CN207491306U - A kind of multilayer printed wiring board structure - Google Patents
A kind of multilayer printed wiring board structure Download PDFInfo
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- CN207491306U CN207491306U CN201721449415.2U CN201721449415U CN207491306U CN 207491306 U CN207491306 U CN 207491306U CN 201721449415 U CN201721449415 U CN 201721449415U CN 207491306 U CN207491306 U CN 207491306U
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- copper
- wiring board
- copper foil
- clad plate
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Abstract
The utility model discloses a kind of multilayer printed wiring board structures, including wiring board ontology, the wiring board ontology includes aluminum base layer and copper-clad plate layer, the copper-clad plate layer upper surface and lower face are respectively disposed with the first copper foil circuit layer and the second copper foil circuit layer, and being distributed setting on the first copper foil circuit layer and the second copper foil circuit layer is distributed the multiple through-holes for being provided with via hole metal process；Covered with solder mask on first copper foil circuit layer of the copper-clad plate layer；Second copper foil circuit layer of the copper-clad plate layer is connect by the pressing layer that insulate with aluminum base layer upper surface, and the aluminum base layer lower face passes through layer of silica gel and basal layer bonding connection；The wiring board ontology surrounding is distributed equipped with multiple mounting holes through solder mask, copper-clad plate layer, insulation pressing layer, layer of silica gel and basal layer.The utility model reduces process complexity, improves production efficiency and product qualified rate, and circuit board structure structure arranges relatively reliable stabilization, and service life is long.
Description
Technical field
The utility model is related to wiring board manufacture technology field, specially a kind of multilayer printed wiring board structure.
Background technology
FPC, that is, flexible print circuit board (FlexiblePrintedCircuitBoard, abbreviation FPC) is to use PI films
(polyimides) is base material, with copper foil pressing together manufactured wiring board plank.Compared with PCB hardness printed wiring board, FPC lines
Road plate has the advantages that free bend, folding, winding.During completed knocked down products, FPC can be as conducting wire according to interiors of products space
Layout arbitrarily arranged, so as to component of arbitrarily arranging in three dimensions, and can also cancel conducting wire with
Interface unit between wiring board, therefore, FPC can make miniaturization of electronic products, precise treatment, and product reliability greatly improves.FPC is
Through being widely used in the fields such as mobile communication product, laptop computer, consumer electronics product, space flight, Military Electronic Equipment.It is existing
Layer flexible printed wiring board usually will appear pressure problem of non-uniform in lamination process, cause product quality production drop
It is low；In addition, the layer flexible printed wiring board after use in unbalance stress, often causes edge cracking in surrounding mounting hole,
Cause wiring board integral installation insecure.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of multilayer printed wiring board structure and preparation method thereof
The problem of being proposed in background technology.
To achieve the above object, the utility model provides following technical solution：
A kind of multilayer printed wiring board structure, including wiring board ontology, the wiring board ontology includes aluminum base layer and covers copper
Plate layer, the copper-clad plate layer upper surface and lower face are respectively disposed with the first copper foil circuit layer and the second copper foil circuit layer, and first
Distribution setting is distributed the multiple through-holes for being provided with via hole metal process on copper foil circuit layer and the second copper foil circuit layer；
Covered with solder mask on first copper foil circuit layer of the copper-clad plate layer；Second copper foil circuit layer of the copper-clad plate layer passes through exhausted
Edge pressing layer is connect with aluminum base layer upper surface, and the aluminum base layer lower face passes through layer of silica gel and basal layer bonding connection；The line
Road plate ontology surrounding is distributed equipped with multiple peaces through solder mask, copper-clad plate floor, insulation pressing layer, layer of silica gel and basal layer
Hole is filled, inner wall of the hole installing is set with elastic rubber set.
As further program of the utility model：The elastic rubber set includes the upper rubber for being sleeved on mounting hole upper end
The lower rubber sleeve of mounting hole lower end is covered and is sleeved on, there are gaps between upper rubber sleeve and lower rubber sleeve.
As further program of the utility model：The solder mask upper surface, which corresponds to mounting hole and is provided with to install, to sink
Slot, the upper rubber set upper side outer wall is extended with protrudes above annulus with what upper installation deep gouge was bonded；The basal layer lower face pair
Mounting hole is answered to be provided with lower installation deep gouge, the lower rubber sleeve lower end outer wall, which is extended with the lower protrusion being bonded with lower installation deep gouge, to be justified
Ring.
As above a kind of preparation method of any multilayer printed wiring board structure, it is characterised in that：Including walking as follows
Suddenly：
1) choose the fixed copper-clad plate of size, made respectively in the upper surface of copper-clad plate and lower face first layer copper circuit and
Second layer copper circuit；
2) it drills on the first layer copper circuit of copper-clad plate and second layer copper circuit, generates multiple through-holes；
3) metalized is carried out to the through-hole drilled out in step 2)；
4) prepreg is added between the second layer copper circuit and aluminum base layer of copper-clad plate, prepreg is bonded by pressing
Insulation pressing layer is formed afterwards；
5) upper surface of bonding substrates layer is pressed by layer of silica gel in aluminum base layer lower face, multilayer wire is formed after cooling and solidifying
Road plate；
6) acid and alkali-resistance peelable glue is printed onto to the upper surface of multilayer circuit board by silk-screen printing, then, carrying out baking makes
The peelable adhesive curing of acid and alkali-resistance is obtained, forms solder mask；
7) mounting hole is opened up in the distribution of the surrounding of multilayer circuit board, elastic rubber set is clamped in mounting hole.
As further program of the utility model：Prepreg is to be coated on electronics by epoxy resin in the step 4)
It dries and is formed on grade glass cloth.
As further program of the utility model：The E-glass cloth is alkali-free plain weave glass cloth.
As further program of the utility model：First layer copper circuit and the second layer copper electricity made in the step 1)
The thickness on road is 4~6 μm.
Compared with prior art, the beneficial effects of the utility model are：Multilayer printed wiring board production and processing technology is simple,
Process complexity is reduced, improves production efficiency and product qualified rate；Second copper foil circuit layer of copper-clad plate layer passes through insulation
Pressing layer is connect with aluminum base layer upper surface, and aluminum base layer can be effectively improved the pressure problem of non-uniform in lamination process, is ensured more
The production quality of layer printed wiring board；Aluminum base layer lower face can be increased by layer of silica gel and basal layer bonding connection, layer of silica gel
Cushion performance enhances the durability of entire wiring board；Inner wall of the hole installing is set with elastic rubber set, when assist side is installed, leads to
It crosses elastic rubber set and wraps bolt or support column, fixing bolt or support column is avoided to be in direct contact and make with inner wall of the hole installing
Along cracking in into mounting hole, service life is longer；There are gaps between upper rubber sleeve and lower rubber sleeve, effectively layer of silica gel are avoided to exist
Rubber sleeve is caused mutually to be contradicted with lower rubber sleeve in buffering course, structure arranges relatively reliable stabilization.
Description of the drawings
Fig. 1 is a kind of structure diagram of multilayer printed wiring board structure and preparation method thereof.
In figure：1- basal layers, 2- layer of silica gel, 3- aluminum base layers, 4- insulation pressing layers, 5- the second copper foil circuit layers, 6- cover copper
Plate layer, 7- the first copper foil circuit layers, 8- solder masks, 9- mounting holes install deep gouge on 10-, deep gouge, the upper rubber of 12- are installed under 11-
It covers, rubber sleeve under 13-.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Referring to Fig. 1, the utility model provides a kind of technical solution：A kind of multilayer printed wiring board structure, including circuit
Plate ontology, the wiring board ontology include aluminum base layer 3 and copper-clad plate layer 6,6 upper surface of copper-clad plate layer and lower face difference cloth
The first copper foil circuit layer 7 and the second copper foil circuit layer 5 are equipped with, is distributed and sets on the first copper foil circuit layer 7 and the second copper foil circuit layer 5
It is equipped with multiple through-holes that distribution is provided with via hole metal process；7 overlying of the first copper foil circuit layer of the copper-clad plate layer 6
It is stamped solder mask 8；Second copper foil circuit layer 5 of the copper-clad plate layer 6 is connect by the pressing layer 4 that insulate with 3 upper surface of aluminum base layer,
3 lower face of aluminum base layer passes through layer of silica gel 2 and 1 bonding connection of basal layer；The wiring board ontology surrounding is distributed equipped with more
A mounting hole 9 through solder mask 8, copper-clad plate layer 6, insulation pressing layer 4, layer of silica gel 2 and basal layer 1,9 inner wall sleeve of mounting hole
Equipped with elastic rubber set.When assist side is installed, bolt or support column are wrapped by elastic rubber set, avoid fixing bolt
Or support column is in direct contact with inner wall of the hole installing and causes in mounting hole along cracking, service life is longer.
It may be preferred that the elastic rubber set includes being sleeved on the upper rubber sleeve 12 of 9 upper end of mounting hole and is sleeved on installation
The lower rubber sleeve 13 of 9 lower end of hole, there are gaps between upper rubber sleeve 12 and lower rubber sleeve 13.
It may be preferred that 8 upper surface of solder mask, which corresponds to mounting hole 9, is provided with installation deep gouge 10, the upper rubber sleeve
12 upper end outer walls are extended with protrudes above annulus with what upper installation deep gouge 10 was bonded；1 lower face of basal layer corresponds to mounting hole 9 and sets
Lower installation deep gouge 11 is equipped with, lower 13 lower end outer wall of rubber sleeve is extended with the lower chime rings being bonded with lower installation deep gouge 11.
Structure design is more reasonable, increases forced contact area, and the local stress for avoiding 9 inner wall of mounting hole is excessive.
As above a kind of preparation method of any multilayer printed wiring board structure, it is characterised in that：Including walking as follows
Suddenly：
1) choose the fixed copper-clad plate of size, made respectively in the upper surface of copper-clad plate and lower face first layer copper circuit and
Second layer copper circuit；
2) it drills on the first layer copper circuit of copper-clad plate and second layer copper circuit, generates multiple through-holes；
3) metalized is carried out to the through-hole drilled out in step 2)；
4) prepreg is added between the second layer copper circuit and aluminum base layer of copper-clad plate, prepreg is bonded by pressing
Insulation pressing layer is formed afterwards；
5) upper surface of bonding substrates layer is pressed by layer of silica gel in aluminum base layer lower face, multilayer wire is formed after cooling and solidifying
Road plate；
6) acid and alkali-resistance peelable glue is printed onto to the upper surface of multilayer circuit board by silk-screen printing, then, carrying out baking makes
The peelable adhesive curing of acid and alkali-resistance is obtained, forms solder mask；
7) mounting hole is opened up in the distribution of the surrounding of multilayer circuit board, elastic rubber set is clamped in mounting hole.
Wherein, prepreg is to be coated on to dry on E-glass cloth by epoxy resin to be formed in the step 4)；Institute
E-glass cloth is stated as alkali-free plain weave glass cloth；The first layer copper circuit that makes in the step 1) and second layer copper circuit
Thickness is 4~6 μm.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned exemplary embodiment, and
And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that by containing in the equivalent requirements of the claims is fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
Claims (3)
1. a kind of multilayer printed wiring board structure, including wiring board ontology, it is characterised in that：The wiring board ontology includes aluminium base
Layer and copper-clad plate layer, the copper-clad plate layer upper surface and lower face are respectively disposed with the first copper foil circuit layer and the second copper foil circuit
Layer, distribution setting, which is distributed, on the first copper foil circuit layer and the second copper foil circuit layer is provided with the more of via hole metal process
A through-hole；Covered with solder mask on first copper foil circuit layer of the copper-clad plate layer；Second copper foil circuit of the copper-clad plate layer
Layer is connect by the pressing layer that insulate with aluminum base layer upper surface, and the aluminum base layer lower face connects by the way that layer of silica gel is Nian Jie with basal layer
It connects；The wiring board ontology surrounding be distributed equipped with it is multiple through solder mask, copper-clad plate layer, insulation pressing layer, layer of silica gel and
The mounting hole of basal layer, inner wall of the hole installing are set with elastic rubber set.
2. a kind of multilayer printed wiring board structure according to claim 1, it is characterised in that：The elastic rubber set includes
The upper rubber sleeve for being sleeved on mounting hole upper end and the lower rubber sleeve for being sleeved on mounting hole lower end, between upper rubber sleeve and lower rubber sleeve
There are gaps.
3. a kind of multilayer printed wiring board structure according to claim 2, it is characterised in that：The solder mask upper surface pair
Mounting hole is answered to be provided with installation deep gouge, the upper rubber set upper side outer wall is extended with protrudes above circle with what upper installation deep gouge was bonded
Ring；The basal layer lower face corresponds to mounting hole and is provided with lower installation deep gouge, and the lower rubber sleeve lower end outer wall is extended with under
The lower chime rings of deep gouge fitting are installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721449415.2U CN207491306U (en) | 2017-11-02 | 2017-11-02 | A kind of multilayer printed wiring board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721449415.2U CN207491306U (en) | 2017-11-02 | 2017-11-02 | A kind of multilayer printed wiring board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491306U true CN207491306U (en) | 2018-06-12 |
Family
ID=62478848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721449415.2U Active CN207491306U (en) | 2017-11-02 | 2017-11-02 | A kind of multilayer printed wiring board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491306U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248462A (en) * | 2019-05-08 | 2019-09-17 | 天津大学 | A kind of modular high-power linear transfer line based on stacked structure is from package platforms |
-
2017
- 2017-11-02 CN CN201721449415.2U patent/CN207491306U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248462A (en) * | 2019-05-08 | 2019-09-17 | 天津大学 | A kind of modular high-power linear transfer line based on stacked structure is from package platforms |
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| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 242200 No. 15 Pengju Road, Guangde County Economic Development Zone, Xuancheng City, Anhui Province Patentee after: Wanben Electronic Technology Co., Ltd. Address before: 242200 No. 15 Pengju Road, Guangde County Economic Development Zone, Xuancheng City, Anhui Province Patentee before: Anhui Wan Po Electronic Technology Co., Ltd. |