CN207151043U - A kind of modular power source structure - Google Patents
A kind of modular power source structure Download PDFInfo
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- CN207151043U CN207151043U CN201720550900.2U CN201720550900U CN207151043U CN 207151043 U CN207151043 U CN 207151043U CN 201720550900 U CN201720550900 U CN 201720550900U CN 207151043 U CN207151043 U CN 207151043U
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- ceramic plate
- power device
- aluminum shell
- conductive ceramic
- thermal conductive
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Abstract
A kind of modular power source structure, including upper plastic cover 1, aluminum shell 2, power device 3, thermal conductive ceramic plate 4, multilayer PCB circuit board 5, high thermal conductivity coefficient potting compound 6.Described power device 3 is assemblied in the bottom of multilayer PCB circuit board 5.Described multilayer PCB circuit board 5 is assemblied in the inside of aluminum shell 2.The lower section of power device 3 and the overlying contact of thermal conductive ceramic plate 4, the lower section of thermal conductive ceramic plate 4 and the bottom contact of aluminum shell contact 2, for reducing the thermal conductivity factor of aluminum shell 2 and power device 3, by the heat derives shell of the institute's product in the course of the work of power device 3.Described high thermal conductivity coefficient potting compound 6 is filled between multi-layer PCB board 5 and aluminum shell 2, for filling gap existing for thermal conductive ceramic plate 4 and power device 3, further reduces the thermal resistance between multi-layer PCB board 5 and aluminum shell 2.
Description
Technical field
It the utility model is related to a kind of modular power source structure, more particularly to the high power density mould with fine heat conductivility
Block power supply architecture.
Background technology
With the various communication technologys, the development of industrial control technology, the device integration technology of device interior also synchronized development,
It is also less and less to the volume requirement of Switching Power Supply, therefore the modular power source of high power density turns into the master of subsequent power industry development
Want direction.The design Main way of high power density power supply is the power for the volume and raising modular power source for reducing modular power source,
But the change in the two directions can all bring the increase of caloric value, if the heating of power supply can not pass, cause device
Temperature exceedes device maximum temperature, and causes design to fail.
The aluminium base modular power source scheme of prior art has preferable heat-conducting effect, always by Gao Gong since 90 years
Rate density module power supply various brands widely use, but the program has the following disadvantages.
One, the thermal conductivity factor of aluminium are 237W/mk, but because to add heat conduction between aluminium base and PCB copper cablings
The very poor insulating barrier of property, so the thermal conductivity factor of aluminium base drops to 1.0-2.0W/mk, the device radiating effect for generating heat larger
It is not fine.Secondly be generally the PCB of individual layer cabling for the PCB of aluminium base, during PCB design can not cross wiring can not jumper connection,
So the modular power source of its framework is generally double-layer structure, it is preferable that the larger power device that generated heat in modular power source is assemblied in radiating
Aluminium base PCB on, little control device of generating heat is assemblied on common control pcb board, control PCB and aluminium base PCB lead to
Connection terminal is crossed to be attached.Product Assembly process is extremely complex, and assembly cost is 5 times of common two layers of pcb board.
The modular power source technical scheme of multi-layer sheet technique, all elements of the program, which all design, is assembled to multilayer
On PCB, the larger device that generally generates heat is designed into PCB bottom, and the less device that generates heat is designed into PCB top layer.It is processed into
The aluminium radiator fin radiating of adaptation PCB fabrics, is contacted by insulating trip and the larger bottom that generates heat, in order to generate heat
The heat derives of power device are to aluminium radiator fin.The shortcomings that process program is：1st, not closed, no three proofings function is (dust-proof, anti-
Shake, the function of waterproof)；2nd, aluminium backing piece is since it is desired that fluting or boss, high processing costs.3rd, power device and aluminium radiator fin it
Between add heat-conducting effect after insulating trip and be deteriorated.
Utility model content
The utility model provides a kind of modular power source structure, can overcome existing aluminium base complex process, manufacturing cost height
The problem of.The utility model can also overcome existing multi-layer PCB board technique without three proofings function, aluminium backing high processing costs, lead
The problem of thermal effect difference.
The purpose of this utility model is, by increasing thermal conductive ceramic plate between power component and aluminum shell, is ensureing
Preferable heat-conducting effect is realized while insulation.
The purpose of this utility model is achieved through the following technical solutions：A kind of modular power source structure, including on plastics
Lid 1, aluminum shell 2, power device 3, thermal conductive ceramic plate 4, multilayer PCB circuit board 5, high thermal conductivity coefficient potting compound 6, magnetic core 7.
Described aluminum shell 2 is ripe existing module power supply architecture technology, and it is shaped as 5 face metallic channels of upper shed.
Its effect is：It can not damaged with protection module power circuit and element by external mechanical power, control high-frequency electromagnetic interference leaks, and carries
For the heat-conducting area of modular power source.
Described upper plastic cover 1 is existing power supply structure technology, and its band buckle can be connected together with aluminum shell 2.Its
Function protection module power supply circuit board and component as aluminum shell.
The prior art of described multilayer PCB circuit board 5 and high power density power supply architecture, on multilayer PCB circuit board 5
Magnetic core and electronic component are assembled with, magnetic core just completes the making and assembling of transformer after snapping onto on PCB, it realizes module electricity
The major function of the voltage transformation in source.
Described high thermal conductivity coefficient potting compound 6, the thermal conductivity factor 0.7W/mk of the potting compound of general modular power source or so, and
The potting compound used in high power density modular power source can reach 2-4W/mk thermal conductivity factor.
Described magnetic core 7 is the magnetic core of existing high power density modular power source transformer or inductance, due to the height of magnetic core
Typically it is far above power device 3, causes have very big space between power device 3 and aluminum shell 2.
The conventional module power supply architecture of the present utility model that is different from is characterized in：Described power device 3 is assemblied in multilayer
The bottom of PCB 5, described multilayer PCB circuit board 5 are assemblied in the inside of aluminum shell 2；Described thermal conductive ceramic plate 4 is put
In the bottom of aluminum shell 2, the top of thermal conductive ceramic plate 4 is in contact with the power device 3 on multilayer PCB circuit board 5, for reducing
The thermal conductivity factor of power device 3 and aluminum shell 2, by the caused heat derives shell in the course of the work of power device 3.It is described
High thermal conductivity coefficient potting compound 6 be filled between multi-layer PCB board 5 and aluminum shell 2, for filling thermal conductive ceramic plate 4 and power
Gap existing for device 3, further reduce the thermal resistance between multilayer power device 3 and aluminum shell 2.Described thermal conductive ceramic plate 4
Bottom and the bottom of magnetic core 7 are maintained at same plane.
Described thermal conductive ceramic plate 4 can be conventional ceramic piece or alumina ceramic plate, and material or shape are unlimited.
Described power device 3 is modular power source loss and the larger device that generates heat, and it includes but is not limited to primary side and opened
Close metal-oxide-semiconductor, secondary commutation diode or metal-oxide-semiconductor, driving IC.
Brief description of the drawings
Fig. 1：The utility model modular power source structural representation.
Embodiment
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment one
Fig. 1 is the modular power source structural representation of the utility model embodiment one, including upper plastic cover 1, aluminum shell 2, work(
Rate device 3, thermal conductive ceramic plate 4, multilayer PCB circuit board 5, high thermal conductivity coefficient potting compound 6, magnetic core 7.
Described aluminum shell 2 is ripe existing module power supply architecture technology, and it is shaped as 5 face metallic channels of upper shed.
It is that can not damaged with protection module power circuit and element by external mechanical power that it, which is acted on, and control high-frequency electromagnetic interference leaks, and carries
For the heat-conducting area of modular power source.
Described upper plastic cover 1 is existing power supply structure technology, and its band buckle can be connected together with aluminum shell 2.Its
Function protection module power supply circuit board and component as aluminum shell.
The prior art of described multilayer PCB circuit board 5 and high power density power supply architecture, on multilayer PCB circuit board 5
Magnetic core and electronic component are assembled with, magnetic core just completes the making and assembling of transformer after snapping onto on PCB, it realizes module electricity
The major function of the voltage transformation in source.
Described high thermal conductivity coefficient potting compound 6, also it is prior art in high power density modular power source.
Described magnetic core 7 is the magnetic core of existing high power density modular power source transformer or inductance, due to the height of magnetic core
Typically it is far above power device 3, causes have very big space between power device 3 and aluminum shell 2.
Described power device 3 is assemblied in the bottom of multilayer PCB circuit board 5, and described multilayer PCB circuit board 5 is assemblied in
The inside of aluminum shell 2；Described thermal conductive ceramic plate 4 is placed in the bottom of aluminum shell 2, top and the multi-layer PCB electricity of thermal conductive ceramic plate 4
Power device 3 on road plate 5 is in contact, for reducing the thermal conductivity factor of power device 3 and aluminum shell 2, by power device 3 in work
Caused heat derives shell during work.Described high thermal conductivity coefficient potting compound 6 is filled in outside multi-layer PCB board 5 and aluminium
Between shell 2, for filling gap existing for thermal conductive ceramic plate 4 and power device 3, multilayer power device 3 and aluminium are further reduced
Thermal resistance between shell 2.The described bottom of thermal conductive ceramic plate 4 and the bottom of magnetic core 7 is maintained at same plane.
Described thermal conductive ceramic plate 4 can be conventional ceramic piece or alumina ceramic plate, any material or arbitrary shape.
Described power device 3 is modular power source loss and the larger device that generates heat, and it includes but is not limited to primary side and opened
Close metal-oxide-semiconductor, secondary commutation diode or metal-oxide-semiconductor, driving IC.
It the above is only some embodiments of the present utility model, it is noted that above-mentioned preferred embodiment should not regard
For to limitation of the present utility model, embodiment can combined crosswise, the scope of protection of the utility model should be limited with claim
Fixed scope is defined.For those skilled in the art, spirit and scope of the present utility model are not being departed from
It is interior, some improvements and modifications can also be made, these improvements and modifications also should be regarded as the scope of protection of the utility model.
Claims (4)
1. a kind of modular power source structure, including upper plastic cover (1), aluminum shell (2), power device (3), multilayer PCB circuit board
(5), high thermal conductivity coefficient potting compound (6) and magnetic core (7), it is characterised in that：Also include thermal conductive ceramic plate (4)；Described power device
Part (3) is assemblied in the bottom of multilayer PCB circuit board (5), and it is inner that described multilayer PCB circuit board (5) is assemblied in aluminum shell (2)
Face；Described thermal conductive ceramic plate (4) is placed in the bottom of aluminum shell (2), the top of thermal conductive ceramic plate (4) and multilayer PCB circuit board
(5) power device (3) on is in contact；
Described high thermal conductivity coefficient potting compound (6) is filled between multilayer PCB circuit board (5) and aluminum shell (2), for filling
Gap existing for described thermal conductive ceramic plate (4) and power device (3).
A kind of 2. modular power source structure according to claim 1, it is characterised in that：Described thermal conductive ceramic plate (4) can be with
It is conventional ceramic piece or alumina ceramic plate.
A kind of 3. modular power source structure according to claim 1, it is characterised in that：Described power device (3) is module
The loss of power and the device of heating, it includes primary side switch metal-oxide-semiconductor, secondary commutation diode or metal-oxide-semiconductor, driving IC.
A kind of 4. modular power source structure according to claim 2, it is characterised in that：Described thermal conductive ceramic plate (4) bottom
Same plane is maintained at magnetic core (7) bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720550900.2U CN207151043U (en) | 2017-05-18 | 2017-05-18 | A kind of modular power source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720550900.2U CN207151043U (en) | 2017-05-18 | 2017-05-18 | A kind of modular power source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207151043U true CN207151043U (en) | 2018-03-27 |
Family
ID=61659396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720550900.2U Active CN207151043U (en) | 2017-05-18 | 2017-05-18 | A kind of modular power source structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207151043U (en) |
-
2017
- 2017-05-18 CN CN201720550900.2U patent/CN207151043U/en active Active
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