CN206312035U - A kind of No. eight rack-mount servers - Google Patents

Abstract

The utility model discloses an eight-way rack-type server, the chassis of which is divided into a typical configuration chamber and an optional configuration chamber, each chamber is independent of each other, and the typical configuration chamber is used to place five fans and other devices required for typical configurations. , forming a completed typical configuration system, the optional configuration chamber does not place any structural parts under the typical configuration, but is filled with windshield materials; controls, compared with the prior art, the number of fans in the typical configuration of the embodiment of the present invention The reduction reduces the cost and reduces the noise generated by the fan rotation when the server is working. At the same time, in the highest configuration of the optional configuration chamber, 3 fans can be installed at the rear, and GPU or hard disk can be installed at the front, so that the GPU is at the air inlet, the temperature of the incoming air is greatly reduced, the wind speed is higher, and the heat dissipation capacity is stronger. It can support the heat dissipation requirements of high-performance GPUs, and can be applied to occasions that require higher graphics processing performance and computing performance.

Description

An eight-way rack server

technical field

The utility model relates to the technical field of server configuration, in particular to an eight-way rack server.

Background technique

Rack server is a common type of server. Its appearance is designed according to a unified standard (the standard width is 919 inches, and the height is a multiple of 4.445cm). When in use, it can be neatly arranged in the rack, which can save space. , and it is convenient for daily maintenance and unified management to meet the intensive server deployment needs of enterprises. Therefore, it is used by many enterprises. According to the number of physical CPUs (Central Processing Units, central processing units), rack servers can generally be divided into single-socket rack servers, dual-socket rack servers, four-socket rack servers, and eight-socket rack servers. rack server etc.

For the eight-way rack-mounted server, it can have different configuration specifications according to different actual use requirements; under different specification configurations, memory, PCIe (Peripheral Component Interconnect Express, a new generation of peripheral component interconnection standards, that is, a bus interface Standard) and other components vary in number. For example, under a typical configuration, the number can be 6, while under the highest configuration, there can be more than 12 PCIe. In order to improve the competitiveness of products and meet the needs of different users at the same time, the existing eight-way rack server manufacturers often make their specifications very high. But in fact, the eight-socket rack server with the highest specification configuration is rarely used, and the typical configuration can meet the needs of most customers.

Based on the existing architecture of an eight-way rack server, the CPU, memory and other devices required for a typical configuration are located at the front of the chassis, and the GPU (Graphics Processing Unit, Graphics Processing Unit) and other components required for a higher specification configuration are located at the rear of the chassis, that is, The downwind of the CPU, memory and other components makes the upstream CPU, memory, and downstream GPU form a front-to-back thermal cascade. Therefore, in order to ensure good heat dissipation of each device in the server, even for an eight-way rack server with a typical configuration, the number of fans must be fully configured (usually 8), and the number of fans cannot be increased or decreased according to the specifications, resulting in The eight-way rack server has disadvantages such as high cost and high noise.

In addition, for an eight-way rack server with high configuration, since its GPU is located at the rear of the chassis, it is thermally cascaded with upstream memory, CPU and other high-power devices, so the temperature of the incoming flow at the GPU is high, resulting in poor heat dissipation of the GPU. ; And the higher the performance of the GPU, the greater the power consumption and the more heat generated, so in order to make the eight-way rack server support high-performance GPU, the only way is to use high-performance, high-speed fans, resulting in a high-specification eight-way rack The problems of high noise and high cost of traditional servers are more prominent.

Utility model content

The utility model provides an eight-way rack server, which can adjust the number of fans according to application requirements, control costs, and improve heat dissipation performance.

In the first aspect, an eight-way rack server is provided, including: a chassis;

A typical configuration chamber and an optional configuration chamber are arranged inside the chassis;

The typical configuration chamber is provided with devices required for a typical configuration; wherein, the devices required for the typical configuration include: 5 fans arranged at the rear of the typical configuration chamber;

In a typical configuration, the optional configuration chamber is filled with windshield material.

The eight-way rack server provided by the embodiment of the utility model divides the chassis into two chambers, that is, a typical configuration chamber and an optional configuration chamber. Each chamber is independent of each other, and the typical configuration chamber is used to place typical configuration The required components constitute a complete typical configuration system, and the optional configuration chamber does not place any structural parts under the typical configuration, but is filled with windshield materials. Therefore, under the typical configuration, compared with the prior art, the number of fans provided by the eight-way rack server provided by the embodiment of the present invention is reduced, the cost is reduced, and the noise generated by the rotation of the fans when the server is working is also reduced; when the customer needs to use In the highest configuration, simply remove the windshield material from the optional configuration chamber and add the structural parts required for the highest configuration.

Optionally, the devices required for the typical configuration also include:

A standard interface module arranged at the rear of the typical configuration chamber and above the five fans; the standard interface module is used for installing an interface card PCIe.

Optionally, the devices required for the typical configuration also include:

The central processing unit CPU, storage device and memory arranged at the front of the typical configuration chamber, and the power supply PSU arranged at the rear of the typical configuration chamber.

In a typical configuration chamber, since devices with high heat generation (including CPU, memory, storage devices (HDD or NVMe), etc.) Heat dissipation; devices with low heat generation (including PCIe, power supply, etc.) have low heat dissipation requirements, so they are installed at the rear of the chamber, that is, the lower air outlet with higher incoming air temperature, which can also ensure these low heat generation devices cooling efficiency. At the same time, at the rear of the typical configuration chamber, the 4 standard interface modules on the top and the 5 fans below form a staggered arrangement, so that each fan is located just below the gap between the standard interface modules, so that it can be driven by the fans. The airflow can quickly flow into the rear of the typical configuration chamber from the gap between the standard interface modules, and then be drawn away by the fan to realize the return air heat dissipation of the devices at the rear of the typical configuration chamber, so that even in the front of the chamber In the case of high incoming flow temperature, the heat dissipation efficiency at the rear of the chamber can also be ensured.

Optionally, the front and rear of the typical configuration chamber are separated by a backboard;

The back plate is provided with a first opening and a second opening;

The first opening is facing the five fans, and the second opening is facing the standard interface module.

In the embodiment of the utility model, by setting two openings on the back plate of the typical configuration chamber, two heat dissipation air ducts can be formed to improve the heat dissipation efficiency; wherein, the above-mentioned first opening facing the fan can make the air flow flow from the chamber The front part flows into the rear part, and then is sucked away by the fan. The above-mentioned second opening facing the standard interface module makes the air flow flow from the front of the chamber to the rear part, and passes through the standard interface module, so that the standard configuration can be taken away. The heat of PCIe in the interface module is finally removed by the fan.

Optionally, the windshield material includes a pseudo-plastic module.

In the embodiment of the utility model, under the typical configuration, the optional configuration chamber is not equipped with any devices, but is filled with cheap materials such as plastic modules, which can not only reduce the cost of the server under the typical configuration, but also protect the inside of the chassis. Wind effect.

Optionally, in the highest configuration, a GPU or a hard disk is arranged at the front of the optional configuration chamber, and three fans are arranged at the rear of the optional configuration chamber.

Compared with the prior art where the GPU is located at the rear of the chassis (i.e. the air outlet), the eight-way rack server provided by the embodiment of the present invention is in the highest configuration, and the GPU is located at the front of the optional configuration chamber, at the upper wind of the heat dissipation channel. That is, at the airflow inlet, so the temperature of the incoming flow at the GPU can be greatly reduced, the wind speed can be increased, and the heat dissipation efficiency of the GPU can be improved, thereby supporting the heat dissipation requirements of the high-performance GPU, so that the eight-way rack server provided by the embodiment of the present invention can be applied It is suitable for occasions that require higher graphics processing performance and computing performance.

In addition, since the chassis of the eight-way rack server provided by the embodiment of the present invention is divided into two chambers, the components required by the eight-way rack server are separately arranged in these two chambers, so the prior art The 8 fans that need to be fully configured in the configuration can also be separately set in the two chambers to dissipate heat for the devices in the corresponding chambers separately and independently; since the number of devices in the typical configuration chamber is more than that in the optional configuration chamber, it is The number of fans installed in the typical configuration chamber is also large (5), and the number of fans installed in the optional configuration chamber is relatively small (3), which can ensure the heat dissipation requirements of the two chambers at the same time. At the same time, because the number of fans in the typical configuration chamber is lower than the full configuration, compared with the prior art, the cost of the eight-way rack-type server under the typical configuration provided by the utility model is reduced, and the heat dissipation efficiency is not affected.

Optionally, under the highest configuration, an optional interface module is also provided at the rear of the optional configuration chamber;

The optional interface module is arranged under the three fans.

In the embodiment of the utility model, in the optional configuration chamber under the highest configuration, devices with high heat generation (including GPU, hard disk, etc.) Devices (including PCIe, power supply, etc.) are arranged at the rear, that is, the lower air outlet with higher incoming air temperature, so as to ensure the heat dissipation efficiency of these high-heat-generating devices and low-heat-generating devices at the same time. At the same time, at the rear of the optional configuration chamber, the four optional interface modules below and the three fans above are also arranged in a staggered manner, so that each fan is just below the gap between the optional interface modules, so that the fans can Driven by the drive, the airflow can quickly flow into the rear of the optional configuration chamber from the gap between the optional interface modules, and then be sucked away by the fan to realize the return air heat dissipation of the devices at the rear of the optional configuration chamber, so that even in the Even when the temperature of the incoming flow at the front of the chamber is high, the heat dissipation efficiency at the rear of the chamber can also be ensured.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only the present invention. For some embodiments of the present invention, those of ordinary skill in the art can also obtain other drawings based on these drawings on the premise of not paying creative efforts.

Fig. 1 is a rear view of an eight-way rack server in a typical configuration provided by an embodiment of the present invention;

Fig. 2 is a front view of an eight-way rack server in a typical configuration provided by an embodiment of the present invention;

Fig. 3 is a side view of an eight-way rack server in a typical configuration provided by an embodiment of the present invention;

Fig. 4 is a rear view of an eight-way rack-mounted server with the highest configuration provided by the embodiment of the present invention;

Fig. 5 is a front view of an eight-way rack-mounted server with the highest configuration provided by the embodiment of the present invention;

Fig. 6 is a side view of an eight-way rack-type server in the highest configuration provided by an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

The utility model provides an eight-way rack server, which can adjust the number of fans according to application requirements, control costs, and improve heat dissipation performance.

Figure 1 is a rear view of an eight-way rack server with a typical configuration provided by an embodiment of the present invention, and Figure 2 is a front view of an eight-way rack server with a typical configuration provided by an embodiment of the present invention, Fig. 3 is a side view of an eight-way rack server in a typical configuration provided by an embodiment of the present invention.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the eight-way rack server includes: a chassis 100 ; a typical configuration chamber 110 and an optional configuration chamber 120 are disposed in the chassis 100 .

Optionally, the outer dimensions of the chassis 100 are designed according to the prior art, that is, the width of the chassis 100 is set to a standard width of 19 inches, and the height is set to n×U, where n is a positive integer, 1U=4.445cm.

In a feasible embodiment of the present invention, the typical configuration chamber 110 and the optional configuration chamber 120 can be obtained by separating the chassis 100 up and down, that is, the typical configuration chamber 110 as shown in FIG. The lower, optional configuration chamber 120 is located in the upper portion of the chassis 100 .

In another feasible embodiment of the present invention, the typical configuration chamber 110 and the optional configuration chamber 120 can be obtained by dividing the cabinet 100 left and right, that is, the typical configuration chamber 110 is located on the left part of the cabinet 100, and can be The optional configuration compartment 120 is located on the right side of the chassis 100 , or the typical configuration compartment 110 is located on the right side of the chassis 100 and the optional configuration compartment 120 is located on the left side of the chassis 100 .

Wherein, the typical configuration chamber 110 is used to place the devices required for the typical configuration; the devices required for the typical configuration at least include: five fans 111 arranged at the rear of the typical configuration chamber 110 .

Optionally, the devices required for the typical configuration may also include: a storage device 114, a central processing unit (CPU) and a memory arranged at the front of the typical configuration chamber 110; A PSU (Power Supply Unit, power supply) 113, and a standard interface module 112 arranged at the rear of the typical configuration chamber 110 and above the five fans 111. Wherein, the standard configuration interface module 112 can be provided with a total of four, and each standard configuration interface module is provided with slots, and can be installed with 3 hot-swappable interface cards 112' (ie PCIe), such as network cards, sound cards, etc. .

Wherein, the storage device 114 may be HDD (Hard Disk Driver, hard disk) or NVMe (Non-VolatileMemory Express, new generation non-volatile memory).

It can be seen that in a typical configuration chamber, devices with high heat generation (including CPU, memory, storage devices (HDD or NVMe), etc.) Devices dissipate heat quickly; and devices with low heat generation (including PCIe, power supply, etc.) have low heat dissipation requirements, so they are installed at the rear of the chamber, that is, the lower air outlet with higher incoming air temperature, which can also ensure these low output. Thermal device cooling efficiency. At the same time, at the rear of the typical configuration chamber, the 4 standard interface modules on the top and the 5 fans below form a staggered arrangement, so that each fan is located just below the gap between the standard interface modules, so that it can be driven by the fans. The airflow can quickly flow into the rear of the typical configuration chamber from the gap between the standard interface modules, and then be drawn away by the fan to realize the return air heat dissipation of the devices at the rear of the typical configuration chamber, so that even in the front of the chamber In the case of high incoming flow temperature, the heat dissipation efficiency at the rear of the chamber can also be ensured.

In a typical configuration, the optional configuration chamber 120 is not provided with any structural components, but is filled with windshielding materials to prevent wind leakage. Optionally, the windshield material may be a pseudo-plastic module.

In the embodiment of the utility model, under the typical configuration, the optional configuration chamber is not equipped with any devices, but is filled with cheap materials such as plastic modules, which can not only reduce the cost of the server under the typical configuration, but also protect the inside of the chassis. Wind effect.

Under the highest configuration, the configuration in the typical configuration chamber 110 remains unchanged, but corresponding structural components, such as GPUs and fans, are added in the optional configuration chamber 120 .

In addition, in the side view shown in FIG. 3 , the arrows also show the air flow direction of the eight-way rack-mounted server during heat dissipation. Referring to FIG. 3 , a back plate 115 is disposed inside the typical configuration chamber 110 for separating the front and rear of the typical configuration chamber 110 ; a first opening and a second opening are disposed on the back board. Wherein, the first opening is facing the five fans 111 , and the second opening is facing the PCIe above the fans 111 .

Five fans 111 provide air volume for the entire internal devices. The air ducts of the storage device 114, DIMM and CPU are forward and rear, and flow out from the first and second openings into the rear of the typical configuration chamber 110, and are 5 fans 111 are taken away. At the same time, the PCIe at the back of the typical configuration chamber 110 relies on return air for heat dissipation, that is, the air flows from the outside through the PCIe panel opening into the rear of the typical configuration chamber 110, and after passing through the PCIe and taking away its heat, it is drawn by five fans 111. Walk.

It can be seen that in this embodiment, two openings are provided on the back panel of the typical configuration chamber to form two heat dissipation air ducts to improve heat dissipation efficiency; wherein, the first opening facing the fan can make the air flow flow from the front of the chamber The air flows from the front of the chamber to the rear, and then is sucked away by the fan, and the above-mentioned second opening facing the standard interface module allows the airflow to flow from the front of the chamber to the rear, and pass through the standard interface module, so that the standard interface can be taken away The heat of PCIe in the module is finally removed by the fan.

It can be seen from the above structure that the eight-way rack server provided by the embodiment of the utility model divides the chassis into two chambers, each chamber is independent of each other, and the typical configuration chamber is used to place the devices required for the typical configuration, forming a completed Typical configuration system, optional configuration The chamber does not place any structural parts in the typical configuration, but is filled with windshield material. It can be seen that under the typical configuration, compared with the prior art, the number of fans provided by the eight-way rack server provided by the embodiment of the present invention is reduced, the cost is reduced (about 2000 RMB), and the noise generated by the rotation of the fan when the server is working is also reduced ( According to the experiment, the noise can be reduced by about 2dBA); when customers need to use the highest configuration, they only need to take out the windshield material in the optional configuration chamber, and add the structural components required by the highest configuration, such as GPU, fan, etc. For server manufacturers, the utility model can not only reduce costs, but also better meet the different configuration requirements of different customers; Adjust the configuration level of the server to optimize resource utilization.

Fig. 4 is a rear view of an eight-way rack server with the highest configuration provided by the embodiment of the present invention, and Fig. 5 is a front view of an eight-way rack server with the highest configuration provided by the embodiment of the present invention, Fig. 6 is a side view of an eight-way rack-type server in the highest configuration provided by an embodiment of the present invention.

Same as the structures shown in FIGS. 1 to 3 , the interior of the chassis 100 of the eight-way rack server in the highest configuration shown in FIGS. 4 to 6 is also divided into a typical configuration chamber 110 and an optional configuration chamber 120 .

Wherein, in the highest configuration, the arrangement of devices in the typical configuration chamber 110 is the same as that in the typical configuration, and reference may be made to the above-mentioned embodiments, which will not be repeated here.

Under the highest configuration, the optional configuration chamber 120 is no longer filled with windshield materials, but placed with the electronic devices required by the highest configuration, specifically including: 3 fans 121 arranged at the rear of the optional configuration chamber 120 and 3 fans 121 located at the rear of the optional configuration chamber 120 An optional interface module 122 below 121 , a graphics processing unit (GPU) 123 or a hard disk (HDD) 124 arranged at the front of the optional configuration chamber 120 . Among them, four optional interface modules 122 can be set in total, each optional interface module is provided with a slot, and three hot-swappable interface cards 122' (ie PCIe) can be installed; the optional configuration chamber 120 There can be 2 GPUs and 24 HDDs.

It can be seen that in the embodiment of the utility model, in the optional configuration chamber under the highest configuration, devices with high heat generation (including GPU, hard disk, etc.) The low-level devices (including PCIe, power supply, etc.) are arranged at the rear, that is, the lower air outlet with higher incoming air temperature, so as to ensure the heat dissipation efficiency of these high-heat-producing devices and low-heat-producing devices at the same time. At the same time, at the rear of the optional configuration chamber, the four optional interface modules below and the three fans above are also arranged in a staggered manner, so that each fan is just below the gap between the optional interface modules, so that the fans can Driven by the drive, the airflow can quickly flow into the rear of the optional configuration chamber from the gap between the optional interface modules, and then be sucked away by the fan to realize the return air heat dissipation of the devices at the rear of the optional configuration chamber, so that even in the Even when the temperature of the incoming flow at the front of the chamber is high, the heat dissipation efficiency at the rear of the chamber can also be ensured.

Similar to FIG. 3 , in the side view shown in FIG. 6 , the arrows also show the airflow direction when cooling the eight-way rack-mounted server in the highest configuration. Wherein, the flow direction of the airflow of the chamber 110 in the typical configuration is the same as that in the typical configuration shown in FIG. 3 , and will not be repeated here.

In the optional configuration chamber 120, the GPU or HDD required for the highest configuration is set at the front of the chassis, at the air inlet, the air flows forward and then out, first flows through the GPU or HDD and takes away its heat, and then enters the optional configuration The rear of the chamber 120 is sucked away by three fans 121; at the same time, the PCIe under the fans 121 relies on the return air for heat dissipation, that is, the air flows from the outside through the PCIe panel opening to the rear of the optional configuration chamber 120, passes through the PCIe and After taking away its heat, it is taken away by 3 fans 121.

It can be seen that compared with the prior art, in the eight-way rack server provided by the utility model, under the highest configuration, the GPU is no longer located at the rear of the chassis (i.e., the air outlet), but is located at the front of the optional configuration chamber, and the heat dissipation channel The upwind position, that is, the airflow inlet, greatly reduces the incoming air temperature at the GPU, the wind speed is higher, and the heat dissipation capacity is stronger, which can support the heat dissipation requirements of high-performance GPUs, so that the eight-way rack server can be applied to graphics processing performance , Higher computing performance requirements.

In addition, since the chassis of the eight-way rack server provided by the embodiment of the present invention is divided into two chambers, the components required by the eight-way rack server are separately arranged in these two chambers, so the prior art The 8 fans that need to be fully configured in the configuration can also be separately set in the two chambers to dissipate heat for the devices in the corresponding chambers separately and independently; since the number of devices in the typical configuration chamber is more than that in the optional configuration chamber, it is The number of fans installed in the typical configuration chamber is also large (5), and the number of fans installed in the optional configuration chamber is relatively small (3), which can ensure the heat dissipation requirements of the two chambers at the same time. At the same time, because the number of fans in the typical configuration chamber is lower than the full configuration, compared with the prior art, the cost of the eight-way rack-type server under the typical configuration provided by the utility model is reduced, and the heat dissipation efficiency is not affected.

The eight-way rack server provided by the utility model has been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the utility model. The description of the above embodiment is only used to help understand the utility model. The method of the utility model and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the utility model, there will be changes in the specific implementation and application range. To sum up, the contents of this specification should not be understood as limiting the utility model.

Claims (7)

1. An eight-way rack server, comprising: a chassis; A typical configuration chamber and an optional configuration chamber are arranged inside the chassis; The typical configuration chamber is provided with devices required for a typical configuration; wherein, the devices required for the typical configuration include: 5 fans arranged at the rear of the typical configuration chamber; In a typical configuration, the optional configuration chamber is filled with windshield material. 2. The eight-way rack server according to claim 1, further comprising: In the highest configuration, a GPU or a hard disk is arranged at the front of the optional configuration chamber, and three fans are arranged at the rear of the optional configuration chamber. 3. The eight-way rack server according to claim 1 or 2, wherein the components required for the typical configuration also include: A standard interface module arranged at the rear of the typical configuration chamber and above the five fans; the standard interface module is used for installing an interface card PCIe. 4. The eight-way rack server according to claim 3, wherein the front part and the rear part of the typical configuration chamber are separated by a backboard; The back plate is provided with a first opening and a second opening; The first opening is facing the five fans, and the second opening is facing the standard interface module. 5. The eight-way rack server according to claim 2, characterized in that, in the highest configuration, an optional interface module is also provided at the rear of the optional configuration chamber; The optional interface module is arranged under the three fans. 6. The eight-socket rack server according to claim 1, wherein the windshielding material comprises a fake plastic module. 7. The eight-way rack server according to claim 1, wherein the components required for the typical configuration further include: The central processing unit CPU, storage device and memory arranged at the front of the typical configuration chamber, and the power supply PSU arranged at the rear of the typical configuration chamber.