CN207479092U - A kind of spray equipment for removing silicon chip surface slurry - Google Patents

A kind of spray equipment for removing silicon chip surface slurry Download PDF

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Publication number
CN207479092U
CN207479092U CN201721421215.6U CN201721421215U CN207479092U CN 207479092 U CN207479092 U CN 207479092U CN 201721421215 U CN201721421215 U CN 201721421215U CN 207479092 U CN207479092 U CN 207479092U
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CN
China
Prior art keywords
spray
water tank
rinse bath
silicon chip
water
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Active
Application number
CN201721421215.6U
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Chinese (zh)
Inventor
倪占翔
陆继波
陈董良
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Jiangsu Meike Solar Technology Co Ltd
Original Assignee
Zhenjiang Huantai Silicon Technology Co Ltd
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Priority to CN201721421215.6U priority Critical patent/CN207479092U/en
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Abstract

The utility model is related to a kind of spray equipments for removing silicon chip surface slurry, including rinse bath, water tank, spray nozzle, sedimentation basin and filter, in the geosyncline that rinse bath installation is set on the ground, water tank includes water tank one and water tank two, it is separately positioned on rinse bath both ends, and it is correspondingly provided with spray tube one and spray tube two in its front end, two spray tubes are all fixed on by pipe rotary connector in rinse bath, multiple spray orifices are designed on two spray tubes, spray nozzle is installed in each spray orifice, steel plate is provided in rinse bath, sieve plate is equipped in steel plate lower end, sieve plate lower end is equipped with wastewater disposal basin, sedimentation basin includes first stage precipitation tank and second-level settling pond, the water inlet of first stage precipitation tank and the water outlet pipeline of wastewater disposal basin connect, water outlet connects the water inlet of second-level settling pond, the import of the water outlet connection filter device of second-level settling pond;The utility model reduces production cost, increases silicon chip and is sprayed amplitude range, while reduce the dirty rate of Wafer Cleaning, silicon chip is hidden to be split so as to reduce.

Description

A kind of spray equipment for removing silicon chip surface slurry
Technical field
The utility model is related to a kind of spray equipment, for the cleaning of silicon slice, and in particular to a kind of removal silicon chip surface The spray equipment of slurry.
Background technology
Spray is influenced by equipment operation limitation, and spray amplitude of fluctuation is restricted, and silicon chip sliced surface is remaining big Amount slurry fail when spray rushes stick it is significantly comprehensive be removed, it is big that follow-up cleaning generates pressure, and in spray process In, the water after spray not can be good at utilizing, and cause water waste very big, increases production and rises this, while useless after spray Water will also result in the pollution of environment.
Utility model content
In view of the problems of the existing technology, the utility model proposes a kind of simple in structure, reduction production cost, increase silicon Piece is sprayed the spray equipment of the removal silicon chip surface slurry of amplitude range, the dirty rate of Wafer Cleaning can be reduced, so as to drop Low silicon chip is hidden to be split.
The utility model solves the technical solution of more than technical problem:A kind of spray dress for removing silicon chip surface slurry is provided It puts, including rinse bath, water tank, spray nozzle, sedimentation basin and filter device, the rinse bath installs the geosyncline set on the ground Interior, the water tank includes water tank one and water tank two, and the water tank one and water tank two are separately positioned on the rinse bath both ends, in institute It states water tank one and two front end of water tank is correspondingly provided with spray tube one and spray tube two, the spray tube one and spray tube two pass through Guan Xuan Turn connector to be fixed in rinse bath, the spray tube one and spray tube two are equipped with multiple spray orifices, in each spray orifice The spray nozzle is installed, the spray tube one and the water inlet of spray tube two side are both provided with control valve, are set in the rinse bath Steel plate is equipped with, sieve plate is equipped in the steel plate lower end, the sieve plate lower end is equipped with wastewater disposal basin, and the sedimentation basin is precipitated including level-one Pond and second-level settling pond, the water inlet of the first stage precipitation tank are connect with the water outlet pipeline of the wastewater disposal basin, and the level-one is sunk The water outlet in shallow lake pond connects the water inlet of the second-level settling pond, the water outlet connection filter device of the second-level settling pond into Mouthful, the filter device out connects water tank one and water tank two respectively by aqueduct.
The technical solution that the utility model further limits as:
Aforementioned spray tube one and spray tube two are poor there are certain altitude not on same horizontal line.
The quantity of aforementioned spray orifice is 10-15.
Aforementioned surface of steel plate is equipped with multiple through-holes.
Aforementioned sieve plate is internally provided with activated carbon.
Running water pipe is connected respectively on aforementioned water tank one and water tank two.
The beneficial effects of the utility model:The utility model is simple in structure, sets water tank respectively in rinse bath both sides, is convenient for Water source is provided for corresponding spray tube, two spray tube both ends are fixed in rinse bath by pipe rotary connector, can adjusted The spray angles of spray tube, and two spray tubes are not arranged on same horizontal line, there are certain difference in height, and it is every 10-15 spray orifices on a spray tube are all set, spray nozzle is fitted in each spray orifice, silicon chip can be increased in this way and be sprayed width Range and area are spent, reduces the dirty rate of Wafer Cleaning, silicon chip is hidden to be split so as to reduce;Steel plate is set in rinse bath, convenient for silicon chip Placement, and steel plate be equipped with multiple through-holes, can by the water of spray flow into lower end wastewater disposal basin, steel plate lower end be equipped with sieve Plate, and activated carbon is filled on sieve plate, the granule foreign in waste water can be tentatively adsorbed, then waste water is precipitated by level-one The processing in pond, second-level settling pond and filter device, again flows into water tank and recycles, and can reduce the waste at water source, reduces Pollution, while saved production cost.
Description of the drawings
Fig. 1 is the structural front view of the utility model;
Fig. 2 is the vertical view of the rinse bath of the utility model.
Specific embodiment
Embodiment 1
The present embodiment provides it is a kind of remove silicon chip surface slurry spray equipment, structure as shown in Figs. 1-2, including rinse bath (1), water tank, spray nozzle 14, sedimentation basin and filter device 9, rinse bath 1 install in the geosyncline set on the ground, water tank includes Water tank 1 and water tank 23, water tank 1 and water tank 23 are separately positioned on 1 both ends of rinse bath, in 23 front end of water tank 1 and water tank Spray tube 1 and spray tube 2 12 are correspondingly provided with, spray tube one and spray tube two exist certain not on same horizontal line Highly, spray tube 1 and spray tube 2 12 are fixed on by pipe rotary connector 13 in rinse bath 1, spray tube 1 and spray Pipe 2 12 is equipped with 12 spray orifices, and spray nozzle 14, spray tube 1 and the water inlet of spray tube 2 12 side are equipped in each spray orifice Control valve 15 is both provided with, steel plate 4 is provided in rinse bath 1, surface of steel plate is equipped with multiple through-holes, is equipped in 4 lower end of steel plate Sieve plate 5, sieve plate are internally provided with activated carbon, and 5 lower end of sieve plate is equipped with wastewater disposal basin 6, and sedimentation basin includes first stage precipitation tank 7 and two-stage precipitation Pond 8, the water inlet of first stage precipitation tank 7 are connect with the water outlet pipeline of wastewater disposal basin 6, the water outlet connection two level of first stage precipitation tank 7 The water inlet of sedimentation basin 8, the import of the water outlet connection filter device 9 of second-level settling pond 8, out passing through for filter device 9 are defeated Waterpipe connects water tank 1 and water tank 23 respectively, and is also respectively connected with running water pipe on water tank one and water tank two.
The present embodiment is simple in structure, and water tank is set respectively in rinse bath both sides, convenient for providing water source for corresponding spray tube, Two spray tube both ends are fixed on by pipe rotary connector in rinse bath, can adjust the spray angles of spray tube, and two A spray tube is not arranged on same horizontal line, there are certain difference in height, and sets 12 spray orifices on each spray tube, Spray nozzle is fitted in each spray orifice, silicon chip can be increased in this way and be sprayed amplitude range and area, reduce Wafer Cleaning Dirty rate, so as to reduce, silicon chip is hidden to be split;Steel plate is set in rinse bath, and convenient for the placement of silicon chip, and steel plate is equipped with multiple The water of spray can be flowed into the wastewater disposal basin of lower end by through-hole, sieve plate is equipped in steel plate lower end, and activity is filled on sieve plate Charcoal can tentatively adsorb the granule foreign in waste water, and then waste water is by first stage precipitation tank, second-level settling pond and filter device Processing, again flows into water tank and recycles, and can reduce the waste at water source, reduces pollution, while saved production cost.
In addition to the implementation, the utility model can also have other embodiment, all to use equivalent replacement or equivalent change The technical solution to be formed is changed, all falls within the protection domain of the requires of the utility model.

Claims (6)

1. a kind of spray equipment for removing silicon chip surface slurry, including rinse bath(1), water tank, spray nozzle(14), sedimentation basin and mistake Filter device(9), it is characterised in that:The rinse bath(1)It installs in the geosyncline set on the ground, the water tank includes water tank one (2)With water tank two(3), the water tank one(2)With water tank two(3)It is separately positioned on the rinse bath(1)Both ends, in the water tank One(2)With water tank two(3)Front end is correspondingly provided with spray tube one(11)With spray tube two(12), the spray tube one(11)And spray Pipe two(12)Pass through pipe rotary connector(13)It is fixed on rinse bath(1)It is interior, the spray tube one(11)With spray tube two(12) Multiple spray orifices are equipped with, the spray nozzle is installed in each spray orifice(14), the spray tube one(11)And spray tube Two(12)Water inlet side is both provided with control valve(15), the rinse bath(1)Inside it is provided with steel plate(4), in the steel plate(4)Under End is equipped with sieve plate(5), the sieve plate(5)Lower end is equipped with wastewater disposal basin(6), the sedimentation basin include first stage precipitation tank(7)And two level Sedimentation basin(8), the first stage precipitation tank(7)Water inlet and the wastewater disposal basin(6)The connection of water outlet pipeline, the level-one sinks Shallow lake pond(7)Water outlet connect the second-level settling pond(8)Water inlet, the second-level settling pond(8)Water outlet connected Filter device(9)Import, the filter device(9)Water tank one out connected by aqueduct respectively(2)With water tank two (3).
2. the spray equipment of removal silicon chip surface slurry according to claim 1, feature are:The spray tube one (11)With spray tube two(12)It is poor there are certain altitude not on same horizontal line.
3. the spray equipment of removal silicon chip surface slurry according to claim 1, feature are:The quantity of the spray orifice It is 10-15.
4. the spray equipment of removal silicon chip surface slurry according to claim 1, feature are:The steel plate(4)Table Face is equipped with multiple through-holes.
5. the spray equipment of removal silicon chip surface slurry according to claim 1, feature are:The sieve plate(5)It is interior Portion is equipped with activated carbon.
6. the spray equipment of removal silicon chip surface slurry according to claim 1, feature are:The water tank one(2) With water tank two(3)It is upper to connect running water pipe respectively(10).
CN201721421215.6U 2017-10-30 2017-10-30 A kind of spray equipment for removing silicon chip surface slurry Active CN207479092U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721421215.6U CN207479092U (en) 2017-10-30 2017-10-30 A kind of spray equipment for removing silicon chip surface slurry

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721421215.6U CN207479092U (en) 2017-10-30 2017-10-30 A kind of spray equipment for removing silicon chip surface slurry

Publications (1)

Publication Number Publication Date
CN207479092U true CN207479092U (en) 2018-06-12

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109434696A (en) * 2018-11-16 2019-03-08 佛山市泽信金属材料有限公司 A kind of sheet material sanding machine of chilling spray
CN111560507A (en) * 2020-05-20 2020-08-21 中国重型机械研究院股份公司 Cleanable steel pipe quenching water supply device and method
CN113617722A (en) * 2021-07-21 2021-11-09 广东科学技术职业学院 Cleaning system of hydraulic brick pressing equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109434696A (en) * 2018-11-16 2019-03-08 佛山市泽信金属材料有限公司 A kind of sheet material sanding machine of chilling spray
CN111560507A (en) * 2020-05-20 2020-08-21 中国重型机械研究院股份公司 Cleanable steel pipe quenching water supply device and method
CN111560507B (en) * 2020-05-20 2023-11-28 中国重型机械研究院股份公司 Cleanable steel pipe quenching water supply device and cleanable steel pipe quenching water supply method
CN113617722A (en) * 2021-07-21 2021-11-09 广东科学技术职业学院 Cleaning system of hydraulic brick pressing equipment

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20201215

Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province

Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd.

Address before: 212200 new materials Industrial Park, Yangzhong Youfang Town, Zhenjiang City, Jiangsu Province

Patentee before: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
CP01 Change in the name or title of a patent holder

Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province

Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd.

Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province

Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd.

CP01 Change in the name or title of a patent holder