CN207343569U - A kind of notebook computer casing heat dissipation pore stamping device - Google Patents
A kind of notebook computer casing heat dissipation pore stamping device Download PDFInfo
- Publication number
- CN207343569U CN207343569U CN201721370273.0U CN201721370273U CN207343569U CN 207343569 U CN207343569 U CN 207343569U CN 201721370273 U CN201721370273 U CN 201721370273U CN 207343569 U CN207343569 U CN 207343569U
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- plate
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- mold
- die holder
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- 239000011148 porous material Substances 0.000 title claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 10
- 230000000875 corresponding Effects 0.000 claims description 3
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- 238000003801 milling Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000005242 forging Methods 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002828 fuel tank Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical group data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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Abstract
The utility model discloses a kind of notebook computer casing heat dissipation pore stamping device, including upper mold seat and die holder, the lower section of the upper mold seat is from top to bottom provided with upper padding plate, upper clamp plate and baffle plate, the upper mold seat and the upper padding plate, upper mold dowel pin is provided between upper clamp plate, the upper mold seat and the upper padding plate, pass through upper mold screw connection between upper clamp plate, lower template is fixedly installed above the die holder, lower bolster is provided between the die holder and the lower template, the lower template, lower bolster is fixedly connected on die holder by lower die screw, the die holder, lower template, lower bolster is internally provided with lower die dowel pin, the upper surface of the lower template is provided with the die cavity for installing product.The utility model solves the problems, such as that traditional lower die enters block and is two layers and spells so that single blade insufficient strength, taper is cut greatly after improvement or back side electric discharge hole milling enters bulk strength and increases, improve service life, have the advantages that using effect is good.
Description
Technical field
Notebook computer casing stamping technology field is the utility model is related to, is specially a kind of notebook computer casing heat dissipation
Pore stamping device.
Background technology
Punching press is that depended on pressure machine and mould apply external force to plate, band, tubing and section bar etc., is allowed to produce plastic deformation
Or separation, so that the forming and machining method of the workpiece of shape and size needed for obtaining.Punching press and forging belong to plastic working together, are collectively referred to as
Forging and stamping.The blank of punching press is mainly the steel plate and steel band of hot rolling and cold rolling.In global steel, it is plate to have 60~70%,
Finished product is made by punching press in wherein most.Vehicle body, chassis, fuel tank, the radiator fin of automobile, the drum of boiler, the shell of container
Body, motor, the iron core silicon-steel sheet etc. of electric appliance are all punch process.Instrument and meter, household electrical appliance, bicycle, office machinery, life
In the products such as vessel living, also there are a large amount of stamping parts, the precision and structure of mould directly affect shaping and the precision of stamping parts.Mould
Manufacture cost and service life are then an important factor for influencing stamping parts cost and quality.When mold design and manufacture need more
Between, this just extends the Operational preparation time of new stamping parts.Die holder, mould bases, the standardization of guide part and development simple die, answer
Molding, multi-station progressive die, and quick die change device is developed, when can reduce punching production preparation amount and shorten preparation
Between, it can make reasonably to be applied to small lot multi-item production suitable for the advanced stamping technology produced in enormous quantities.Traditional punching press
Lower mould, which enters block, to be two layers and spells so that single blade insufficient strength.
Utility model content
The purpose of this utility model is to provide a kind of notebook computer casing heat dissipation pore stamping device, to solve the above-mentioned back of the body
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides following technical solution：A kind of notebook computer casing heat emission hole punching
Pressure device, including upper mold seat and die holder, the lower section of the upper mold seat are from top to bottom provided with upper padding plate, upper clamp plate and backstop
Plate, is provided with upper mold dowel pin between the upper mold seat and the upper padding plate, upper clamp plate, the upper mold seat and the upper padding plate, on
By upper mold screw connection between clamping plate, be fixedly installed lower template above the die holder, the die holder with it is described under
Lower bolster is provided between template, the lower template, lower bolster are fixedly connected on die holder by lower die screw, the lower die
Seat, lower template, lower bolster are internally provided with lower die dowel pin, and the upper surface of the lower template is provided with the mould for installing product
Chamber, the lower surface of the baffle plate are provided with stripper plate in the position of corresponding die cavity, and the lower section of the upper clamp plate and baffle plate is consolidated
Surely it is provided with punch.
Preferably, the lower template is being fixedly installed interior positioning in die cavity.
Preferably, contour set is provided between the upper padding plate, upper clamp plate and baffle plate.
Preferably, the side between the lower template and the baffle plate is provided with limited post, the lower template with it is described
Opposite side between baffle plate is provided with inner guiding post.
Preferably, the lower section of the die holder is connected with lower pallet by lower foot pad.
Compared with prior art, the beneficial effects of the utility model are：The utility model solves traditional lower die and enters block
It is two layers and spells so that taper is cut the big or back side electric discharge hole milling the problem of single blade insufficient strength, after improvement enters bulk strength
Increase, improve service life, have the advantages that using effect is good.
Brief description of the drawings
Fig. 1 is a kind of notebook computer casing heat dissipation pore stamping device overall structure diagram of the utility model.
In figure：1- upper mold seats；2- upper mold dowel pins；3- upper mold screws；The contour sets of 4-；5- upper padding plates；6- upper clamp plates；7- is rushed
Head；8- baffle plates；9- lower die screws；10- limited posts；11- lower pallets；Foot pad under 12-；13- inner guiding posts；14- lower die dowel pins；
Positioning in 15-；16- die holders；17- stripper plates；18- lower templates；19- lower bolsters；20- lower bolsters.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
Referring to Fig. 1, the utility model provides a kind of technical solution：A kind of notebook computer casing heat emission hole punching press dress
Put, including upper mold seat 1 and die holder 16, the lower section of the upper mold seat 1 are from top to bottom provided with upper padding plate 5, upper clamp plate 6 and backstop
Plate 8, is provided with upper mold dowel pin 2, the upper mold seat 1 and the upper pad between the upper mold seat 1 and the upper padding plate 5, upper clamp plate 6
Connected between plate 5, upper clamp plate 6 by upper mold screw 3, the top of the die holder 16 is fixedly installed lower template 18, under described
Lower bolster 20 is provided between die holder 16 and the lower template 18, the lower template 18, lower bolster 20 are fixed by lower die screw 9
It is connected on die holder 16, the die holder 16, lower template 18, lower bolster 20 are internally provided with lower die dowel pin 14, under described
The upper surface of template 18 is provided with the die cavity for installing product, and the lower surface of the baffle plate 8 is set in the position of corresponding die cavity
Stripper plate 17 is equipped with, the lower section of the upper clamp plate 6 and baffle plate 8 is fixedly installed punch 7.
The lower template 18 is being fixedly installed interior positioning 15 in die cavity, for fixing the position of processed product；
Contour set 4 is provided between the upper padding plate 5, upper clamp plate 6 and baffle plate 8, for stripper plate 17 to be held；The lower template 18
Side between the baffle plate 8 is provided with limited post 10, and the opposite side between the lower template 18 and the baffle plate 8 is set
Inner guiding post 13 is equipped with, plays the role of positioning；The lower section of the die holder 16 is connected with lower pallet 11 by lower foot pad 12, is used for
Support die holder 16.
The utility model solves the problems, such as that traditional lower die enters block and is two layers and spells so that single blade insufficient strength, changes
Taper cut into big or back side electric discharge hole milling after enter bulk strength and increase, improve service life, there is good excellent of using effect
Point.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed, or further include as this process, method, article or equipment
Intrinsic key element.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from the principle of the utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
- The pore stamping device 1. a kind of notebook computer casing radiates, including upper mold seat (1) and die holder (16), it is characterised in that： The lower section of the upper mold seat (1) is from top to bottom provided with upper padding plate (5), upper clamp plate (6) and baffle plate (8), the upper mold seat (1) It is provided with upper mold dowel pin (2) between the upper padding plate (5), upper clamp plate (6), the upper mold seat (1) and the upper padding plate (5), Connected between upper clamp plate (6) by upper mold screw (3), lower template (18), institute are fixedly installed above the die holder (16) State and lower bolster (20) is provided between die holder (16) and the lower template (18), the lower template (18), lower bolster (20) are logical Lower die screw (9) is crossed to be fixedly connected on die holder (16), the die holder (16), lower template (18), lower bolster (20) it is interior Portion is provided with lower die dowel pin (14), and the upper surface of the lower template (18) is provided with the die cavity for installing product, the backstop The lower surface of plate (8) is provided with the lower section of stripper plate (17), the upper clamp plate (6) and baffle plate (8) in the position of corresponding die cavity It is fixedly installed punch (7).
- A kind of 2. notebook computer casing heat dissipation pore stamping device according to claim 1, it is characterised in that：The lower die Plate (18) is being fixedly installed interior positioning (15) in die cavity.
- A kind of 3. notebook computer casing heat dissipation pore stamping device according to claim 1, it is characterised in that：The upper pad Contour set (4) is provided between plate (5), upper clamp plate (6) and baffle plate (8).
- A kind of 4. notebook computer casing heat dissipation pore stamping device according to claim 1, it is characterised in that：The lower die Side between plate (18) and the baffle plate (8) is provided with limited post (10), the lower template (18) and the baffle plate (8) Between opposite side be provided with inner guiding post (13).
- A kind of 5. notebook computer casing heat dissipation pore stamping device according to claim 1, it is characterised in that：The lower die The lower section of seat (16) is connected with lower pallet (11) by lower foot pad (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721370273.0U CN207343569U (en) | 2017-10-23 | 2017-10-23 | A kind of notebook computer casing heat dissipation pore stamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721370273.0U CN207343569U (en) | 2017-10-23 | 2017-10-23 | A kind of notebook computer casing heat dissipation pore stamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207343569U true CN207343569U (en) | 2018-05-11 |
Family
ID=62356231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721370273.0U Active CN207343569U (en) | 2017-10-23 | 2017-10-23 | A kind of notebook computer casing heat dissipation pore stamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207343569U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108714648A (en) * | 2018-06-13 | 2018-10-30 | 苏州博赢精密模具有限公司 | Kickboard and baffle plate balanced structure under a kind of progressive die |
-
2017
- 2017-10-23 CN CN201721370273.0U patent/CN207343569U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108714648A (en) * | 2018-06-13 | 2018-10-30 | 苏州博赢精密模具有限公司 | Kickboard and baffle plate balanced structure under a kind of progressive die |
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