CN207503962U - Power device and its (PCC) power - Google Patents
Power device and its (PCC) power Download PDFInfo
- Publication number
- CN207503962U CN207503962U CN201721485194.4U CN201721485194U CN207503962U CN 207503962 U CN207503962 U CN 207503962U CN 201721485194 U CN201721485194 U CN 201721485194U CN 207503962 U CN207503962 U CN 207503962U
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- China
- Prior art keywords
- lead frame
- cooling fin
- power device
- power
- radiator
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- 238000001816 cooling Methods 0.000 claims abstract description 59
- 230000005855 radiation Effects 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 28
- 239000006071 cream Substances 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 19
- 238000000465 moulding Methods 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of power device and its (PCC) power, wherein, power device includes chip and lead frame, the power device further includes the cooling fin under the lead frame, insulating radiation layer is equipped between the cooling fin and the lead frame, and encapsulated layer is enclosed on the chip and the lead frame.The power device of the utility model is by the way of by chip, half molding of lead frame, and insulating radiation layer is equipped between lead frame and cooling fin, and then while the heat dissipation of device and insulating requirements are ensured, and exposed cooling fin is not charged, it can be directly mounted on radiator, it is highly reliable, and do not limited by use environment, such as moist, high pressure, is applicable to different environment.
Description
Technical field
The utility model belongs to technical field of electronic equipment, is to be related to a kind of power device and its power more specifically
Component.
Background technology
With the progress of electronic technology, power device constantly makes towards more high-power, bigger heat dissipation performance and preferably
Developed with the service life, in practical applications, the heat dissipation problem of power device, Insulation Problems are one that emphasis is needed to consider during design
Part.
Current main means are to be realized to insulate with the full molding of resin (or total incapsulation) method, i.e., will using epoxy resin
Device chip and lead frame are integrally encapsulated, then be installed on a heat sink again, so as to fulfill insulation, can prevent from charging
Lead frame and other conductors be formed into a loop, such as TO-220F is encapsulated；And this method heat dissipation performance is undesirable, because of epoxy resin
Thermal conductivity it is poor, thermal conductivity (thermal conductivity factor) only has 0.2W/ (mK), when the power of power device is larger, power device
Very high heat is generated when part works can not effectively realize heat dissipation, i.e. the program belongs to by reducing product heat dissipation performance come real
Existing insulation performance, can not be applicable in when power device radiating requirements are high.
And cooling fin is had in lead frame with traditional, then by lead frame, half molding of chip, that is, utilize epoxy
Device chip and leadframe portion are encapsulated by resin, and cooling fin exposed to realize high radiating requirements, should
Internal circuit one in scheme in cooling fin and lead frame, cooling fin category electrical body during work, in cooling fin and radiator
During connection, an insulation rubber cushion need to be added to prevent from being formed into a loop so as to damage with other conductors between device cooling fin and radiator
Product, although the program can realize high radiating requirements, since its cooling fin charges, in the big environment of humidity, there may be electricity
Arc leads to short circuit, and the insulation rubber cushion heat conductivility is poor (thermal conductivity about 1.3W/ (mK)), insulating cement pad inherently one
Thickness control must be obtained very thin, and then lead to its insulation performance not by kind of grease type material, poor thermal conductivity in order to meet heat conductivility
Good, i.e., easily generating electric arc in wet environment, high-voltage applications leads to Damage by Short Circuit complete machine, and reliability is not high, using by environment
Limitation.
Utility model content
The purpose of this utility model is to provide a kind of power device, to solve in power device in the prior art
Heat dissipation performance and insulation performance are bad, and reliability is not high, the technical issues of using being limited by environment.
To achieve the above object, the technical solution adopted in the utility model is：A kind of power device, including chip and lead
Frame, the power device further include the cooling fin set on the lead frame lower end, the cooling fin and the lead frame
Between be equipped with insulating radiation layer, and be enclosed with encapsulated layer on the chip and the lead frame.
As a preferred embodiment of the utility model, the cooling fin and the insulating radiation layer are connected by high temperature tin cream
It connects, the insulating radiation layer is connected with the lead frame by high temperature tin cream.
As a preferred embodiment of the utility model, room temperature tin paste layer is equipped between the chip and the lead frame.
As a preferred embodiment of the utility model, the cooling fin is metal fin.
As a preferred embodiment of the utility model, the insulating radiation layer is ceramic layer.
As a preferred embodiment of the utility model, the encapsulated layer is epoxy resin layer.
The advantageous effect of power device provided by the utility model is：It is compared with the prior art, the work(of the utility model
Rate device is equipped with insulating radiation layer by the way of by chip, half molding of lead frame between lead frame and cooling fin,
And then while the heat dissipation of device and insulating requirements are ensured, and exposed cooling fin is not charged, can be directly mounted at scattered
It is highly reliable in thermal, and do not limited by use environment, such as moist, high pressure, it is applicable to different environment.
The utility model additionally provides a kind of (PCC) power, including radiator and at least one power device as described above
Part, wherein, the power device is mounted on by the connection of the cooling fin and the radiator on the radiator.
As a preferred embodiment of the utility model, the cooling fin is detachably connected with the radiator.
As a preferred embodiment of the utility model, the cooling fin and the radiator screw connect or are buckled company
It connects.
As a preferred embodiment of the utility model, the radiator is equipped with radiator fan installation position.
The advantageous effect of (PCC) power provided by the utility model is：Compared with prior art, the utility model work(
In rate component, insulating radiation layer is equipped between lead frame and cooling fin, and then ensureing the heat dissipation of device and insulating requirements
While, and exposed cooling fin is not charged, is applicable to different environment, and at least one power device can be by dissipating
The connection be installed on a heat sink of backing and radiator, you can install multiple power devices on a heat sink, realize more power devices
The integrated heat dissipation of part so that overall structure is more compact, can meet the needs of high-power electric appliance.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing is briefly described needed in description, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the configuration schematic diagram (encapsulated layer is not shown) of power device that the utility model embodiment 1 provides；
Fig. 2 is the structure diagram of power device that the utility model embodiment 1 provides；
Fig. 3 is the structure diagram of (PCC) power that the utility model embodiment 2 provides；
Wherein, each reference numeral in figure：
100th, power device；
110th, chip；120th, lead frame；130th, cooling fin；140th, insulating radiation layer；150th, encapsulated layer；
200th, (PCC) power；
210th, radiator；220th, radiator fan installation position.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and advantageous effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention is further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being set to " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System is for only for ease of description the utility model and simplifies description rather than instruction or imply that signified device or element are necessary
With specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.
Embodiment 1
Also referring to Fig. 1 and Fig. 2, now power device 100 provided by the utility model is illustrated.Power device
100, including chip 110 and lead frame 120, power device 100 further includes the cooling fin set on 120 lower end of lead frame
130, insulating radiation layer 140 is equipped between cooling fin 130 and lead frame 120, and wrapped up on chip 110 and lead frame 120
There is encapsulated layer 150.
In above-mentioned, specifically, chip 110 is mounted on lead frame 120,120 lower end of lead frame is equipped with cooling fin
130, and the power device 100 is by the way of half molding, i.e., chip 110, be enclosed with encapsulated layer 150 on lead frame 120,
I.e. using insulating materials, by chip 110,120 half molding of lead frame, (such as epoxide resin material, i.e. encapsulated layer 150 are epoxy
Resin layer), cooling fin 130 is exposed, and then meet high heat dissipation using the high thermal conductivity (thermal conductivity is high) of cooling fin 130
It is required that if cooling fin 130 is that (i.e. the material of cooling fin 130 is metal to metal fin, and the thermal conductivity of metal is high, heat conductivility
It is good), and insulating radiation layer 140 is equipped between cooling fin 130 and lead frame 120 (for example, insulating radiation layer 140 can be ceramics
Layer, the i.e. material of insulating radiation layer 140 are ceramic material, i.e., insulating radiation layer 140 is potsherd made of ceramic material, ceramic
Material is preferable insulating materials, and insulation performance reaches exchange more than 2500V, and the thermal conductivity factor of ceramic material is
29.3W/ (mK) has preferable heat conductivility), cooling fin 130 can be avoided to be linked as with the internal circuit in lead frame 120
When one, i.e. power device 100 work, cooling fin 130 is not charged, and insulation performance is good, can be directly mounted on radiator, and
It is not limited by use environment, you can used in the environment of moist, high pressure, be applicable to different environment.
It is, of course, understood that the material of the material of cooling fin 130 in above-mentioned, insulating radiation layer 140, encapsulated layer 150
Matter can also be other materials, only need function and effect in reaching above-mentioned, be not limited herein.
Further, in the present embodiment, cooling fin 130 can be connected with insulating radiation layer 140 by high temperature tin cream, insulation
Heat dissipating layer 140 can be connected with lead frame 120 by high temperature tin cream.
In above-mentioned, specifically, high temperature tin cream is the cream formed by solder powder, scaling powder and other additives mixeds
Body.High temperature tin cream has certain viscosity at normal temperatures, can just be sticked to lead frame 120, cooling fin 130, insulating radiation layer 140
Commitment positions, under welding temperature, with the volatilization of solvent and portions additive, by lead frame 120, cooling fin 130, insulation
Heat dissipating layer 140 is welded together to form permanently connected.And high temperature tin cream belongs to the metal of high atomic weight with lead frame, leads
Hot coefficient similar, heat dissipation are on close level.
Further, in the present embodiment, room temperature tin paste layer can be equipped between chip 110 and lead frame 120.
In above-mentioned, specifically, the material of room temperature tin paste layer is room temperature tin cream, the conductive energy of room temperature tin cream can incite somebody to action
Chip 110 is electrically connected with lead frame 120, and then lead frame 120 passes through conducting wire either guide pin or pin etc.
It is electrically connected with the other parts (such as circuit board) in electric appliance.
In above-mentioned, it is to be understood that the power device 100 first dissipates cooling fin 130 and insulation in installation process
Thermosphere 140 is linked together by high temperature tin cream, and insulating radiation layer 140 and lead frame 120 are connected to one by high temperature tin cream
It rises, and then is again bonded in chip 110 on lead frame 120 with room temperature tin cream, i.e., be equipped between chip 110 and lead frame 120
Room temperature tin paste layer, and then, since the welding temperature of room temperature tin cream is less than high temperature tin cream, and then by the room temperature tin cream of chip 110
It is bonded on lead frame 120, lead frame 120, the cooling fin being welded before will not being corrupted to by high temperature tin cream
130th, insulating radiation layer 140.
In above-mentioned, it should be noted that high temperature tin cream, room temperature tin cream in above-mentioned are come with the required welding temperature of tin cream
It distinguishes, such as the fusing point of high temperature tin cream can be 210-227 DEG C, the fusing point of room temperature tin cream can be 138 DEG C.
The advantageous effect of power device provided by the utility model is：It is compared with the prior art, the work(of the utility model
Rate device is set by the way of by chip 110,120 half molding of lead frame between lead frame 120 and cooling fin 130
There is insulating radiation layer 140, and then while the heat dissipation of device and insulating requirements are ensured, and exposed cooling fin 130 is not
Electrification, can be directly mounted on radiator, highly reliable, and not limited by use environment, such as moist, high pressure, can fit
For different environment.
Embodiment 2
- Fig. 3 is please referred to Fig.1, a kind of (PCC) power 200 is present embodiments provided, including radiator 210 and at least one work(
Rate device 100, wherein, as described in example 1 above, power device 100, including chip 110, lead frame 120, power device
100 further include the cooling fin 130 under lead frame 120, wherein, insulation is equipped between cooling fin 130 and lead frame 120
Heat dissipating layer 140, and encapsulated layer 150 is enclosed on chip 110 and lead frame 120, power device 100 by cooling fin 130 with
The connection of radiator 210 is mounted on radiator 210.
In above-mentioned, power device 100 is by the way of by chip 110,120 half molding of lead frame, and lead frame
Insulating radiation layer 140 is equipped between 120 and cooling fin 130, and then while the heat dissipation of device and insulating requirements are ensured, and
And exposed cooling fin 130 is not charged, can be directly mounted on radiator 210, it is highly reliable, and do not limited by use environment
System, such as moist, high pressure, are applicable to different environment.
In above-mentioned, specifically, since cooling fin 130 is not charged, the different function on same radiator 210 is prevented
Device between it is conductive mutually the problem of, an at least power device 100 can be mounted directly on radiator 210, when there is super large heat dissipation
It, can be according to application environment by 210 shape of radiator during the application of demand (such as have multiple power devices 100 have radiating requirements)
Shape or size are adjusted, and then multiple power devices 100 can be installed on radiator 210, realize superior heat dissipation performance, full
The demand of the electric appliance of sufficient super high power.
In above-mentioned, radiator fan installation position 220 can be also equipped on the radiator 210, it can in radiator fan installation position 220
Radiator fan is installed according to actual needs, to improve heat dissipation effect, realization is superior to obtain heat dissipation performance, meets powerful electric appliance
Demand.
Further, cooling fin 130 is detachably connected with radiator 210, and then can facilitate power device 100 and radiator
200 installation and detachable maintaining etc., specifically, such as cooling fin 130 connect or snaps connection with 210 screw of radiator
Deng.
The advantageous effect of (PCC) power provided by the utility model is：Compared with prior art, the utility model work(
In rate component, between lead frame 120 and cooling fin 130 be equipped with insulating radiation layer 140, and then ensure device heat dissipation and
While insulating requirements, and exposed cooling fin 130 is not charged, is applicable to different environment, and at least one power
Device 100 can be mounted on by the connection of cooling fin 130 and radiator 210 on radiator 210, you can pacified on radiator 210
Fill multiple power devices 100 so that overall structure is more compact, can meet the needs of high-power electric appliance.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. power device, including chip and lead frame, which is characterized in that the power device is further included under lead frame
The cooling fin at end is equipped with insulating radiation layer, and the chip and the lead frame between the cooling fin and the lead frame
Encapsulated layer is enclosed on frame.
2. power device as described in claim 1, which is characterized in that the cooling fin and the insulating radiation layer pass through high temperature
Tin cream connects, and the insulating radiation layer is connected with the lead frame by high temperature tin cream.
3. power device as described in claim 1, which is characterized in that room temperature tin is equipped between the chip and the lead frame
Layer of paste.
4. power device as described in claim 1, which is characterized in that the cooling fin is metal fin.
5. power device as described in claim 1, which is characterized in that the insulating radiation layer is ceramic layer.
6. power device as described in claim 1, which is characterized in that the encapsulated layer is epoxy resin layer.
7. (PCC) power, which is characterized in that including radiator and at least one such as claim 1-6 any one of them power devices
Part, wherein, the power device is mounted on by the connection of the cooling fin and the radiator on the radiator.
8. (PCC) power as claimed in claim 7, which is characterized in that the cooling fin is detachably connected with the radiator.
9. (PCC) power as claimed in claim 8, which is characterized in that the cooling fin connect with the radiator screw or
It snaps connection.
10. (PCC) power as claimed in claim 7, which is characterized in that the radiator is equipped with radiator fan installation position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721485194.4U CN207503962U (en) | 2017-11-08 | 2017-11-08 | Power device and its (PCC) power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721485194.4U CN207503962U (en) | 2017-11-08 | 2017-11-08 | Power device and its (PCC) power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503962U true CN207503962U (en) | 2018-06-15 |
Family
ID=62503782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721485194.4U Active CN207503962U (en) | 2017-11-08 | 2017-11-08 | Power device and its (PCC) power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207503962U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107808858A (en) * | 2017-11-08 | 2018-03-16 | 深圳芯能半导体技术有限公司 | Power device and its (PCC) power |
-
2017
- 2017-11-08 CN CN201721485194.4U patent/CN207503962U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107808858A (en) * | 2017-11-08 | 2018-03-16 | 深圳芯能半导体技术有限公司 | Power device and its (PCC) power |
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| GR01 | Patent grant |