CN207396162U - A kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness - Google Patents

Abstract

The utility model provides a bonding device capable of precisely controlling the thickness of a butt joint adhesive layer, which comprises a base, one end of the base is installed with a screw adjusting assembly, and one end of the screw adjusting assembly is fixed with a slider, the At the same time, the slider and the chute arranged on the base form a linear movement of the chute. The slider cooperates with the scale set on the top of the chute to indicate the sliding displacement. The side of the base is equipped with a lateral limit assembly. . The invention solves the problem that the thickness of the adhesive layer cannot be accurately controlled in the prior art, and thus the problem that a qualified test piece cannot be provided for the impact strength test of the adhesive.

Description

A bonding device that can precisely control the thickness of the glue layer of the butt joint

technical field

The utility model relates to the technical field of bonding tooling, in particular to a bonding device capable of precisely controlling the thickness of a glue layer of a butt joint.

Background technique

Compared with traditional connection methods such as threaded connection, welding and riveting, adhesive bonding technology has the advantages of wide application range, small stress concentration, high strength, good fatigue resistance, light structure weight and good sealing performance, so it is widely used in aerospace, Automobiles, electronic products and other fields.

Today, bonding technology has become an indispensable technology. However, in practical applications, adhesive joints are often affected by impact loads. Since the adhesive is a viscoelastic material, the impact strength of adhesive joints is affected by many factors. In actual use, it is necessary to test the impact strength of adhesive joints. . At present, the commonly used impact tests include pendulum shear impact test, Charpy impact test and Izod impact test. In the impact test, it is necessary to prepare Charpy impact specimens or Izod impact specimens with the same adhesive layer thickness, because the thickness of the adhesive layer has a great influence on the bonding. The impact strength of the joint also has a significant impact, and how to prepare the impact test specimen of the glued joint with a uniform glue layer thickness requires the design of the bonding device. The commonly used method is to put spacers, filaments or glass beads to control the thickness of the adhesive layer between the two bonded samples. After the adhesive layer is cured, it is taken out or left in the adhesive layer. The adhesive prepared by this method The joint sample has defects in the adhesive layer due to the insertion of filaments or glass beads, which affects the strength test of the adhesive.

Utility model content

The purpose of this utility model is to propose a bonding device and operation method that can accurately control the thickness of the glue layer of the butt joint, so as to solve the problem that the thickness of the glue layer cannot be accurately controlled in the prior art, and thus cannot provide qualified test pieces for the impact strength test of the adhesive. question.

In order to solve the above technical problems, the utility model proposes the following technical solutions: a bonding device that can precisely control the thickness of the glue layer of the butt joint, which includes a base, and a screw adjustment assembly is installed on one end of the base, and the screw adjustment One end of the assembly is fixed with a slider, which simultaneously forms a linear motion with the chute on the base, and cooperates with the scale at the top of the chute to indicate the sliding displacement. A lateral limit assembly is installed on the side of the seat.

The base includes a base plate, one end of the base plate is fixedly mounted with a front support plate, the other end is fixed with a rear support plate, and a side fixing plate and a side support plate are respectively installed on the sides of the base plate.

The screw adjustment assembly includes a lead screw nut, which is fixedly installed on the front support plate of the base, and a screw shaft is mounted on the lead screw nut through screw drive cooperation, and one end of the screw shaft A knob is fixed, the other end of the screw shaft is supported on a bearing, and the bearing is installed in the center hole of the slider, the outer ring of the bearing is positioned by the bearing end cover, and the inner ring of the bearing is fixed by the wire The first snap ring on the shaft performs axial positioning.

The scale includes a vernier scale and a main scale, the vernier scale is installed on the slider, and the main scale is installed on the top of the chute of the side support plate of the base.

The lateral limit assembly includes two guide shafts, the two guide shafts are assembled on the side fixing plate of the base, one end of the two guide shafts is equipped with a handle, and the other end is fixed with a U-shaped plate. A spring is installed on the guide shaft, a connecting plate is fixed on the U-shaped plate, a pin hole is processed on the connecting plate, a pin is installed on the pin hole, and four pin holes are processed on the U-shaped plate. A group of mounting holes, the mounting holes are respectively equipped with limit shafts, limit rollers are installed on the limit shafts, and the limit shafts are fixed axially by the second snap ring.

The measurement accuracy of the vernier scale in the scale is 0.02mm.

The utility model has the following beneficial effects:

1. The utility model can realize the precise alignment of the two bonded samples through the side support plate, the rear support plate and the lateral limit assembly, and realize the precise control of the thickness of the adhesive layer through the main scale and the vernier scale. The bonding device is simple and convenient to operate, and can be used for the preparation of adhesive joint samples in adhesive impact strength testing.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Fig. 1 is a schematic diagram of the front three-dimensional structure of the utility model.

Fig. 2 is a schematic diagram of the side stereoscopic structure of the utility model.

Fig. 3 is a schematic diagram of the three-dimensional structure of the utility model.

Fig. 4 is a schematic diagram of the bonding of the adhesive joint of the present invention.

Fig. 5 is a schematic diagram of the utility model after the thickness of the adhesive layer is accurately controlled.

In the figure: base 1, screw adjustment component 2, slider 3, scale 4, lateral limit component 5, bonded sample 6;

Bottom plate 101, front support plate 102, side fixing plate 103, side support plate 104, rear support plate 105;

Knob 201, screw shaft 202, screw nut 203, bearing end cover 204, bearing 205;

Vernier scale 401, main scale 402;

U-shaped plate 501, connecting plate 502, handle 503, latch 504, guide shaft 505, spring 506, limit shaft 507, limit roller 508, second snap ring 509;

The sample to be bonded 601, the adhesive layer 602, and the sample to be bonded 603.

Detailed ways

Embodiments of the present utility model will be further described below in conjunction with the accompanying drawings.

Example 1:

As shown in Figures 1-5, a bonding device that can precisely control the thickness of the butt joint adhesive layer includes a base 1, and a screw adjustment assembly 2 is installed on one end of the base 1, and the screw adjustment assembly 2 One end is fixed with a slider 3, and the slider 3 forms a linear movement of the chute with the chute arranged on the base 1 at the same time, and the slider 3 cooperates with the scale 4 provided at the top of the chute to indicate the sliding displacement, A lateral limit assembly 5 is installed on the side of the base 1 . By using the above-mentioned bonding device, the precise alignment of the two bonded samples can be realized through the side support plate, the rear support plate and the lateral limit assembly, and the precise control of the thickness of the adhesive layer can be realized through the main scale and vernier scale , the bonding device is simple and convenient to operate, and can be used for the preparation of adhesive joint samples in the impact strength test of adhesives.

Further, the base 1 includes a bottom plate 101, one end of the bottom plate 101 is fixedly mounted with a front support plate 102, the other end is fixed with a rear support plate 105, and a side fixing plate 103 and a side support plate 104 are respectively installed on its side. .

Further, the screw adjustment assembly 2 includes a lead screw nut 203, the lead screw nut 203 is fixedly installed on the front support plate 102 of the base 1, and the lead screw nut 203 is fitted with a lead screw through screw drive. shaft 202, one end of the screw shaft 202 is fixed with a knob 201, the other end of the screw shaft 202 is supported on a bearing 205, and the bearing 205 is installed in the center hole of the slider 3, and the outer surface of the bearing 205 The ring is positioned by the bearing end cover 204, and the inner ring of the bearing 205 is axially positioned by the first snap ring 206 installed on the screw shaft 202. The thickness of the adhesive layer can be precisely controlled through the threaded drive fit through the screw adjusting assembly 2 .

Further, the scale 4 includes a vernier scale 401 and a main scale 402, the vernier scale 401 is installed on the slider 3, and the main scale 402 is installed on the slide of the side support plate 104 of the base 1 Groove top. The cooperation between the vernier scale 401 and the main scale 402 ensures the precision of bonding. Through the cooperation between the vernier scale 401 and the main scale 402, the precision of bonding can be guaranteed.

Further, the lateral limit assembly 5 includes two guide shafts 505, the two guide shafts 505 are assembled on the side fixing plate 103 of the base 1, one end of the two guide shafts 505 is equipped with a handle 503 , the other end is fixed with a U-shaped plate 501, two springs 506 are installed on the guide shafts 505, a connecting plate 502 is fixed on the described U-shaped plate 501, and a bolt hole is processed on the connecting plate 502, and the bolt A bolt 504 is mounted on the hole, and four sets of mounting holes are processed on the U-shaped plate 501. Limiting shafts 507 are respectively installed on the mounting holes, and limiting rollers 508 are installed on the limiting shafts 507. The limiting shaft 507 is axially limited and fixed by the second snap ring 509 . The sample can be laterally limited by the lateral limiting component 5 .

Further, the measurement accuracy of the vernier scale 401 in the scale 4 is 0.02 mm. The above-mentioned measurement accuracy ensures the bonding accuracy of the sample, and then makes it meet the bonding requirements.

Example 2:

Any method for using a bonding device capable of precisely controlling the thickness of a butt joint adhesive layer, which includes the following steps:

Step1: first move the slider 3 close to the front support plate 102; place the prepared but not yet glued bonded sample A601 and bonded sample B603 against the side support plate 102 according to the gluing operation process, And through the back support plate 105 to limit the end;

Step2: Take out the pin 504 on the connecting plate 502 and place it in the pin hole above the side fixing plate 103, make the limit roller 508 in the lateral limit assembly 5 limit the bonded sample laterally, and rotate The knob 201 makes the slider 3 contact the bonded sample B603, so as to realize the precise and controllable movement of the bonded sample;

Step3: Continue to rotate the knob 201 until the two surfaces to be bonded are in close contact, record the scales of the main scale 402 and the vernier scale 401 at this time, and then pull back the handle 503 in the lateral limit assembly 5 and push the pin 504 Insert into the pin hole in the connecting plate 502 to reset the lateral limit assembly 5, return the slide block 3 and then take out the sample.

Working process and working principle of the present utility model are:

First, move the slider to the front support plate, place the prepared but not yet glued bonded sample A and bonded sample B against the side support plate according to the gluing operation process, and pass through the rear support plate To limit the end, take out the pin on the connecting plate and place it in the hole above the side fixing plate, so that the limit roller in the side limit component can limit the bonded sample laterally, and turn the knob to make the slide The block contacts the bonded sample B, so as to realize the precise and controllable movement of the bonded sample, continue to rotate the knob until the two bonded surfaces are in close contact, record the scales of the main scale and the vernier scale at this time, and then Pull back the handle in the lateral limit assembly and insert the pin into the pin hole in the connecting plate to reset the lateral limit assembly, return the slider and take out the sample.

When bonding, place the bonded sample A and the bonded sample B close to the side support plate according to the bonding operation process in the original order after the glue is applied, and also make the bonded sample The end of sample A is tightly attached to the rear support plate, and the pin on the connecting plate is taken out and placed in the pin hole above the side fixing plate, so that the limit roller in the lateral limit component can limit the bonded sample laterally. According to the thickness of the adhesive layer of the bonded sample to be prepared, calculate the scale of the main scale and the vernier scale after the glue is applied, and turn the knob to push the slider to move the bonded sample B along the side support plate until the main scale The scale of the vernier scale meets the requirements, so that the thickness of the adhesive layer of the adhesive joint can be accurately controlled. Scrape off the excess adhesive, pull back the handle after the adhesive layer is cured, reset the lateral limit assembly through the pin, and take out the sample to obtain a butt joint with an accurate and controllable adhesive layer thickness.

Through the above description, those skilled in the art can make various changes and modifications without departing from the technical idea of the utility model, all of which are within the protection scope of the utility model. Unfinished matters of the utility model belong to the common knowledge of those skilled in the art.

Claims (6)

1. a kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness, it is characterised in that：It includes pedestal（1）, it is described Pedestal（1）One end adjusting screw assembly is installed（2）, the adjusting screw assembly（2）One end be fixed with sliding block（3）, institute State sliding block（3）Simultaneously with being arranged on pedestal（1）On sliding slot form sliding slot linear motion, the sliding block（3）It is set with sliding slot top The graduated scale put（4）It is engaged, indicates slide displacement, the pedestal（1）Side is equipped with lateral Displacement component（5）.

2. a kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness according to claim 1, it is characterised in that： The pedestal（1）Including bottom plate（101）, the bottom plate（101）One end be installed with front end panel（102）, the other end is solid Surely there is rear bearing sheet（105）, side fixed plate is separately installed in its side（103）And side support plate（104）.

3. a kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness according to claim 1, it is characterised in that： The adjusting screw assembly（2）Including feed screw nut（203）, the feed screw nut（203）It is fixedly mounted on pedestal（1）Preceding branch Fagging（102）On, the feed screw nut（203）It is upper that screw axis are equipped with by screw rod transmission cooperation（202）, the screw axis （202）One end be fixed with knob（201）, the screw axis（202）The other end be supported on bearing（205）On, the bearing （205）Mounted on sliding block（3）Centre bore, the bearing（205）Outer ring by bearing (ball) cover（204）Positioning, the bearing （205）Inner ring by being mounted on screw axis（202）On the first snap ring（206）Carry out axially position.

4. a kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness according to claim 1, it is characterised in that： The graduated scale（4）Including vernier graduation ruler（401）With master calibration ruler（402）, the vernier graduation ruler（401）Mounted on sliding block （3）On, the master calibration ruler（402）Mounted on pedestal（1）Side support plate（104）Sliding slot at the top of.

5. a kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness according to claim 1, it is characterised in that： The lateral Displacement component（5）Including two guiding axis（505）, two guiding axis（505）It is assemblied in pedestal（1）Side consolidate Fixed board（103）On, two guiding axis（505）One end equipped with knob（503）, the other end is fixed with U-shaped board（501）, two Guiding axis described in root（505）On spring is installed（506）, the U-shaped board（501）On be fixed with connecting plate（502）, the connection Plate（502）On be machined with pin hole, on the pin hole cooperation bolt is installed（504）, the U-shaped board（501）On be machined with Four groups of mounting holes are separately installed with limit shaft on the mounting hole（507）, the limit shaft（507）On /V roller is installed （508）, the limit shaft（507）Pass through the second snap ring（509）Axial limiting is carried out to fix.

6. a kind of adhering device for accurately controlling banjo fixing butt jointing bondline thickness according to claim 4, it is characterised in that： The graduated scale（4）In vernier graduation ruler（401）Measurement accuracy be 0.02mm.