CN206412347U - Liquid direct contact type cooler - Google Patents
Liquid direct contact type cooler Download PDFInfo
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- CN206412347U CN206412347U CN201720096690.4U CN201720096690U CN206412347U CN 206412347 U CN206412347 U CN 206412347U CN 201720096690 U CN201720096690 U CN 201720096690U CN 206412347 U CN206412347 U CN 206412347U
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- cooling
- direct contact
- contact type
- thermovent
- heat exchange
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Abstract
The utility model is related to a kind of direct contact type cooler, including cooler body, heat exchange structure and circulating pump, the periphery of the connector of cooler body is used to that with power device fitted seal cooling cavities, the cooling cavities and heat exchange structure of the cooler body cooling medium formation circulation loop can be made by circulating pump.During work, cooling medium in direct contact type cooler of the present utility model can directly be in contact with the heat-delivery surface of power device and then take away heat, on the one hand relative to the less radiating mode of air specific heat capacity, eliminate the thermal contact resistance of the heat-delivery surface of conventional power devices and the heat sink of cooler, it is remarkably improved heat transfer property, another aspect circulating by cooling medium, heat exchange structure constantly takes away heat, the radiating efficiency of power device is substantially increased on the whole.Meanwhile, liquid direct contact type cooler of the present utility model can make the temperature of the heat-delivery surface of power device uniform, improve the service life of power device.
Description
Technical field
The utility model is related to the cooling technology field of power device, more particularly to a kind of liquid direct contact type cooling
Device.
Background technology
In real work, the heat that highly integrated high power device is produced can raise chip temperature, if radiating
Slowly, it is possible to chip temperature is increased above allowed maximum junction temperature, the performance of device will be remarkably decreased, and not
Energy steady operation, in some instances it may even be possible to can directly burn out.Therefore the programming rate of high power device is controlled, makes chip internal temperature all the time
Maintain within the junction temperature of permission, it is ensured that machine stable operation, emphasis and problem as high power device technical field research.
Because power device needs insulation protection, radiated more than the radiating of power device using wind-cooling heat dissipating pattern and cooled plate
Device.When using wind-cooling heat dissipating pattern, the specific heat capacity of air is smaller, and the heat taken away by air is relatively small, in face of structure
Increasingly compact and power device that power increasingly increases, wind-cooling heat dissipating pattern can not meet radiating requirements.Dissipated when using cooled plate
During hot device, high power device is directly attached to the surface of cooled plate radiator, radiated by circulating for cooling water, this
On the one hand kind radiating mode, which is likely to occur leakage, causes shutdown, and the incrustation scale to be formed is used for a long time in another aspect water-cooling base plate radiator
Thermal conductivity factor can be greatly reduced, and thermal contact resistance is big, it is impossible to which high power device meets radiating requirements.
Utility model content
Based on this, it is necessary to provide a kind of liquid direct contact type cooler for improving cooling effect.
A kind of liquid direct contact type cooler, for the radiating of power device, including cooler body, the first heat exchange knot
Structure and circulating pump；
The cooler body has cooling cavities and the thermovent being connected with the cooling cavities；The cooling cavities
For filling cooling medium, and for enabling the cooling medium directly to contact the power device by the thermovent
Heat-delivery surface；The cooler body is used to coordinate with the radiating wall sealing at least about the peripheral part of the thermovent；
The cooling duct of first heat exchange structure is connected with the cooling cavities by reflux line；
The circulating pump is on the reflux line, for the cooling medium for making to flow out out of described cooling cavities
It is back to after being cooled down through first heat exchange structure in the cooling cavities.
In one of the embodiments, the thermovent is located at the middle part of the side wall of the cooler body.
In one of the embodiments, the circulation liquid outlet of the cooler body is located at the bottom of the cooling cavities,
The circulation liquid outlet is connected with the reflux line.
In one of the embodiments, the circulation inlet of the cooler body is located at the top of the cooling cavities,
The circulation inlet is connected with the reflux line；When the cooler body and the power device, which are sealed, to be coordinated,
In the cooling cavities, the loading of the cooling medium can at least flood the thermovent.
In one of the embodiments, the liquid direct contact type cooler also includes injection structure, the injection knot
Structure is located in the cooling cavities and set towards the thermovent, and the liquid storage cylinder of the injection structure is tied with the described first heat exchange
The cooling duct of structure is connected；Positioned at the lower section of the thermovent for for filling cooling Jie in the cooling cavities
The hydrops portion of matter.
In one of the embodiments, the injection structure includes jet tray, be covered with the jet tray spray orifice for
The cooling medium from the cooling duct cooling for reflux is set to spray to the thermovent.
In one of the embodiments, the injection structure include nozzle, the nozzle towards the thermovent set with
The cooling medium cooled down from the cooling duct is set to spray to the thermovent to be atomized shape.
In one of the embodiments, the nozzle has multiple, and multiple nozzles are set in array.
In one of the embodiments, the liquid direct contact type cooler also includes the second heat exchange structure, described the
Two heat exchange structures have condensation channel, and the condensation channel is connected with the cooling cavities, for after the volatilization of hydrops portion
In cooling medium condensing reflux to the cooling cavities.
In one of the embodiments, second heat exchange structure is on the cooler body, and is located at described cold
But the top of cavity.
Above-mentioned direct contact type cooler includes cooler body, heat exchange structure and circulating pump, and the cooling cavities is used for
Cooling medium is filled, is used to coordinate with the radiating wall sealing at least about the peripheral part of the thermovent, the circulating pump
To form circulation loop between cooler body and heat exchange structure.Cooling medium in above-mentioned direct contact type cooler can
To be directly in contact with the heat-delivery surface of power device and then take away heat, on the one hand relative to the less radiating of air specific heat capacity
Mode, eliminates the thermal contact resistance of the heat-delivery surface of conventional power devices and the heat sink of cooler, is remarkably improved conductivity of heat
Energy；Another aspect circulating by cooling medium, heat exchange structure constantly takes away heat, power device is substantially increased on the whole
The radiating efficiency of part.Meanwhile, when aforesaid liquid direct contact type cooler works, the temperature of the heat-delivery surface of power device can be made
Degree is uniform, improves the service life of power device.
Further, by setting the direct spray cooling medium of injection structure to the heat-delivery surface of power device or making cooling
Medium atomization undergoes phase transition heat absorption, can further improve the radiating efficiency of power device.
Brief description of the drawings
Fig. 1 is the structural representation of the liquid direct contact type cooler of embodiment 1；
Fig. 2 is the structural representation of the liquid direct contact type cooler of embodiment 2；
Fig. 3 is the structural representation of the liquid direct contact type cooler of embodiment 3.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But, the utility model can come real in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model
The understanding for opening content is more thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
The liquid direct contact type cooler of one embodiment, for the radiating of power device, including cooler body,
One heat exchange structure and circulating pump.Wherein, power device is usually used in referring to the larger device of power ratio, including power semiconductor,
Such as IGBT, IGCT, controllable silicon, rectifier bridge or relay etc..The timely radiating of power device operationally is to maintain its long-term
The key normally run.
In the present embodiment, cooler body has cooling cavities and the thermovent being connected with cooling cavities.Cooling
Cavity is used to fill cooling medium, and for enabling cooling medium directly to contact the radiating table of power device by thermovent
Face.Cooler body is used to coordinate with radiating wall sealing at least about the peripheral part of thermovent.
Specifically, on cooler body at least about can between the peripheral part of thermovent and the heat-delivery surface of power device
To be tightly connected by insulated enclosure glue-line, cooling medium is set directly to be in contact with the heat-delivery surface of power device heat transfer, raising
Heat transfer efficiency.It is appreciated that cooling medium requires insulation and heat conduction, conventional silicone oil, mineral oil or vegetable oil can be used.
Preferably, thermovent is located at the middle part of the side wall of cooler body.
The cooling duct of first heat exchange structure is connected with cooling cavities by reflux line.Circulating pump is located at reflux line
On, the cooling medium for making to flow out out of cooling cavities is back in cooling cavities after being cooled down through the first heat exchange structure.
Preferably, the pipeline that the first heat exchange structure is connected with cooler body can be using rigid conduit connection or flexible
Pipeline is connected.Rigid conduit can be the larger pipelines of hardness such as metal tube, and flexible connection pipeline can be plastic tube etc., structure
Simply, it is easy to install.It is appreciated that the first heat exchange structure in the present embodiment mode is external in cooler body, it can be adopted
With conventional pressure cooling air mode, water cooling heat exchange mode, the hot fluid flowed out from cooling cavities is set to cool down Posterior circle again
With raising efficiency.
In the present embodiment, it is preferable that the circulation liquid outlet of cooler body is located at the bottom of cooling cavities, recycles
Liquid mouthful is connected with reflux line.
Specifically, the circulation inlet of cooler body is located at the top of cooling cavities, circulation inlet and reflux line
It is connected.When cooler body and power device, which are sealed, to be coordinated, in cooling cavities, the loading of cooling medium at least can
Flood thermovent.
Further, liquid direct contact type cooler can also include injection structure, and injection structure is located at cooling cavities
Interior and set towards thermovent, the liquid storage cylinder of injection structure is connected with the cooling duct of the first heat exchange structure.In cooling cavities
The lower section for the thermovent being located at is the hydrops portion for filling cooling medium.
Specifically, injection structure includes being covered with spray orifice on jet tray, jet tray making to lead to from cooling by liquid storage cylinder
The cooling medium of road cooling for reflux sprays to thermovent, is mixed with the higher cooling medium of the temperature for preventing with being located at cooling cavities bottom
Close, the radiating efficiency of power device can be greatly improved.In other embodiments, jet tray can be replaced further with nozzle
Generation.Nozzle towards thermovent set for by liquid storage cylinder make from cooling duct cool down cooling medium be atomized shape spray to it is scattered
Hot mouth.In order to further improve radiating effect, nozzle has can be with multiple, and multiple nozzles are set in array.
Further, liquid direct contact type cooler also includes the second heat exchange structure, and the second heat exchange structure has condensation
Passage, condensation channel is connected with cooling cavities, for from the cooling medium condensing reflux after the volatilization of hydrops portion to cooling cavities
It is interior.Preferably, the second heat exchange structure is on cooler body, and is located at the top of cooling cavities.Volatilized from cooling cavities
Cooling medium undergo phase transition, can further take away heat, improve radiating efficiency.It is appreciated that in the present embodiment mode
Second heat exchange structure be external in cooler body or with cooler body integrated molding, it can be empty using conventional pressure
Air cooling mode, water cooling heat exchange mode, improve efficiency.
With reference to specific embodiment, further liquid direct contact type cooler of the present utility model is explained.
Embodiment 1
Fig. 1 is refer to, the present embodiment provides a kind of liquid immersion type cooler 10, for the radiating of power device 1, including
Cooler body 100, heat exchange structure 110 and circulating pump 120.
Cooler body 100 has cooling cavities 101 and the thermovent being connected with cooling cavities 101.Thermovent is located at
The middle part of the side wall of cooler body 100.Cooling cavities 101 is used to be full of insulating heat-conductive liquid, and for passing through thermovent
Insulating heat-conductive liquid is set directly to contact the heat-delivery surface of power device.Week of the cooler body 100 at least about thermovent
Rim portion is coordinated by insulated enclosure glue-line with radiating wall sealing.
The inlet of heat exchange structure 110 is connected with the liquid outlet of cooler body 100, the liquid outlet of heat exchange structure 110
It is connected with the inlet of cooler body 100, heat exchange structure 110 is led for cooling down the insulation flowed out from cooling cavities 101
Hot liquid.Heat exchange structure 110 passes through air-cooled heat exchange.
Circulating pump 120 makes on the pipeline between the liquid storage mouthful and the inlet of heat exchange structure 110 of cooler body 100
Insulating heat-conductive liquid forms circulation loop between cooler body 100 and heat exchange structure 110.
When power device 1 works, the insulating heat-conductive liquid being pre-filled with directly contacts heat-delivery surface by thermovent, inhales
Heat is received, then is cooled down in extracting for circulating pump 120 in the heat exchanger channels for entering heat exchange structure 110 under power, is recycled after cooling
Flow back to cooling cavities 101, persistent loop and take away power device 1 generation heat.
Embodiment 2
Fig. 2 is refer to, the present embodiment provides a kind of liquid spray cooler 20, for the radiating of power device 1, including
Cooler body 200, heat exchange structure 210, circulating pump 220 and injection structure 230.
Cooler body 200 has the thermovent that cooling cavities 201 is connected with cooling cavities 201.Thermovent is located at
The middle part of the side wall of cooler body 200, cooler body 200 is used for and radiating wall at least about the peripheral part of thermovent
Sealed and coordinated by insulated enclosure glue-line.The cooling duct of heat exchange structure 210 is connected with cooling cavities 201 by reflux line
It is logical.Heat exchange structure 210 is exchanged heat by water cooling.Circulating pump 220 is on reflux line, for making to flow out out of cooling cavities 201
Cooling medium 2 through first heat exchange structure cool down after be back in cooling cavities 201.Cooler body 200 is recycled
Liquid mouthful is located at the bottom of cooling cavities 201, and circulation liquid outlet is connected with reflux line.
Injection structure 230 is located in cooling cavities 201 and set towards thermovent, and the liquid storage cylinder of injection structure 230 is with changing
The cooling duct of heat structure 210 is connected.The lower section that cooling cavities 201 is located at thermovent is the product for filling cooling medium 2
Liquid portion.It is covered with spray orifice on jet tray for making the cooling medium 2 from cooling duct cooling for reflux spray to thermovent, prevents and position
The higher cooling medium mixing of temperature in the bottom of cooling cavities 201, can greatly improve the radiating efficiency of power device 1.
When power device 1 works, under the extraction of circulating pump 220, the entrance of cooling medium 2 for being pre-filled in hydrops portion is changed
Cooled down in the cooling duct of heat structure 210, cooling cavities 201 is flowed back in recycling after cooling, and persistent loop simultaneously takes away power device 1
Caloric value.
Embodiment 3
Fig. 3 is refer to, the present embodiment provides a kind of liquid spray cooler 30, for the radiating of power device 1, including
Cooler body 300, the first heat exchange structure 310, circulating pump 320, the heat exchange structure 340 of injection structure 330 and second.
Cooler body 300 has the thermovent that cooling cavities 301 is connected with cooling cavities 301.Thermovent is located at
The middle part of the side wall of cooler body 300, cooler body 300 is used for and radiating wall at least about the peripheral part of thermovent
Sealed and coordinated by insulated enclosure glue-line.The cooling duct of first heat exchange structure 310 passes through reflux line phase with cooling cavities 301
Connection.Heat exchange structure 310 is exchanged heat by water cooling.Circulating pump 320 is on reflux line, for making to flow out of cooling cavities 301
The cooling medium 2 gone out is back in cooling cavities 301 after being cooled down through first heat exchange structure 310.Cooler body 300 is followed
Ring liquid outlet is located at the bottom of cooling cavities 301, and circulation liquid outlet is connected with reflux line.
Injection structure 330 is located in cooling cavities 301 and set towards thermovent, the liquid storage cylinder of injection structure 330 and the
The cooling duct of one heat exchange structure 310 is connected.The lower section that cooling cavities 301 is located at thermovent is for filling cooling medium
Hydrops portion.Injection structure 330 include multiple nozzles, multiple nozzles in array set, multiple nozzles towards thermovent setting with
In making the cooling medium 2 cooled down from cooling duct spray to thermovent to be atomized shape by liquid storage cylinder, radiating can be further improved
Effect.
Second heat exchange structure 340 has condensation channel, and condensation channel is connected with cooling cavities 301, for from hydrops portion
In the condensing reflux of cooling medium 2 to cooling cavities 301 after volatilization.Second heat exchange structure 340 is located on cooler body 300,
And positioned at the top of cooling cavities 301.The cooling medium 2 volatilized from cooling cavities 301 is undergone phase transition, and can further be taken away
Heat, improves radiating efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that for the common skill of this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
Protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of liquid direct contact type cooler, the radiating for power device, it is characterised in that including cooler body,
First heat exchange structure and circulating pump；
The cooler body has cooling cavities and the thermovent being connected with the cooling cavities；The cooling cavities is used for
Cooling medium is filled, and for enabling the cooling medium directly to contact the radiating of the power device by the thermovent
Surface；The cooler body is used to coordinate with the radiating wall sealing at least about the peripheral part of the thermovent；
The cooling duct of first heat exchange structure is connected with the cooling cavities by reflux line；
The circulating pump is on the reflux line, for the cooling medium that makes to flow out out of described cooling cavities through institute
It is back to after stating the cooling of the first heat exchange structure in the cooling cavities.
2. liquid direct contact type cooler according to claim 1, it is characterised in that the thermovent is located at described cold
But the middle part of the side wall of device body.
3. liquid direct contact type cooler according to claim 2, it is characterised in that the circulation of the cooler body
Liquid outlet is located at the bottom of the cooling cavities, and the circulation liquid outlet is connected with the reflux line.
4. liquid direct contact type cooler according to claim 3, it is characterised in that the circulation of the cooler body
Inlet is located at the top of the cooling cavities, and the circulation inlet is connected with the reflux line；When the cooler
When body seals cooperation with the power device, in the cooling cavities, the loading of the cooling medium can at least flood
Do not have the thermovent.
5. liquid direct contact type cooler according to claim 3, it is characterised in that described also including injection structure
Injection structure is located in the cooling cavities and set towards the thermovent, the liquid storage cylinder of the injection structure and described first
The cooling duct of heat exchange structure is connected；The lower section that the cooling cavities is located at the thermovent is described cold for filling
But the hydrops portion of medium.
6. liquid direct contact type cooler according to claim 5, it is characterised in that the injection structure includes injection
It is covered with spray orifice on plate, the jet tray cooling medium from the cooling duct cooling for reflux is sprayed to described dissipate
Hot mouth.
7. liquid direct contact type cooler according to claim 5, it is characterised in that the injection structure includes spray
Mouth, the nozzle is set towards the thermovent so that the cooling medium cooled down from the cooling duct is sprayed to being atomized shape
The thermovent.
8. liquid direct contact type cooler according to claim 7, it is characterised in that the nozzle has multiple, multiple
The nozzle is set in array.
9. the liquid direct contact type cooler according to any one of claim 5 to 8, it is characterised in that also including
Two heat exchange structures, second heat exchange structure has condensation channel, and the condensation channel is connected with the cooling cavities, is used for
In cooling medium condensing reflux to the cooling cavities after being volatilized from hydrops portion.
10. liquid direct contact type cooler according to claim 9, it is characterised in that second heat exchange structure is set
In on the cooler body, and positioned at the top of the cooling cavities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720096690.4U CN206412347U (en) | 2017-01-24 | 2017-01-24 | Liquid direct contact type cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720096690.4U CN206412347U (en) | 2017-01-24 | 2017-01-24 | Liquid direct contact type cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206412347U true CN206412347U (en) | 2017-08-15 |
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ID=59557792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720096690.4U Active CN206412347U (en) | 2017-01-24 | 2017-01-24 | Liquid direct contact type cooler |
Country Status (1)
| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783770A (en) * | 2017-01-24 | 2017-05-31 | 广东合新材料研究院有限公司 | Liquid direct contact type cooler |
-
2017
- 2017-01-24 CN CN201720096690.4U patent/CN206412347U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783770A (en) * | 2017-01-24 | 2017-05-31 | 广东合新材料研究院有限公司 | Liquid direct contact type cooler |
| WO2018137265A1 (en) * | 2017-01-24 | 2018-08-02 | 广东合一新材料研究院有限公司 | Direct contact liquid cooler |
| CN106783770B (en) * | 2017-01-24 | 2024-04-02 | 广东西江数据科技有限公司 | Liquid direct contact cooler |
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Effective date of registration: 20211108 Address after: 526040 room 142, plant (Building B) of Zhaoqing New Area Investment Development Co., Ltd., Beiba District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xijiang Data Technology Co.,Ltd. Address before: Room 2006, building 2, No. 8, Fenghuang Third Road, Zhongxin Guangzhou Knowledge City, Guangzhou, Guangdong 510635 Patentee before: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |