CN206488255U - A kind of semiconductor module group formula loop heating system - Google Patents
A kind of semiconductor module group formula loop heating system Download PDFInfo
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- CN206488255U CN206488255U CN201621301500.XU CN201621301500U CN206488255U CN 206488255 U CN206488255 U CN 206488255U CN 201621301500 U CN201621301500 U CN 201621301500U CN 206488255 U CN206488255 U CN 206488255U
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Abstract
A kind of semiconductor module group formula loop heating system disclosed in the utility model, including semiconductor heater, internal circulation pump, heat exchanger, outer circulation pump, water tank, air bleeding valve pipe and heating equipment, its semiconductor heater is made up of the heating internal-circulation of more than 100 DEG C saturated vapors and saturation water the tube side of internal circulation pump and heat exchanger；The outer circulation for the shell side composition heat that heating equipment passes through outer circulation pump and heat exchanger；Exhaust outlet is provided with semiconductor heater, exhaust outlet connects air bleeding valve pipe by air bleeding valve, and the hot water import and export of water tank connects the shell side and semiconductor heater of the heat exchanger by pipeline.How much is module number of the utility model in module group, determines watt level and produces the amount of saturated vapor and saturation water, easily realizes high-power and produces the fairly large of saturated vapor amount and saturated water amount.
Description
Technical field
The utility model is related to electronic apparatus saturated vapor (saturation water) generating means technical field, and more particularly to a kind of half
Conductor module group formula loop heating system.
Background technology
Semiconductor (PTC) heater heats low-temperature heat of the water and air below 100 DEG C currently used for air-conditioning, heating,
The heating of the saturated vapor and saturation water more than 100 DEG C is cannot be used for, the high-power of module group is not formed also and produces saturation
Steam and saturation water it is fairly large.
Traditional cartridge type unit module is all that semiconductor element is fixed on the cylinder of outer space, and the inside does not have thin alloy tube bank to fill out
Fill, heat transfer area is small, the rate of heat addition is low, do not realize the heating of the saturated vapor and saturation water more than 100 DEG C.
Traditional semiconductor heating element heater, is formed a whole by several semiconductor optical chips.Mating plate and mating plate it
Between without using semi-conductor adhesive bonding, only be encapsulated with conductive copper box.An element global copper box is made some with semiconductor
Also do not sealed between mating plate with high-temperature electric conduction glue bond, during electrified regulation, due to phenomenon of expanding with heat and contract with cold, such as produce space
It is easy for sparking to puncture, burns element.Encapsulation copper box is not also used with the insulating trip both sides between outmost sheath alloy covers
High temperature and insulating heat conductive glue bond is sealed, and also easily produces gap, is often occurred sparking, is punctured and burn phenomenon.Insulating trip used in addition
The overwhelming majority is punctured because high temperature resistant degree difference often has using the polyimide insulative piece of non-refractory, is burnt phenomenon.
Utility model content
Technical problem to be solved in the utility model is for present in existing semiconductor heating module and element
Above-mentioned technical problem and a kind of semiconductor module group formula loop heating system is provided.The semiconductor module group formula loop heating system
How much is module number in module group, determines watt level and produces the amount of saturated vapor and saturation water, easily realizes big
Power and produce the fairly large of saturated vapor amount and saturated water amount.
Technical problem to be solved in the utility model can be achieved through the following technical solutions：
A kind of semiconductor module group formula loop heating system, including semiconductor heater, internal circulation pump, heat exchanger,
Outer circulation pump, water tank, air bleeding valve pipe and heating equipment, it is characterised in that the semiconductor heater by internal circulation pump with
The tube side of heat exchanger constitutes the heating internal-circulation of more than 100 DEG C saturated vapors and saturation water；The heating equipment by following outside
The outer circulation of the shell side composition heat of ring pump and heat exchanger；Exhaust outlet, the row are provided with the semiconductor heater
Gas port connects air bleeding valve pipe by air bleeding valve, and the hot water import and export of the water tank connects the shell of the heat exchanger by pipeline
Journey and the semiconductor heater.
In a preferred embodiment of the present utility model, the semiconductor heater has several semiconductor heated moulds
Block connection in series-parallel is constituted, and the quantity of the semiconductor heating module determines heating power and the generation of the semiconductor heater
Saturated vapor amount and saturated water amount.
In a preferred embodiment of the present utility model, the semiconductor heating module includes a heat conduction cylinder, some
The tube bank that semiconductor heating element heater and some thin compo pipes are constituted, the axial direction of the heat conduction cylinder is provided at both ends with the turnover mouth of pipe,
Turnover mouth of pipe valve is installed in the turnover mouth of pipe, the tube bank that some thin compo pipes are constituted is arranged in the heat-conducting cylinder body, if
What dry thin compo pipe was constituted restrains forming good thermal conductive contact, some thin compo pipes compositions between the heat conduction cylinder
Tube bank axis and the heat conduction cylinder diameter parallel；If the dry semiconductor heating element heater is attached to the appearance of heat conduction cylinder
On face.
In a preferred embodiment of the present utility model, the outer wall of the heat conduction cylinder is polygon.
In a preferred embodiment of the present utility model, the outer wall of the heat conduction cylinder is quadrangle or hexagon.
In a preferred embodiment of the present utility model, the material of the heat conduction cylinder is aluminium alloy, copper alloy, stainless
One kind in steel or electrographite.
In a preferred embodiment of the present utility model, the thin compo pipe is thin copper alloy tube, thin aluminium-alloy pipe, thin
One kind in stainless steel alloy pipe, thin electrographite pipe.
In a preferred embodiment of the present utility model, the semiconductor heating element heater includes semiconductor and heats mating plate group
Part, conductive copper box, some high-temperature insulation pieces and metal alloy armoured heating set, the semiconductor heating mating plate component pass through resistance to
High-temperature electric conduction glue is encapsulated in the conductive copper box, and some high-temperature insulation pieces are wrapped in conductive copper box using multilayer parcel mode
On, adjacent high-temperature insulation piece interlayer is using the insulation glue-line isolation of two-sided thermostable heat-conductive, the metal alloy armoured heating set
It is wrapped on outermost high-temperature insulation piece and each other using the insulation glue-line isolation of two-sided thermostable heat-conductive, it is described partly to lead
The lead-out wire of body heating mating plate passes through the high-temperature insulation piece and metal alloy armoured heating set.
In a preferred embodiment of the present utility model, the semiconductor heating mating plate component is added using more semiconductor
Hot mating plate semiconductor high temperature glue bond and formed.
In a preferred embodiment of the present utility model, the high-temperature insulation piece is artificial mica insulation sheet, epoxy
The one kind of insulation resin piece, epoxy resin in organic-silicon-modified insulating trip.
In a preferred embodiment of the present utility model, the high-temperature resistant conducting glue is that epoxy resin or epoxy resin are used
Organic-silicon-modified insulating cement.
In a preferred embodiment of the present utility model, the material of metal alloy armoured heating set is aluminium alloy,
One kind in copper alloy, stainless steel alloy.
In a preferred embodiment of the present utility model, the internal circulation pump is magnetic drive pump or plunger pump.
In a preferred embodiment of the present utility model, the outer circulation pump is to be followed outside steam outer circulation pump or saturation water
Ring pump.
In a preferred embodiment of the present utility model, the steam outer circulation pump is single-stage low pressure impulse turbine
Formula steam circulation pump, unit low pressure reheating turbine formula steam circulation pump, single-stage back pressure turbine formula steam circulation
One kind in pump.
In a preferred embodiment of the present utility model, the saturation water outer circulation pump is in magnetic drive pump, plunger pump
It is a kind of.
In a preferred embodiment of the present utility model, the volume in the heat-conducting cylinder body is less than 0.03m3。
In a preferred embodiment of the present utility model, the connection in the semiconductor module group formula loop heating system
Tubing internal diameter is less than 50mm.
In a preferred embodiment of the present utility model, the heat exchanger is less than 150mm some lists by interior diameter
First heat exchanger is composed in parallel.
As a result of technical scheme as above, the utility model compared with prior art, with advantages below：
1. the module number in module group is how much, determines watt level and produce the amount of saturated vapor and saturation water,
Easily realize high-power and produce the fairly large of saturated vapor amount and saturated water amount.Heat conduction cylinder in semiconductor heating module
For polygon, multiple semiconductor heating element heaters can be arranged, make power increase.Using the tube bank of thin alloy in heat-conducting cylinder body, with biography
Hot area is big, the high advantage of rate of heat transfer, is adapted to the heating of more than 100 DEG C saturated vapors and saturation water.
2. semiconductor high temperature is used between semiconductor element mating plate and semiconductor element mating plate in semiconductor element mating plate component
Glue bond one entirety of formation, and make semiconductor optical chip component use high-temperature electric conduction glue bond to seal between conductive copper box.It is conductive
Copper box is close all with two-sided thermostable heat-conductive insulation glue bond with the high-temperature insulation piece two sides between metal alloy armoured heating set
Envelope, forms an entirety, very close to each other, is difficult to strike sparks, punctures, burns.
3. the high-temperature insulation piece used is more resistant to elevated temperatures than polyimide insulative piece natural or synthetic mica insulating trip or
Epoxy resins insulation piece or epoxy resin with organic-silicon-modified insulating trip, insulating properties more preferably, more resistant to high temperature be difficult it is breakdown,
Burn.
4. the volume in heat-conducting cylinder body of the present utility model is less than 0.03m3.In semiconductor module group formula loop heating system
Connecting line internal diameter be less than 50mm.Some unit heat exchangers that heat exchanger is less than 150mm by interior diameter are composed in parallel.No
Belong to the scope of application of " safe technology of pressure vessel Supervision Code (TSG21-2016) ".It is extremely secure, can be directly with use
Hot equipment short distance connection.Save capital cost.
Brief description of the drawings
Fig. 1 is the principle schematic of semiconductor module group formula loop heating system structure of the present utility model.
Fig. 2 is the radial cross-section of the utility model semiconductor heating module.
Fig. 3 is the axial sectional view of the utility model semiconductor heating module.
Fig. 4 is the axial sectional view of the utility model semiconductor heating element heater.
Fig. 5 is the radial cross-section of the utility model semiconductor heating element heater.
Embodiment
Referring to Fig. 1, a kind of semiconductor module group formula loop heating system provided in figure, including semiconductor heater
100th, internal circulation pump 200, heat exchanger 300, outer circulation pump 400, water tank 500, air bleeding valve pipe 600 and heating equipment 700.
Semiconductor heater 100 constitutes more than 100 DEG C saturations by the tube side of internal circulation pump 200 and heat exchanger 300
The heating internal-circulation of steam and saturation water；Heating equipment 700 is made up of the shell side of outer circulation pump 400 and heat exchanger 300 and used
The outer circulation of heat；Exhaust outlet is provided with semiconductor heater 100, exhaust outlet connects air bleeding valve pipe by air bleeding valve 610
600, the hot water import and export of water tank 500 connects the shell side and semiconductor heater 100 of heat exchanger 300 by pipeline.
Semiconductor heater 100 is made up of several connection in series-parallel of semiconductor heating module 110, semiconductor heating module
Saturated vapor amount and saturated water amount that 110 quantity determines the heating power of semiconductor heater 100 and produced.
Referring to Fig. 2 and Fig. 3, if semiconductor heating module 110 includes a heat conduction cylinder 111, dry semiconductor heating element heater 112
The tube bank 113 constituted with some thin compo pipes.
The outer wall of heat conduction cylinder 111 is polygonal such as hexagon, can so arrange multiple semiconductor heating element heaters 112,
Power is set to become big.The axial direction of heat conduction cylinder 111 is provided at both ends with the turnover mouth of pipe 111a, 111b, in the turnover mouth of pipe 111a, 111b peace
Equipped with the turnover mouth of pipe valve 111c, 111d.The material of heat conduction cylinder 111 is in aluminium alloy, copper alloy, stainless steel or electrographite
It is a kind of.
The tube bank 113 that some thin compo pipes are constituted is arranged in heat conduction cylinder 111, the tube bank that some thin compo pipes are constituted
Good thermal conductive contact, the axis for the tube bank 113 that some thin compo pipes are constituted and heat conduction are formed between 113 and heat conduction cylinder 111
The diameter parallel of cylinder 111；Thin compo pipe is thin copper alloy tube, thin aluminium-alloy pipe, thin stainless steel alloy pipe, thin electrographite pipe
In one kind.The tube bank constituted using some thin compo pipes has heat transfer area big, and the high advantage of rate of heat transfer is adapted to 100 DEG C
The heating of above saturated vapor and saturation water.
If dry semiconductor heating element heater 112 is attached on six outer surfaces of heat conduction cylinder 111.Referring to Fig. 4 and Fig. 5, each
Semiconductor heating element heater 112 includes semiconductor heating mating plate component 112a, conductive copper box 112b, some high-temperature insulation piece 112c
112d is covered with metal alloy armoured heating.
Semiconductor heating mating plate component 112a is using more semiconductor heating mating plate 112aa semiconductor high-temp glue 112ab
Bond and formed.Whole semiconductor heating mating plate component 112a is encapsulated in conductive copper box 112b by high-temperature resistant conducting glue 112e
Interior, some high-temperature insulation piece 112c are wrapped on conductive copper box 112b using multilayer parcel mode, adjacent high-temperature insulation piece
112c interlayers are wrapped in outermost layer using the insulation glue-line 112g isolation of two-sided thermostable heat-conductive, metal alloy armoured heating set 112d
High-temperature insulation piece 112c on and each other using the insulation glue-line 112g isolation of two-sided thermostable heat-conductive, semiconductor heating light
The lead-out wire 112f of piece covers 112d through high-temperature insulation piece 112c and metal alloy armoured heating.
It is high with semiconductor between semiconductor element mating plate and semiconductor element mating plate in semiconductor heating mating plate component 112a
One entirety of warm glue bond formation, and semiconductor heating mating plate component 112a is used high-temperature electric conduction glue between conductive copper box 112b
Adhesive seal.All use double in the high-temperature insulation piece 112c two sides that conductive copper box 112b is covered with metal alloy armoured heating between 112d
Face thermostable heat-conductive insulating cement 112g adhesive seals, form an entirety, very close to each other, are difficult to strike sparks, puncture, burn.
High-temperature insulation piece 112c is artificial mica insulation sheet, epoxy resins insulation piece, epoxy resin with organic-silicon-modified
One kind in insulating trip, insulating properties more preferably, more resistant to high temperature be difficult it is breakdown, burn.
High-temperature resistant conducting glue 112e is epoxy resin or the organic-silicon-modified insulating cement of epoxy resin.Metal alloy heating armour
Encapsulation 112d material is one kind in aluminium alloy, copper alloy, stainless steel alloy.
Above-mentioned internal circulation pump 200 is magnetic drive pump or plunger pump.Outer circulation pump 400 is to be followed outside steam outer circulation pump or saturation water
Ring pump, steam outer circulation pump is single-stage low pressure impulse turbine formula steam circulation pump, unit low pressure reheating turbine
One kind in formula steam circulation pump, single-stage back pressure turbine formula steam circulation pump.Saturation water outer circulation pump is magnetic drive pump, plunger
One kind in pump.
Volume in heat-conducting cylinder body of the present utility model is less than 0.03m3.In semiconductor module group formula loop heating system
Connecting line internal diameter is less than 50mm.Some unit heat exchangers that heat exchanger is less than 150mm by interior diameter are composed in parallel.Do not belong to
In the scope of application of " safe technology of pressure vessel Supervision Code (TSG21-2016) ".It is extremely secure, can be directly hot with using
Equipment short distance is connected.Save capital cost.
Above-mentioned semiconductor module group formula loop heating system is filled by the air in the emptying system of air bleeding valve pipe 600 with pump
Full water, is in saturation water by circulating-heating, circulating-heating, such as shell side of heat exchanger 300 is carried out to the water in the shell side of heat exchanger 300
The liquid level of interior control certain altitude, leaves enough spaces, can produce saturated vapor.
Claims (10)
1. a kind of semiconductor module group formula loop heating system, including it is semiconductor heater, internal circulation pump, heat exchanger, outer
Circulating pump, water tank, air bleeding valve pipe and heating equipment, it is characterised in that the semiconductor heater passes through internal circulation pump and heat
The tube side of exchanger constitutes the heating internal-circulation of more than 100 DEG C saturated vapors and saturation water；The heating equipment passes through outer circulation
The outer circulation of the shell side composition heat of pump and heat exchanger；Exhaust outlet, the exhaust are provided with the semiconductor heater
Mouth connects air bleeding valve pipe by air bleeding valve, and the hot water import and export of the water tank connects the shell side of the heat exchanger by pipeline
With the semiconductor heater.
2. semiconductor module group formula loop heating system as claimed in claim 1, it is characterised in that the semiconductor heating dress
Several semiconductor heating module connection in series-parallel composition is equipped with, the quantity of the semiconductor heating module determines the semiconductor heating
The heating power of device and the saturated vapor amount and saturated water amount produced.
3. semiconductor module group formula loop heating system as claimed in claim 1, it is characterised in that the semiconductor heated mould
If block includes the tube bank that a heat conduction cylinder, dry semiconductor heating element heater and some thin compo pipes are constituted, the axle of the heat conduction cylinder
To the turnover mouth of pipe is provided at both ends with, turnover mouth of pipe valve is installed in the turnover mouth of pipe, the tube bank that some thin compo pipes are constituted is set
Put in the heat-conducting cylinder body, forming good heat conduction between the tube bank of some thin compo pipes compositions and the heat conduction cylinder connects
Touch, the diameter parallel of the axis and the heat conduction cylinder of the tube bank that some thin compo pipes are constituted；If the dry semiconductor adds
Thermal element is attached on the outer surface of heat conduction cylinder.
4. semiconductor module group formula loop heating system as claimed in claim 3, it is characterised in that outside the heat conduction cylinder
Wall is polygon.
5. semiconductor module group formula loop heating system as claimed in claim 3, it is characterised in that outside the heat conduction cylinder
Wall is quadrangle or hexagon.
6. semiconductor module group formula loop heating system as claimed in claim 3, it is characterised in that the material of the heat conduction cylinder
Matter is one kind in aluminium alloy, copper alloy, stainless steel or electrographite；The thin compo pipe is thin copper alloy tube, thin aluminium alloy
One kind in pipe, thin stainless steel alloy pipe, thin electrographite pipe.
7. semiconductor module group formula loop heating system as claimed in claim 3, it is characterised in that the semiconductor heating unit
Part includes semiconductor heating mating plate component, conductive copper box, some high-temperature insulation pieces and metal alloy armoured heating set, described half
Conductor heating mating plate component is encapsulated in the conductive copper box by high-temperature resistant conducting glue, and some high-temperature insulation pieces use multilayer
Parcel mode is wrapped on conductive copper box, and adjacent high-temperature insulation piece interlayer is isolated using two-sided thermostable heat-conductive insulation glue-line,
The metal alloy armoured heating set is wrapped on outermost high-temperature insulation piece and led each other using two-sided high temperature resistant
Heat insulation glue-line is isolated, and the lead-out wire of the semiconductor heating mating plate passes through the high-temperature insulation piece and metal alloy heating armour
Encapsulation.
8. semiconductor module group formula loop heating system as claimed in claim 7, it is characterised in that the semiconductor heats light
Piece component heats mating plate semiconductor high temperature glue bond using more semiconductor and formed.
9. semiconductor module group formula loop heating system as claimed in claim 7, it is characterised in that the high-temperature insulation piece
For artificial mica insulation sheet, epoxy resins insulation piece, the one kind of epoxy resin in organic-silicon-modified insulating trip；The high temperature resistant
Conducting resinl is epoxy resin or the organic-silicon-modified insulating cement of epoxy resin；The material of the metal alloy armoured heating set is aluminium
One kind in alloy, copper alloy, stainless steel alloy；The internal circulation pump is magnetic drive pump or plunger pump；The outer circulation pump is steaming
Vapour outer circulation pump or saturation water outer circulation pump；The steam outer circulation pump is single-stage low pressure impulse turbine formula steam circulation
One kind in pump, unit low pressure reheating turbine formula steam circulation pump, single-stage back pressure turbine formula steam circulation pump；
The saturation water outer circulation pump is one kind in magnetic drive pump, plunger pump.
10. semiconductor module group formula loop heating system as claimed in claim 3, it is characterised in that in the heat-conducting cylinder body
Volume be less than 0.03m3, the volume in the water tank is less than 0.03m3；In the semiconductor module group formula loop heating system
Tubing internal diameter is less than 150mm, and some unit heat exchangers that the heat exchanger is less than 150mm by interior diameter are composed in parallel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621301500.XU CN206488255U (en) | 2016-11-30 | 2016-11-30 | A kind of semiconductor module group formula loop heating system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621301500.XU CN206488255U (en) | 2016-11-30 | 2016-11-30 | A kind of semiconductor module group formula loop heating system |
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| CN206488255U true CN206488255U (en) | 2017-09-12 |
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| CN201621301500.XU Active CN206488255U (en) | 2016-11-30 | 2016-11-30 | A kind of semiconductor module group formula loop heating system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524105A (en) * | 2016-11-30 | 2017-03-22 | 刘文治 | Semiconductor module set type cyclic heating system |
-
2016
- 2016-11-30 CN CN201621301500.XU patent/CN206488255U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524105A (en) * | 2016-11-30 | 2017-03-22 | 刘文治 | Semiconductor module set type cyclic heating system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ding Yunqing Inventor after: Liu Wenzhi Inventor after: Ding Zijian Inventor before: Liu Wenzhi |
|
| CB03 | Change of inventor or designer information | ||
| CP02 | Change in the address of a patent holder |
Address after: Room 101, block 4, dongyiyuan, 35 Xingtai Road, Panyu District, Guangzhou, Guangdong 511400 Patentee after: Liu Wenzhi Address before: 201800 Building 2, Lane 1883, Huicheng South Road, Jiading District, Shanghai Patentee before: Liu Wenzhi |
|
| CP02 | Change in the address of a patent holder |