility model.XYZ space is straight in Fig. 1 In angular coordinate system, what X-direction represented is the width direction of wireless IC equipment 101, and what Y axis directions represented is wireless IC equipment 101 thickness direction, what Z-direction represented is the short transverse of wireless IC equipment 101.Fig. 2 is bowing for wireless IC equipment 101 View.Fig. 3 is the bottom view of wireless IC equipment.Fig. 4 is the schematic structural diagram of wireless IC equipment 101.

As shown in Figure 1, wireless IC equipment 101 has：Resin component 70, the magnetic substance circuit base for being embedded in resin component 70 Plate 1, the RFIC elements 61 for being equipped on magnetic substance circuit board 1 and the aerial coil for being set to resin component 70.Aerial coil By the 1st wiring pattern 20A, 20B, 20C, 20D, 20E, 20F, 20G, the 1st metallic object 30A, 30B, 30C, 30D, 30E, 30F, 2 wiring pattern 50A, 50B, 50C, 50D, 50E, 50F and the 2nd metallic object 40A, 40B, 40C, 40D, 40E, 40F are formed.

Resin component 70 protects magnetic substance circuit board 1, RFIC elements 61, aerial coil etc..As shown in Fig. 1, resin structure The shape of part 70 is cuboid.Specifically, resin component 70 has：1st interarea VS1, the opposite with the 1st interarea VS1 the 2nd Interarea VS2, the 1st side VS3 for being connected to the 1st interarea VS1 and the 2nd interarea VS and be connected to the 1st interarea VS1 and the 2nd master The 2nd side VS4 of face VS.Resin component 70 is made of such as epoxy system resin etc..

As shown in Fig. 2, it is formed with the 2nd wiring pattern extended along X-direction on the 1st interarea VS1 of resin component 70 50A、50B、50C、50D、50E、50F.Prolong as shown in figure 3, being formed on the 2nd interarea VS2 of resin component 70 along X-direction The 1st wiring pattern 20A, 20B, 20C, 20D, 20E, 20F, the 20G stretched.As shown in Figure 1, in the 1st side of resin component 70 Near VS3, it is embedded with the 1st metallic object 30A, 30B, 30C, 30D, 30E, the 30F extended along Z-direction.In resin component 70 The 2nd side VS4 near, be embedded with the 2nd metallic object 40A, 40B, 40C, 40D, 40E, the 40F extended along Z-direction.

Aerial coil by the 1st wiring pattern 20A~20G, the 1st metallic object 30A~30F, the 2nd wiring pattern 50A~50F, And the 2nd metallic object 40A~40F be formed as the number of turn be 6 circles rectangular coil shape.

As shown in Figure 1, the 1st wiring pattern 20A~20G prolongs in the 2nd interarea VS2 upper edge X axis directions of resin component 70 It stretches, the 2nd wiring pattern 50A~50F extends in the 1st interarea VS1 upper edges X-direction of resin component 70.Herein, " along X-direction The meaning of extension " is not limited between the 1st wiring pattern 20A~20G between parallel and the 2nd wiring pattern 50A~50F respectively It is parallel respectively.In addition, the meaning of " extending along X-direction " is not limited to the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F is parallel." parallel along X-direction " also comprising such as the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~ The extending direction of 50F is approximately towards X-direction, i.e., the meaning substantially extended in the X-axis direction.

1st metallic object 30A~30F is arranged near the 1st side VS3 of resin component 70 along Y direction, and in Z axis Side upwardly extends.2nd metallic object 40A~40F is arranged near the 2nd side VS4 of resin component 70 along Y direction, and Extend in the Z-axis direction.In the embodiment 1, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F are mutually parallel.

1st metallic object 30A~30F and the 2nd metallic object 40A~40F is for example columned copper metallic pin.1st gold medal Belong to body 30A~30F and the 2nd metallic object 40A~40F be for example by using specific length unit cut off section as circular copper wire and It obtains.In addition, the section shape of these metallic pins is not necessarily round.For example, it is preferable to aspect ratio (height/the bottom of metallic pin Face diameter) it is 5 to 30.

As shown in Figure 1, normal directions of the 1st metallic object 30A~30F in the 2nd interarea VS2 relative to resin component 70 Extend configuration i.e. in Z-direction, and reach the 1st interarea VS1 and the 2nd interarea VS2 of resin component 70.1st metallic object 30A~ The 1st end of 30F is connected to the 1st wiring pattern 20A~20F.The 2nd end of 1st metallic object 30A~30F is connected to the 2nd wiring pattern 50A~50F.In addition, the 1st end refers to the 2nd master for being located at resin component 70 in the length direction end of the 1st metallic object 30A~30F The end of face VS2 sides, the 2nd end refer to be located at the 1st of resin component 70 in the length direction end of the 1st metallic object 30A~30F The end of interarea VS1 sides.

It is further described, i.e. the 1st end of the 1st metallic object 30A is connected to the 1st wiring pattern 20A.1st metallic object 30B The 1st end be connected to the 1st wiring pattern 20B.The 1st end of 1st metallic object 30C is connected to the 1st wiring pattern 20C.1st metallic object The 1st end of 30D is connected to the 1st wiring pattern 20D.The 1st end of 1st metallic object 30E is connected to the 1st wiring pattern 20E.1st gold medal The 1st end for belonging to body 30F is connected to the 1st wiring pattern 20F.

The 2nd end of 1st metallic object 30A is connected to the 2nd wiring pattern 50A.The 2nd end of 1st metallic object 30B is connected to the 2nd Wiring pattern 50B.The 2nd end of 1st metallic object 30C is connected to the 2nd wiring pattern 50C.The 2nd end of 1st metallic object 30D is connected to 2nd wiring pattern 50D.The 2nd end of 1st metallic object 30E is connected to the 2nd wiring pattern 50E.The 2nd end of 1st metallic object 30F connects It is connected to the 2nd wiring pattern 50F.

As shown in Figure 1, normal directions of the 2nd metallic object 40A~40F in the 2nd interarea VS2 relative to resin component 70 Extend configuration i.e. in Z-direction, and reach the 1st interarea VS1 and the 2nd interarea VS2 of resin component 70.2nd metallic object 40A~ The 3rd end of 40F is connected to the 1st wiring pattern 20B~20G.The 4th end of 2nd metallic object 40A~40F is connected to the 2nd wiring pattern 50A~50F.In addition, the 3rd end refers to the 2nd master for being located at resin component 70 in the length direction end of the 2nd metallic object 40A~40F The end of face VS2 sides, the 4th end refer to be located at the 1st of resin component 70 in the length direction end of the 2nd metallic object 40A~40F The end of interarea VS1 sides.

It is further described, i.e. the 3rd end of the 2nd metallic object 40A is connected to the 1st wiring pattern 20B.2nd metallic object 40B The 3rd end be connected to the 1st wiring pattern 20C.The 3rd end of 2nd metallic object 40C is connected to the 1st wiring pattern 20D.2nd metallic object The 3rd end of 40D is connected to the 1st wiring pattern 20E.The 3rd end of 2nd metallic object 40E is connected to the 1st wiring pattern 20F.2nd gold medal The 3rd end for belonging to body 40F is connected to the 1st wiring pattern 20G.

The 4th end of 2nd metallic object 40A is connected to the 2nd wiring pattern 50A.The 4th end of 2nd metallic object 40B is connected to the 2nd Wiring pattern 50B.The 4th end of 2nd metallic object 40C is connected to the 2nd wiring pattern 50C.The 4th end of 2nd metallic object 40D is connected to 2nd wiring pattern 50D.The 4th end of 2nd metallic object 40E is connected to the 2nd wiring pattern 50E.The 4th end of 2nd metallic object 40F connects It is connected to the 2nd wiring pattern 50F.

As a result, aerial coil by the 1st wiring pattern 20A~20G comprising multiple wiring patterns, include multiple wiring patterns The 2nd wiring pattern 50A~50F, the 1st metallic object 30A~30F comprising multiple metallic pins and include multiple metallic pins The quantity of 2nd metallic object 40A~40F forms multiple rings.

Magnetic substance circuit board 1 is the circuit board of the magnetic substance with wiring conductor pattern.Magnetic substance circuit board 1 by The ferrite substrate of sintering system is made.As shown in figure 4, magnetic substance circuit board 1 is by being configured inside aerial coil i.e. coil In the range of winding, so as to which the magnetic core as aerial coil plays a role.

As shown in figure 4, magnetic substance circuit board 1 has the 1st face PS1 and the 2nd face PS2, the 1st face PS1 is towards resin structure 1st interarea VS1 sides of part 70, the 2nd face PS2 is towards the 2nd interarea VS2 sides of resin component.In magnetic substance circuit board 1 2nd face PS2 is formed with wiring conductor pattern 10A, 10B, is equipped with RFIC elements 61 and patch capacitor 62 etc..As RFIC members 2nd face PS2 of 61 mounting surface of part tends to interfere with the magnetic field of aerial coil.Therefore, by the 2nd face PS2 of magnetic substance circuit board 1 with 2nd interarea VS2 of resin component 70 is configured in opposite directions.

It is preferred that the 2nd face PS2 of magnetic substance circuit board 1 is parallel in wireline reel G1 directions, that is, Y direction of aerial coil Configuration, in case the wireline reel G1 with aerial coil intersects.More preferably by the 2nd face PS2 and resin component of magnetic substance circuit board 1 70 the 2nd interarea VS2 configured in parallel.

The magnetic field that aerial coil is formed is bigger closer to aerial coil intensity.Therefore, in wireless IC equipment 101, installation The magnetic substance circuit board 1 for having RFIC elements 61 leaves aerial coil configuration.It is preferred that magnetic substance circuit board 1 is from aerial coil During wireline reel G1 directions, that is, Y direction observation, the 2nd face PS2 for being equipped with RFIC elements 61 is configured compared to resin component 70 The 2nd interarea VS2 closer to the position of wireline reel G1.In order to reduce influence and the wireless IC to forming aerial coil magnetic field In the case that equipment 101 is built in resin forming body, heat caused by high-temperature resin during injection molding influences, more preferably The 2nd face PS2 for being equipped with RFIC elements 61 is configured to the center of wireless IC equipment 101.

Magnetic substance circuit board 1 is provided with the 1st conductor 11A and the 2nd conductor 11B, and being used for will be mounted on the 2nd face PS2 RFIC elements 61 and the 1st wiring pattern 20A, 20G electrical connection.1st conductor 11A and the 2nd conductor 11B is from magnetic substance circuit board 2nd interarea VS2 of 1 the 2nd face PS2 towards resin component 70 extends.In other words, from the 2nd interarea VS2 of resin component 70 Towards the 1st interarea VS1 directions, that is, Z-direction extension.

It is further described, the 1st conductor 11A connections the 1st wiring pattern 20A and wiring conductor pattern 10A, the 1st cloth Line pattern 20A is formed on the 2nd interarea VS2 of resin component 70, and wiring conductor pattern 10A is formed in magnetic substance circuit board On 1 the 2nd face PS2.2nd conductor 11B connections the 1st wiring pattern 10G and wiring conductor pattern 10B, the 1st wiring pattern 10G It is formed on the 2nd interarea VS2 of resin component 70, wiring conductor pattern 10B is formed in the 2nd face of magnetic substance circuit board 1 On PS2.

Fig. 5 is the bottom view of magnetic substance circuit board 1, the figure of the 2nd face PS2 for observation magnetic substance circuit board 1. As shown in figure 5, it is formed with wiring conductor pattern 10A, 10B and NC terminal in the 2nd face PS2 of magnetic substance circuit board 1.Wiring Conductive pattern 10A, 10B and NC terminal is patterned such as the etching by copper foil.In wiring conductor pattern 10A, 10B are provided with power supply terminal, the power supply terminal be connected to RFIC elements 61 the 1st input and output terminal and the 2nd input it is defeated Go out terminal.Wiring conductor pattern 10A, 10B is via the 1st conductor 11A and the 2nd conductor 11B, respectively with one end of aerial coil and separately One end is electrically connected, and the 1st conductor 11A and the 2nd conductor 11B extend from the 2nd interarea VS2 of resin component 70 to the 1st interarea VS1. In addition, wiring conductor pattern 10A, 10B are provided with connection terminal 12A, 12B of connection the 1st conductor 11A and the 2nd conductor 11B.

Wiring conductor pattern 10A, 10B via the 1st conductor 11A and the 2nd conductor 11B respectively with one end of aerial coil and another One end is electrically connected, and the 1st conductor 11A and the 2nd conductor 11B are from the 2nd interarea VS2 of resin component 70 to the side of the 1st interarea VS1 To extension.1st wiring pattern 20A of aerial coil is connected in series in wiring conductor pattern 10A, and in addition the 1st wiring pattern 20G goes here and there Connection is connected to wiring conductor pattern 10B.

It is further described, one end of the 1st conductor 11A and the other end are connected to the 1st wiring pattern 20A and company Connecting terminal 12A, the 1st wiring pattern 20A are formed in the 2nd interarea VS2 of resin component 70, and connection terminal 12A is set to magnetic Property body circuit board 1.One end of 2nd conductor 11B and the other end are connected to the 1st wiring pattern 20G and connection terminal 12B, 2nd wiring pattern 20G is formed in the 2nd interarea VS2 of resin component 70, and connection terminal 12B is set to magnetic substance circuit base Plate 1.

1st conductor 11A and the 2nd conductor 11B is for example columnar metallic pin.The length of 1st conductor 11A and the 2nd conductor 11B The length of direction length, i.e. Z-direction is longer than the thickness of RFIC element 61 and 62 grade surfaces of patch capacitor installation parts.1st leads Body 11A and the 2nd conductor 11B is made using conductive material, for example, the metal materials such as copper can be used to make and Into.

RFIC elements 61 are by the RFIC chip with the 1st input and output terminal 61a and the 2nd input and output terminal 61b (bare chip) encapsulates.RFIC elements 61 are installed on the 2nd face PS2 sides of magnetic substance circuit board 1.More specifically, as schemed Shown in 4 and Fig. 5, the 1st input and output terminal 61a of RFIC elements 61 is connected to the power supply terminal of wiring conductor pattern 10A, should Wiring conductor pattern 10A is formed in the 2nd face PS2 sides of magnetic substance circuit board 1.2nd input and output terminal 61b is connected to wiring The power supply terminal of conductive pattern 10B, wiring conductor pattern 10B are formed in the 2nd face PS2 sides of magnetic substance circuit board 1.This Outside, RFIC elements 61 are also connected on the NC terminals for the 2nd face PS2 sides for being formed in magnetic substance circuit board 1.

Fig. 6 is the circuit diagram of wireless IC equipment 101.RFIC elements 61 connect aerial coil ANT.On aerial coil ANT Patch capacitor 62 is parallel with, and is in series with patch capacitor 63,64.By aerial coil ANT, patch capacitor 62,63,64 and The capacitive component that RFIC elements 61 have itself constitutes LC resonance circuit.In addition, patch capacitor 62,63,64 forms matching electricity Road is used to adjust frequency.The capacitance of patch capacitor 62,63,64 is chosen to be the resonant frequency and RFID system of LC resonance circuit The actually equal frequency of communication frequency, such as 13.56MHz.

As shown in figure 4, wireless IC equipment 101 is on the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F It is provided with electroplated layer 80A and 80B.Electroplated layer 80A and 80B is formed by electroplating films such as copper.Electroplated layer 80A and 80B increase the 1st wiring The film thickness of pattern 20A~20G and the 2nd wiring pattern 50A~50F reduce the D.C. resistance component of coil.Also, wireless IC is set Standby 101 are provided with anti-oxidation protective layer 90A and 90B on electroplated layer 80A and 80B.Protective layer 90A and 90B are for example by welding resistance The protections such as film are formed with resin film.In addition, in figs. 1 to 3, to simplify the explanation, electroplated layer 80A and 80B, protective layer is omitted 90A and 90B.

In [specific embodiment], " RFID element " can refer to RFIC chip in itself, can also refer in RFIC chip By the integrated RFIC encapsulation such as match circuit.In addition, " RFID label tag " has RFIC elements and is connected to the day of RFIC elements Line coil is defined as, using electric wave (electromagnetic wave) or magnetic field, reading and writing the letter of internal memory data in a manner of discontiguous Cease medium.That is, the wireless IC equipment of present embodiment is configured to RFID label tag.

RFIC elements 61 have the wireless IC chip of high frequency of such as HF frequency ranges of HF band RFID systems.Wireless IC equipment 101 are for example arranged on the article of management object.It is close by the wireless IC equipment 101 i.e. RFID label tag that will be installed on the article Read/write device makes the aerial coil magnetic coupling of the aerial coil of wireless IC equipment 101 and the read/write device of RFID.As a result, RFID communication is realized between RFID label tag and read-write equipment.

[configuration of the 1st metallic object and the 2nd metallic object]

Next, using Fig. 7 and Fig. 8, for the 1st metallic object 30A in the wireless IC equipment 101 described in embodiment 1~ The configuration of 30F and the 2nd metallic object 40A~40F illustrate.

Fig. 7 is the drawing in side sectional elevation of the wireless IC equipment of embodiment 1.Fig. 8 is the cross section of the wireless IC equipment of embodiment 2 Figure.The wireless IC equipment of embodiment 1 and the wireless IC equipment of embodiment 2 are in the 1st metallic object 30A~30F and the 2nd metallic object 40A It is different in the configuration of~40F.

All it is multiple 1st metallic object 30A~30F and multiple 2nd metallic object 40A~40F in embodiment 1 and embodiment 2 It is arranged separately on Y direction, and configuration is serrated (zigzag alignment) when from Z-direction.Such as Fig. 7 institutes Show, in embodiment 1, the aerial coil of rectangular coil shape includes 2 kinds of different rings of coil internal-and external diameter.Include the 1st metallic object 30A Ring with the 2nd metallic object 40A, includes the 1st metallic object 30D and the 2nd gold medal at the ring comprising the 1st metallic object 30C and the 2nd metallic object 40C Belong to the ring of body 40D, the respective opening width of ring comprising the 1st metallic object 30F and the 2nd metallic object 40F is Ww.In addition, include The respective opening of ring, the ring comprising the 1st metallic object 30E and the 2nd metallic object 40E of 1 metallic object 30B and the 2nd metallic object 40B is wide It spends for Wn.Also, Wn ＜ Ww.On the other hand, in example 2, as shown in figure 8, the opening width of all rings is all identical W。

In embodiment 1,2 rings for opening aperture position of rectangular coil shape aerial coil include the 1st metallic object 30A The internal-and external diameter of ring with the ring of the 2nd metallic object 40A and comprising the 1st metallic object 30F and the 2nd metallic object 40F is larger in 2 kinds of rings.

In other words, the ring comprising the 1st metallic object 30A and the 2nd metallic object 40A is referred to as " the 1st ring ", the 1st metallic object 1st end positions of the 30A in multiple 1st metallic object 30A~30F in the Y-axis direction, the 2nd metallic object 40A is multiple The 3rd end position in 2 metallic object 40A~40F in the Y-axis direction.Include the ring of the 1st metallic object 30F and the 2nd metallic object 40F Referred to as " the 2nd ring ", 2nd end positions of the 1st metallic object 30F in multiple 2nd metallic object 30A~30F in the Y-axis direction It puts, 4th end positions of the 2nd metallic object 40F in multiple 2nd metallic object 40A~40F in the Y-axis direction.At this point, the 1st Ring and the 2nd ring internal-and external diameter in 2 kinds of rings are larger.

In Fig. 7 and Fig. 8, dotted line is the magnetic flux line concept map of magnetic flux line disengaging rectangular coil shape aerial coil.In such as Fig. 8 In shown embodiment 2, the practical internal-and external diameter of 2 rings for opening aperture position of rectangular coil shape aerial coil is less than above-mentioned ring Opening width W.In addition, magnetic flux line is easily leaked from the gap location of contiguous metal body.On the other hand, in implementation as shown in Figure 7 Example 1,2 rings for opening aperture position of rectangular coil shape aerial coil internal-and external diameter in 2 kinds of rings is larger, therefore magnetic flux line comes in and goes out day The actual coil opening of line coil is more than embodiment 2.In addition, magnetic flux line is difficult to the gap location leakage from contiguous metal body.Therefore, Aerial coil can couple under relatively wide position relationship with the antenna magnetic field of communication object.That is, being formed has more than 3 circles During several helical antenna coil, preferred disposition metallic object, so that the anchor ring product of coil axis, that is, two end side of Y direction becomes larger.

In addition, the aerial coil of above-mentioned rectangular coil shape can include 3 kinds or more different of a variety of rings of internal-and external diameter.This When, 2 ring internal-and external diameters for opening aperture position of aerial coil are that internal-and external diameter is maximum in a variety of rings.

[manufacturing method]

Using Fig. 9 A~9H, illustrated for the manufacturing method of wireless IC equipment 101 described in embodiment 1.Fig. 9 A~ 9H is the figure for representing 101 manufacturing process of wireless IC equipment successively.

As shown in Figure 9 A, prepare magnetic substance circuit board 1.Specifically, in the 2nd face PS2 of magnetic substance circuit board 1 Upper formation wiring conductor pattern 10A, 10B.In addition, it is formed on the 2nd face PS2 of magnetic substance circuit board 1：For installing RFIC The power supply terminal and NC terminals of element etc., for the weld pad of installing patch capacitor 62,63,64 and for connecting the 1st conductor Connection terminal 12A, 12B of 11A and the 2nd conductor 11B.And then it is formed to connect in the 2nd face PS2 of magnetic substance circuit board 1 Cabling pattern of these power supply terminals, weld pad and connection terminal 12A, 12B etc. (with reference to Fig. 5).

Next, on wiring conductor pattern 10A, 10B of magnetic substance circuit board 1, pass through the conduction of scolding tin etc. respectively Property grafting material, installation RFIC elements 61, the 62,63,64, the 1st conductor 11A and the 2nd conductor 11B of patch capacitor.Use scolding tin When, the print solder thickener on wiring conductor pattern 10A, 10B of the 2nd face PS2 of magnetic substance circuit board 1 is pacified using chip mounter After filling each parts, these parts are welded by reflow soldering process.It electrically conducts in magnetic substance circuit board 1 as a result, RFIC elements 61, the 62,63,64, the 1st conductor 11A and the 2nd conductor 11B of patch capacitor, and carry out structural formula engagement.

Magnetic substance circuit board 1 is such as ferrite substrate.Wiring conductor pattern 10A, 10B, weld pad and connecting pin Sub- 12A is patterned with copper foil.Magnetic substance circuit board 1 can also be the formation thick film figure on ferrite substrate The substrate of case.

For example, the section size of wiring conductor pattern 10A, 10B are 100 μm of 18 μ m.It is preferred that making these wiring diagrams After case, implement the electroplating processes of copper etc., total film thickness is thickeied to 40~50 μm.

RFIC elements 61 are to encapsulate the RFIC chip of RFID label tag.Patch capacitor 62,63,64 is such as layer Stacked ceramic chip parts.

Next, as shown in Figure 9 B, magnetic substance circuit base is respectively configured on the adhered layer 2 of the pedestal 3 with adhered layer 2 Plate 1, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F.Magnetic substance circuit board 1 is using the 2nd face PS2 sides as stickup State of 1st conductor 11A and the 2nd conductor 11B standings on adhered layer 2 is configured at pedestal 3 by 2 side of layer.1st metallic object 30A ~30F and the 2nd metallic object 40A~40F respectively using the 1st end side of one end and the 3rd end side as 2 side of adhered layer, and with stand State on pedestal 3 is configured.In this way, by magnetic substance circuit board 1, the 1st metallic object 30A~30F and the 2nd metal Body 40A~40F is installed in the state of being firmly secured to pedestal 3.In addition, it is fixed to stablize magnetic substance circuit board 1 In pedestal 3, adhered layer 2 can be fixed in for example by the supporting member being made with 70 identical material of resin component.

Adhered layer 2 is the resin for example with stickup property.40A~40F points of 1st metallic object 30A~30F and the 2nd metallic object It is not copper metallic pin.In addition, these metallic pins are that for example a diameter of 0.3mm, length are cylindric for 7mm's or so.It is although golden Belong to pin to be not limited to using copper as main component, but consider from conductivity and processability, preferably using copper as main component.

Next, as shown in Figure 9 C, resin component 70 is formed until the 1st metallic object 30A~30F and the 2nd metallic object 40A The height of~40F.Specifically, it is that epoxy resin is applied to specified altitude.Specified altitude refers at least be not less than the 1st metal The height of body 30A~30F and the 2nd metallic object 40A~40F.As a result, using resin component 70 by the 1st metallic object 30A~30F and 2nd metallic object 40A~40F coatings.

Next, as shown in fig. 9d, by the 1st interarea VS1 of plane lapping resin component 70, make the 1st metallic object 30A The 2nd end of~30F and the 4th end of the 2nd metallic object 40A~40F are exposed.

Resin component 70 can also be set by being coated with fluid resin or lamination semi-solid preparation flaky resin.

Next, as shown in fig. 9e, the 4th of the 2nd end of the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F the On the 1st interarea VS1 for holding the resin component 70 exposed, form the 2nd wiring pattern 50A~50F (with reference to Fig. 3).Specifically, By to electric conductivity solder flux carry out silk-screen printing, on the 1st interarea VS1 of resin component 70 formed the 2nd wiring pattern 50A~ 50F.As a result, by the 2nd end of the 2nd wiring pattern 50A~50F and the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F 4th end connects.

Next, as shown in fig. 9f, the pedestal 3 with adhered layer 2 is removed from resin component 70, makes the 1st metallic object 30A The 1st end of~30F, the 3rd end of the 2nd metallic object 40A~40F, the 1st conductor 11A and the 2nd conductor 11B one end expose resin structure 2nd interarea VS2 of part 70.Specifically, by dismantling pedestal 3, plane lapping adhered layer 2 and resin structure from resin component 70 Part 70 makes the 1st end of the 1st metallic object 30A~30F, the 3rd end, the 1st conductor 11A and the 2nd conductor of the 2nd metallic object 40A~40F Expose the 2nd interarea VS2 of resin component 70 in one end of 11B.

Next, as shown in fig. 9g, the 3rd of the 1st end of the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F the On the 2nd interarea VS2 for holding the resin component 70 exposed, form the 1st wiring pattern 20A~20G (with reference to Fig. 2).Specifically, By to electric conductivity solder flux carry out silk-screen printing, on the 2nd interarea VS2 of resin component 70 formed the 1st wiring pattern 20A~ 20G.As a result, by the 1st end of the 1st wiring pattern 20A~20G and the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F 3rd end connects.In addition, the 1st wiring pattern 20A and 20G is connected to one end of the 1st conductor 11A and the 2nd conductor 11B.

1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F can be respectively in the 2nd interarea of resin component 70 On VS2 and the 1st interarea VS1, the electrically conductive films such as copper film are formed, then cloth is made by forming photoresistance film and etching by galvanoplastic etc. Line pattern forms.

Next, as shown in Fig. 9 H, electricity is formed on the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F Coating 80A, 80B.In addition, in the forming face of the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F, from electroplated layer The top of 80A, 80B form protective layer 90A, 90B.

Electroplated layer is formed by plating such as copper.During copper plating film, film surface can be electroplated in copper etc. and re-form gold-plated film.Pass through shape Into electroplating film, the film thickness of the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F, D.C. resistance (DCR) are increased Become smaller, conductor losses can be reduced.Thereby, it is possible to reduce the 1st wiring pattern 20A~20G's and the 2nd wiring pattern 50A~50F DCR makes its DCR with the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F reach equal extent.That is, the sheet in this stage Exposing on the outer surface of body has the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F.Therefore, by by the ontology Electroplate liquid is immersed, can selectively increase the thickness of the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F.For example, In wireless IC equipment 101, can increase the 1st wiring pattern 20A~20G thickness be larger than wiring conductor pattern 10A, The thickness of 10B.

Protective layer 90A, 90B are the protection resin films for preventing oxidation, such as solder mask etc..

In addition, above-mentioned operation is directly handled in the state of mother substrate.Finally, mother substrate is separated into each wireless IC Equipment unit (monolithic).

[effect]

By wireless IC equipment 101 described in embodiment 1, following effect can be reached.

The 1 wireless IC equipment 101 according to embodiment, by installing RFIC elements 61 in magnetic substance circuit board 1 Deng space can be saved.Further, since be not the structure in 1 mounted antennas coil of magnetic substance circuit board, so can be with Simple structure realizes the compact in size of wireless IC equipment 101.

Magnetic substance circuit board 1 plays a role as the magnetic core of aerial coil, therefore can improve the L values of aerial coil, Promote antenna performance.Therefore, in wireless IC equipment 101, aerial coil will not be made to become larger, and can obtained with regulation inductance The aerial coil of value.In addition, in wireless IC equipment 101, even if reducing the height of aerial coil, defined electricity can be also obtained Inductance value.

According to wireless IC equipment 101, due to the poly- magnetic effect of magnetic substance circuit board 1, can enhance and communication object Magnetic coupling between antenna.Also, RFIC elements 61 in magnetic substance circuit board 1 are installed, therefore RFIC can be inhibited Element is to the obstruction in formation aerial coil magnetic field.For example, it can inhibit what the digital signal input and output of RFIC elements 61 generated Noise is to the obstruction in formation aerial coil magnetic field.Additionally it is possible to reduce interference of the magnetic field of aerial coil to RFIC elements 61.

Magnetic substance circuit board 1 leaves aerial coil, is embedded in resin component 70.Therefore, in magnetic substance circuit board 1 The 2nd face PS2 sides, be provided with space between magnetic substance circuit board 1 and resin component 70.Pass through wireless IC equipment 101, energy It is enough effectively to use this space, such as in the installations such as the 2nd face PS2 sides of magnetic substance circuit board 1 installation RFIC elements 61 and capacitance Parts.Therefore, it is possible to realize the miniaturization of wireless IC equipment 101.It is further possible to installation parts are mounted on magnetic substance 1st face PS1 of circuit board 1 and the 2nd face PS2 both sides.

In addition, being configured by the way that the 2nd face PS2 of magnetic substance circuit board 1 is made to leave aerial coil, RFIC elements 61 are not easy It hinders through the magnetic flux line near aerial coil.Especially by by the mounting surface of RFIC elements 61 i.e. the 2nd face PS2 configuration from During the wireline reel G1 directions observation of aerial coil, compared to resin component 70 the 2nd interarea VS2 closer to the position of wireline reel G1, Make it possible to further reduce obstruction of the RFIC elements 61 to aerial coil magnetic field.

According to wireless IC equipment 101, the part with large-size of aerial coil, therefore phase can be formed with metallic pin Than for example multiple substrate layers with interlayer connection conductor are laminated so as to form the connecting portion of short transverse, can subtract Few connecting portion.Therefore, the electrical characteristic of aerial coil can be promoted by wireless IC equipment 101.In addition, there will be via hole When multiple substrate layers of type interlayer connection conductor are laminated and form connecting portion, through-hole is formed on substrate, is filled out in the through-hole It fills electric conductivity solder flux etc. and forms interlayer connection conductor i.e. via hole.At this point, through-hole can form taper in processing, therefore it is laminated more After a substrate layer, the different via hole of diameter is laminated.In addition, when being laminated multiple substrate layers, may be sandwiched between via hole The impurity materials such as copper.

By wireless IC equipment 101, without forming coil on multilager base plate, without carrying out complicated wiring.Therefore nothing Line IC equipment 101 easy to implement can have larger height dimension and the big line of degree of freedom in the design of coil opening size Coil structures.Furthermore it is possible to reduce the resistance of aerial coil, therefore can obtain with highly sensitive micro radio IC equipment.

1st metallic object 30A~30F and the 2nd metallic object 40A~40F are made of columnar metallic pin.It is welded compared to by electric conductivity The sintering metal body formed and the DCR that the electrically conductive films such as the film metal body formed are etched by conductive membrane are fired in agent, can Fully reduce the DC resistance component that the metallic pin has itself.Has Q values height i.e. low loss antenna coil therefore, it is possible to provide Wireless IC equipment 101.

In the pattern for forming aerial coil, the 1st wiring pattern 20A~20G and the 2nd wiring diagram that extend along X-direction Case 50A~50F can increase film thickness by forming the electroplating films such as copper, further reduce coil D.C. resistance component.

The capacitance 62,63,64 of RFIC elements 61 is connected to due to having, so can easily form to match RFIC members Part and aerial coil or the circuit for setting resonant frequency, without external circuit or can be such that circuit more simplifies.

The surface mount chip parts of RFIC elements 61, patch capacitor 62,63,64 etc., the 1st metallic object 30A~30F, And the 2nd metallic object 40A~40F protected by resin component 70, therefore wireless IC equipment 101 is whole securely.It is particularly that this is wireless When IC equipment 101 is embedded in resin forming article, high-temperature resin that for injection molding when is flowed, surface mount chip zero The weld part of part is protected.In addition, the resin flowed during injection molding such as moment reaches 300 DEG C or more of high temperature, still Since RFIC elements itself are embedded in resin component 70, and the bonding part of RFIC elements and magnetic substance circuit board 1 is also buried In resin component, so the reliability of RFIC elements and wireless IC equipment will not be damaged.

RFIC elements 61 will not be exposed to the outside of wireless IC equipment 101, and the defencive function of RFIC elements 61 becomes strong, and The volume caused by RFIC elements 61 are mounted in outside can be avoided excessive.Furthermore, it is possible to improve RFIC elements 61 and magnetic The reliability of the connecting portion of property body circuit board 1.Thereby, it is possible to realize to be built in the synthetic resins such as plastics also can The high-fire resistance wireless IC equipment of hot environment during tolerance injection molding.The particularly wireless IC equipment 101 of embodiment 1 In, the magnetic substance circuit board 1 for carrying RFIC elements 61 leaves the surface of resin component 70.Therefore, pass through injection molding Built in manufacture during the synthetic resin of wireless IC equipment 101, resin heat during injection molding is difficult to be conveyed to magnetic substance circuit Substrate 1, so can make scolding tin splashing etc. is dangerous to reduce.

In addition, by the way that magnetic substance circuit board 1 is embedded in resin component 70, magnetic substance circuit board 1 can be protected.Example Such as, even wireless IC equipment 101 is built in injection-molded article, the use in injection molding resin of high temperature will not be in direct contact magnetic Property body circuit board 1.Therefore, the excellent heat resistance of wireless IC equipment 101.

About the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F, carried out on the surface of resin component 70 Silk-screen printing or pattern-making, therefore can be simply formed.In addition, easily from the 1st wiring pattern 20A~20G connections To the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F, also easily the 1st is connected to from the 2nd wiring pattern 50A~50F Metallic object 30A~30F and the 2nd metallic object 40A~40F.It also, also can be simply by the 1st conductor of magnetic substance circuit board 1 11A and the 2nd conductor 11B, connect with the 1st wiring pattern 20A, 20G.

RFIC elements 61 via be formed in the 2nd face PS2 of magnetic substance circuit board 1 wiring conductor pattern 10A, 10B, the 1st Conductor 11A and the 2nd conductor 11B, is connected to aerial coil.Therefore, bridge joint pattern is easily formed.In addition, RFIC elements 61 also may be used To be connected directly to the 1st conductor 11A and the 2nd conductor 11B.RFIC elements 61 via cabling wiring conductor pattern 10A, 10B, The 1st conductor 11A and the 2nd conductor 11B is connected to, therefore can be in any position shape of the 2nd face PS2 of magnetic substance circuit board 1 Into the 1st conductor 11A and the 2nd conductor 11B.In addition, RFIC elements 61 can also be connected directly to the 1st conductor 11A and the 2nd conductor 11B。

In wireless IC equipment 101, the actual aperture diameter of aerial coil is big, therefore can be closed with relatively wide position System communicates with the antenna of communication object.

1st metallic object 30A~30F and the 2nd metallic object 40A~40F is at least in coil axial end portion not in orientation On be serrated configuration, even if thus increasing the radical of metallic object, increase the number of turn, can also realize 101 size of wireless IC equipment Miniaturization.

By the manufacturing method of wireless IC equipment 101 described in embodiment 1, following effect can be reached.

The manufacturing method of the 1 wireless IC equipment 101 according to embodiment, can save space, simply produce with letter Single structure realizes miniaturization, and coil aperture area is big, has an excellent electrics characteristics such as D.C. resistance is small, and fastness and The strong wireless IC equipment 101 of heat resistance.

It, can be by the 1st metal by using the pedestal 3 with adhered layer 2 according to the manufacturing method of wireless IC equipment 101 Body 30A~30F and the 2nd metallic object 40A~40F are firmly fixed, therefore can the metallic object of smaller width to be used for antenna line Circle.Therefore, it is possible to manufacture the aerial coil that more than the number of turn and inductance value is high.In addition, by using larger height dimension, and use The smaller metallic object of width can further increase the opening area of coil.

In addition, in the wireless IC equipment 101 described in embodiment 1, the 1st metallic object 30A~30F and the 2nd metallic object 40A The cylindric side of~40F is embedded in the 1st side VS3 and the 2nd side VS4 of resin component 70, and but not limited to this ties Structure.Expose a part to resin structure in the side that can also be configured to the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F 1st side VS3 of part 70 and the 2nd side VS4.

1st metallic object 30A~30F of embodiment 1 and the 2nd metallic object 40A~40F by taking columned copper pin as an example into Explanation is gone, but not limited to this.For example, it may be column block tin etc..

The 1st metallic object 30A~30F and the 2nd metallic object 40A~40F in embodiment 1 are arranged separately on Y direction, And configuration is serrated (zigzag alignment) when from Z-direction, is illustrated above in relation to this structure, But not limited to this.For example, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F can also form a line.

Configuration is in phase when magnetic substance circuit board 1 in embodiment 1 is with from the wireline reel G1 directions of aerial coil Than the 2nd interarea VS2 of resin component 70 closer to being illustrated for the position of wireline reel G1, but not limited to this.Example Such as, at least part of magnetic substance circuit board 1 is located at the inside of aerial coil and is functioned as magnetic core.It is in addition, logical The position of change magnetic substance circuit board 1 is crossed, using the poly- magnetic effect of magnetic core, the magnetic field directive property of aerial coil can be changed. For example, it is desirable to by magnetic field towards resin component 70 the 1st interarea VS1 sides when, by magnetic substance circuit board 1 close to the 1st interarea VS1 Configuration.

RFIC elements 61 in embodiment 1 are encapsulated by RFIC chip, and but not limited to this.For example, RFIC Element 61 can also be the RFIC of naked core sheet.At this point, RFIC has gold electrode terminal, by ultrasonic bonding electric with magnetic substance The power supply terminal that gold-plated film has been printed on base board 1 is attached.

In wireless IC equipment 101 described in embodiment 1, illustrate using this 3 capacitors of patch capacitor 62,63,64 The example of match circuit is formed, but not limited to this.In wireless IC equipment 101, as setting the electricity of resonant frequency Hold, capacitance more than at least one is connected in parallel in aerial coil.

Resin component 70 in embodiment 1 is configured to include the magnetic substance powder of ferrite powder etc..Pass through this Structure, resin component 70 have magnetism, therefore can reduce the overall dimensions needed for the aerial coil for obtaining regulation inductance.This Outside, when resin component 70 has magnetic, the side of the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F can also be from trees Expose the side of fat component 70.By such structure, magnetic field, which can be expanded to, exposes the 1st metallic object 30A~30F and the 2nd metallic object 70 surface of resin component of 40A~40F, so as to can also communicate to these directions.

In the embodiment 1, it is installed on the 2nd of magnetic substance circuit board 1 about RFIC elements 61 and capacitance 62,63,64 The structure of face PS2 sides is illustrated, and but not limited to this.Installation parts can also be mounted on magnetic substance circuit board On 1 the 1st face PS1 or on the 1st face PS1 and the 2nd this two sides of face PS2.

1st conductor 11A of embodiment 1 and the 2nd conductor 11B are illustrated by taking columnar metallic pin as an example, but not It is defined in this.For example, the 1st conductor 11A and the 2nd conductor 11B can be the column block tins formed in magnetic substance circuit board 1, Can be that galavanic growth forms when forming electroplated layer 80.

Magnetic substance circuit board 1 in embodiment 1 is illustrated for being sintered the ferrite substrate of system, but not It is defined in this.Magnetic substance circuit board 1 is the circuit board for having magnetic substance, can be made of magnetic material.

In embodiment 1, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F of an aerial coil part are formed It is illustrated by taking metallic pin as an example, but not limited to this.For example, the 1st metallic object 30A~30F and the 2nd metallic object 40A~ 40F can be the metal to be metallized by filling electric conductivity solder flux in the multiple through holes for being set to resin component 70 Body.1st metallic object 30A~30F and the 2nd metallic object 40A~40F can be by the multiple perforations for being set to resin component 70 The metallic object (the electroplates in hole) of electroplating film is formed in hole.In addition, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F can To be in the side of resin component 70 metallic object that metallizes of printing electric conductivity solder flux or in the side of resin component 70 The metallic object that pattern is made in electroplating film and is formed.

(embodiment 2)

[overall structure]

Using Figure 10 and Figure 11, illustrated for the wireless IC equipment of embodiment 2 described in the utility model.

What Figure 10 was represented is the outline structure of wireless IC equipment 102 described in embodiment 2.What Figure 11 was represented is embodiment The bottom view of the 2 wireless IC equipment 102.In addition, in embodiment 2, carried out mainly for the difference from embodiment 1 Explanation.In embodiment 2, about the structure identical or equal with embodiment 1, the identical label of affix is said It is bright.In addition, in embodiment 2, the record repeated with embodiment 1 is omitted.

As shown in Figure 10, the wireless IC equipment 102 of embodiment 2 is compared with the wireless IC equipment 101 of embodiment 1, no It is magnetic substance circuit board 1 being configured on the 2nd interarea VS2 of resin component 70 with part.In addition, embodiment 2 and reality It applies mode 1 to compare, the difference lies in the 2nd face PS2 of magnetic substance circuit board 1 forms the 2nd interarea VS's of resin component 70 A part, the 3rd conductor 11C and the 4th conductor 11D are set to the inside of magnetic substance circuit board 1.

The magnetic substance circuit board 1 of wireless IC equipment 102 is configured at the 2nd interarea VS2 of resin component 70, magnetic substance circuit 2nd face PS2 of substrate 1 forms a part of the 2nd interarea VS2 of resin component 70.As shown in figure 11, in magnetic substance circuit board 1 the 2nd face PS2 is formed with a part of the 1st wiring pattern 20A~20G.

In the 1st face PS1 of magnetic substance circuit board 1, it is formed with wiring conductor pattern 10A, 10B, power supply terminal, NC ends Son, connection terminal etc. are equipped with RFIC elements 61 and capacitance 62 etc..It is seen from the wireline reel G1 directions of aerial coil, that is, Y direction When examining, the 1st face PS1 configurations compared to the 2nd face PS2 closer to the position of wireline reel.That is, in wireless IC equipment 102, from antenna During the wireline reel G1 directions observation of coil, on compared to 1st face PS1s of the 2nd face PS2 closer to the position of wireline reel G1, It is formed with the mounting surface of RFIC elements 61.

The 3rd conductor 11C and the 4th conductor 11D is internally provided in magnetic substance circuit board 1.3rd conductor 11C is electrically connected Wiring conductor pattern 10A and the 1st wiring conductor pattern 20A, wiring conductor pattern 10A are formed on the 1st face PS1, and the 1st Wiring pattern 20A is formed on the 2nd face PS2.4th conductor 11D is electrically connected wiring conductor pattern 10B and the 1st wiring pattern 20G, Wiring conductor pattern 10B is formed on the 1st face PS1, and the 1st wiring pattern 20G is formed on the 2nd face PS2.3rd conductor It by silver is the via hole conductor that forms of electric conductivity solder flux firing that 11C and the 4th conductor 11D, which is,.3rd conductor 11C and the 4th conductor 11D Connect via connection terminal with wiring conductor pattern 10A, 10B, so as to the 1st input and output terminal 61a of RFIC elements 61 and 2nd input and output terminal 61b connections.

[manufacturing method]

Using Figure 12 A~12J, illustrated for the manufacturing method of wireless IC equipment 101 described in embodiment 1.Figure 12 A ~12J is the figure for representing 101 manufacturing process of wireless IC equipment successively.

As illustrated in fig. 12, conductor hole 111A, 111B are formed in unfired magnetic material 110, for setting Put the 3rd conductor 11C and the 4th conductor 11D.Magnetic material 110 is such as ferrite sheet.

As shown in Figure 12 B, in conductor filling silver system electric conductivity solder flux in hole 111A, 111B.In addition, in magnetic material Silver system electric conductivity solder flux is printed on 110 the 1st face PS1, is used to form wiring conductor pattern 10A, 10B.Later, it is arrived 800 Magnetic material 110 is fired at a temperature of 1000 DEG C.After firing, by cooling process, acquisition has to be formed on the 1st face PS1 Wiring conductor pattern 10A, 10B and be set to the magnetic substance circuit board 1 of the 3rd internal conductor 11C and the 4th conductor 11D.

As indicated in fig. 12 c, in wiring conductor pattern 10A, 10B of the 1st face PS1 sides for being formed in magnetic substance circuit board 1 On, RFIC elements 61 are installed via conductive bonding material and parts are installed on 62 grade surfaces of capacitance.Conductive bonding material Such as use tin silver system scolding tin.In addition, after installing each parts using chip mounter, welded by reflow soldering process.

Next, as indicated in fig. 12d, on the adhered layer 2 of the pedestal 3 with adhered layer 2, magnetic substance circuit is respectively configured Substrate 1, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F.Magnetic substance circuit board 1 is using the 2nd face PS2 sides as viscous 2 side of paste layer is configured at pedestal 3.1st metallic object 30A~30F and the 2nd metallic object 40A~40F is respectively by the 1st end side of one end And the 3rd end side installed as 2 side of adhered layer, and with the state stood on pedestal 3.In this way, by magnetic substance circuit base Plate 1, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F are configured in the state of being firmly secured to pedestal 3.Separately It outside, can be for example by being made with 70 identical material of resin component in order to which magnetic substance circuit board 1 is made to be stably fixed on pedestal 3 The supporting member formed is fixed in adhered layer 2.

Next, as shown in figure 12e, resin component 70 is formed until the 1st metallic object 30A~30F and the 2nd metallic object 40A The height of~40F.Specifically, it is that epoxy resin is applied to specified altitude.Specified altitude refers at least be not less than the 1st metal The height of body 30A~30F and the 2nd metallic object 40A~40F.Pass through the 1st metallic object 30A~30F of 70 coating of resin component as a result, And the 2nd metallic object 40A~40F.

Next, as shown in Figure 12 F, by the 1st interarea VS1 of plane lapping resin component 70, make the 1st metallic object 30A The another side of~30F i.e. the 2nd end and i.e. the 4th end of another side of the 2nd metallic object 40A~40F are exposed.

Next, as shown in fig. 12g, the of the 2nd end of the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F On 1st interarea VS1 of the resin component 70 that 4 ends are exposed, form the 2nd wiring pattern 50A~50F (with reference to Fig. 3).Specifically, By to electric conductivity solder flux carry out silk-screen printing, on the 1st interarea VS1 of resin component 70 formed the 2nd wiring pattern 50A~ 50F.As a result, by the 2nd end of the 2nd wiring pattern 50A~50F and the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F 4th end connects.

Next, as shown in Figure 12 H, the pedestal 3 with adhered layer 2 is removed from resin component 70, makes the 1st metallic object The 1st end of 30A~30F, the 3rd end of the 2nd metallic object 40A~40F, the 3rd conductor 11C and the 4th conductor 11D one end expose tree 2nd interarea VS2 of fat component 70.Specifically, by dismantling pedestal 3, plane lapping adhered layer 2, tree from resin component 70 Fat component 70 and magnetic substance circuit board 1, make the 1st end of the 1st metallic object 30A~30F, the 2nd metallic object 40A~40F the 3rd Expose the 2nd interarea VS2 of resin component 70 in the one end at end, the 3rd conductor 11C and the 4th conductor 11D.

Next, as shown in figure 12i, the 1st end of the 1st metallic object 30A~30F, the 2nd metallic object 40A~40F the 3rd The 2nd interarea VS2 of resin component 70 and magnetic substance circuit that end and one end of the 3rd conductor 11C and the 4th conductor 11D are exposed On 2nd face PS2 of substrate 1, form the 1st wiring pattern 20A~20G (with reference to Figure 11).Specifically, by being welded to electric conductivity Agent carries out silk-screen printing, and the 1st cloth is formed on the 2nd interarea VS2 of resin component 70 and the 2nd face PS2 of magnetic substance circuit board 1 Line pattern 20A~20G.As a result, by the 1st end and the 2nd metal of the 1st wiring pattern 20A~20G and the 1st metallic object 30A~30F The 3rd end connection of body 40A~40F.In addition, the 1st wiring pattern 20A and 20G is connected to the 3rd conductor 11C and the 4th conductor One end of 11D.

Next, as shown in Figure 12 J, electricity is formed on the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F Coating 80A, 80B.In addition, in the forming face of the 1st wiring pattern 20A~20G and the 2nd wiring pattern 50A~50F, from electroplated layer The top of 80A, 80B form protective layer 90A, 90B.

[effect]

By wireless IC equipment 102 described in embodiment 2, following effect can be reached.

Magnetic substance circuit board 1 is configured at the 2nd interarea of resin component 70 by wireless IC equipment 102 described in embodiment 2 VS2 is formed a part of the 2nd interarea VS2 of resin component 70 by the 2nd face PS2.In addition, by magnetic substance circuit board 1 Inside setting the 3rd conductor 11C and the 4th conductor 11D, will be formed in wiring conductor pattern 10A, 10B on the 1st face PS1 and formation In the 1st wiring pattern 20A, 20G connections on the 2nd face PS2.By such structure, the L values of aerial coil can be improved, and The height of aerial coil is reduced, therefore the compact in size of wireless IC equipment 102 can be made.

In addition, by installing the installation parts such as RFIC61 on the 1st face PS1 of magnetic substance circuit board 1, compared to implementation More simply the bonding part of magnetic substance circuit board 1 and installation parts can be configured than resin component 70 for mode 1 2nd interarea VS2 is closer to the position of aerial coil wireline reel G1.61 mounting surface of RFIC elements tends to interfere with aerial coil formation Magnetic field.When therefore, by from the wireline reel of aerial coil (Y-axis) direction, than the 2nd face PS2 closer to wireline reel G1's The mounting surface of RFIC elements 61 is formed on 1st face PS1 of position, so as to simply protect RFIC elements 61 and aerial coil Hold distance.Therefore, wireless IC equipment 102 described in embodiment 2 compares embodiment 1, can 61 grade of RFIC elements be installed zero Component is configured close to wireline reel G1, so as to further improve electrical characteristic and hot property.

The manufacturing method of the 2 wireless IC equipment 102 according to embodiment, can simply produce can improve aerial coil L values, reduce aerial coil height, realize miniaturization wireless IC equipment 102.In addition, manufacture magnetic substance circuit board 1 When, the 3rd conductor 11C and the 4th conductor 11D can be formed, therefore manufacturing process can be simplified.

In addition, in embodiment 2, the 3rd conductor 11C and the 4th conductor are formed for by firing silver system electric conductivity solder flux The via hole conductor of 11D is illustrated, and but not limited to this.As long as the 3rd conductor 11C and the 4th conductor 11D are by having conduction It property and the material of wiring conductor pattern 10A, 10B and the 1st wiring pattern 20A, 20G can be electrically connected is made.

In embodiment 2, magnetic material 110 is illustrated by taking ferrite sheet as an example, and but not limited to this.Magnetic As long as material of the elastomer material 110 with magnetic substance.

(embodiment 3)

[overall structure]

Using Figure 13 and Figure 14, illustrated for the wireless IC equipment of embodiment 3 described in the utility model.

What Figure 13 was represented is the outline structure of wireless IC equipment 103 described in embodiment 3.What Figure 14 was represented is embodiment The bottom view of the 3 wireless IC equipment 103.In addition, in embodiment 3, carried out mainly for the difference from embodiment 2 Explanation.In embodiment 3, about the structure identical or equal with embodiment 2, the identical label of affix illustrates. In addition, in embodiment 3, the record repeated with embodiment 2 is omitted.

As shown in figure 13, the wireless IC equipment 103 of embodiment 3 is compared with the wireless IC equipment 102 of embodiment 2, no The 2nd face PS2 for being magnetic substance circuit board 1 with part forms the entire 2nd interarea VS2 of resin component 70.In addition, implementing In mode 3, difference is that the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F are set to magnetic substance circuit board 1 On 1st face PS1, by the 1st connection conductor 13A~13F and the 2nd connection conductor 14A~14F, respectively with the 1st wiring pattern 20A ~20G connections.

As shown in figure 13, the 2nd face PS2 of the magnetic substance circuit board 1 of wireless IC equipment 103 forms the whole of resin component 70 A 2nd interarea VS2.Multiple 1st connection terminal 15A~15F and multiple are provided on the 2nd face PS2 of magnetic substance circuit board 1 2nd connection terminal 16A~16F.In the inside of magnetic substance circuit board 1, it is provided with and is connect with the 1st wiring pattern 20A~20G Multiple 1 connection conductor 13A~13F and multiple 2nd connection conductor 14A~14F.1st metallic object 30A~30F and the 2nd gold medal Belong to body 40A~40F via the 1st connection terminal 15A~15F and the 2nd connection terminal 16A~16F, with the 1st connect conductor 13A~ The connection conductor 14A~14F connections of 13F and the 2nd.As shown in figure 14, it on the 2nd face PS2 of magnetic substance circuit board 1, is formed with 1st wiring pattern 20A~20G.

In embodiment 3, the 1st metallic object 30A~30F and the 2nd metallic object 40A~40F are set to magnetic substance circuit base On 1st face PS1 of plate 1.Specifically, the 1st end of the 1st metallic object 30A~30F is with being set to the 1st of magnetic substance circuit board 1 The 1st connection terminal 15A~15F connections on the PS1 of face.The 3rd end of 2nd metallic object 40A~40F is with being set to magnetic substance circuit The 2nd connection terminal 16A~16F connections on 1st face PS1 of substrate 1.

Magnetic substance circuit board 1 is internally provided with the 1st connection conductor 13A~13F and the 2nd connection conductor 14A~14F. One end of 1st connection conductor 13A~13F is connect with the 1st wiring pattern 20A~20F, and the other end and the 1st connection terminal 15A~ 15F connections.The 1st metallic object 30A~30F and the 1st wiring pattern 20A~20F are electrically connected by the 1st connection conductor 13A~13F as a result, It connects.One end of 2nd connection conductor 14A~14F is connect with the 1st wiring pattern 20B~20G, the other end and the 2nd connection terminal 16A ~16F connections.The 2nd connection conductor 14A~14F is electric by the 2nd metallic object 40A~40F and the 1st wiring pattern 20B~20G as a result, Connection.1st metallic object 30A~30F and the 1st connection terminal 15A~15F and the 2nd metallic object 40A~40F and the 2nd connecting pin Sub- 16A~16F is attached via conductive bonding material.Conductive bonding material is for example using tin silver system scolding tin.

1st connection conductor 13A~13F and the 2nd connection conductor 14A~14F are made, such as can be with of conductive material It is made with the 3rd conductor 11C and the 4th conductor 11D likewise by silver system electric conductivity scolding tin is fired.

In embodiment 3, a part for magnetic substance circuit board 1 is functioned as the magnetic core of aerial coil.Therefore, As long as at least part of magnetic substance circuit board 1 is configured at the inside of aerial coil, magnetic substance circuit board 1 will act as day The magnetic core of line coil functions.

[effect]

By wireless IC equipment 103 described in embodiment 3, following effect can be reached.

In wireless IC equipment 103 described in embodiment 3, the 2nd face PS2 of magnetic substance circuit board 1 forms resin component 70 entire 2nd interarea VS2.In addition, it is set to the 1st metallic object 30A~30F on the 1st face PS1 of magnetic substance circuit board 1 And the 2nd metallic object 40A~40F via the 1st connection conductor 13A~13F and the 2nd connection conductor 14A~14F, with the 1st wiring diagram Case 20A~20G is electrically connected.By such structure, the size of magnetic substance circuit board 1 can not be increased, further improves antenna The L values of coil promote antenna performance.In addition, even if wireless IC equipment 103 reduces the height of aerial coil, can also be advised Fixed inductance value, therefore equipment can be miniaturised.

In embodiment 3, part 1 magnetic core as aerial coil of magnetic substance circuit board inside aerial coil It functions, by the poly- magnetic effect of the part, the magnetic coupling between the antenna of communication object can be improved.

In addition, in embodiment 3, the quantity of the 1st connection conductor 13A~13F and the 1st connection terminal 15A~15F's Quantity is identical with the quantity of the 1st metallic object 30A~30F, the quantity and the 2nd connection terminal 16A of the 2nd connection conductor 14A~14F The quantity of~16F is identical with the quantity of the 2nd metallic object 40A~40F.

(embodiment 4)

[overall structure]

Using Figure 15, illustrated for the wireless IC equipment of embodiment 4 described in the utility model.

What Figure 15 was represented is the outline structure of wireless IC equipment 104 described in embodiment 4.In addition, in embodiment 3, It is illustrated mainly for the difference from embodiment 2.In embodiment 4, about identical with embodiment 1 or equal Structure, the identical label of affix illustrate.In addition, in embodiment 4, the record repeated with embodiment 1 is omitted.

As shown in figure 15, the wireless IC equipment 104 of embodiment 4 is compared with the wireless IC equipment 101 of embodiment 1, no It is that magnetic substance circuit board 1A includes magnetic substance substrate layer 1a and magnetic substance auxiliary layer 1b with part.

The magnetic substance circuit board 1A of embodiment 4 is in the 1st face PS1, the 2nd face PS2 and magnetic substance circuit board 1A Center of inside sets magnetic substance auxiliary layer 1b respectively, and magnetic substance substrate layer 1a is set between each magnetic substance auxiliary layer 1b.

Magnetic substance substrate layer 1a and magnetic substance auxiliary layer 1b by it is substantially all be that the material of polycrystalline phase is formed.Magnetic substance base material The polycrystalline phase of layer 1a mutually has substantive identical crystal structure, and magnetic substance is auxiliary each other with the polycrystalline of magnetic substance auxiliary layer 1b The linear expansion coefficient α 2 of layer 1b is helped to be less than the linear expansion coefficient α 1 of magnetic substance substrate layer 1a.

The polycrystalline phase of magnetic substance substrate layer 1a and the polycrystalline of magnetic substance auxiliary layer 1b are mutually the polycrystalline phases being made of ferrite. In addition, magnetic substance substrate layer 1a and magnetic substance auxiliary layer 1b are fired simultaneously.

The ferrite for forming magnetic substance substrate layer 1a is the ferrite of such as iron-nickel-zinc-copper system.Form magnetic substance base material The ferrite of layer 1a for example will allocate iron oxide (Fe with requirement ratio₂O₃), zinc oxide (ZnO), nickel oxide (NiO) and oxygen The material for changing copper (CuO) is fired.The ferrite of magnetic substance substrate layer 1a is formed as a result, for example with the magnetic conductance under 1MHz Rate is 150, and linear expansion coefficient α 1 is 10.5 characteristic.

Form the ferrite of the preferred low magnetic permeability of ferrite of magnetic substance auxiliary layer 1b.Low magnetic permeability is that for example magnetic conductivity is Less than 30.The magnetic substance auxiliary layer 1b of low magnetic permeability is the ferrite of such as iron-nickel-zinc-copper system.Form magnetic substance auxiliary layer 1b Ferrite will be fired with the material of requirement ratio allotment iron oxide, zinc oxide, nickel oxide and copper oxide.Structure as a result, Ferrite into low magnetic permeability magnetic layer for example with the magnetic conductivity under 1MHz is 20, and linear expansion coefficient α 2 is 9.5 Characteristic.

[effect]

By wireless IC equipment 104 described in embodiment 4, following effect can be reached.

In wireless IC equipment 104 described in embodiment 4, the 1st face PS1 of magnetic substance circuit board 1A, the 2nd face PS2, with And the center of inside configuration magnetic substance auxiliary layer 1b of magnetic substance circuit board 1A, it is configured with magnetic substance substrate layer 1a in-between. Magnetic substance auxiliary layer 1b by it is substantially all be made of polycrystalline phase material.The polycrystalline of magnetic substance auxiliary layer 1b mutually has and magnetic substance The mutually identical crystal structure of the polycrystalline of substrate layer 1a.In addition, the linear expansion coefficient α 2 of magnetic substance auxiliary layer 1b is less than magnetic substance The linear expansion coefficient α 1 of substrate layer 1a.By such structure, in the cooling process after ablating work procedure, magnetic substance substrate layer 1a It can larger be shunk compared to magnetic substance auxiliary layer 1b, in the interarea residual compression stress of magnetic substance auxiliary layer 1b.As a result, it is possible to it carries The mechanical strength of high magnetic substance circuit board 1A.

In addition, in the inside for the magnetic substance substrate layer 1a for leaving magnetic substance auxiliary layer 1b, due to the difference of linear expansion coefficient, Easily generate internal stress.In embodiment 4, by the way that magnetic substance auxiliary layer is also configured in the inside of magnetic substance substrate layer 1a 1b can mitigate internal stress caused by the inside of magnetic substance substrate layer 1a.

By forming magnetic substance auxiliary layer 1b by the ferrite of low magnetic permeability, formed to connect up on magnetic substance auxiliary layer 1b and be led Whens body pattern 10A, 10B etc., it can inhibit by the useless magnetic field of the generations such as wiring conductor pattern 10A, 10B.

In addition, in embodiment 4, about the 1st face PS1, the 2nd face PS2, the magnetic substance circuit in magnetic substance circuit board 1A Magnetic substance auxiliary layer 1b is respectively configured in the center of inside of substrate 1A, and magnetic substance substrate layer 1a is configured between magnetic substance auxiliary layer 1b Structure be illustrated, but not limited to this.For example, magnetic substance auxiliary layer 1b can be only configured in magnetic substance circuit board The 1st face PS1 and the 2nd face PS2 in magnetic substance circuit board 1A can also be configured in the 1st face PS1 of 1A and the 2nd this two sides of face PS2 In at least one side.In addition, magnetic substance auxiliary layer 1b can be only fitted to the 1st face PS1 and the 2nd face of magnetic substance circuit board 1A This two sides of PS2, and it is multiple in the setting of the inside of magnetic substance circuit board 1A.The magnetic being configured inside magnetic substance circuit board 1A Easily being generated on elastomer substrate layer 1a leads to the internal stress of crackle, therefore by the way that magnetic substance auxiliary layer 1b is configured at magnetic substance The inside of circuit board 1A can mitigate internal stress.

In embodiment 4, magnetic substance auxiliary layer 1b is illustrated by taking the ferrite of iron-nickel-zinc-copper system as an example, but It is to be not limited to this.For example, the ferrite for forming magnetic substance auxiliary layer 1b can be the ferrite of iron-zinc-copper system.The iron oxygen Body is will for example to be fired with the material of requirement ratio allotment iron oxide, zinc oxide and copper oxide.Magnetic substance is formed as a result, The ferrite of auxiliary layer 1b is 1.0 for example with the magnetic conductivity under 1MHz, and linear expansion coefficient α 2 is 9.0 characteristic.This Outside, magnetic substance auxiliary layer 1b can be the layer for having equal extent or the magnetic conductivity more than it with magnetic substance substrate layer 1a.

(embodiment 5)

[overall structure]

Using Figure 16~Figure 18, illustrated for the wireless IC equipment of embodiment 5 described in the utility model.

What Figure 16 was represented is the outline structure of wireless IC equipment 105 described in embodiment 5.Figure 17 is the nothing of embodiment 5 The circuit diagram of line IC equipment 105.Figure 18 is the bottom view of the wireless IC equipment 105 of embodiment 5.In addition, in embodiment 5 In, it is illustrated mainly for the difference from embodiment 1.In embodiment 5, about identical or same with embodiment 1 Deng structure, the identical label of affix illustrates.In addition, in embodiment 5, it is omitted what is repeated with embodiment 1 It records.

As shown in figure 16, the wireless IC equipment 105 of embodiment 5 is compared with the wireless IC equipment 101 of embodiment 1, no It is to be mounted with that parts are installed on surface on the 1st face PS1 of magnetic substance circuit board 1 and the 2nd this two sides of face PS2 with part, And it is also formed with input and output terminal P1, P2 on the 2nd interarea VS2 of resin component 70.In addition, embodiment 5 and embodiment party Formula 1 is compared, and is also differ in that and is formed with reader/writer module (hereinafter referred to as " RW modules ").

As shown in figure 16, in the 1st face PS1 of the magnetic substance circuit board 1 of wireless IC equipment 105, it is formed with wiring conductor Pattern 10A, 10B.In the 2nd face PS2 of magnetic substance circuit board 1, it is formed with wiring conductor pattern 10C, 10D and the 5th conductor 11E.In addition, it is internally provided with the 6th conductor 11F in magnetic substance circuit board 1.

RW-IC elements 5, match circuit capacitance 62 etc. on wiring conductor pattern 10A, 10B are installed and install zero Part.The installation parts such as low-pass filter capacitance 65,67 are installed on wiring conductor pattern 10C, 10D.In addition, it is formed Extend in the wiring conductor pattern 10B of the 2nd face PS2 via the 2nd interarea VS2 from resin component 70 to the direction of the 1st interarea VS1 The 5th conductor 11E, connect with being formed in the input and output terminal P1 of the 2nd interarea VS2 of resin component 70.

5th conductor 11E is made for example, by using the material identical with the 1st conductor 11A and the 2nd conductor 11B.6th leads Body 11F is made for example, by using the material identical with the 3rd conductor 11C of embodiment 2 and the 4th conductor 11D.

As shown in figure 17, RW modules have RW-IC elements 5, low-pass filter (hereinafter referred to as " LPF ") 6, match circuit 7 and aerial coil ANT.

RW-IC elements 5 are one of RFIC elements 61, to high-frequency band signals as defined in aerial coil ANT transmissions.High frequency band Signal refers to the signal of such as 13MHz frequency bands.RW-IC elements 5 should be sent to communication in accordance with defined digital modulation mode The baseband signal of object is transformed to defined high frequency band and sends signal (positive phase signals).In addition, RW-IC elements 5 generate relative to The inversion signal of 180 ° of the phase place of positive phase signals, generates differential wave.RW-IC elements 5 can also be used as power supply circuit hair Function is waved, the power supply circuit is for handling the high-frequency signal received via aerial coil ANT, in accordance with defined digital modulation side Formula will be transformed to baseband signal from aerial coil ANT received signals.In addition, RW-IC elements 5 are defeated in addition to having the 1st input Go out terminal 61a, the 2nd input and output terminal 61b, be also equipped with input and output terminal P1, P2.

LPF6 only passes through the low-frequency component in the differential wave that RW-IC elements 5 export below prespecified frequency, Xiang Tian Line loop A NT outputs send signal.Thus, it is suppressed that radiate unwanted higher harmonic component from aerial coil ANT.LPF6 It is made of capacitance 65,66,67 and coil 68,69.

The match circuit 7 and aerial coil ANT be made of capacitance 62,63,64 is identical with embodiment 1, therefore is omitted Explanation.

In embodiment 5, be equipped in the 2nd face PS2 sides of magnetic substance circuit board 1 RW-IC elements 5 and for Capacitance with circuit.On the other hand, LPF6 capacitances and coil are installed in the 1st face PS1 sides of magnetic substance circuit board 1.

As shown in figure 18, it near the 2nd interarea VS2 of resin component 70 centers, is formed with from RW-IC elements 5 and draws Input and output terminal P1, P2.Input and output terminal P1, P2 are connected to microcomputer etc..

[effect]

By wireless IC equipment 105 described in embodiment 5, following effect can be reached.

5 wireless IC equipment 105 according to embodiment, by the 1st face PS1 of magnetic substance circuit board 1 and the 2nd face PS2 both sides are fitted with surface installation parts, increase installation parts with can not increasing wireless IC equipment body size Quantity.In addition, in wireless IC equipment 105, input and output terminal P1, P2 are set by additional, the progress such as microcomputer can be passed through Control.

In addition, in embodiment 5, all pacify in the 1st face PS1 of magnetic substance circuit board 1 and the 2nd face PS2 both sides Surface installation parts are filled, the example for forming the RW modules with LPF6 and match circuit 7 is illustrated, but is not limited to This.For example, in embodiment 5, other circuits such as the capacitance for eliminating flip-flop can also be installed.

In addition, in embodiment 5, resin component is configured at for by input and output terminal P1, P2 of RW-IC elements 5 Structure near 70 the 2nd interarea VS2 centers is illustrated, and but not limited to this.Input and output terminal P1, P2 can match It puts at an arbitrary position.By such structure, design freedom gets a promotion.

(embodiment 6)

[overall structure]

Using Figure 19, illustrated for the wireless IC equipment of embodiment 6 described in the utility model.

What Figure 19 was represented is the outline structure of wireless IC equipment 106 described in embodiment 6.In addition, in embodiment 6, It is illustrated mainly for the difference from embodiment 2.In embodiment 6, about identical with embodiment 2 or equal Structure, the identical label of affix illustrate.In addition, in embodiment 6, the record repeated with embodiment 2 is omitted.

As shown in figure 19, the wireless IC equipment 106 of embodiment 6 is compared with the wireless IC equipment 102 of embodiment 2, no It is with part comprising sealing resin layer 140 and magnetic module 141.

As shown in figure 19, wireless IC equipment 106 forms sealing resin layer in the 1st face PS1 sides of magnetic substance circuit board 1 140, and magnetic module 141 is configured on sealing resin layer 140.In addition, magnetic substance circuit board 1, sealing resin layer 140 and magnetic module 141 be embedded in resin component 70, and be configured at the inside of aerial coil.

Sealing resin layer 140 is electric by the RFIC61 and patch that are installed on the 1st face PS1 of magnetic substance circuit board 1 with resin Hold 62 grade surfaces installation parts sealing.Sealing resin layer 140 is made of thermosetting resins such as such as epoxy system resin etc..

Magnetic module 141 is configured on sealing resin layer 140.The shape of magnetic module 141 is cuboid, such as by Ferrite etc. is made.Magnetic module 141 is configured at the inside of aerial coil, and antenna is used as together with magnetic substance circuit board 1 The magnetic core of coil plays a role.

[effect]

By wireless IC equipment 106 described in embodiment 6, following effect can be reached.

6 wireless IC equipment 106 according to embodiment, by sealing resin layer 140 by the 1st of magnetic substance circuit board 1 the The surface installation parts sealing of interarea side, and magnetic module 141 is configured on sealing resin layer 140.It is in addition, magnetic Module 141 is configured on the inside of aerial coil.By such structure, magnetic module 141 is made together with magnetic substance circuit board 1 Magnetic core for aerial coil plays a role, and can improve poly- magnetic effect.As a result, it is possible to enhance between the antenna of communication object Magnetic coupling.

Magnetic substance circuit board 1 is in order in inside formation the 1st conductor 11A and the 2nd conductor 11B, it is necessary into column conductor hole The trepanning processing of 111A, 111B (with reference to Figure 12 A).Wireless IC equipment 106 can promote poly- magnetic effect by magnetic module 141 Fruit, therefore compared to embodiment 2, it is capable of the thickness of relatively reduced magnetic substance circuit board 1.It therefore, can in embodiment 6 Shorten the depth of conductor hole 111A, 111B, therefore easily carry out the processing of magnetic substance circuit board 1.

6 wireless IC equipment 106 according to embodiment will be mounted on magnetic substance circuit base by using sealing resin layer 40 The surface installation parts sealing of 1st face PS1 sides of plate 1, can protect surface to install parts.

(embodiment 7)

[overall structure]

Using Figure 20~Figure 21, said for the article of the subsidiary RFID label tag of embodiment 7 described in the utility model It is bright.

Figure 20 is the stereogram of subsidiary RFID label tag article 301 described in embodiment 7.Figure 21 is attached described in embodiment 7 Front view with RFID label tag article 301.

The article 301 of subsidiary RFID label tag is the resin-formed body of built-in RFID tag, such as make by resin forming The toys such as the microminiature vehicle mould formed.The article 301 of subsidiary RFID has the wireless IC equipment 101 of embodiment 1.Implementing In mode 7, wireless IC equipment 101 is used as RFID label tag.

As shown in Figure 20 and Figure 21, wireless IC equipment 101 is embedded in resin-formed body 201, is not exposed to article 301 It is external.Wireless IC equipment 101 is embedded in toy bottom.Toy bottom refer to from the view of Figure 21 when, corresponding to subsidiary The adjacent top surface of the article 301 of RFID.

The aerial coil wireline reel of wireless IC equipment 101 is towards the normal direction of the toys bottom surfaces such as microminiature vehicle mould.Therefore, By make the toy bottom surface and read/write device reading part it is opposite, read/write device communicates with wireless IC equipment 101.As a result, Read/write device is connected to processing as defined in the host apparatus progress of read/write device.

Next, using Figure 22, illustrated for the manufacturing method of the article 301 of subsidiary RFID label tag.Figure 22 is table Show through injection molding, the process for manufacturing subsidiary RFID label tag article 301 described in embodiment 7.

As shown in figure 22, prepare the metal mold for injection-molding tool 401 of resin-formed body 201, in use in injection molding metal Fixed wireless IC equipment 101 in mold 401.Wireless IC equipment 101 is for example by with the tree identical with use in injection molding resin 402 Supporting member that fat is made etc. is fixed in metal mold for injection-molding tool 401.Next, by use in injection molding resin 402 fill from cast gate to metal mold for injection-molding tool 401, are molded resin-formed body 201, thus manufacture subsidiary RFID marks The article 301 of label.

61 grade of RFIC elements is identical with wireless IC equipment described in other embodiment, by the protection of resin component 70, because This wireless IC equipment 101 is very firm.Also, the resin for injection 402 flowed at high heat during for injection molding, surface peace The weld part of cartridge chip parts is also protected.In addition, if general be wound with what is covered by polyimides system resins film The winding wire type coil parts of copper wire, then heat melts covering when can be due to injection molding and occur short circuit between copper wire. Accordingly, it is difficult to previous general winding wire type coil parts are used as aerial coil.

When the magnetic substance circuit board 1 of wireless IC equipment 101 is configured from the wireline reel G1 directions from aerial coil, phase Than resin component 70 the 2nd interarea VS2 closer to the position of wireline reel G1.That is, the magnetic substance circuit base of wireless IC equipment 101 The position in distance and the edge certain distance of the resin component 70 for the use in injection molding resin 402 for contacting high temperature is configured in plate 1, Therefore it is not easily susceptible to heat influence.

[effect]

By the article 301 of RFID label tag subsidiary described in embodiment 7, following effect can be reached.

According to embodiment 7, being capable of providing can be communicated by read/write device etc. and with excellent electric characteristic and heat The article 301 of the subsidiary RFID label tag of performance.

In addition, the magnetic substance circuit board 1 of wireless IC equipment 101 is by being configured any position inside aerial coil, It can make the magnetic field that aerial coil is formed that there is directive property.Therefore, the article of the subsidiary RFID label tag of wireless IC equipment 101 is carried 301 magnetic fields that can generate RFID label tag have directive property.

(embodiment 8)

[overall structure]

Using Figure 23~Figure 25, said for the article of the subsidiary RFID label tag of embodiment 8 described in the utility model It is bright.

Figure 23 is the stereogram of subsidiary RFID label tag article 302 described in embodiment 8.Figure 24 is subsidiary RFID label tag object The sectional view of product 302.Figure 25 is the magnified partial view of Figure 24.

The article 302 of subsidiary RFID label tag is the communication terminal for carrying RFID label tag, such as smart mobile phone etc. is portable Formula electronic equipment.The article 302 of subsidiary RFID label tag has wireless IC equipment 101 and the amplification antenna 120 with resonant frequency. As shown in Figure 23 and Figure 24, there is lower part box 202 in the top surface side of the article 302 of subsidiary RFID label tag, bottom surface side has upper Portion's babinet 203.In the space interior that lower part box 202 and upper box body 203 surround, has circuit board 200, wireless IC equipment 101 and with resonant frequency amplification antenna 120.

Wireless IC equipment 101 is as shown in Embodiment 1.Wireless IC equipment 101 is installed on electricity as shown in Figure 23 and Figure 24 Base board 200.Parts in addition to wireless IC equipment 101 are also installed in circuit board 200.

Amplification antenna 120 with resonant frequency is pasted on the inner face of lower part box 202.The amplification antenna 120 is configured The not position Chong Die with battery pack 130.Amplification antenna 120 includes insulator base material 123 and is formed in the circuit diagram of insulator 123 Case 121,122.

As shown in figure 25, the side that wireless IC equipment 101 is interlinked relative to the aerial coil and amplification antenna 120 with magnetic flux line Formula is configured.That is, configuration wireless IC equipment 101 and amplification antenna 120, so that the aerial coil 101 of wireless IC equipment 101 is with increasing The coil magnetic field coupling of width antenna 120.In addition, the dotted line in Figure 25 is conceptually to represent to contribute to the magnetic flux of the magnetic coupling Line.

The RFIC elements 61 of wireless IC equipment 101 are towards the close configuration in 200 side of circuit board, and aerial coil direction increases 120 side of width antenna is close to configuration.Therefore, the degree of coupling of the aerial coil of wireless IC equipment 101 and amplification antenna 120 is high.In addition, RFIC elements 61 and the wiring of other circuit elements, particularly digital signal line and power cord are connected, it is practical and aerial coil Magnetic flux line parallel wiring, thus it is small with the coupling of aerial coil.

Figure 26 is the stereogram of amplification antenna 120.Figure 27 is the circuit diagram of amplification antenna 120.Amplification antenna 120 is the 1st 121 and the 2nd coil pattern 122 of coil pattern is respectively formed the conductor of rectangle swirl pattern, and electric current is to same side during overlooking Capacity coupled mode forms pattern in the state of flowing.It is formed between 1st coil pattern 121 and the 2nd coil pattern 122 Parasitic capacitance.The capacitance of the inductance and parasitic capacitance of 1st coil pattern 121 and the 2nd coil pattern 122 forms LC resonance electricity Road.The resonant frequency of this LC resonance circuit is substantially equal with the communication frequency of the RFID system.Communication frequency is, for example, 13.56MHz frequency bands.

[effect]

By the article 302 of RFID label tag subsidiary described in embodiment 8, following effect can be reached.

By the article 302 of the subsidiary RFID label tag of embodiment 8, can utilize the larger coil aperture of amplification antenna into Row communication, therefore the longest distance that can be communicated can be expanded.

In addition, in embodiment 7 and embodiment 8, for the article for the wireless IC equipment 101 for having embodiment 1 It is illustrated, but not limited to this.For example, it can be the articles for the wireless IC equipment for having embodiment 2~6.

The utility model has carried out detailed record for preferred embodiment, by person skilled in the art with reference to attached drawing The various modifications of progress and amendment and the situation that combines these embodiments etc. are self-evident.As long as the deformation and amendment exist In the scope of the utility model of institute's cum-rights claimed range, that is, it should be understood to be included in the scope of the utility model.

Industrial practicability

The utility model contributes to wireless IC equipment, can reduce obstruction of the RFIC elements to aerial coil magnetic field, and have There is excellent electrical characteristic.

Label declaration

ANT aerial coils

1st face of PS1 magnetic substance circuit boards

2nd face of PS2 magnetic substance circuit boards

1st interarea of VS1 resin components

2nd interarea of VS2 resin components

1st, 1A magnetic substances circuit board

1a magnetic substance substrate layers

1b magnetic substance auxiliary layers

2 adhered layers

3 pedestals

5 RW-IC elements

6 low-pass filters

7 match circuits

10A, 10B, 10C, 10D wiring conductor pattern

11A, 11B, 11C, 11D, 11E, 11F conductor

12A, 12B connection terminal

The connection conductors of 13A, 13B, 13C, 13D, 13E, 13F the 1st

The connection conductors of 14A, 14B, 14C, 14D, 14E, 14F the 2nd

The 1st connection terminal of 15A, 15B, 15C, 15D, 15E, 15F

The 2nd connection terminal of 16A, 16B, 16C, 16D, 16E, 16F

The 1st wiring pattern of 20A, 20B, 20C, 20D, 20E, 20F, 20G

The 1st metallic object of 30A, 30B, 30C, 30D, 30E, 30F

The 2nd metallic object of 40A, 40B, 40C, 40D, 40E, 40F

The 2nd wiring pattern of 50A, 50B, 50C, 50D, 50E, 50F

61 RFIC elements

62nd, 63,64,65,66,67 patch capacitor

68,69 coils

70 resin components

80A, 80B electroplated layer

90A, 90B protective layer

101st, 102,103,104,105,106 wireless IC equipment

110 magnetic materials

111A, 111B conductor hole

120 amplification antennas

121 the 1st coil patterns

122 the 2nd coil patterns

123 insulator base materials

130 battery packs

131 metal components

140 sealing resin layers

141 magnetic modules

200 circuit boards

201 resin-formed bodies

202 lower part box

203 upper box bodies

301st, 302 subsidiary RFID label tag article

401 metal mold for injection-molding have

402 use in injection molding resins

Claims

1. a kind of wireless IC equipment, which is characterized in that have：

Magnetic substance circuit board, with wiring conductor pattern；

RFIC elements are mounted on the wiring conductor pattern of the magnetic substance circuit board, have the 1st input/output terminal Son and the 2nd input and output terminal；And

Aerial coil is set to the resin component, and one end is connected to the 1st input and output terminal, and the other end connects The 2nd input and output terminal is connected to,

At least part of the magnetic substance circuit board is configured at the aerial coil as the magnetic core of the aerial coil Inside.

2. wireless IC equipment as described in claim 1, which is characterized in that

The aerial coil has：

1st wiring pattern is formed in the 2nd interarea of the resin component, is connected to the described 1st of the RFIC elements Input and output terminal and the 2nd input and output terminal；

2nd wiring pattern is formed in the 1st interarea of the resin component；

2nd metallic object connects the 1st wiring pattern and the 2nd wiring pattern.

3. wireless IC equipment as claimed in claim 2, which is characterized in that

1st metallic object and the 2nd metallic object are columnar metallic pins.

4. wireless IC equipment as claimed in claim 2 or claim 3, which is characterized in that

The magnetic substance circuit board leaves the aerial coil configuration,

The 1st input and output terminal of the RFIC elements and the magnetic substance of the 2nd input and output terminal are installed The mounting surface of circuit board and the 2nd interarea of the resin component are configured in opposite directions,

The 1st input and output terminal of the RFIC elements is connect via the 1st conductor with the 1st wiring pattern, and the 1st leads Body extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component,

The 2nd input and output terminal of the RFIC elements is connect via the 2nd conductor with the 1st wiring pattern, and the 2nd leads Body extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component.

5. wireless IC equipment as claimed in claim 4, which is characterized in that

The magnetic substance circuit board have the 1st face and the 2nd face, the 1st face towards the resin component the 1st interarea, 2nd face towards the resin component the 2nd interarea,

The RFIC elements are mounted on the 2nd face of the magnetic substance circuit board.

6. wireless IC equipment as claimed in claim 2 or claim 3, which is characterized in that

The magnetic substance circuit board has the 1st face and 2nd face opposite with the 1st face,

The 2nd face of the magnetic substance circuit board forms at least part of the 2nd interarea of the resin component,

The 1st input and output terminal of the RFIC elements is connect via the 3rd conductor with the 1st wiring pattern, and the 3rd leads Body extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component,

The 2nd input and output terminal of the RFIC elements is connect via the 4th conductor with the 1st wiring pattern, and the 4th leads Body extends from the connection terminal of the magnetic substance circuit board to the 2nd interarea of the resin component,

3rd conductor and the 4th conductor are arranged on the inside of the magnetic substance circuit board.

7. wireless IC equipment as claimed in claim 6, which is characterized in that

1st metallic object is connect with the 1st connection terminal in the magnetic substance circuit board, via being set to the magnetic substance The 1st connection conductor in circuit board is connect with the 1st wiring pattern,

2nd metallic object is connect with the 2nd connection terminal in the magnetic substance circuit board, via being set to the magnetic substance The 2nd connection conductor in circuit board is connect with the 1st wiring pattern.

8. wireless IC equipment as described in claim 1, which is characterized in that

The magnetic substance circuit board includes：

Magnetic substance substrate layer is entirely polycrystalline phase；And

Magnetic substance auxiliary layer is configured at least one face of magnetic substance substrate layer, and entirely polycrystalline phase,

The polycrystalline phase of the magnetic substance substrate layer mutually has substantive identical crystalline substance each other with the polycrystalline of the magnetic substance auxiliary layer Body structure,

The linear expansion coefficient of the magnetic substance auxiliary layer is less than the linear expansion coefficient of the magnetic base material layer.

9. wireless IC equipment as claimed in claim 2, which is characterized in that

1st wiring pattern and the 2nd wiring pattern are respectively provided with multiple wiring patterns,

The aerial coil is by the 1st wiring pattern, the 2nd wiring pattern, the 1st metallic object and the 2nd metal The bodily form becomes the helical form with multiple rings.

10. wireless IC equipment as claimed in claim 9, which is characterized in that

1st metallic object and the 2nd metallic object are respectively provided with the metallic pin of 3 or more,

1st metallic object and the 2nd metallic object are arranged separately on Y direction, and from Z-direction when is serrated Configuration.

11. wireless IC equipment as claimed in claim 10, which is characterized in that

Comprising multiple rings that internal-and external diameter is different when the aerial coil is from the Y direction,

Ring positioned at aerial coil opening face is the ring of the internal-and external diameter maximum in the multiple ring.

12. a kind of resin-formed body is the resin-formed body for having wireless IC equipment, which is characterized in that

The wireless IC equipment has：

Magnetic substance circuit board, with wiring conductor pattern；

13. resin-formed body as claimed in claim 12, which is characterized in that

The aerial coil has：

2nd wiring pattern is formed in the 1st interarea of the resin component；

2nd metallic object connects the 1st wiring pattern and the 2nd wiring pattern.

14. a kind of communication terminal is the communication terminal for having wireless IC equipment, which is characterized in that

The wireless IC equipment has：

Magnetic substance circuit board, with wiring conductor pattern；

15. communication terminal as claimed in claim 14, which is characterized in that

The aerial coil has：

2nd wiring pattern is formed in the 1st interarea of the resin component；

2nd metallic object connects the 1st wiring pattern and the 2nd wiring pattern.