CN207096920U - Thin client based on Feiteng processor - Google Patents

Abstract

The utility model discloses a thin client based on a Phytium processor, which comprises a lower cover (1), an upper cover (2), a heat dissipation module (3) and a PCBA board (4). The combination of the lower cover and the upper cover Forming an overall rectangular parallelepiped housing, the heat dissipation module (3) and the PCBA board (4) are arranged in the housing, and the heat dissipation module (3) includes a first heat dissipation module (31) and a second heat dissipation module (32) , the first heat dissipation module (31) and the second heat dissipation module (32) both include heat dissipation fans, the first heat dissipation module is arranged at the upper left position of the casing, and the heat dissipation fan blows air from the upper side wall of the casing, The second cooling module is arranged at the lower right part of the casing, and its cooling fan blows air from the right side wall of the casing. The utility model adopts the design of double heat dissipation modules, optimizes the air duct inside the shell, ensures that there is no heat dissipation dead zone inside the shell, and realizes the super heat dissipation effect of the whole machine. In addition, the actual fan speed can be controlled at the rated speed under normal load. Below 40%, to achieve ultra-quiet.

Description

Phytium Processor-Based Thin Clients

technical field

The utility model belongs to the technical field of computer hardware, in particular to a thin client based on a Feiteng processor.

Background technique

The thin client (network computer) is smart in design, small in size, light and beautiful, which can save office desk space. At the same time, the network computer can be installed on the back of the monitor with the attached bracket, which is light and beautiful. Thin clients based on x86 architecture usually have low power consumption, and the power consumption of the whole machine is usually below 10W. It adopts a fanless heat dissipation design, and mainly uses the case cover heat conduction heat dissipation method, which can not only meet the heat dissipation requirements but also create a low-noise office environment. surroundings. However, core technologies such as software and hardware of products based on the x86 architecture are subject to foreign manufacturers, and information security cannot be guaranteed. However, the power consumption of a thin client based on a domestic Phytium processor is more than 35W, and the heat dissipation structure of the existing technology cannot meet the heat dissipation requirements of the product.

Utility model content

The purpose of the utility model is to avoid the deficiencies in the prior art and provide a thin client based on the Phytium processor to solve the heat dissipation problem of the thin client.

The purpose of this utility model is achieved through the following technical solutions:

A thin client based on a Phytium processor is provided, comprising a lower cover, an upper cover, a heat dissipation module, and a PCBA board. The board is arranged in the casing, the heat dissipation module includes a first heat dissipation module and a second heat dissipation module, the first heat dissipation module and the second heat dissipation module both include a heat dissipation fan, and the first heat dissipation module is arranged in the housing The upper left position of the body, its cooling fan blows air from the upper side wall of the housing, the second heat dissipation module is arranged at the lower right position of the housing, and its cooling fan blows air from the right side wall of the housing.

As a further improvement, the left part and the middle right part of the upper side wall of the housing are respectively provided with a first air outlet and a first air inlet, and the lower left part of the bottom wall of the housing is provided with a second air inlet, The lower part of the right side wall of the casing is provided with a second air outlet.

As a further improvement, a first air inlet, a second air inlet, a third air inlet, and a fourth air inlet are formed in the housing, and the first air inlet is where external air enters from the first air inlet. In the casing, it reaches the air inlet of the heat dissipation fan of the first heat dissipation module; the second air inlet is that external air enters the casing from the first air inlet, and reaches the air inlet of the heat dissipation fan of the second heat dissipation module; The third air inlet is for external air to enter the casing from the second air inlet and reach the cooling fan suction port of the first heat dissipation module; the fourth air inlet is for external air to enter the casing from the second air inlet to reach the second air inlet. The air inlet of the heat dissipation fan of the heat dissipation module.

As a further improvement, the IO interfaces on the PCBA board are arranged on the left and right sides, the CPU and memory particles are arranged in the upper middle, the GPU is arranged in the middle and lower parts, and the power module of the CPU is arranged in the first air inlet, In the second air intake channel, the power module of the GPU is arranged in the fourth air intake channel, and other devices with high heat generation are evenly distributed in the third air intake channel.

As a further improvement, the air intake flow rate of the grid hole of the first air inlet and the second air inlet is 100% of the rated air volume of a single cooling fan; 100% of the rated air volume of the fan.

As a further improvement, the upper left part and the lower right part of the PCBA board are provided with a first notch and a second notch, the cooling fan of the first heat dissipation module is arranged in the first notch, and the cooling fan of the second heat dissipation module is arranged in the first notch. The cooling fan is arranged in the second notch.

As a further improvement, the upper cover is composed of a top wall, an upper side wall, a lower side wall and a right side wall, and the lower cover is composed of a bottom wall and a left side wall.

As a further improvement, a bracket installation groove is provided on the back of the bottom wall.

As a further improvement, the back of the bottom wall is provided with foot pad installation grooves, and foot pads are installed in the foot pad installation grooves.

The thin client based on the Feiteng processor provided by the utility model includes a lower cover, an upper cover, a heat dissipation module, and a PCBA board. , The PCBA board is arranged in the casing, the heat dissipation module includes a first heat dissipation module and a second heat dissipation module, the first heat dissipation module and the second heat dissipation module both include a heat dissipation fan, and the first heat dissipation module is arranged At the upper left position of the housing, its cooling fan blows air from the upper side wall of the housing, and the second heat dissipation module is arranged at the lower right position of the housing, and its cooling fan outputs air from the right side wall of the housing. The utility model adopts the design of double heat dissipation modules, optimizes the air duct inside the shell, ensures that there is no heat dissipation dead zone inside the shell, and realizes the super heat dissipation effect of the whole machine. In addition, the actual fan speed can be controlled at the rated speed under normal load. Below 40%, to achieve ultra-quiet. The utility model not only achieves a good heat dissipation effect, but also creates a low-noise office environment.

Description of drawings

Utilize accompanying drawing to further illustrate the utility model, but the embodiment in the accompanying drawing does not constitute any restriction to the utility model, for those of ordinary skill in the art, under the premise of not paying creative work, also can obtain according to following accompanying drawing Additional drawings.

FIG. 1 is a schematic diagram of a three-dimensional structure of a thin client based on a Phytium processor.

Fig. 2 is a three-dimensional structural diagram of a thin client based on a Phytium processor with the upper cover removed.

Fig. 3 is a schematic perspective view of the upper cover.

Fig. 4 is a three-dimensional schematic diagram of the lower cover.

Fig. 5 is a schematic diagram of an internal air duct of a thin client based on a Phytium processor.

Fig. 6 is a structural schematic diagram of the PCBA board.

Detailed ways

In order to enable those skilled in the art to better understand the technical solution of the utility model, the utility model will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the The embodiments and the features in the embodiments can be combined with each other.

The orientations such as "up", "down", "left" and "right" involved in the embodiments of the present utility model are all relative positions, and their reference is the orientation of the drawings on paper.

As shown in Figures 1 to 6, a thin client based on a Phytium processor provided by an embodiment of the present invention includes a lower cover 1, an upper cover 2, a cooling module 3, and a PCBA board 4 (PCBA: Printed Circuit Board +Assembly, that is, the finished product after the empty PCB board passes through SMT, and then passes through the DIP plug-in). The upper cover 2 is composed of a top wall 21 , an upper side wall 22 , a lower side wall 23 and a right side wall 24 , and the lower cover 1 is composed of a bottom wall 11 and a left side wall 12 . The lower cover 1 and the upper cover 2 are combined to form a rectangular parallelepiped housing as a whole. The heat dissipation module 3 and the PCBA board 4 are arranged in the housing, the heat dissipation module 3 includes a first heat dissipation module 31 and a second heat dissipation module 32, and the first heat dissipation module 31 and the second heat dissipation module 32 are both Including a heat dissipation fan, the first heat dissipation module 31 is arranged at the upper left position of the housing, and its heat dissipation fan blows air from the upper side wall of the housing, and the second heat dissipation module 32 is arranged at the lower right position of the housing , its cooling fan blows air from the right side wall of the housing. Due to the dual heat dissipation module design, it can achieve a super cooling effect of the whole machine, and the actual fan speed can be controlled below 40% of the rated speed under normal load, achieving ultra-quiet.

As a further preferred embodiment, the first air outlet 221 and the first air inlet 222 are respectively provided on the left part and the middle right part of the upper side wall of the housing, and the first air outlet 222 is provided on the lower left part of the bottom wall of the housing. Two air inlets 111, and a second air outlet 241 is provided on the lower part of the right side wall of the housing. A first air inlet 71 , a second air inlet 72 , a third air inlet 73 , and a fourth air inlet 74 are formed in the housing, and the first air inlet 71 is where the outside air passes through the first air inlet 222 . into the housing and reach the cooling fan suction port of the first heat dissipation module 31; the second air inlet channel 72 is for external air to enter the housing from the first air inlet 222 and reach the cooling fan suction port of the second heat dissipation module 32. The third air inlet 73 is for external air to enter the casing from the second air inlet 111 and reach the air inlet of the cooling fan of the first heat dissipation module 31; the fourth air inlet 74 is for external air to enter from the second air inlet. The air inlet 111 enters the housing and reaches the air inlet of the cooling fan of the second heat dissipation module 32 . In addition, a first air outlet channel 81 and a second air outlet channel 82 are formed in the housing, and the first air outlet channel 81 is used for the cooling fan of the first heat dissipation module to discharge the inhaled air out of the body through the first air outlet; The second air outlet channel 82 is used for the cooling fan of the second heat dissipation module to discharge the sucked air out of the body through the second air outlet. In this way, four air inlet channels and two air outlet channels are formed in the casing to ensure that there is no heat dissipation dead zone inside the casing, thereby obtaining a good heat dissipation effect of the whole machine.

As a further preferred embodiment, the IO interfaces on the PCBA board 4 are arranged on the left and right sides, the CPU and memory particles are arranged in the upper middle, the GPU is arranged in the middle and lower, and the power supply module of the CPU is arranged in the first In the air duct 71 and the second air intake duct 72 , the power module of the GPU is arranged in the fourth air intake duct 74 , and other devices with high heat generation are evenly distributed in the third air intake duct 73 . In this way, the uniform heat dissipation layout of the PCBA board components is realized, and the uniform heat dissipation of the whole machine is realized.

As a further preferred embodiment, the size of the grid hole of the air inlet and the air outlet is set according to the distribution ratio of the air flow in and out. Specifically, the air flow rate of the grid holes of the first air inlet 222 and the second air inlet 111 are both rated by a single cooling fan. 100% of the air volume; the air flow rate of the grid hole of the first air outlet 221 and the second air outlet 241 is 100% of the rated air volume of a single cooling fan.

As a further preferred embodiment, the upper left part and the lower right part of the PCBA board 4 are provided with a first notch 41 and a second notch 42, and the cooling fan of the first heat dissipation module 31 is arranged in the first notch 41, so The heat dissipation fan of the second heat dissipation module 32 is disposed in the second gap 42 . The first notch 41 and the second notch 42 formed by cutting off the PCBA board 4 make space for the cooling fans and radiators of the first and second heat dissipation modules, which facilitates the arrangement of the heat dissipation modules, and the structure is more compact, and the PCBA The lower left part of the plate 4 is also provided with a third notch 43, the position of the third notch 43 corresponds to the position of the second air inlet 111, the third notch 43 ensures that the wind of the third air inlet channel and the fourth air inlet channel can pass through The front of the PCBA board reaches the first and second heat dissipation fans, which solves the heat dissipation problem of the front components on the left lower part of the PCBA board.

As a further preferred embodiment, the back of the bottom wall 11 is provided with a plurality of bracket installation grooves 112, and the bracket installation grooves 112 allow the thin client to be fixed on the back of the display through a bracket. The back side of the bottom wall 11 is provided with a foot pad installation groove 113 , and the foot pad 5 is installed in the foot pad installation groove 113 .

The structural features of the embodiment of the utility model are as follows: First, the double heat dissipation module design is adopted, and the speed of the double heat dissipation fans can be controlled by EC. Second, adopt 4 air inlet channels and 2 air outlet channels to ensure the air duct structure design of the whole machine without heat dissipation dead zone inside the shell; The heat dissipation problem of the front device on the lower left; Fourth, the uniform heat dissipation layout of the PCBA board device. Through the above settings, the super cooling effect of the whole machine is realized, and it is super quiet.

A lot of specific details have been set forth in the above description in order to fully understand the utility model. However, the utility model can also be implemented in other ways different from those described here. Therefore, it should not be understood as limiting the protection scope of the utility model.

In a word, although the utility model has listed above-mentioned preferred embodiment, it should be noted that although those skilled in the art can make various changes and modifications, unless such changes and modifications deviate from the scope of the utility model, otherwise all should Included in the protection scope of the present utility model.

Claims (9)

1. A kind of 1. thin client based on Feiteng processor, it is characterised in that：Including lower cover（1）, upper lid（2）, heat radiation module （3）, PCBA board（4）, the lower cover（1）, upper lid（2）Combination forms the overall housing in cuboid, the heat radiation module （3）, PCBA board（4）It is arranged in housing, the heat radiation module（3）Including the first heat radiation module（31）With the second heat radiation module （32）, the first heat radiation module（31）With the second heat radiation module（32）Include radiator fan, first heat radiation module（31）Cloth Put in the upper left quarter position of housing, its radiator fan is from the upper side wall air-out of housing, second heat radiation module（32）It is arranged in The right lower quadrant position of housing, right side wall air-out of its radiator fan from housing.
2. 2. the thin client according to claim 1 based on Feiteng processor, it is characterised in that：The upper side wall of the housing Left part, middle right part be respectively arranged with the first air outlet（221）, the first air inlet（222）, the lower left quarter of the bottom wall of the housing It is provided with the second air inlet（111）, the bottom of the right side wall of the housing is provided with the second air outlet（241）.
3. 3. the thin client according to claim 2 based on Feiteng processor, it is characterised in that：The is formed in the housing One air inlet duct（71）, the second air inlet duct（72）, the 3rd air inlet duct（73）, the 4th air inlet duct（74）, first air inlet duct（71） It is extraneous air from the first air inlet（222）Into in housing, the first heat radiation module is reached（31）Radiator fan inlet scoop at； Second air inlet duct（72）It is extraneous air from the first air inlet（222）Into in housing, the second heat radiation module is reached（32） Radiator fan inlet scoop at；3rd air inlet duct（73）It is extraneous air from the second air inlet（111）Into in housing, arrive Up to the first heat radiation module（31）Radiator fan inlet scoop at；4th air inlet duct（74）It is extraneous air from the second air inlet （111）Into in housing, the second heat radiation module is reached（32）Radiator fan inlet scoop at.
4. 4. the thin client according to claim 3 based on Feiteng processor, it is characterised in that：The PCBA board（4）On I/O interface be arranged in left side and right edge, CPU and memory grain are arranged in middle part, and GPU is arranged in middle and lower part, CPU's Power module is arranged in the first air inlet duct（71）, the second air inlet duct（72）Interior, GPU power module is arranged in the 4th air inlet duct （74）Interior, the big device of other caloric values is evenly distributed on the 3rd air inlet duct（73）It is interior.
5. 5. the thin client based on Feiteng processor according to Claims 2 or 3 or 4, it is characterised in that：Described first enters Air port（222）With the second air inlet（111）Gate hole air intake flow be the 100% of single radiator fan nominal air delivery；First goes out Air port（221）With the second air outlet（241）Gate hole air-out flow be the 100% of single radiator fan nominal air delivery.
6. 6. the thin client according to any one of claim 1 to 4 based on Feiteng processor, it is characterised in that：It is described PCBA board（4）Upper left quarter and right lower quadrant be provided with the first breach（41）With the second breach（42）, first heat radiation module （31）Radiator fan be arranged on the first breach（41）In, second heat radiation module（32）Radiator fan be arranged on second lack Mouthful（42）In.
7. 7. the thin client according to any one of claim 1 to 4 based on Feiteng processor, it is characterised in that：It is described Upper lid（2）By roof（21）, upper side wall（22）, lower wall（23）And right side wall（24）Composition, the lower cover（1）By bottom wall（11） And left side wall（12）Composition.
8. 8. the thin client according to claim 7 based on Feiteng processor, it is characterised in that：The bottom wall（11）The back of the body Face is provided with support mounting groove（112）.
9. 9. the thin client according to claim 7 based on Feiteng processor, it is characterised in that：The bottom wall（11）The back of the body Face is provided with foot pad mounting groove（113）, foot pad mounting groove（113）Foot pad is inside installed（5）.