CN207268719U - The ceramic package of MEMS gas sensors and module - Google Patents
The ceramic package of MEMS gas sensors and module Download PDFInfo
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- CN207268719U CN207268719U CN201721321871.9U CN201721321871U CN207268719U CN 207268719 U CN207268719 U CN 207268719U CN 201721321871 U CN201721321871 U CN 201721321871U CN 207268719 U CN207268719 U CN 207268719U
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Abstract
The utility model provides a kind of ceramic package of MEMS gas sensors and module, wherein, MEMS gas sensors include air-sensitive chip, base of ceramic and stainless steel cover board, and the air-sensitive chip is arranged on inside the base of ceramic, and the stainless steel cover plate lid is located on base of ceramic；The base of ceramic includes Base body and pedestal pads；Air hole is offered on the stainless steel cover board；The air-sensitive chip includes silicon substrate micro-hotplate, heating electrode, measuring electrode and air-sensitive material, one end of the silicon substrate micro-hotplate upper surface is two heating electrodes, the other end of the silicon substrate micro-hotplate upper surface is two measuring electrodes, the middle part of the silicon substrate micro-hotplate upper surface is air-sensitive material, and isolation channel is provided between the heating electrode and the measuring electrode；The measuring electrode is connected to the pedestal pads by being bonded gold thread；MEMS module ceramic packages further include the asic chip being arranged on inside the base of ceramic.
Description
Technical field
MEMS gas sensor domains are the utility model is related to, specifically, relate to a kind of MEMS gas sensors and mould
The ceramic package of group.
Background technology
It is domestic at present still without the MEMS gas sensors of ceramic package, the encapsulation of gas sensor be still including pipe cap,
The conventional package form of tube socket and electrode slice, production technology are essentially all to be made of artisan craftsmanship, and structure is entirely to hang
Formula structure, element poor seismic behavior, production cost is high, and it is limited that production industrialization expands development.
In order to solve the problems, such as present on, people are seeking a kind of preferable technical solution always.
Utility model content
The purpose of this utility model is in view of the deficiencies of the prior art, there is provided a kind of design science, it is simple in structure, be easy to raw
Produce the MEMS gas sensors of non-suspended structure and the ceramic package of module of industrialization.
To achieve these goals, technical solution is used by the utility model：A kind of MEMS gas sensors ceramics envelope
Dress, including air-sensitive chip, base of ceramic and stainless steel cover board, the air-sensitive chip is arranged on inside the base of ceramic, described
Stainless steel cover plate lid is located on base of ceramic；The base of ceramic includes Base body and pedestal pads；The stainless steel cover board
On offer air hole；The air-sensitive chip includes silicon substrate micro-hotplate, heating electrode, measuring electrode and air-sensitive material, the silicon substrate
One end of micro-hotplate upper surface is two heating electrodes, and the other end of the silicon substrate micro-hotplate upper surface is two measuring electrodes,
The middle part of the silicon substrate micro-hotplate upper surface is air-sensitive material, and isolation is provided between the heating electrode and the measuring electrode
Groove；The measuring electrode and the heating electrode are connected to the pedestal pads by being bonded gold thread.
Based on above-mentioned, the asic chip being arranged on inside the base of ceramic is further included, the asic chip passes through bonding
Gold thread is connected with the heating electrode.
Based on above-mentioned, by dispenser on the base of ceramic inner bottom millet cake epoxide-resin glue by the air-sensitive chip
It is fixed on inside the base of ceramic.
Based on above-mentioned, by dispenser on the base of ceramic inner bottom millet cake epoxide-resin glue by the asic chip
It is fixed on inside the base of ceramic.
Based on above-mentioned, by bind automatically machine by the measuring electrode of the air-sensitive chip by be bonded gold thread be welded on it is described
On pedestal pads.
Based on above-mentioned, the pin of the asic chip is welded on the pedestal by being bonded gold thread by binding machine automatically
On pad.
Based on above-mentioned, the stainless steel cover board is pasted onto on base of ceramic by epoxide-resin glue.
Based on above-mentioned, witness marker hole is offered in the Base body.
The utility model has substantive distinguishing features and progress compared with the prior art, and specifically, the utility model is by adopting
With non-suspended structure, and the mode of bonding gold thread welding, by air-sensitive chip bonding in base of ceramic, it is outstanding to solve tradition
Hanging structure poor seismic behavior, production industrialization expand the problem of development is limited.
Brief description of the drawings
Fig. 1 is the internal structure schematic diagram of the utility model MEMS gas sensors.
Fig. 2 is the internal structure schematic diagram of the utility model MEMS modules.
Fig. 3 is the structure diagram of the utility model base of ceramic.
Fig. 4 is the structure diagram of the utility model stainless steel cover board.
In figure：Air-sensitive chip 1；Base of ceramic 2；Stainless steel cover board 3；Asic chip 4；Silicon substrate micro-hotplate 11；Measuring electrode
13 and air-sensitive material 14；Heat electrode 12；Base body 21 and pedestal pads 22；Witness marker hole 23；Air hole 31.
Embodiment
Below by embodiment, the technical solution of the utility model is described in further detail.
As shown in Figure 1, a kind of MEMS gas sensors ceramic package, including air-sensitive chip 1, base of ceramic 2 and stainless steel cover
Plate 3, the air-sensitive chip 1 are arranged on inside the base of ceramic 2, and the lid of stainless steel cover board 3 is located at the base of ceramic 2
On；The base of ceramic 2 includes Base body 21 and pedestal pads 22；The air-sensitive chip 1 includes silicon substrate micro-hotplate 11, heating
Electrode 12, measuring electrode 13 and air-sensitive material 14, one end of 11 upper surface of silicon substrate micro-hotplate is two heating electrodes 12, described
The other end of 11 upper surface of silicon substrate micro-hotplate is two measuring electrodes 13, and the middle part of 11 upper surface of silicon substrate micro-hotplate is air-sensitive
Material 14, isolation channel is provided between the heating electrode 12 and the measuring electrode 13；The measuring electrode 13 and the heating
Electrode 12 is connected to the pedestal pads 22 by being bonded gold thread.
As shown in Fig. 2, MEMS modules further include the asic chip 4 being arranged on inside the base of ceramic, the ASIC cores
Piece 4 is connected by being bonded gold thread with the heating electrode 12.By the array package with asic chip, can expand to all
Heater-type gas sensor, can realize the miniaturization of gas sensor module, can also be encapsulated in a variety of air-sensitive chip portfolios
One base interior forms array, produces mini type gas sensor integration module.
As shown in figure 3, offer witness marker hole 23 in the base of ceramic main body 21.During specific assembling, pass through dispensing
The air-sensitive chip 1 is fixed in the base of ceramic 2 by machine epoxide-resin glue on the 2 inner bottom millet cake of base of ceramic
Portion；The measuring electrode 13 of the air-sensitive chip 1 is welded on pedestal pads 22 by binding machine automatically；The stainless steel cover board
3 are pasted onto on the base of ceramic 2 by epoxide-resin glue.Whole assembling technology procedure uses standard automated production.
As shown in figure 4, it is provided with air hole 31 on the stainless steel cover board 3.The stainless steel cover board 3 passes through epoxide-resin glue
It is pasted onto on base of ceramic 2.
Dispensing technology occupies critical role in the realization of this technique, different from suspension type encapsulation, air-sensitive chip patch type
Encapsulation and automatic wiring technology need accurate positioning, therefore the selection of dispenser is crucial, and the design uses robot point
The mode of glue is completed, and witness marker hole is offered in the Base body.
Binding technique is also the key of technique.Completed by using full-automatic binding robot, can be before formal binding
Simulation binding is carried out, it is automatic to correct the little deviation of air-sensitive chip and asic chip with respect to base of ceramic.Whole assembly technology mistake
The standard automated productions of Cheng Caiyong.
Finally it should be noted that:Above example is only illustrating the technical solution of the utility model rather than it is limited
System；Although the utility model is described in detail with reference to preferred embodiment, those of ordinary skill in the art should
Understand：It can still modify to specific embodiment of the present utility model or some technical characteristics are equally replaced
Change；Without departing from the spirit of technical solutions of the utility model, it should all cover in the claimed technical solution of the utility model
Among scope.
Claims (8)
- A kind of 1. MEMS gas sensors ceramic package, it is characterised in that：Including air-sensitive chip, base of ceramic and stainless steel cover board, The air-sensitive chip is arranged on inside the base of ceramic, and the stainless steel cover plate lid is located on base of ceramic；The base of ceramic includes Base body and pedestal pads；Air hole is offered on the stainless steel cover board；The air-sensitive Chip includes silicon substrate micro-hotplate, heating electrode, measuring electrode and air-sensitive material, and one end of the silicon substrate micro-hotplate upper surface is two Heat electrode, the other end of the silicon substrate micro-hotplate upper surface is two measuring electrodes, in the silicon substrate micro-hotplate upper surface Portion is air-sensitive material, and isolation channel is provided between the heating electrode and the measuring electrode；The measuring electrode and the heating Electrode is connected to the pedestal pads by being bonded gold thread.
- 2. MEMS gas sensors ceramic package according to claim 1, it is characterised in that：By dispenser in the ceramics The air-sensitive chip is fixed on inside the base of ceramic by epoxide-resin glue on the point of base interior bottom surface.
- 3. MEMS gas sensors ceramic package according to claim 1, it is characterised in that：By binding machine automatically by described in The measuring electrode of air-sensitive chip is welded on the pedestal pads by being bonded gold thread.
- 4. according to claim 1-3 any one of them MEMS gas sensor ceramic packages, it is characterised in that：The stainless steel cover Plate is pasted onto on base of ceramic by epoxide-resin glue.
- 5. MEMS gas sensors ceramic package according to claim 4, it is characterised in that：Offered in the Base body Witness marker hole.
- 6. a kind of MEMS module ceramic packages based on any one of the claim 1-5 MEMS gas sensors ceramic packages, its It is characterized in that：The asic chip being arranged on inside the base of ceramic is further included, the asic chip is by being bonded gold thread and institute State heating electrode connection.
- 7. MEMS modules ceramic package according to claim 6, it is characterised in that：By dispenser in the base of ceramic The asic chip is fixed on inside the base of ceramic by epoxide-resin glue on inner bottom millet cake.
- 8. MEMS modules ceramic package according to claim 6, it is characterised in that：By binding machine automatically by the ASIC The pin of chip is welded on the pedestal pads by being bonded gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721321871.9U CN207268719U (en) | 2017-10-14 | 2017-10-14 | The ceramic package of MEMS gas sensors and module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721321871.9U CN207268719U (en) | 2017-10-14 | 2017-10-14 | The ceramic package of MEMS gas sensors and module |
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| Publication Number | Publication Date |
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| CN207268719U true CN207268719U (en) | 2018-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721321871.9U Active CN207268719U (en) | 2017-10-14 | 2017-10-14 | The ceramic package of MEMS gas sensors and module |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107703189A (en) * | 2017-10-14 | 2018-02-16 | 郑州炜盛电子科技有限公司 | The ceramic package of MEMS gas sensors and module |
| CN114917948A (en) * | 2022-07-18 | 2022-08-19 | 山东乾能科技创新有限公司 | g-C 3 N 4 -Ag 3 PO 4 Preparation method of nano material, MEMS ammonia gas sensor and application thereof |
-
2017
- 2017-10-14 CN CN201721321871.9U patent/CN207268719U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107703189A (en) * | 2017-10-14 | 2018-02-16 | 郑州炜盛电子科技有限公司 | The ceramic package of MEMS gas sensors and module |
| CN114917948A (en) * | 2022-07-18 | 2022-08-19 | 山东乾能科技创新有限公司 | g-C 3 N 4 -Ag 3 PO 4 Preparation method of nano material, MEMS ammonia gas sensor and application thereof |
| CN114917948B (en) * | 2022-07-18 | 2022-10-25 | 山东乾能科技创新有限公司 | g-C 3 N 4 -Ag 3 PO 4 Preparation method of nano material, MEMS ammonia gas sensor and application thereof |
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