CN207381390U - Aluminum radiator with water cooling - Google Patents

Abstract

The utility model relates to a hardware field, concretely relates to take water-cooled aluminium system radiator, including parallel arrangement's the upper base plate and the infrabasal plate that are the cavity form, connect in the first spliced pole, second spliced pole, third spliced pole and the fourth spliced pole of four apex angles departments of upper base plate and infrabasal plate, install the water supply connector on first spliced pole, install the water outlet connector on the second spliced pole, from the fashioned a plurality of upper heat radiation fins of upper base plate one side, from the fashioned a plurality of lower heat radiation fins of infrabasal plate one side, parallel connection deviates from two mounting brackets of heat radiation fins one side surface in the infrabasal plate; the water inlet joint, the first connecting column, the upper substrate, the third connecting column, the fourth connecting column, the lower substrate, the upper radiating fins and the lower radiating fins form a cavity together, and a cooling medium is filled in the cavity; the upper radiating fins and the lower radiating fins are oppositely arranged. The utility model discloses combine together water-cooling heat dissipation and forced air cooling heat dissipation, the radiating effect is good, and occupies small, the installation of being convenient for.

Description

Aluminum radiator with water cooling

technical field

The utility model relates to the field of hardware products, in particular to an aluminum radiator with water cooling.

Background technique

With the continuous development of the electronic information industry, the operating frequency and speed of current computer processors, such as central processing units or display card processors, are constantly increasing, and the heat generated by them is also increasing, and the temperature is rising, which seriously affects the Operational performance and stability of electronic components. Therefore, in order to improve the heat dissipation performance, almost all current processors are equipped with a corresponding heat dissipation device to operate at a normal operating temperature, thereby avoiding performance degradation or even burning problems.

The heat dissipation device in the prior art has two modes of active heat dissipation and passive heat dissipation. Passive heat dissipation generally dissipates heat through heat exchange between heat sinks and air.

In many occasions, when the power of electronic products is high and the heat dissipation is large, it is difficult to quickly cool down the temperature of electronic products only by relying on the two methods of active heat dissipation and passive heat dissipation, and the heat dissipation effect needs to be improved. At the same time, in order to improve the heat dissipation effect, the heat dissipation area of the radiator needs to be made very large, which takes up a large space and is not easy to install.

Utility model content

The purpose of the utility model is to overcome the deficiencies of the prior art and provide a water-cooled aluminum radiator that combines water-cooled heat dissipation and air-cooled heat dissipation, has a good heat dissipation effect, occupies a small volume, and is easy to install.

The technical solution adopted in the utility model is: an aluminum radiator with water cooling, including a hollow upper base plate and a lower base plate arranged in parallel, connected to the first connecting columns at the four corners of the upper base plate and the lower base plate, The second connecting column, the third connecting column and the fourth connecting column, the water inlet joint installed on the first connecting column, the water outlet joint installed on the second connecting column, several formed from the upper base plate to the lower base plate The upper heat dissipation fins are a plurality of lower heat dissipation fins formed from the lower base plate toward the upper base plate side, connected in parallel to two mounting frames on the surface of the lower base plate away from the lower heat dissipation fins; the water inlet joint, the first connecting column , the upper substrate, the third connecting column, the fourth connecting column, the lower substrate, the upper heat dissipation fin and the lower heat dissipation fin are connected to form a joint cavity, and the cavity is filled with a cooling medium; the upper heat dissipation fin and the The lower cooling fins are arranged oppositely.

A further improvement to the above technical solution is that the upper substrate is provided with an upper opening corresponding to the upper heat dissipation fin, and the upper heat dissipation fin is M-shaped, and the lower substrate is provided with a lower opening corresponding to the lower heat dissipation fin, and the lower heat dissipation fin is The slices are M-shaped.

A further improvement to the above technical solution is that both the upper substrate and the lower substrate include a planar aluminum casing, a high thermal conductivity diamond-like coating deposited on the outer surface of the aluminum casing, and a diamond-like coating coated on the inner surface of the aluminum casing. Anti-corrosion layer, the cooling medium is filled inside the anti-corrosion layer.

A further improvement to the above technical solution is that both the upper heat dissipation fins and the lower heat dissipation fins include an aluminum core body and a heat conversion layer coated on the surface of the aluminum core body for converting heat into infrared rays.

A further improvement to the above technical solution is that a waist-shaped hole for locking is opened at the bottom of the installation frame.

The beneficial effects of the utility model are:

1. On the one hand, the water inlet joint, the first connecting column, the upper base plate, the third connecting column, the fourth connecting column, the lower base plate, the upper cooling fin and the lower cooling fin are connected to form a joint cavity, together with the inside of the cavity Filled with a cooling medium, it can exchange heat with the electronic product installed at the bottom of the lower substrate to reduce the temperature of the electronic product and has a good heat dissipation effect. In the second aspect, there are several lower heat dissipation fins and several upper heat dissipation fins. After the heat exchange, the overall temperature of the radiator rises, and the upper heat dissipation fins and the lower heat dissipation fins exchange heat with the surrounding air to realize heat dissipation. , to further reduce the temperature of electronic products, and the heat dissipation effect is good. In the third aspect, the cooling medium has a large flow space, a large heat exchange area, and a large heat dissipation area, which further improves the heat dissipation effect. In the fourth aspect, the upper heat dissipation fins and the lower heat dissipation fins are relatively arranged between the upper base plate and the lower base plate. Small footprint, good cooling effect.

2. The upper substrate has an upper opening corresponding to the upper heat dissipation fin, and the upper heat dissipation fin is M-shaped, and the lower substrate has a lower opening corresponding to the lower heat dissipation fin, and the lower heat dissipation fin is M-shaped. Through the arrangement of the upper opening and the lower opening, the surface areas of the upper base plate and the lower base plate are increased, thereby increasing the heat dissipation area and further improving the heat dissipation effect. The upper heat dissipation fins are M-shaped, and the lower heat dissipation fins are M-shaped. Compared with the straight-line structure, the M-shaped structure has a larger surface area, thereby increasing the heat dissipation area and further improving the heat dissipation effect.

3. Both the upper substrate and the lower substrate include a planar aluminum shell, a high thermal conductivity diamond-like coating deposited on the outer surface of the aluminum shell, and an anti-corrosion layer coated on the inner surface of the aluminum shell, and the cooling medium is filled in the anti-corrosion layer internal. The high thermal conductivity diamond-like coating on the outer surface of the upper substrate and the lower substrate is directly in contact with the electronic product, and quickly transfers heat to the aluminum shell, which is cooled by the cooling medium to reduce the temperature of the radiator, thereby reducing the temperature of the electronic product and further improving The heat dissipation effect is improved, and the inner surface of the upper substrate and the lower substrate is coated with an anti-corrosion layer. Due to the poor corrosion resistance of aluminum materials, and the uniform corrosion of some cooling media, it will corrode the aluminum shell. The body is corroded to ensure the cooling effect.

4. Both the upper heat dissipation fin and the lower heat dissipation fin include an aluminum core body and a heat conversion layer coated on the surface of the aluminum core body for converting heat into infrared rays. After the heat is transferred to the aluminum core, the heat is converted into infrared radiation to the surroundings through the heat conversion layer, which further improves the heat dissipation effect of the radiator. For the same heat dissipation efficiency, the utility model can be designed to be more compact, so that it is easy to install .

5. There are waist-shaped holes for locking at the bottom of the mounting frame, and the electronic products are locked between the bottom of the lower substrate and the mounting frame through various waist-shaped holes to prevent unstable connection of electronic products and ensure heat dissipation.

Description of drawings

Fig. 1 is the perspective view of the utility model;

Fig. 2 is the bottom view of the utility model;

Fig. 3 is the top view of the utility model;

Fig. 4 is a side view of the utility model;

5 is a schematic cross-sectional view of the upper substrate of the present invention;

FIG. 6 is a schematic cross-sectional view of the upper cooling fin of the present invention.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings.

As shown in Figures 1-4, they are respectively a perspective view and views from different perspectives of the present utility model.

The aluminum heat sink 100 with water cooling includes a hollow upper base plate 110 and a lower base plate 120 arranged in parallel, connected to the first connecting column 130a and the second connecting column at the four corners of the upper base plate 110 and the lower base plate 120 130b, the third connecting column 130c and the fourth connecting column, the water inlet joint 140 installed on the first connecting column 130a, the water outlet joint 150 installed on the second connecting column 130b, from the upper base plate 110 to the lower base plate 120 side Several upper heat dissipation fins 160 formed, several lower heat dissipation fins 170 formed from the lower substrate 120 toward the upper substrate 110 side, connected in parallel to two mounting brackets 180 on the surface of the lower substrate 120 away from the lower heat dissipation fins 170 The water inlet joint 140, the first connecting column 130a, the upper substrate 110, the third connecting column 130c, the fourth connecting column, the lower substrate 120, the upper cooling fin 160 and the lower cooling fin 170 are connected to form a joint cavity body, together with the cooling medium 190 filled in the cavity; the upper heat dissipation fins 160 and the lower heat dissipation fins 170 are arranged oppositely.

The upper substrate 110 is provided with an upper opening 111 corresponding to the upper cooling fin 160, and the upper cooling fin 160 is M-shaped, and the lower substrate 120 is provided with a lower opening 121 corresponding to the lower cooling fin 170, and the lower cooling fin 170 is M-shaped. shape. Through the arrangement of the upper opening 111 and the lower opening 121, the surface areas of the upper substrate 110 and the lower substrate 120 are increased, thereby increasing the heat dissipation area and further improving the heat dissipation effect. The upper cooling fins 160 are M-shaped, and the lower cooling fins 170 are M-shaped. Compared with the straight-shaped structure, the surface area of the M-shaped structure is larger, thereby increasing the cooling area and further improving the cooling effect.

As shown in FIG. 5 , it is a schematic cross-sectional view of the upper substrate of the present invention.

Both the upper substrate 110 and the lower substrate 120 include a planar aluminum shell 111, a high thermal conductivity diamond-like coating 112 deposited on the outer surface of the aluminum shell 111, and an anti-corrosion layer 113 coated on the inner surface of the aluminum shell 111. , the cooling medium 190 is filled inside the anti-corrosion layer 113 . The high thermal conductivity diamond-like coating 112 on the outer surface of the upper substrate 110 and the lower substrate 120 is in direct contact with the electronic product, quickly transfers heat to the aluminum casing 111, and is cooled by the cooling medium 190 to reduce the temperature of the heat sink 100, thereby reducing the temperature of the electronic product. The temperature of the product further improves the heat dissipation effect, and the inner surfaces of the upper substrate 110 and the lower substrate 120 are coated with an anti-corrosion layer 113. Due to the poor corrosion resistance of aluminum materials, and the uniform corrosion of part of the cooling medium 190, it will corrode the aluminum shell. 111, by setting the anti-corrosion layer 113, the aluminum shell 111 is prevented from being corroded, and the heat dissipation effect is ensured.

As shown in FIG. 6 , it is a schematic cross-sectional view of the upper cooling fin of the present invention.

Both the upper fins 160 and the lower fins 170 include an aluminum core 161 and a heat conversion layer 162 coated on the surface of the aluminum core 161 for converting heat into infrared rays. After the heat is transferred to the aluminum core 161, the heat is converted into infrared radiation to the surroundings through the heat conversion layer 162, which further improves the heat dissipation effect of the radiator 100. For the same heat dissipation efficiency, the utility model can be designed to be more compact. thereby facilitating installation.

The bottom of the mounting frame 180 is provided with waist-shaped holes 181 for locking. Through various waist-shaped holes 181, the electronic products are locked between the bottom of the lower substrate 120 and the mounting frame 180 to prevent unstable connection of the electronic products and ensure heat dissipation.

On the one hand, the water inlet joint 140, the first connecting post 130a, the upper base plate 110, the third connecting post 130c, the fourth connecting post, the lower base plate 120, the upper cooling fins 160 and the lower cooling fins 170 are connected to form a connecting cavity. The body, together with the cooling medium 190 filled in the cavity, can perform heat exchange with the electronic product installed at the bottom of the lower substrate 120, so as to reduce the temperature of the electronic product and have a good heat dissipation effect. In the second aspect, several lower heat dissipation fins 170 and several upper heat dissipation fins 160 are provided. After the heat exchange, the overall temperature of the radiator 100 rises, and the upper heat dissipation fins 160 and the lower heat dissipation fins 170 communicate with the surrounding air. Heat exchange to achieve heat dissipation, further reduce the temperature of electronic products, and the heat dissipation effect is good. In the third aspect, the cooling medium 190 has a large flow space, a large heat exchange area, and a large heat dissipation area, which further improves the heat dissipation effect. In the fourth aspect, the upper heat dissipation fins 160 and the lower heat dissipation fins 170 are relatively arranged between the upper base plate 110 and the lower base plate 120, the heat sink 100 is in the shape of a regular cube as a whole, and electronic products are directly installed on the bottom of the lower base plate 120 and the mounting frame 180 Between, easy to install, small overall space occupation, good heat dissipation effect.

The working principle of the utility model is:

The electronic product is installed between the bottom of the lower base plate 120 and the mounting frame 180, and the cooling medium 190 is loaded into the radiator 100 through the water inlet joint 140. , the third connecting column 130c, the fourth connecting column, the lower substrate 120, the upper cooling fins 160 and the lower cooling fins 170, together with the flow in the cavity, when the temperature rises, it is discharged through the water outlet joint 150.

The electronic product is directly in contact with the lower substrate 120, and the heat is quickly transferred to the aluminum shell 111 of the lower substrate 120 through the high thermal conductivity diamond-like coating 112, and then transferred to the internal cooling medium 190, where heat exchange occurs, and the temperature of the cooling medium 190 rises. High, the cooling medium 190 after the temperature rises flows, transfers heat to the upper heat dissipation fin 160 and the lower heat dissipation fin 170, and the upper heat dissipation fin 160 and the lower heat dissipation fin 170 radiate heat to the external environment through the heat conversion layer 162 , thereby reducing the temperature of electronic products, and the heat dissipation effect is good.

The above-mentioned embodiments only express several implementations of the utility model, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (5)

1. the Aluminium Radiator with water cooling, it is characterised in that：Including the upper substrate and lower substrate in hollow form being arranged in parallel, connect First connecting pole, the second connecting pole, the 3rd connecting pole and the 4th connecting pole of four vertex of upper substrate and lower substrate are connected to, is pacified Loaded on the water supply connector on the first connecting pole, the water out adapter being installed on the second connecting pole, from upper substrate towards lower substrate one The molding radiating fin on several in side, from lower substrate towards several molding lower radiating fins of upper substrate one side, parallel company Lower substrate is connected to away from lower radiating fin one side surface two mounting bracket；The water supply connector, the first connecting pole, upper substrate, Three connecting poles, the 4th connecting pole, lower substrate, upper radiating fin and lower radiating fin are connected to form one together with cavity, together with chamber It is filled with cooling medium in vivo；The upper radiating fin and lower radiating fin are oppositely arranged.

2. the Aluminium Radiator according to claim 1 with water cooling, it is characterised in that：The upper substrate corresponds to upper heat radiating fin Piece offers opening, and upper radiating fin, in M shapes, the lower substrate corresponds to lower radiating fin and offers under shed, and lower scattered Hot fin is in M shapes.

3. the Aluminium Radiator according to claim 2 with water cooling, it is characterised in that：The upper substrate and lower substrate wrap It includes planar aluminium casing, be deposited on the high heat conduction diamond-like coating of aluminium casing outer surface, coated in aluminium casing The erosion resistant coating on surface, cooling Filled Dielectrics are inside erosion resistant coating.

4. the Aluminium Radiator according to claim 3 with water cooling, it is characterised in that：The upper radiating fin and lower heat dissipation Fin includes aluminum core and coated on aluminum core surface to the heat conversion layer by converting heat for infrared ray.

5. the Aluminium Radiator according to claim 4 with water cooling, it is characterised in that：The mounting bracket bottom opens up useful In the waist-shaped hole of locking.