CN207217566U - Silicon chip guiding mechanism - Google Patents
Silicon chip guiding mechanism Download PDFInfo
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- CN207217566U CN207217566U CN201720967130.1U CN201720967130U CN207217566U CN 207217566 U CN207217566 U CN 207217566U CN 201720967130 U CN201720967130 U CN 201720967130U CN 207217566 U CN207217566 U CN 207217566U
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- guide plate
- guide
- silicon chip
- drive component
- plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of silicon chip guiding mechanism, including：First guider and the second guider, first guider are used to jack up the silicon chip in fixture, are vertically supported guiding to the silicon chip；Second guider is arranged in pairs in the top both sides of first guider, and the guiding for the silicon chip being supported on first guider to be carried out to placing attitude in the horizontal direction adjusts.The utility model is adjusted by the guiding of the placing attitude to silicon chip, is changed the spacing between silicon chip, is easy to the insertion of silicon wafer sucking disc, silicon chip is captured, and is touched so as to avoid silicon wafer sucking disc and is damaged silicon chip.
Description
Technical field
Photovoltaic automation equipment field is the utility model is related to, is specifically related to a kind of silicon chip guiding mechanism.Background technology
In manufacture of solar cells link, when depositing silicon chip using fixture, the spacing between adjacent silicon chip is 2.38mm,
And the silicon wafer sucking disc thickness that in the market generally uses is generally 1.5-2mm, silicon chip is drawn from fixture using above-mentioned silicon wafer sucking disc
When, silicon chip is easily touched, is damaged.
The content of the invention
The purpose of this utility model is to provide a kind of silicon chip guiding mechanism, is adjusted by the guiding of the placing attitude to silicon chip
It is whole, change the spacing between silicon chip, be easy to the insertion of silicon wafer sucking disc, silicon chip is captured.
Above-mentioned purpose of the present utility model can be realized using following technical proposal：The utility model provides a kind of silicon chip and led
To mechanism, including the first guider and the second guider, second guider is arranged in pairs in described first and is oriented to
The top both sides of device；First guider includes the first guide plate drive component and is arranged on the first guide plate driving group
First guide plate of part drive end, the side of the first guide plate towards the silicon chip has jagged first guide part, described
First guide plate drive component drives first guide plate to jack the silicon chip in fixture between second guider；
Second guider includes the second guide plate drive component A, the second guide plate drive component B, the second guide plate A and second
Guide plate B, the second guide plate A are arranged on the drive end of the second guide plate drive component A, the second guide plate B
The drive end of the second guide plate drive component B is arranged on, is divided on the second guide plate A and the second guide plate B
Put and be parallel to each other；The side of second guide plate A towards the silicon chip has a jagged second guide part A, and described
The side of two guide plate B towards the silicon chips has jagged second guide part B；The second guide plate drive component A is used
In driving the second guide plate A side-to-side movements so that each silicon chip is placed in the second guide part A in parallel to each other
Sawtooth teeth groove in；The second guide plate drive component B is used to drive the second guide plate B side-to-side movements so that every
Two silicon chip upper ends are placed in a teeth groove of the sawtooth of the second guide part B with abutting.
In embodiment of the present utility model, the tooth pitch of the sawtooth of first guide part and the spacing phase of the silicon chip
Deng, the crown spacing of the crown spacing of the sawtooth of the second guide part A and the sawtooth of first guide part is equal, and described
The crown spacing of two guide part B sawtooth is twice of the crown spacing of the sawtooth of first guide part.
In embodiment of the present utility model, the teeth groove of the sawtooth of the second guide part B is V-shaped.
In embodiment of the present utility model, the second guide plate drive component A and the second guide plate driving group
Part B is separately positioned on the second bottom plate, and the second bottom plate rear and front end is hung down respectively is provided with the second riser, and two described second vertical
Plate top is provided with the second top plate；The second bottom plate top front and rear sides are provided with the second guide A, second guide
For A between two second risers, two the second guide A sliding end is connected with the second connecting plate A, and described the
Two connecting plate A bottoms are provided with the second guide plate A, and the drive end of the second guide plate drive component A is connected to described second
On connecting plate A；The second top plate bottom front and rear sides are provided with the second guide B, the second guide B and are located at two institutes
Between stating the second riser, two the second guide B sliding end is connected with the second connecting plate B, the second connecting plate B
The drive end that portion is provided with the second guide plate B, the second guide plate drive component B is connected on the second connecting plate B.
In embodiment of the present utility model, the second guide plate drive component B and the second guide plate drive component A have
There are at least two sections of driving trips.
In embodiment of the present utility model, the second guide plate drive component B and the second guide plate drive component A have
There is identical structure.
In embodiment of the present utility model, the second guide plate drive component A includes the first cylinder A, the second cylinder
A, the first cylinder contiguous block A, the second cylinder contiguous block A and cylinder guide A, the described one end of first cylinder A away from drive end
It is fixedly connected with the described one end of second cylinder A away from drive end, the drive end of the first cylinder A is connected to first gas
On cylinder contiguous block A, the second cylinder A is arranged on the second cylinder contiguous block A, and the cylinder guidance part A is arranged on institute
State on the second bottom plate and be fixedly installed on the bottom of the horizontal component of the second cylinder contiguous block A.
In embodiment of the present utility model, the teeth groove of the sawtooth of first guide part is in Y-shaped, and the teeth groove includes
Vertical deep trouth portion and " V " shape shallow slot portion, the bottom in the shallow slot portion is connected with the top in the deep trouth portion.
In embodiment of the present utility model, the first guide plate drive component is arranged on the first bottom plate, along described
First guide plate drive component driving direction is arranged with the first guide, the drive end of the first guide plate drive component in parallel
Lifting portable plate is connected with the sliding end of first guide, the first connecting plate, institute are provided with the lifting portable plate
State and be symmetrically arranged with the first guide plate at left and right sides of the first connecting plate.
In embodiment of the present utility model, the first guide plate drive component is made up of motor, and the motor passes through
Shaft coupling is connected with screw mandrel, and feed screw nut is provided with the screw mandrel, and the feed screw nut is connected with the lifting portable plate；Institute
Stating motor drives the feed screw nut on the screw mandrel to move, and drives the lifting portable plate elevating movement.
The beneficial effects of the utility model are：Adjusted by the guiding of the placing attitude to silicon chip, between change silicon chip
Spacing, it is easy to the insertion of silicon wafer sucking disc, silicon chip is captured, touches so as to avoid silicon wafer sucking disc and damage silicon chip.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the utility model, will make below to required in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the utility model,
For those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Other accompanying drawings.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the first guider of the present utility model.
Fig. 3 is the structural representation of the first angle of the second guider of the present utility model.
Fig. 4 is the structural representation of the second angle of the second guider of the present utility model.
Fig. 5 is the schematic diagram of the initial placing attitude of silicon chip of the present utility model.
Fig. 6 is the schematic diagram of placing attitude of the silicon chip of the present utility model after being oriented to and adjusting.
The reference of the figures above is：1st, the first guider；11st, the first guide plate drive component；12nd, first it is oriented to
Plate；121st, the first guide part；13rd, lifting portable plate；14th, the first connecting plate；15th, the first guide；16th, the first bottom plate；2nd,
Two guiders；21st, the second guide plate drive component A；211st, the first cylinder A；212nd, the second cylinder A；213rd, the first cylinder connects
Meet block A；214th, cylinder guidance part A；215th, the second cylinder contiguous block A；22nd, the second guide plate drive component B；23rd, second it is oriented to
Plate A；24th, the second guide plate B；241st, the second guide part B；251st, the second bottom plate；252nd, the second riser；253rd, the second top plate；26、
Second guide B；27th, the second connecting plate B；28th, the second guide A；29th, the second connecting plate A；3rd, silicon chip.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment, based on the embodiment in the utility model, those of ordinary skill in the art are not making the premise of creative work
Lower obtained other embodiment, belong to the scope of the utility model protection.
Coordinate uses in describing below：With in Fig. 1 left and right for left and right, up and down be it is upper and lower, it is on the contrary before vertical paper is outwards
To be rear.
As shown in figure 1, the utility model provides a kind of silicon chip guiding mechanism, including the first guider 1 and second is oriented to
Device 2, the first guider 1 are used to jack up the silicon chip 3 in fixture, are vertically supported guiding to the silicon chip 3；The
Two guiders 2 are arranged in pairs in the top both sides of the first guider 1, for will be supported on the first guider 1
Silicon chip 3 carries out the guiding adjustment of placing attitude in the horizontal direction.
As shown in Figure 5, Figure 6, the initial placing attitude of silicon chip 3 is to be placed in the first guide part substantially parallel to each other
In the teeth groove of 121 sawtooth, it is preferred that teeth groove is in Y-shaped, including vertical deep trouth portion and " V " shape shallow slot portion, the bottom in shallow slot portion
End is connected with the top in deep trouth portion, and silicon chip 3 is inserted in deep trouth portion, is limited by deep trouth portion two at a distance of less cell wall, substantially
On stand in teeth groove, there is also the situation about leaning against on cell wall of inclining slightly.In a specific embodiment, adjacent two silicon chip 3
Spacing is 2.38mm, the silicon wafer sucking disc now generally used using in the market（Thickness is 1.5mm-2mm）When removing to draw silicon chip 3,
Silicon wafer sucking disc touching silicon chip 3 is easily caused, causes the damage of silicon chip 3；Pendulum by embodiment of the present utility model to silicon chip 3
Put after posture carries out guiding adjustment, the placing attitude of silicon chip 3 abuts for the upper end of adjacent odd number silicon chip and even number silicon chip
（From left to right count, numbering is that the silicon chip of odd number is defined as odd number silicon chip, and numbering is that the silicon chip of even number is defined as even number silicon chip）,
Generally in " ∧ " shape, the spacing of every group of silicon chip 3 abutted silicon chip 3 for abutting adjacent with another group is 4.76
Mm, when now drawing silicon chip 3 using above-mentioned silicon wafer sucking disc, just it is not easy silicon wafer sucking disc touching silicon chip 3 occur, silicon chip 3 is damaged
Bad situation.
As shown in Figure 1 and Figure 2, the first guider 1 includes the first guide plate drive component 11 and is arranged on the first guide plate
First guide plate 12 of the drive end of drive component 11, the side of the first guide plate 12 towards silicon chip have jagged first to be oriented to
Portion 121；The tooth pitch of the sawtooth of first guide part 121 is equal with the spacing of silicon chip 3.In a specific embodiment, first is oriented to
Plate 12 can be one, and first guide plate 12 is along the length direction of silicon chip 3（From left to right）Thickness be sufficiently wide, Ke Yiwen
Surely supporting silicon chip 3；First guide plate 12 can be two or more, be arranged on the first guide plate drive component 11 spaced and parallelly
Drive end, now the thickness of the first guide plate 12 can do thinner, it is preferred that the number of the first guide plate 12 be two.
In an embodiment of the present utility model, the first guide plate drive component 11 is arranged on the first bottom plate 16,
The first guide 15, the drive of the first guide plate drive component 11 are arranged with parallel along the driving direction of the first guide plate drive component 11
The sliding end of moved end and the first guide 15 is connected with lifting portable plate 13, and the first connecting plate is provided with lifting portable plate 13
14, the left and right sides of the first connecting plate 14 is symmetrically arranged with the first guide plate 12.Wherein, the first guide 15 is slide rail.
In one embodiment, the first guide plate drive component 11 is made up of motor, and motor passes through shaft coupling and screw mandrel
Connect, be provided with feed screw nut on screw mandrel, feed screw nut is connected with lifting portable plate 13；Feed screw nut in motor drive screw
Motion, drive the elevating movement of lifting portable plate 13.
As shown in Fig. 1, Fig. 3, Fig. 4, the second guider 2 includes the second guide plate drive component A21, the second guide plate drives
Dynamic component B22, the second guide plate A23 and the second guide plate B24, the second guide plate A23 are arranged on the second guide plate drive component
A21 drive end, the second guide plate B24 are arranged on the second guide plate drive component B22 drive end, the second guide plate driving group
Part A21 and the second guide plate drive component B22 has at least two sections of driving trips respectively, and the second guide plate A23 and second is oriented to
Plate B24 is setting up and down and is parallel to each other.
The side of second guide plate A23 towards silicon chip 3 has jagged second guide part A, the second guide plate B24 directions
The side of silicon chip 3 has jagged second guide part B241；Specifically, the teeth groove of the second guide part B241 sawtooth is " V "
Shape.
The crown spacing of the sawtooth of the crown spacing of second guide part A sawtooth and the first guide part 121 is equal, and second leads
Crown spacing to portion B241 sawtooth is twice of the crown spacing of the sawtooth of the first guide part 121.Specifically, first is oriented to
The crown spacing of the guide part A of portion 121 and second sawtooth is 2.38mm, and the crown spacing of the second guide part B241 sawtooth is
4.76mm。
In an embodiment of the present utility model, the second guide plate drive component A21 and the second guide plate driving group
Part B22 is separately positioned on the second bottom plate 251, and the rear and front end of the second bottom plate 251 is hung down respectively is provided with the second riser 252, two the
The top of two riser 252 is provided with the second top plate 253；The top front and rear sides of second bottom plate 251 are provided with the second guide A28, the
Two guide A28 are between two the second risers 252；Two the second guide A28 sliding end is connected with the second connecting plate
A29, the second connecting plate A29 bottoms are provided with the second guide plate A23, and the second guide plate drive component A21 drive end is connected to
On second connecting plate A29, the second connecting plate A29 can be driven to drive the second guide plate A23 to be moved towards or away from silicon chip 3；The
The bottom front and rear sides of two top plate 253 are provided with the second guide B26, the second guide B26 positioned at two the second risers 252 it
Between；Two the second guide B26 sliding end is connected with the second connecting plate B27, and the second connecting plate B27 tops are provided with second and led
To plate B24, the second guide plate drive component B22 drive end is connected on the second connecting plate B27, can drive the second connecting plate
B27 drives the second guide plate B24 to be moved towards or away from silicon chip 3.Wherein, the second guide A28 and the second guide B26 is cunning
Rail, further, slide rail bottom can set up keel, adjust the height of slide rail so that the sliding block being equipped with slide rail and
Two connecting plate A29 and the second connecting plate B27 connections.
In a specific embodiment, the second guide plate drive component A21 includes the first cylinder A211, the second cylinder
A212, the first cylinder contiguous block A213, the second cylinder contiguous block A215 and cylinder guide A214, the first cylinder A211 are away from drive
One end of moved end is fixedly connected with second one end of cylinder A212 away from drive end, and the first cylinder A211 drive end is connected to
On one cylinder contiguous block A213, the second cylinder A212 is arranged on the second cylinder contiguous block A215, and cylinder guidance part A214 is set
On the second bottom plate 251 and it is fixedly installed on the bottom of the second cylinder contiguous block A215 horizontal component.By the first cylinder A211
There are two sections of strokes with the actuator of the second cylinder A212 compositions, the piston rod that first paragraph stroke is the first cylinder A211 stretches out,
The second cylinder A212 is promoted to be moved towards silicon chip 3, the piston rod that second segment stroke is the second cylinder A212 stretches out, thus, second
Guide plate drive component A21 has two sections of strokes.
In another specific embodiment, the second guide plate drive component A21 is made up of motor, motor by shaft coupling with
Screw mandrel connects, and is provided with feed screw nut on screw mandrel, feed screw nut is connected with the second connecting plate A29；Silk in motor drive screw
Stem nut moves, and drives the second connecting plate A29 to be moved towards or away from silicon chip 3.During motor driving, the second connecting plate A29
Motion process is continuous, can be considered as with some sections of strokes.
Second guide plate drive component B22 and the second guide plate drive component A21 have identical structure, just do not go to live in the household of one's in-laws on getting married herein
State.
The course of work of the present utility model is described below：
The fixture of carrying silicon chip 3 flows to the top of the first guider 1, the first guide plate driving of the first guider 1
Component 11 drives the first guide plate 12 to rise（Rise to the sawtooth that the second guide plate A23 is generally in the first guide plate of face 12
Partial position, the as lower end position of silicon chip 3, the silicon chip 3 of the position are inserted in teeth groove, and relative distance is relatively more stable, it is not easy to
There is the situation in the gap of the second guide plate A23 wrong plugs silicon chip 3）, silicon chip 3 is jacked up into support guide；Now, silicon chip 3 is in
In the teeth groove of the sawtooth of first guide part 121 of one guide plate 12, placing attitude is to be substantially parallel to each other.
Then, the second guide plate drive component A21 of two the second guiders 2 drives the second guide plate A23 courts simultaneously
A trip is fed to silicon chip 3, the second guide plate A23 the second guide part A sawtooth is inserted in the gap of silicon chip 3（Towards silicon
The motion of piece 3 is defined as feeding, and is defined as retracting away from the motion of silicon chip 3.）.
In the process, when silicon chip 3 puts more at random, the second guide plate driving group of two the second guiders 2
Part A21 drives the second guide plate A23 to be directly fed two sections of strokes, the second guide plate A23 the second guide part towards silicon chip 3 simultaneously
In the gap of A sawtooth insertion silicon chip 3, silicon chip 3 is being entered into professional etiquette just, rule are just complete rear while away from the rollback a trip of silicon chip 3.
Followed by, the first guider 1 the first guide plate drive component 11 drive the first guide plate 12 decline one section away from
From so that the second guide part A sawtooth is located at the upper end position of silicon chip 3, by end gauage on silicon chip 3 just so that silicon chip 3 is parallel to each other.
Then, the second guide plate drive component B22 of two the second guiders 2 drives the second guide plate B24 courts simultaneously
A trip, the gap of the second guide plate B24 the second guide part B241 a small half of insertion silicon chip 3 of sawtooth are fed to silicon chip 3
In.
Subsequently, the second guide plate drive component A21 of two the second guiders 2 drives the second guide plate A23 simultaneously
Away from the rollback a trip of silicon chip 3, the second guide plate A23 the second guide part A sawtooth is withdrawn from the gap of silicon chip 3, simultaneously
Second guide plate drive component B22 of two the second guiders 2 drives the second guide plate B24 to be fed again towards silicon chip 3 simultaneously
A trip, the second guide plate B24 the second guide part B241 sawtooth are entirely insertable in the gap of silicon chip 3, are led due to second
Crown distance to the sawtooth in portion 241 is twice of the spacing of silicon chip 3, so be in per two panels silicon chip 3 in same sawtooth teeth groove,
Under silicon chip 3 Action of Gravity Field of itself, topple over to both sides, now, the placing attitude of silicon chip 3 is adjacent odd number silicon chip and even number
Silicon chip upper end abuts, generally in " ∧ " shape；Finally, silicon wafer sucking disc is inhaled from the top in the gap of silicon chip 3 to silicon chip 3
Take.
The utility model is described above in association with specific embodiment, but those skilled in the art should be clear
Chu, these descriptions are all exemplary, are not the limitation to scope of protection of the utility model.Those skilled in the art can root
Various variants and modifications are made to the utility model according to spirit of the present utility model and principle, these variants and modifications are also in this reality
With in new scope.
Claims (10)
- A kind of 1. silicon chip guiding mechanism, it is characterised in that including：First guider（1）With the second guider（2）, it is described Second guider（2）It is arranged in pairs in first guider（1）Top both sides；First guider（1）Including the first guide plate drive component（11）Be arranged on the first guide plate drive component （11）First guide plate of drive end（12）, first guide plate（12）Towards silicon chip（3）Side have jagged One guide part（121）, the first guide plate drive component（11）Drive first guide plate（12）By the silicon chip in fixture （3）Jack to second guider（2）Between；Second guider（2）Including the second guide plate drive component A（21）, the second guide plate drive component B（22）, Two guide plate A（23）With the second guide plate B（24）, the second guide plate A（23）It is arranged on the second guide plate driving group Part A（21）Drive end, the second guide plate B（24）It is arranged on the second guide plate drive component B（22）Drive end, The second guide plate A（23）With the second guide plate B（24）It is setting up and down and be parallel to each other；The second guide plate A（23）Towards the silicon chip（3）Side there is jagged second guide part A, described second Guide plate B（24）Towards the silicon chip（3）Side there is jagged second guide part B（241）；The second guide plate drive component A（21）For driving the second guide plate A（23）Side-to-side movement so that Mei Gesuo State silicon chip（3）It is placed in parallel to each other in the teeth groove of the sawtooth of the second guide part A；The second guide plate drive component B（22）For driving the second guide plate B（24）Side-to-side movement so that silicon chip described in each two（3）Upper end abuts ground It is placed in the second guide part B（241）Sawtooth a teeth groove in.
- 2. silicon chip guiding mechanism according to claim 1, it is characterised in that：First guide part（121）Sawtooth Tooth pitch and the silicon chip（3）Spacing it is equal, the crown spacing of the sawtooth of the second guide part A and first guide part （121）Sawtooth crown spacing it is equal, the second guide part B（241）Sawtooth crown spacing be it is described first be oriented to Portion（121）Twice of crown spacing of sawtooth.
- 3. silicon chip guiding mechanism according to claim 1 or 2, it is characterised in that：The second guide part B（241）Saw The teeth groove of tooth is V-shaped.
- 4. silicon chip guiding mechanism according to claim 1, it is characterised in that：The second guide plate drive component A（21） With the second guide plate drive component B（22）It is separately positioned on the second bottom plate（251）On, second bottom plate（251）It is front and rear Both ends are hung down respectively is provided with the second riser（252）, two second risers（252）Top is provided with the second top plate（253）；It is described Second bottom plate（251）Top front and rear sides are provided with the second guide A（28）, the second guide A（28）Positioned at two institutes State the second riser（252）Between, two the second guide A（28）Sliding end be connected with the second connecting plate A（29）, it is described Second connecting plate A（29）Bottom is provided with the second guide plate A（23）, the second guide plate drive component A（21）Drive end It is connected to the second connecting plate A（29）On；Second top plate（253）Bottom front and rear sides are provided with the second guide B （26）, the second guide B（26）Positioned at two second risers（252）Between, two the second guide B（26） Sliding end be connected with the second connecting plate B（27）, the second connecting plate B（27）Top is provided with the second guide plate B（24）, institute State the second guide plate drive component B（22）Drive end be connected to the second connecting plate B（27）On.
- 5. silicon chip guiding mechanism according to claim 4, it is characterised in that：The second guide plate drive component B（22) There are at least two sections of driving trips with the second guide plate drive component A (21).
- 6. silicon chip guiding mechanism according to claim 5, it is characterised in that：The second guide plate drive component B（22) There is identical structure with the second guide plate drive component A (21).
- 7. silicon chip guiding mechanism according to claim 6, it is characterised in that：The second guide plate drive component A（21） Including the first cylinder A（211）, the second cylinder A（212）, the first cylinder contiguous block A（213）, the second cylinder contiguous block A（215）With Cylinder guidance part A（214）, the first cylinder A（211）One end and the second cylinder A away from drive end（212）Away from drive One end of moved end is fixedly connected, the first cylinder A（211）Drive end be connected to the first cylinder contiguous block A（213） On, the second cylinder A（212）It is arranged on the second cylinder contiguous block A（215）On, the cylinder guidance part A（214）If Put in second bottom plate（251）Go up and be fixedly installed on the second cylinder contiguous block A（215）Horizontal component bottom.
- 8. silicon chip guiding mechanism according to claim 1, it is characterised in that：First guide part（121）Sawtooth Teeth groove is in Y-shaped, and the teeth groove includes vertical deep trouth portion and " V " shape shallow slot portion, the bottom in the shallow slot portion and the deep trouth The top in portion is connected.
- 9. silicon chip guiding mechanism according to claim 1, it is characterised in that：The first guide plate drive component（11）If Put in the first bottom plate（16）On, along the first guide plate drive component（11）Driving direction is arranged with the first guide in parallel （15）, the first guide plate drive component（11）Drive end and first guide（15）Sliding end be connected with lifting Portable plate（13）, the lifting portable plate（13）On be provided with the first connecting plate（14）, first connecting plate（14）Left and right two Side is symmetrically arranged with the first guide plate（12）.
- 10. silicon chip guiding mechanism according to claim 9, it is characterised in that：The first guide plate drive component（11） It is made up of motor, the motor is connected by shaft coupling with screw mandrel, and feed screw nut, the feed screw nut are provided with the screw mandrel With the lifting portable plate（13）Connection；The motor drives the feed screw nut motion on the screw mandrel, drives the liter Portable plate drops（13）Elevating movement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720967130.1U CN207217566U (en) | 2017-08-04 | 2017-08-04 | Silicon chip guiding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720967130.1U CN207217566U (en) | 2017-08-04 | 2017-08-04 | Silicon chip guiding mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217566U true CN207217566U (en) | 2018-04-10 |
Family
ID=61817427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720967130.1U Expired - Fee Related CN207217566U (en) | 2017-08-04 | 2017-08-04 | Silicon chip guiding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217566U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113911695A (en) * | 2021-09-24 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Pitch-variable mechanism |
| CN113911696A (en) * | 2021-09-24 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Device for changing silicon wafer pitch |
-
2017
- 2017-08-04 CN CN201720967130.1U patent/CN207217566U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113911695A (en) * | 2021-09-24 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Pitch-variable mechanism |
| CN113911696A (en) * | 2021-09-24 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Device for changing silicon wafer pitch |
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