CN207233717U - A kind of silicon chip automatic blanking system - Google Patents

A kind of silicon chip automatic blanking system Download PDF

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Publication number
CN207233717U
CN207233717U CN201721329858.8U CN201721329858U CN207233717U CN 207233717 U CN207233717 U CN 207233717U CN 201721329858 U CN201721329858 U CN 201721329858U CN 207233717 U CN207233717 U CN 207233717U
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CN
China
Prior art keywords
transport
silicon chip
fixed
automatic blanking
snap
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Application number
CN201721329858.8U
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Chinese (zh)
Inventor
朱雷
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Nanjing Ying Rui Energy Technology Co Ltd
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Sichuan Yingfa Solar Technology Co Ltd
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Priority to CN201721329858.8U priority Critical patent/CN207233717U/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The utility model discloses a kind of silicon chip automatic blanking system, including the first transport mechanism, lifting gear and the second transport mechanism, the lifting gear includes fixed mechanism, the bottom of the fixed mechanism is provided with elevating mechanism, first transport mechanism is used to transmit silicon wafer bearing box, second transport mechanism is used to transmit silicon chip, the lower end of second transport mechanism is provided with horizontal air cylinder, the fixed mechanism is arranged on the second transport mechanism, between first transport mechanism, the fixed mechanism includes riser, the top and bottom of the riser are both provided with support plate, the upper end of the fixed mechanism is additionally provided with pressure strip below support plate, the pressure strip is provided at both ends with L-shaped snap-gauge, the L-shaped snap-gauge is moved left and right by cylinder control, the pressure strip is moved up and down by vertical cylinder control.The utility model solves the problems, such as that existing silicon wafer bearing box easily tilts.

Description

A kind of silicon chip automatic blanking system
Technical field
It the utility model is related to crystal silicon solar manufacturing technology field, and in particular to a kind of silicon chip automatic blanking system.
Background technology
Crystal silicon solar energy battery manufacture craft includes making herbs into wool, the work such as spreads, wash phosphorus, depositing antireflection film, print electrode Skill.More than 70% transmits by belt or roller between each process equipment and process, and after technique is completed, blanking generally relies on people Work takes piece to carry out blanking or automation blanking box progress blanking.Piece is manually taken to carry out blanking, such production process not only carries High cost of labor, simultaneously because human hand directly contacts cell piece, causes the damage of matte after battery slice etching.
When silicon wafer bearing box transmits during existing automation blanking easily tiltedly, when lifting, contacts with belt transmission mechanism, leads Cause belt transmission mechanism deformation.
Utility model content
The purpose of this utility model is to provide a kind of silicon chip automatic blanking system, solves existing silicon wafer bearing box and easily tilts The problem of.
The utility model is achieved through the following technical solutions：
A kind of silicon chip automatic blanking system, including the first transport mechanism, lifting gear and the second transport mechanism, the lifting Device includes fixed mechanism, and the bottom of the fixed mechanism is provided with elevating mechanism, and first transport mechanism is used to transmit silicon The bottom of piece Carrier box, first transport mechanism and fixed mechanism is arranged on first in same level, the fixed mechanism The rear end of transport mechanism, second transport mechanism are used to transmit silicon chip, and the lower end of second transport mechanism is provided with level Cylinder, the fixed mechanism are arranged on the rear end of the second transport mechanism, and the fixed mechanism is arranged on the second transport mechanism, first Between transport mechanism, the fixed mechanism includes riser, and the top and bottom of the riser are both provided with support plate, the fixation The upper end of mechanism is additionally provided with pressure strip below support plate, and the pressure strip is provided at both ends with L-shaped snap-gauge, the L-shaped card Plate is moved left and right by cylinder control, and the pressure strip is moved up and down by vertical cylinder control.
When existing silicon wafer bearing box is transported on fixed mechanism by the first transport mechanism, corresponding fixed knot is not provided with Structure, easily leads to silicon wafer bearing box run-off the straight on fixed mechanism.
Front and rear or rear end described in the utility model is the horizontal air cylinder for the direction of motion of opposite fortune transport mechanism It can realize the contraction in horizontal direction, and then realize the movement of the second transport mechanism in the horizontal direction, the vertical cylinder Enough realize the contraction on vertical direction, then realize the raising and lowering of pressure strip, 2 L-shaped snap-gauges are oppositely arranged, and pass through cylinder Realize that L-shaped snap-gauge is opposite or relatively moves.
The operation principle of the utility model：After silicon wafer bearing box is transported on fixed mechanism by the first transport mechanism, cylinder 2 L-shaped snap-gauges are pushed out into (relative motion), while vertical cylinder pushes down on pressure strip, is set until pressure strip compresses The support plate in upper end is put, then 2 L-shaped snap-gauges are inwardly promoted and (moved toward one another) by cylinder so that 2 L-shaped snap-gauges are by silicon chip The symmetrical edge of 2 of the upper end of Carrier box clamps, and then realizes and silicon wafer bearing box is fixed in fixed mechanism, then elevator Structure promotes fixed mechanism to be moved upwardly until the height for moving to and coordinating with the second transport mechanism, and horizontal air cylinder is by the second conveyer Structure is pushed to inside silicon wafer bearing box, and first silicon chip is placed on silicon wafer bearing box, and then elevating mechanism promotes fixed machine Structure moves upwards, and second silicon chip is placed on silicon wafer bearing box, and so on, until filling silicon chip in silicon wafer bearing box.
The utility model on fixed mechanism by setting the pressure strip and L-shaped snap-gauge that are used for clamping silicon wafer bearing box, institute State pressure strip and realized under the action of vertical cylinder and moved up and down, 2 L-shaped snap-gauges are under the action of cylinder, opposite or phase To movement, realize and clamp silicon wafer bearing box, avoid its inclination that shifts in fixed mechanism.In this way, the utility model solution The problem of existing silicon wafer bearing box of having determined easily tilts.
Further, silicon wafer bearing box includes 2 symmetrically arranged horizontal bases, and 4 are provided between 2 horizontal bases Supporting rod, the silicon wafer bearing box further include 2 symmetrically arranged vertical snap-gauges, and the vertical snap-gauge is arranged in supporting rod Side, is provided with silicon chip placement plate on the inside of the vertical snap-gauge, and the silicon chip placement plate on 2 vertical snap-gauges corresponds setting, and 2 A L-shaped snap-gauge is used to clamp the horizontal base being disposed over.
The inner side specifically refers to 2 vertical opposite sides of snap-gauge.
Further, the end set for being arranged on the support plate of lower end has baffle.
The setting of the baffle can play silicon wafer bearing box certain position-limiting action, further improve silicon wafer bearing box Stability maintenance.
Further, the lower end of riser is provided with the first limiting plate in one end close to the second transport mechanism.
It is when silicon wafer bearing box is transported on fixed mechanism by the first transport mechanism, there is inertia, it is possible to silicon can be caused Piece Carrier box moves forward, and the setting of first limiting plate can prevent silicon wafer bearing box from moving out fixed mechanism.
Further, the upper end of riser is provided with the second limiting plate in one end close to the second transport mechanism.
Second limiting plate can to the upper end of silicon wafer bearing box carry out it is spacing, avoid silicon wafer bearing box run-off the straight or It is to be moved forward out fixed mechanism.
Further, the second limiting plate is U-shaped structure, and the openend of the U-shaped structure is away from the second transport mechanism.
The U-shaped structure can just clamping silicon wafer bearing box upper end, improve the second limiting plate to silicon wafer bearing box Position-limiting action.
Further, the both sides of the first transport mechanism are provided with limiting plate.
The setting of the limiting plate can avoid silicon wafer bearing box run-off the straight when being moved in the first transport mechanism.
Further, it is arranged on the transport mechanism for being provided with the support plate of lower end and coordinating with the first transport mechanism.
The setting of the transport mechanism steadily can be transported silicon wafer bearing box to fixed mechanism by the first transport mechanism.
Further, the first transport mechanism and the second transport mechanism are belt transmission.
Further, the upper surface for being arranged on the support plate of lower end is flank.
The flank can increase frictional force when support plate is contacted with silicon wafer bearing box, further improve silicon chip carrying Box stability maintenance.
The utility model compared with prior art, has the following advantages and advantages：
The utility model on fixed mechanism by setting the pressure strip and L-shaped snap-gauge that are used for clamping silicon wafer bearing box, institute State pressure strip and realized under the action of vertical cylinder and moved up and down, 2 L-shaped snap-gauges are under the action of cylinder, opposite or phase To movement, realize and clamp silicon wafer bearing box, avoid its inclination that shifts in fixed mechanism.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the utility model embodiment, forms the one of the application Part, does not form the restriction to the utility model embodiment.In the accompanying drawings：
Fig. 1 is the structure diagram of blanking system；
Fig. 2 is the structure diagram that elevating mechanism coordinates with silicon wafer bearing box.
Mark and corresponding parts title in attached drawing：
The first transport mechanisms of 1-, 2- silicon wafer bearing boxes, 3- fixed mechanisms, the second transport mechanisms of 4-, 5- elevating mechanisms, 6- water Flat cylinder, 7- silicon chips, 11- limiting plates, 21- horizontal bases, 22- supporting rods, the vertical snap-gauges of 23-, 24- silicon chip placement plates, 31- are stood Plate, 32- support plates, 33- pressure strips, 34-L shape snap-gauges, 35- vertical cylinders, the second limiting plates of 36-, the first limiting plates of 37-, 38- Baffle.
Embodiment
For the purpose of this utility model, technical solution and advantage is more clearly understood, with reference to embodiment and attached drawing, The utility model is described in further detail, and the exemplary embodiment and its explanation of the utility model are only used for explaining this Utility model, is not intended to limit the scope of the present invention.
Embodiment 1：
As shown in Figure 1 and Figure 2, a kind of silicon chip automatic blanking system, including the first transport mechanism 1, lifting gear and second pass Sending mechanism 4, the lifting gear includes fixed mechanism 3, and the bottom of the fixed mechanism 3 is provided with elevating mechanism 5, and described first Transport mechanism 1 is used to transmit silicon wafer bearing box 2, and the silicon wafer bearing box 2 includes 2 symmetrically arranged 21,2 water of horizontal base 4 supporting rods 22 are provided between flat bed 21, the silicon wafer bearing box 2 further includes 2 symmetrically arranged vertical snap-gauges 23, institute State vertical snap-gauge 23 and be arranged on the inner side of supporting rod 22, the inner side of the vertical snap-gauge 23 is provided with silicon chip placement plate 24,2 vertically Silicon chip placement plate 24 on snap-gauge 23, which corresponds, to be set, and 2 L-shaped snap-gauges 34 are used to clamp the horizontal base being disposed over 21, first transport mechanism 1 and the bottom of fixed mechanism 3 are arranged on the first transmission in same level, the fixed mechanism 3 The rear end of mechanism 1, second transport mechanism 4 are used to transmit silicon chip 7, and the lower end of second transport mechanism 4 is provided with level Cylinder 6, the fixed mechanism 3 are arranged on the rear end of the second transport mechanism 4, and the fixed mechanism 3 is arranged on the second transport mechanism 4th, between the first transport mechanism 1, the fixed mechanism 3 includes riser 31, and the top and bottom of the riser 31 are both provided with branch Fagging 32, is arranged on the transport mechanism for being provided with the support plate 32 of lower end and coordinating with the first transport mechanism 1, the fixed mechanism 3 upper end is additionally provided with pressure strip 33 below support plate 32, and the pressure strip 33 is provided at both ends with L-shaped snap-gauge 34, the L Shape snap-gauge 34 is moved left and right by cylinder control, and the pressure strip 33 is moved up and down by the control of vertical cylinder 35；First transmission 1 and second transport mechanism 4 of mechanism is belt transmission.
Embodiment 2：
As shown in Figure 1 and Figure 2, the present embodiment is based on embodiment 1, and the end set for being arranged on the support plate 32 of lower end has gear Plate 38；The lower end of the riser 31 is provided with the first limiting plate 37 in one end close to the second transport mechanism 4；The riser 31 Upper end is provided with the second limiting plate 36 in one end close to the second transport mechanism 4；Second limiting plate 36 is U-shaped structure, institute The openend of U-shaped structure is stated away from the second transport mechanism 4；The both sides of first transport mechanism 1 are provided with limiting plate 11；Set It is flank in the upper surface of the support plate 32 of lower end.
Above-described embodiment, the purpose of this utility model, technical solution and beneficial effect have been carried out into One step describes in detail, it should be understood that the foregoing is merely specific embodiment of the present utility model, is not used to limit Determine the scope of protection of the utility model, where within the spirit and principles of the present invention, any modification for being made, equally replace Change, improve, should be included within the scope of protection of this utility model.

Claims (10)

1. a kind of silicon chip automatic blanking system, including the first transport mechanism (1), lifting gear and the second transport mechanism (4), described Lifting gear includes fixed mechanism (3), and the bottom of the fixed mechanism (3) is provided with elevating mechanism (5), first conveyer Structure (1) is used to transmit silicon wafer bearing box (2), and the bottom of first transport mechanism (1) and fixed mechanism (3) is in same level Face, the fixed mechanism (3) are arranged on the rear end of the first transport mechanism (1), and second transport mechanism (4) is used to transmit silicon chip (7), the lower end of second transport mechanism (4) is provided with horizontal air cylinder (6), and the fixed mechanism (3) is arranged on the second transmission The rear end of mechanism (4), the fixed mechanism (3) are arranged between the second transport mechanism (4), the first transport mechanism (1), its feature It is, the fixed mechanism (3) includes riser (31), and the top and bottom of the riser (31) are both provided with support plate (32), The upper end of the fixed mechanism (3) is additionally provided with pressure strip (33), the both ends of the pressure strip (33) below support plate (32) L-shaped snap-gauge (34) is provided with, the L-shaped snap-gauge (34) is moved left and right by cylinder control, and the pressure strip (33) is by vertical cylinder (35) control moves up and down.
A kind of 2. silicon chip automatic blanking system according to claim 1, it is characterised in that silicon wafer bearing box (2) bag 2 symmetrically arranged horizontal bases (21) are included, are provided with 4 supporting rods (22) between 2 horizontal bases (21), the silicon chip is held Carrying box (2) and further include 2 symmetrically arranged vertical snap-gauges (23), the vertical snap-gauge (23) is arranged on the inside of supporting rod (22), It is provided with silicon chip placement plate (24) on the inside of the vertical snap-gauge (23), the silicon chip placement plate (24) on 2 vertical snap-gauges (23) Correspond and set, 2 L-shaped snap-gauges (34) are used to clamp the horizontal base (21) being disposed over.
3. a kind of silicon chip automatic blanking system according to claim 1, it is characterised in that be arranged on the support plate of lower end (32) end set has baffle (38).
4. a kind of silicon chip automatic blanking system according to claim 1, it is characterised in that the lower end of the riser (31) exists One end of second transport mechanism (4) is provided with the first limiting plate (37).
5. a kind of silicon chip automatic blanking system according to claim 1, it is characterised in that the upper end of the riser (31) exists One end of second transport mechanism (4) is provided with the second limiting plate (36).
6. a kind of silicon chip automatic blanking system according to claim 5, it is characterised in that second limiting plate (36) is U-shaped structure, the openend of the U-shaped structure is away from the second transport mechanism (4).
A kind of 7. silicon chip automatic blanking system according to claim 1, it is characterised in that first transport mechanism (1) Both sides be provided with limiting plate (11).
8. a kind of silicon chip automatic blanking system according to claim 1, it is characterised in that be arranged on the support plate of lower end (32) transport mechanism coordinated with the first transport mechanism (1) is provided with.
A kind of 9. silicon chip automatic blanking system according to claim 1, it is characterised in that first transport mechanism (1) It is belt transmission with the second transport mechanism (4).
10. a kind of silicon chip automatic blanking system according to claim 1, it is characterised in that be arranged on the support plate of lower end (32) upper surface is flank.
CN201721329858.8U 2017-10-16 2017-10-16 A kind of silicon chip automatic blanking system Active CN207233717U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721329858.8U CN207233717U (en) 2017-10-16 2017-10-16 A kind of silicon chip automatic blanking system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721329858.8U CN207233717U (en) 2017-10-16 2017-10-16 A kind of silicon chip automatic blanking system

Publications (1)

Publication Number Publication Date
CN207233717U true CN207233717U (en) 2018-04-13

Family

ID=61850649

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721329858.8U Active CN207233717U (en) 2017-10-16 2017-10-16 A kind of silicon chip automatic blanking system

Country Status (1)

Country Link
CN (1) CN207233717U (en)

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Effective date of registration: 20180620

Address after: 210000 23 North Bridge Road, Jiangbei new district, Nanjing, Jiangsu

Patentee after: Nanjing Ying Rui Energy Technology Co Ltd

Address before: 610000 Chengdu, Sichuan, China (Sichuan) free trade zone, 1 Print-Rite Road, Southwest Airport Economic Development Zone, Shuangliu District, Chengdu.

Patentee before: Sichuan Yingfa Solar Technology Co. Ltd.