CN207425856U - A kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen - Google Patents
A kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen Download PDFInfo
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- CN207425856U CN207425856U CN201721050159.XU CN201721050159U CN207425856U CN 207425856 U CN207425856 U CN 207425856U CN 201721050159 U CN201721050159 U CN 201721050159U CN 207425856 U CN207425856 U CN 207425856U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 44
- 238000005538 encapsulation Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 239000002184 metal Substances 0.000 claims abstract description 88
- 229910052751 metal Inorganic materials 0.000 claims abstract description 88
- 239000012528 membrane Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a kind of chip-scale RGB LED packages, encapsulation module and its display screen, including three the first metal substrates and second metal substrate, first metal substrate and the second metal substrate are arranged on glued membrane, the back side is equipped with pin pad, the first metal substrate front is used to place LED chip, place a LED chip in each first metal substrate front, using wafer-level package, the second metal substrate front is copolar area, and the LED chip is realized by bonding line and the first metal substrate and the second metal substrate and is electrically connected.The utility model uses chip-scale, package dimension is reduced to greatest extent, eliminate the package support and BT material substrates used in traditional SMD devices, reduce production cost, multiple packaging bodies are integrated into an encapsulation module, solve the problems such as LED component low production efficiency, poor sealing of existing single attachment.
Description
Technical field
The utility model is related to arrive SMD LED（Surface Mounted Devices, surface mount device）Encapsulate skill
Art, more particularly to a kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen.
Background technology
As display screen industry continues to develop, display screen is with LED by original DIP（dual inline-pin
Package, dual-inline package technology）Structure high-speed changes to SMD structures, and the LED of SMD structures is with light-weight, individual
Smaller, automation installation, the advantages that light emitting angle is big, color is uniform, attenuation is few accepted extensively by market, in the market prevalence
The models packaging such as SMD2121,1515,1010,0808,0505 makes small clearance display screen have the development of explosion type.At present
, there are two bottlenecks in small spacing LED component in the market, these devices of one side are mainly used for small of more than P0.7 spacing
Away from display screen, with the raising that market requires display effect, LED display pel spacing constantly reduces, SMD described above
The LED component of structure can not meet the requirement of micro- clearance display screen, and the display screen device of smaller spacing needs to be studied out
Hair；On the other hand, as the diminution of display screen spacing, the quantity of LED component used also increase into multiple, LED devices are persistently reduced
The cost of part is the basis that small clearance display screen is further exploited market.
Therefore, existing RGB LED encapsulation technologies have yet to be improved and developed.
Utility model content
The purpose of this utility model is to provide a kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen, purports
The requirement of micro- clearance display screen can not be met solving existing RGB-LED products, production cost is high, and production efficiency is low etc. asks
Topic.
To solve the above problems, the technical solution of the utility model is as follows：
A kind of chip-scale RGB-LED packaging bodies, including three the first metal substrates and second metal substrate, described
One metal substrate and the second metal substrate are arranged on glued membrane, and the back side is equipped with pin pad, the first metal substrate front
For placing LED chip, a LED chip, using wafer-level package, second gold medal are placed in each first metal substrate front
Category substrate front side is copolar area, and the LED chip is realized electrical by bonding line and the first metal substrate and the second metal substrate
Connection.
The chip-scale RGB-LED packaging bodies, wherein, first metal substrate and the second metallic substrate surfaces are equipped with
Coating.
The chip-scale RGB-LED packaging bodies, wherein, it is also molded on first metal substrate and the second metal substrate
Matcoveredn.
The chip-scale RGB-LED packaging bodies, wherein, the protective layer is the epoxy resin layer of hardening or organosilicon tree
Lipid layer.
The chip-scale RGB-LED packaging bodies, wherein, the thickness of first metal substrate and the second metal substrate is
0.1mm-0.5mm。
The chip-scale RGB-LED packaging bodies, wherein, it is provided on first metal substrate and the second metal substrate
Step.
The chip-scale RGB-LED packaging bodies, wherein, first metal substrate is square, second Metal Substrate
Plate is equipped with polarity mark, is distinguished with the first metal substrate.
The chip-scale RGB-LED packaging bodies, wherein, first metal substrate and the second metal substrate are square row
Cloth.
A kind of chip-scale RGB-LED encapsulation modules, wherein, there is chip-scale RGB-LED packaging bodies as described above, it is described
The quantity of chip-scale RGB-LED packaging bodies is at least two.
A kind of chip-scale RGB-LED display screens, wherein, there is chip-scale RGB-LED packaging bodies as described above.
The beneficial effects of the utility model include：Chip-scale RGB-LED packaging bodies provided by the utility model, encapsulation module
And its display screen, LED chip is directly anchored on metal substrate, using chip-scale, makes each metal substrate front only fixed
One LED chip, reduces package dimension to greatest extent, meanwhile, the utility model eliminates the encapsulation used in traditional SMD devices
Stent and BT material substrates, reduce production cost；LED chip is exactly metal substrate directly below, and as heat sink, thermal resistance is small, is dissipated
Hot property is more preferable；In addition, multiple packaging bodies are integrated into an encapsulation module by the utility model, solves existing single patch
The problems such as LED component low production efficiency of dress, packaging machinery intensity difference, poor sealing, weak heat-dissipating.
Description of the drawings
Fig. 1 is a kind of positive structure schematic of chip-scale RGB-LED packaging bodies provided by the utility model.
Fig. 2 is a kind of side structure schematic diagram of chip-scale RGB-LED packaging bodies provided by the utility model.
Fig. 3 is a kind of positive structure schematic of chip-scale RGB-LED encapsulation modules provided by the utility model.
Fig. 4 is a kind of side structure schematic diagram of chip-scale RGB-LED encapsulation modules provided by the utility model.
Fig. 5 is a kind of Facad structure schematic diagram of chip-scale RGB-LED display screens provided by the utility model.
Reference sign：1st, the first metal substrate；2nd, the second metal substrate；3rd, glued membrane；4th, LED chip；5th, bonding line；
6th, protective layer；7th, LED display；8th, step.
Specific embodiment
To make the purpose of this utility model, technical solution and advantage clearer, clear and definite, develop simultaneously implementation referring to the drawings
The utility model is further described in example.
It is a kind of chip-scale RGB-LED packaging bodies provided by the utility model, including three the first Metal Substrates referring to Fig. 1
Plate 1 and second metal substrate 2, the first metal substrate 1 and the second metal substrate 2 are arranged on glued membrane 3, and the back side, which is equipped with, draws
Foot pad（It is not shown in figure）, the electric connection with external circuit is realized by pin pad.First metal substrate, 1 front is used for
LED chip 4 is placed, a LED chip 4 is placed in each first metal substrate, 1 front, it is preferable that the LED chip 4 is RGB-
LED chip, three the first metal substrates place red light chips, blue chip and green light chip respectively.In the present embodiment, it is described
LED chip 4 uses wafer-level package, even if the front surface region of the first metal substrate 1 is to greatest extent close to the ruler of LED chip 4
It is very little, it is preferable that CSP encapsulation to may be employed, to reduce package dimension to greatest extent.Second metal substrate, 2 front is copolar
Area, LED chip 4 are realized by 5 and first metal substrate 1 of bonding line and the second metal substrate 2 and are electrically connected.The utility model leads to
It crosses and directly LED chip 4 is placed in 1 on the first metal substrate, and the first metal substrate 1 and the second metal substrate 2 are directly set
On glued membrane 3, package support and BT material substrates used in SMD devices are eliminated, reduces the cost of LED component.On the other hand,
LED chip 4 is exactly the first metal substrate 1 directly below, and as heat sink, thermal resistance is small, and heat dissipation performance is excellent.
In practical applications, 1 and second metal substrate of the first metal substrate, 2 surface is equipped with coating, is led with strengthening it
Electrical property, it is preferable that the first metal substrate 1 and 2 surface of the second metal substrate plated with gold or silver by way of electroplating or depositing
As coating.
In practical applications, referring to Fig. 2, to strengthen the mechanical strength of the packaging body, while strengthen to LED chip 4
It protects, matcoveredn 6 is also molded on the first metal substrate 1 and the second metal substrate 2.Preferably, protective layer 6 is the epoxy of hardening
Resin bed or silicone resin layer can be used as luminescent layer, enhance its luminescent properties simultaneously.
In practical applications, the thickness of the first metal substrate 1 and the second metal substrate 2 is preferably 0.1mm-0.5mm, is made
The encapsulation body thickness is thinner, to adapt to different types of product requirement.
In practical applications, it is tight in order to further strengthen the combination of the first metal substrate 1 and the second metal substrate 2 and glued membrane
Step 8 is also provided on density, the first metal substrate 1 and the second metal substrate 2.
In practical applications, to save space, facilitating cutting, the shape of the first metal substrate 1 is square, the second Metal Substrate
Plate 2 is equipped with polarity mark, is distinguished with the first metal substrate 1, the polarity mark could be provided as the second metal substrate 2
Wherein one jiao cut away, as polarity mark.
Further, to save space, facilitating cutting, the first metal substrate 1 and the second metal substrate 2 are square arrangement.
Referring to Fig. 3-Fig. 4, the utility model additionally provides a kind of chip-scale RGB-LED encapsulation modules, wherein, have as above
The chip-scale RGB-LED packaging bodies, the quantity of the chip-scale RGB-LED packaging bodies are at least two.Such as Fig. 3 and Fig. 4
Shown, there are four chip-scale RGB-LED packaging bodies for tool in the chip-scale RGB-LED encapsulation modules.Pass through the shape of module packaging
Formula further improves production efficiency, and subsequent clients are in use, it is not necessary to carry out single encapsulation, drastically increase life
The problems such as producing efficiency, while also solving existing RGB LED packaging machineries intensity difference, poor sealing.In practical applications, institute
The particular number and arrangement mode of the packaging body in encapsulation module are stated, the utility model is not restricted, is encapsulated in the present embodiment
The quantity of body is 4, and be square arrangement, can facilitate the processes such as subsequent processing and cutting.
Referring to Fig. 5, the utility model additionally provides a kind of chip-scale RGB-LED display screens, has chip as described above
Grade RGB-LED packaging bodies.With the development of small space distance LED display screen, pel spacing is less and less, the wrapper on unit area
Number of packages amount is more and more, and the requirement to package dimension is higher and higher.Chip-scale RGB-LED display screens provided by the utility model,
It using chip-scale RGB-LED packaging bodies as described above, will greatly reduce the size of single packaging body, meet micro- spacing and show
The requirement of screen.
It should be appreciated that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
It says, can be improved or converted according to the above description, all these modifications and variations should all belong to the appended power of the utility model
The protection domain of profit requirement.
Claims (10)
1. a kind of chip-scale RGB-LED packaging bodies, which is characterized in that including three the first metal substrates and second Metal Substrate
Plate, first metal substrate and the second metal substrate are arranged on glued membrane, and the back side is equipped with pin pad, first metal
Substrate front side is for placing LED chip, and a LED chip is placed in each first metal substrate front, using wafer-level package, institute
It is copolar area to state the second metal substrate front, and the LED chip passes through bonding line and the first metal substrate and the second metal substrate
It realizes and is electrically connected.
2. chip-scale RGB-LED packaging bodies according to claim 1, which is characterized in that first metal substrate and
Two metallic substrate surfaces are equipped with coating.
3. chip-scale RGB-LED packaging bodies according to claim 1, which is characterized in that first metal substrate and
Matcoveredn is also molded on two metal substrates.
4. chip-scale RGB-LED packaging bodies according to claim 3, which is characterized in that the protective layer is the ring of hardening
Oxygen resin bed or silicone resin layer.
5. chip-scale RGB-LED packaging bodies according to claim 1, which is characterized in that first metal substrate and
The thickness of two metal substrates is 0.1mm-0.5mm.
6. chip-scale RGB-LED packaging bodies according to claim 1, which is characterized in that first metal substrate and
Step is provided on two metal substrates.
7. chip-scale RGB-LED packaging bodies according to claim 1, which is characterized in that first metal substrate is side
Shape, second metal substrate are equipped with polarity mark, are distinguished with the first metal substrate.
8. chip-scale RGB-LED packaging bodies according to claim 7, which is characterized in that first metal substrate and
Two metal substrates are square arrangement.
9. a kind of chip-scale RGB-LED encapsulation modules, which is characterized in that there is the core as described in claim 1-8 any one
Chip level RGB-LED packaging bodies, the quantity of the chip-scale RGB-LED packaging bodies are at least two.
10. a kind of chip-scale RGB-LED display screens, which is characterized in that there is the chip as described in claim 1-8 any one
Grade RGB-LED packaging bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721050159.XU CN207425856U (en) | 2017-08-22 | 2017-08-22 | A kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721050159.XU CN207425856U (en) | 2017-08-22 | 2017-08-22 | A kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207425856U true CN207425856U (en) | 2018-05-29 |
Family
ID=62314921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721050159.XU Active CN207425856U (en) | 2017-08-22 | 2017-08-22 | A kind of chip-scale RGB-LED packaging bodies, encapsulation module and its display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207425856U (en) |
-
2017
- 2017-08-22 CN CN201721050159.XU patent/CN207425856U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Effective date of registration: 20231211 Granted publication date: 20180529 |
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