CN206411418U - One kind is inverted exposure sources - Google Patents
One kind is inverted exposure sources Download PDFInfo
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- CN206411418U CN206411418U CN201720053359.4U CN201720053359U CN206411418U CN 206411418 U CN206411418 U CN 206411418U CN 201720053359 U CN201720053359 U CN 201720053359U CN 206411418 U CN206411418 U CN 206411418U
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- exposure
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- supporting construction
- inversion
- load sample
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Abstract
Exposure sources are inverted the utility model discloses one kind, belong to direct write exposure machine technical field.Inversion exposure sources of the present utility model, including supporting construction, exposure device, alignment device, load sample device and control device；The supporting construction bottom is a body structure, and exposure device and control device are located in the body structure, and the load sample device is embedded in body structure upper surface and above exposure device；The supporting construction top is metope structure or gantry structure, and the alignment device is connected with supporting construction top and positioned at the top of load sample device.Equipment of the present utility model can be realized to the product double-sided exposure image exactitude position such as semiconductor, pcb board, and permanent destruction will not be caused to plate；Equipment is simple, it is not necessary to the extra equipment added for printing or exposing marker graphic, cost-effective.
Description
Technical field
The utility model is related to a kind of inversion exposure sources, belongs to direct write exposure machine technical field.
Background technology
Direct write exposure technique is the direct transfer techniques of the image developed rapidly in recent years, with its technological process it is simple,
Production efficiency is high, the low feature of manufacturing cost, and the board-like photoetching technique of traditional mask is instead of quickly, as in PCB and half
The most important and most common technology of the production fields such as conductor.
But, when the direct write equipment of prior art carries out double-sided exposure to pcb board, however it is often difficult to by the figure on plate two sides
Exactitude position is carried out, particularly with inner plating, due to there is no the presence of positioning hole on inner plating, it is more difficult to realize two sides exposure diagram
The exactitude position of shape, causes exposure quality to decline, and product rejection is caused when serious.
Traditional alignment method-UV mark methods can solve this problem.But, on the one hand, the technology is for a long time by state
Outer company monopolizing, significantly limit development in science and technology of the China in direct write exposure technique field, and then have influence on association area
Scientific and technological progress；On the other hand, the principle of the technology is while a face figure is exposed, to be positioned beneficial to ultraviolet in another side one
Put and do respective markers, contraposition when being exposed as the face, such technology is in the presence of the trace that can cause to eliminate on product
And influence properties of product, stayed in unexposed face trace unexposed face can be caused to be contaminated, mark branding edge not sharp keen enough and
Very high aligning accuracy is relatively inaccessible to, causes substrate adsorption uneven and causes the problems such as plate face is uneven.
In addition, the direct write equipment of prior art is operationally, the part such as sample, exposure device is in the state exposed to the open air completely,
And exposure device is normally at the top of sample, on the one hand sample to be exposed is highly susceptible to the pollution of external environment, causes
The situation for exposing the influence product quality such as lines open circuit occurs, on the other hand, and sample receives reaction during laser irradiation, can produce
A certain amount of pernicious gas and dust, these pernicious gases and dust produce burn into equipment such as exposure device and alignment devices
Blocking, short circuit, improper ventilation etc. endanger.
Therefore, in the urgent need to developing a kind of effect superior technique to break long-term monopolization of the offshore company in the field,
And the problems such as preferably solve contraposition inaccurate, part of appliance and sample vulnerable to pollution.
Utility model content
In order to solve the above problems, the utility model provides a kind of inversion exposure sources.
The utility model provides a kind of inversion exposure sources, including supporting construction, exposure device, alignment device, load sample
Device and control device；The supporting construction bottom is a body structure, and exposure device and control device are located at the casing knot
In structure, the load sample device is embedded in body structure upper surface and above exposure device；The supporting construction top is metope
Structure or gantry structure, the alignment device are connected with supporting construction top and positioned at the top of load sample device.
In one embodiment, the load sample device is the transparent loading being made up of the material of two layers of transparent material up and down
Device.Specimen holder is put between two layers.
In one embodiment, the exposure device, alignment device, the steric form of load sample device are from upper
Under be followed successively by alignment device, load sample device, exposure device, load sample device is located between exposure device and alignment device.
In one embodiment, the body structure is a containment housing.
In one embodiment, the load sample device is mechanical press device.Sample can be fixed on by mechanical force
On load sample device.
In one embodiment, the exposure device includes exposure cameras and exposure moving parts.
In one embodiment, the alignment device includes alignment cameras and alignment motion component.
In one embodiment, the alignment motion component includes the guide rail in 3 directions of X, Y, Z.Alignment cameras can be with
Under the cooperation with alignment motion component, the position movement in X, Y, Z3 directions is realized.
In one embodiment, the exposure cameras of the exposure device is DMD components or polygon prism component.
In one embodiment, the alignment cameras of the alignment device is CCD camera.
Advantage and effect of the present utility model：
Inversion exposure sources of the present utility model：
(1) realize to the product double-sided exposure image exactitude position such as semiconductor, pcb board, particularly realize for nothing
The image exactitude position of the double-sided exposure of the inner plating for the pcb board that positioning hole is present.
(2) in position fixing process, shape is as marker graphic using in existing graphics or uses addition marker graphic conduct
The mark of positioning, will not cause permanent destruction to plate.
(3) equipment is simple, it is not necessary to the extra equipment added for printing or exposing marker graphic, cost-effective.
(4) this equipment, when product needs two sides to expose, the present apparatus can realize that the two sides of product is accurately aligned.With biography
Device that the exposure system of system is exposed from top to substrate on the contrary, exposure system of the present utility model is located at below device,
Transmitting laser is exposed to substrate from the bottom up.
Brief description of the drawings
Fig. 1 is inversion exposure sources structural representation of the present utility model；Wherein, 1 supporting construction, 2 exposure devices, 3 pairs
Standard apparatus, 4 load sample devices, 5 control devices, 6 alignment motion components.
Embodiment
The technical scheme to utility model is described in detail below in conjunction with the accompanying drawings：
Embodiment 1：It is inverted exposure sources
Inversion exposure sources of the present utility model are illustrated by taking such as Fig. 1 as an example.
Inversion exposure sources of the present utility model, including supporting construction 1, exposure device 2, alignment device 3, load sample device 4
With control device 5；1 point of the supporting construction is two parts up and down；The bottom of supporting construction 1 is a body structure, exposure device 2
It is located at control device 5 in the body structure, the load sample device 4 is embedded in body structure upper surface and positioned at exposure device 2
Top；The top of the supporting construction 1 is metope structure or gantry structure, and the alignment device 3 and the top of supporting construction 1 connect
Connect and positioned at the top of load sample device 4.
The exposure device 2 includes exposure cameras and exposure moving parts；The alignment device 3 includes alignment cameras and right
Quasi-moving component 6.Alternatively, the exposure cameras of the exposure device 2 is DMD components or polygon prism component, the alignment device 3
Alignment cameras be CCD camera.The control of control device 5 exposure device 2 is exposed, controls alignment device 3 to be aligned.
Further, the load sample device 4 is the transparent carrying apparatus being made up of the material of two layers of transparent material up and down.Sample
Product (such as semiconductor or pcb board) are folded up between two layers.By using transparent load sample device 4, on the one hand, alignment device
3 can obtain the image information for folding up the sample on load sample device 4, and on the other hand, the producible laser of exposure device 2 can
To be exposed by lower floor's transparent material through load sample device 4 to sample.
Further, the body structure is a containment housing, can further prevent external dust pollution to be located at casing knot
Exposure device 2 in structure.
Inversion exposure sources of the present utility model, alignment device 3 and exposure device 2 are located at the both sides of load sample device 4 respectively.
It is in the face exposure figure during work, when being formerly exposed to the A faces of sample, it is not necessary to carry out any operation to B faces
Determine some special shapes that can be used for making marks or some special shapes that can be used for making marks are added in exposure figure；
When being exposed in the B faces to sample, A faces just face the determination on alignment device 3, the crawl of alignment device 3 A faces be used for mark
The special shape of note, that is, complete the determination of the position to B faces figure to be exposed, instruct exposure device 2 to be exposed B faces.
Such laser direct-write photoetching equipment, with advantages below：(1) when in the figure of A faces containing the available of the identification of device 3 can be aligned
Mark the special shape of figure, then need not carry out extra mark, any harmful effect will not be produced to sample；When A faces
The special shape that can be used as marker graphic of the identification of device 3 can be aligned by not contained in figure, the marker graphic additionally added,
It can be minimum, the thin mark of shape, not interfere with the quality of product, and the marker graphic holds very much in subsequent point shadow
Easily it is washed out；So, no matter whether marker graphic used is extra addition, all without leaving permanent branding on product；(2)
Special shape for marker graphic is exposed up by exposure device 2, and the use of exposure device 2 is all aggregation light,
Precision is high, marker graphic svelteness, sharp keen, and the aligning accuracy reached is higher；(3) any mark is not done in B faces, will not be right
B faces are polluted.
The operation principle of the present utility model for being inverted exposure sources is as follows：For convenience of understanding, the sample of double-sided exposure will be treated
Two sides be referred to as A faces, B faces；When being exposed using laser direct-write photoetching equipment of the present utility model, there is following situation：
The first situation, the two sides of sample is not yet exposed, and the laser direct-write photoetching equipment is exposed including as follows
Step：
(1) sample is positioned over load sample device 4, and makes A facing to the side of exposure device 2；
(2) determination of marker graphic：If do not contained in the electrical patterns to be exposed of A faces can be aligned device 3 identification can
Special shape as marker graphic, then add the marker graphic for location position, so in the electrical patterns to be exposed of A faces
Step (3) is carried out afterwards；If can be used as marker graphic containing can be aligned the identification of device 3 in the electrical patterns to be exposed of A faces
Special shape, then using the special shape as marker graphic, carry out step (3)；
(3) sample A faces are exposed；
(4) sample is reapposed, makes unexposed B facing to the side of exposure device 2, the A exposed is filled facing to alignment
Put 3 sides；
(5) alignment device 3 captures the position for the marker graphic being exposed on A faces in A faces side, and then acquisition B faces wait to expose
The position that light figure should expose, completes contraposition；
(6) B faces are exposed.
Second case, the one side of sample has exposed, another side is to be exposed, now using completed the one side of exposure as A faces,
Another side is B faces, and the laser direct-write photoetching equipment, which is exposed, to be comprised the following steps：
(1) determination of marker graphic：With can be aligned in A faces exposure figure device 3 identification can be used as marker graphic
Special shape be used as marker graphic；
(2) sample is positioned over load sample device 4, and makes A facing to the side of alignment device 3, makes unexposed B facing to exposure
Electro-optical device side；
(3) alignment device 3 captures the marker graphic on A faces in A faces side, and then acquisition B faces figure to be exposed should expose
The position of light, completes contraposition；
(4) B faces are exposed.
The inversion exposure sources of two sides alignment of the present utility model, can overcome traditional direct-write photoetching equipment to make completely
Problems caused by carrying out double-sided exposure with UV mark, in industry belong to the innovation and creation of innovative form, can break state
Long-term monopolization of the outer company in the field.
Although the utility model is disclosed as above with preferred embodiment, it is not limited to the utility model, any
Person skilled in the art, is not departing from spirit and scope of the present utility model, can all do various changes and modification, therefore this
What the protection domain of utility model should be defined by claims is defined.
Claims (8)
1. one kind is inverted exposure sources, it is characterised in that the inversion exposure sources include supporting construction, exposure device, alignment
Device, load sample device and control device；The supporting construction bottom is a body structure, and exposure device and control device are located at institute
State in body structure, the load sample device is embedded in body structure upper surface and above exposure device；In the supporting construction
Portion is metope structure or gantry structure, and the alignment device is connected with supporting construction top and positioned at the top of load sample device.
2. inversion exposure sources according to claim 1, it is characterised in that the load sample device is transparent by two layers up and down
The transparent carrying apparatus that the material of material is constituted.
3. inversion exposure sources according to claim 1, it is characterised in that the body structure is a containment housing.
4. inversion exposure sources according to claim 1, it is characterised in that the exposure device includes exposure cameras and exposure
Photomovement component.
5. inversion exposure sources according to claim 1, it is characterised in that the exposure cameras of the exposure device is DMD
Component or polygon prism component.
6. inversion exposure sources according to claim 1, it is characterised in that the alignment device includes alignment cameras and right
Quasi-moving component.
7. inversion exposure sources according to claim 1, it is characterised in that the alignment cameras of the alignment device is CCD
Camera.
8. inversion exposure sources according to claim 6, it is characterised in that the alignment motion component includes X, Y, Z 3
The guide rail in individual direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720053359.4U CN206411418U (en) | 2017-01-16 | 2017-01-16 | One kind is inverted exposure sources |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720053359.4U CN206411418U (en) | 2017-01-16 | 2017-01-16 | One kind is inverted exposure sources |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206411418U true CN206411418U (en) | 2017-08-15 |
Family
ID=59556194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720053359.4U Active CN206411418U (en) | 2017-01-16 | 2017-01-16 | One kind is inverted exposure sources |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106814552A (en) * | 2017-01-16 | 2017-06-09 | 上海誉刻智能装备有限公司 | A kind of inversion exposure sources of two sides alignment |
| CN112484636A (en) * | 2020-11-05 | 2021-03-12 | 湖北大学 | PCB laser target positioning method and positioning system based on neural network |
-
2017
- 2017-01-16 CN CN201720053359.4U patent/CN206411418U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106814552A (en) * | 2017-01-16 | 2017-06-09 | 上海誉刻智能装备有限公司 | A kind of inversion exposure sources of two sides alignment |
| CN112484636A (en) * | 2020-11-05 | 2021-03-12 | 湖北大学 | PCB laser target positioning method and positioning system based on neural network |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181016 Address after: 221300 Huashan Road, Pizhou Economic Development Zone, Pizhou, Xuzhou, Jiangsu, China Patentee after: Jiangsu shadow Speed Technology Co., Ltd. Address before: 201612 401, room 9, 1158 Songjiang District Road, Songjiang District, Shanghai. Patentee before: Shanghai reputation Intelligent Equipment Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190709 Address after: 221300 Huashan Road, Pizhou Economic Development Zone, Xuzhou, Jiangsu Patentee after: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY CO., LTD. Address before: 221300 Huashan Road, Pizhou Economic Development Zone, Pizhou, Xuzhou, Jiangsu, China Patentee before: Jiangsu shadow Speed Technology Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 221000 west side of Hengshan Road, Pizhou City, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Yingsu integrated circuit equipment Co., Ltd Address before: 221300 Huashan Road, Pizhou Economic Development Zone, Jiangsu, China, Xuzhou Patentee before: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |