CN207523142U - A kind of high temperature resistant release paper based on mica paper base material - Google Patents
A kind of high temperature resistant release paper based on mica paper base material Download PDFInfo
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- CN207523142U CN207523142U CN201720818621.XU CN201720818621U CN207523142U CN 207523142 U CN207523142 U CN 207523142U CN 201720818621 U CN201720818621 U CN 201720818621U CN 207523142 U CN207523142 U CN 207523142U
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Abstract
A kind of high temperature resistant release paper based on mica paper base material, including ground paper layer, ductile bed and parting agent layer, wherein, the ground paper layer is one layer of muscovite paper or phlogopite paper, and the ductile bed is molded directly within base stock layer surface, for multi-layer compound structure, including the cationic polyacrylamide layer for being molded over the alkyl ketene dimer sizing agent layer of base stock layer surface and being molded on the outside of alkyl ketene dimer sizing agent layer, one layer of PET film layer with dot matrix through-hole is also formed between the alkyl ketene dimer sizing agent layer and cationic polyacrylamide layer simultaneously, and the parting agent layer is then molded directly within the cationic polyacrylamide layer surface.The utility model has good high temperature resistance, release paper can be made to bear high temperature, so as to ensure the entire surface performance of release paper contact surface and suitability for secondary processing.
Description
Technical field
The utility model is related to extraordinary release paper products field, it is specially a kind of with preferable high temperature resistance based on cloud
The high temperature resistant release paper of female paper base material.
Background technology
Release paper（The release paper）Also referred to as silicone oil paper or separate paper are that one kind prevents prepreg adhesion,
The not contaminated separate paper of prepreg can be protected again.At present, most domestic release paper manufacturer is all using common
Neutral sizing or raw release paper are as base material, after polyethylene or polypropylene lamination or plastic-coated, then by organosilicon or silicone oil come
Secondary coating, anti-sticking and easily peelable to achieve the effect that, the release paper of this molding mode is made due to size, stable structure
It is of low cost, it has been widely used in the making of the ground paper layers of various self adhesive materials, lining paper and packaging.But there is also resistance to for itself
The defects of high-temperature behavior is poor, at high temperature, the paper of release paper can all deform, so as to make it in electronics cross cutting etc. to ruler
The very little very high industry of stability requirement is not allowed to.
Utility model content
The technical issues of the utility model solves be to provide a kind of high temperature resistant release paper based on mica paper base material, with
It solves the disadvantage that in above-mentioned background technology.
The technical issues of the utility model solves is realized using following technical scheme：
A kind of high temperature resistant release paper based on mica paper base material, including ground paper layer, ductile bed and parting agent layer, wherein,
The ground paper layer is one layer of muscovite paper or phlogopite paper, and the ductile bed is molded directly within base stock layer surface, is multilayer
Composite construction, including being molded over the alkyl ketene dimer sizing agent layer of base stock layer surface and being molded over alkyl ketene dimer
The cationic polyacrylamide layer being glued on the outside of oxidant layer, while in the alkyl ketene dimer sizing agent layer and cation poly- third
One layer of PET film layer with dot matrix through-hole is also formed between acrylamide layer, and the parting agent layer is then molded directly within the sun
Cationic polyacrylamide layer surface.
In the utility model, the thickness of muscovite paper or phlogopite paper in the ground paper layer is 20 ~ 30 μm, and excellent
Choosing is using muscovite paper.
In the utility model, the dot matrix through-hole on the PET film layer is preferably circular hole or regular polygon hole, this unit
The gross area of through-hole in area is the 1/3 ~ 1/2 of unit area.
In the utility model, the thickness of the PET film layer is 15~50 μm.
In the utility model, the thickness of the alkyl ketene dimer sizing agent layer is 8 ~ 10 μm.
In the utility model, the thickness of the cationic polyacrylamide layer is 10 ~ 15 μm.
Advantageous effect：The utility model is simple in structure, easy to use, is used as base material by mica paper, coordinates high temperature resistant material
Material molding so that the release paper has stronger high temperature resistance, and shrinkage deformation is not easy under hot conditions in short-term, is had simultaneously
Standby preferable brightness and tensile strength, stability are good.
Description of the drawings
Fig. 1 is the schematic diagram of the utility model preferred embodiment.
Wherein：1st, parting agent layer；2nd, cationic polyacrylamide layer；3rd, dot matrix through-hole；4th, PET film layer；5th, alkyl ketene
Dimer sizing agent layer；6th, ground paper layer.
Specific embodiment
In order to be easy to understand technical means, creative features, achievable purpose and effectiveness of the utility model, under
Face combines and is specifically illustrating, and the utility model is expanded on further.
Referring to a kind of preferred embodiment of high temperature resistant release paper based on mica paper base material of Fig. 1, in the present embodiment, bottom
Paper layer 6 is the muscovite paper that a layer thickness is 20 μm, and surface forms ductile bed successively, which is MULTILAYER COMPOSITE knot
Structure, the thickness including being molded over 6 surface of ground paper layer are 9 μm of alkyl ketene dimer sizing agent layer 5, are molded over alkyl ketene two
The thickness on aggressiveness sizing oxidant layer 5 surface is 12 μm of cationic polyacrylamide layer 2 and takes shape in alkyl ketene dimer and apply
PET film layer 4 between glue agent layer 5 and cationic polyacrylamide layer 2, and parting agent layer 1 is then molded over cation polypropylene acyl
2 surface of amine layer.
In the present embodiment, the thickness of PET film layer 4 is 30 μm, and forms dot matrix on the surface of this PET film layer 4 and lead to
Hole 3, dot matrix through-hole 3 are circular hole, and 1/3 that the sum of gross area of circular hole in 4 unit area of PET film layer is the unit area.
The advantages of basic principle, main feature and the utility model of the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Only illustrate the principle of the utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
Various changes and modifications are had, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. a kind of high temperature resistant release paper based on mica paper base material, including ground paper layer, ductile bed and parting agent layer, feature exists
In the ground paper layer is one layer of muscovite paper or phlogopite paper, and the ductile bed is molded directly within base stock layer surface, is more
Layer composite construction, including being molded over the alkyl ketene dimer sizing agent layer of base stock layer surface and being molded over alkyl ketene dimerization
Cationic polyacrylamide layer on the outside of body sizing oxidant layer, while gather in the alkyl ketene dimer sizing agent layer with cation
Also form one layer of PET film layer with dot matrix through-hole between acrilamide layer, and the parting agent layer be then molded directly within it is described
Cationic polyacrylamide layer surface.
2. high temperature resistant release paper according to claim 1, which is characterized in that the thickness of the ground paper layer is 20 ~ 30 μm.
3. high temperature resistant release paper according to claim 1, which is characterized in that the thickness of the PET film layer is 15~50 μm.
4. high temperature resistant release paper according to claim 1, which is characterized in that the dot matrix through-hole on the PET film layer is preferred
For circular hole or regular polygon hole, and 1/3 ~ 1/2 that the gross area of the through-hole on PET film layer in unit area is unit area.
5. high temperature resistant release paper according to claim 1, which is characterized in that the alkyl ketene dimer sizing agent layer
Thickness is 8 ~ 10 μm.
6. high temperature resistant release paper according to claim 1, which is characterized in that the thickness of the cationic polyacrylamide layer
It is 10 ~ 15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720818621.XU CN207523142U (en) | 2017-07-07 | 2017-07-07 | A kind of high temperature resistant release paper based on mica paper base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720818621.XU CN207523142U (en) | 2017-07-07 | 2017-07-07 | A kind of high temperature resistant release paper based on mica paper base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207523142U true CN207523142U (en) | 2018-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720818621.XU Active CN207523142U (en) | 2017-07-07 | 2017-07-07 | A kind of high temperature resistant release paper based on mica paper base material |
Country Status (1)
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| CN (1) | CN207523142U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116554711A (en) * | 2023-04-28 | 2023-08-08 | 广东省科学院生物与医学工程研究所 | Organic modified mica and preparation method and application thereof |
-
2017
- 2017-07-07 CN CN201720818621.XU patent/CN207523142U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116554711A (en) * | 2023-04-28 | 2023-08-08 | 广东省科学院生物与医学工程研究所 | Organic modified mica and preparation method and application thereof |
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