CN206209361U - Sensor test platform based on virtual instrument - Google Patents
Sensor test platform based on virtual instrument Download PDFInfo
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- CN206209361U CN206209361U CN201621336402.XU CN201621336402U CN206209361U CN 206209361 U CN206209361 U CN 206209361U CN 201621336402 U CN201621336402 U CN 201621336402U CN 206209361 U CN206209361 U CN 206209361U
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Abstract
Sensor test platform based on virtual instrument.The utility model is related to a kind of sensor test platform based on virtual instrument.Described sensor assembly transmits a signal to signal condition unit, and signal is transferred to described signal condition unit the ADC pins of embedded microcontroller and the ADC pins of collection card interface respectively;The DAC pins of described collection card interface transmit a signal to sensor assembly;The GPIO pin of described collection card interface transmits a signal to line or structure, and signal is transferred to signal condition unit and temperature control/measuring unit respectively for described line or structure;The GPIO pin of described embedded microcontroller transmits a signal to line or structure;Described collection card interface transmits a signal to data collecting card by cable.The utility model is used for sensor test platform.
Description
Technical field
The utility model is related to a kind of sensor test platform based on virtual instrument.
Background technology
Traditional diagnosis detecting system needs the working range and amount of human configuration working sensor parameter and relevant device
Journey, also there is a problem of needing to change different instruments using different sensors, and very big inconvenience is brought to test job.
The content of the invention
The purpose of this utility model is to provide a kind of sensor test platform based on virtual instrument, can complete various sensings
The test Information acquisition task of device, with hardware configuration flexibly, highly versatile and the construction cycle it is short.
Above-mentioned purpose is realized by following technical scheme:
A kind of sensor test platform based on virtual instrument, its composition includes:Sensor, computer, described calculating
The USB interface of machine connects the USB interface of embedded microcontroller by data wire, and the GPIO of described embedded microcontroller draws
Pin transmits a signal to pumping signal generating unit, and described pumping signal generating unit transmits a signal to sensor assembly;
Described sensor assembly and temperature control/measuring unit two-way transmission signals, described temperature control/measurement are single
Signal is transferred to the ADC pins of embedded microcontroller and the ADC pins of collection card interface respectively for unit;
Described sensor assembly transmits a signal to signal condition unit, and described signal condition unit distinguishes signal
It is transferred to the ADC pins of embedded microcontroller and the ADC pins of collection card interface;
The DAC pins of described collection card interface transmit a signal to sensor assembly;
The GPIO pin of described collection card interface transmits a signal to line or structure, and described line or structure divides signal
Supplementary biography is defeated by signal condition unit and temperature control/measuring unit;
The GPIO pin of described embedded microcontroller transmits a signal to line or structure;
Described collection card interface transmits a signal to data collecting card by cable.
The described sensor test platform based on virtual instrument, described temperature control/measuring unit includes chip U7,
One end of No. 3 pins connection resistance R4 of described chip U7, the other end shunt voltage end+24V and electricity of described resistance R4
Hinder one end of R3, No. 1 of one end of the other end parallel resistance R5 of described resistance R4, one end of electric capacity C51 and socket P2 is drawn
Pin;
No. 6 pins of the other end connection chip U7 of described resistance R4, the other end earth of described electric capacity C51
No. 2 pins of end AGND and socket P2;
No. 8 one end of pins in parallel resistance R7, one end of electric capacity C55 and the voltage output end V of described chip U7OUT, institute
The other end earth terminal AGND of the other end earth terminal AGND of the resistance R7 for stating, described electric capacity C55.
Beneficial effect:
1. the utility model is the multiple technologies synthesis such as virtual instrument technique, multi-sensor technology, realize data acquisition,
Presentation of information, data readback and storage are integrated, and complete multiple analog, the synchronous acquisition of digital signal data and display.
By the design of different modulate circuits, and set with PCI-6221 multichannels, the communication function of multi-functional data collecting card
Meter.
2. the utility model realizes the collection, the treatment that automatically configure with data of sensor.Save the configuration of system
Time, reduce workload.
3. the utility model is in real-time monitoring diagnostic system, and the data acquisition of multichannel, analysis can in time rapidly
Draw diagnosis.The application of pci bus ensure that the complete of data transfer, and advanced control program is the test of multisensor
Control provides convenient.
Brief description of the drawings:
Accompanying drawing 1 is signal flow schematic diagram of the present utility model.
Accompanying drawing 2 is the measurement signal modulate circuit figure of temperature of the present utility model.
Specific embodiment:
Embodiment 1
A kind of sensor test platform based on virtual instrument, its composition includes:Sensor, computer, described calculating
The USB interface of machine connects the USB interface of embedded microcontroller by data wire, and the GPIO of described embedded microcontroller draws
Pin transmits a signal to pumping signal generating unit, and described pumping signal generating unit transmits a signal to sensor assembly;
Described sensor assembly and temperature control/measuring unit two-way transmission signals, described temperature control/measurement are single
Signal is transferred to the ADC pins of embedded microcontroller and the ADC pins of collection card interface respectively for unit;
Described sensor assembly transmits a signal to signal condition unit, and described signal condition unit distinguishes signal
It is transferred to the ADC pins of embedded microcontroller and the ADC pins of collection card interface;
The DAC pins of described collection card interface transmit a signal to sensor assembly;
The GPIO pin of described collection card interface transmits a signal to line or structure, and described line or structure divides signal
Supplementary biography is defeated by signal condition unit and temperature control/measuring unit;
The GPIO pin of described embedded microcontroller transmits a signal to line or structure;
Described collection card interface transmits a signal to data collecting card by cable.
Embodiment 2
The sensor test platform based on virtual instrument described in embodiment 1, described temperature control/measuring unit includes
One end of No. 3 pins connection resistance R4 of chip U7, described chip U7, the other end shunt voltage end of described resistance R4+
One end of 24V and resistance R3, one end of the other end parallel resistance R5 of described resistance R4, one end of electric capacity C51 and socket P2
No. 1 pin;
No. 6 pins of the other end connection chip U7 of described resistance R4, the other end earth of described electric capacity C51
No. 2 pins of end AGND and socket P2;
No. 8 one end of pins in parallel resistance R7, one end of electric capacity C55 and the voltage output end V of described chip U7OUT, institute
The other end earth terminal AGND of the other end earth terminal AGND of the resistance R7 for stating, described electric capacity C55.
Embodiment 3
The sensor test platform based on virtual instrument described in embodiment 1, the model of described embedded microcontroller
It is LPC236;
The model 8PCI-6221 of described data collecting card.
Embodiment 4
The sensor test platform based on virtual instrument described in embodiment 3, the model MAX472 of chip U7.
Certainly, described above is not that, to limitation of the present utility model, the utility model is also not limited to the example above,
Change, remodeling, addition or replacement that those skilled in the art are made in essential scope of the present utility model, also should
Belong to protection domain of the present utility model.
Claims (4)
1. a kind of sensor test platform based on virtual instrument, its composition includes:Sensor, computer, it is characterized in that:It is described
The USB interface of computer pass through the USB interface that data wire connects embedded microcontroller, described embedded microcontroller
GPIO pin transmits a signal to pumping signal generating unit, and described pumping signal generating unit transmits a signal to sensor
Module;
Described sensor assembly and temperature control/measuring unit two-way transmission signals, described temperature control/measuring unit will
Signal is transferred to the ADC pins of embedded microcontroller and the ADC pins of collection card interface respectively;
Described sensor assembly transmits a signal to signal condition unit, and described signal condition unit transmits signal respectively
To the ADC pins and the ADC pins for gathering card interface of embedded microcontroller;
The DAC pins of described collection card interface transmit a signal to sensor assembly;
The GPIO pin of described collection card interface transmits a signal to line or structure, and described line or structure passes signal respectively
It is defeated by signal condition unit and temperature control/measuring unit;
The GPIO pin of described embedded microcontroller transmits a signal to line or structure;
Described collection card interface transmits a signal to data collecting card by cable.
2. the sensor test platform based on virtual instrument according to claim 1, it is characterized in that:Described temperature control
System/measuring unit includes chip U7, one end of No. 3 pins connection resistance R4 of described chip U7, and described resistance R4's is another
One end of one end shunt voltage end+24V and resistance R3, one end, the electric capacity C51 of the other end parallel resistance R5 of described resistance R4
One end and socket P2 No. 1 pin;
No. 6 pins of the other end connection chip U7 of described resistance R4, the other end earth end of described electric capacity C51
No. 2 pins of AGND and socket P2;
No. 8 one end of pins in parallel resistance R7, one end of electric capacity C55 and the voltage output end V of described chip U7OUT, it is described
The other end earth terminal AGND of the other end earth terminal AGND of resistance R7, described electric capacity C55.
3. the sensor test platform based on virtual instrument according to claim 1, it is characterized in that:Described insertion declines
The model LPC236 of controller;
The model 8PCI-6221 of described data collecting card.
4. the sensor test platform based on virtual instrument according to claim 3, it is characterized in that:The model of chip U7
MAX472。
Priority Applications (1)
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CN201621336402.XU CN206209361U (en) | 2016-12-07 | 2016-12-07 | Sensor test platform based on virtual instrument |
Applications Claiming Priority (1)
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CN201621336402.XU CN206209361U (en) | 2016-12-07 | 2016-12-07 | Sensor test platform based on virtual instrument |
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CN206209361U true CN206209361U (en) | 2017-05-31 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114964346A (en) * | 2022-04-11 | 2022-08-30 | 合肥通用机械研究院有限公司 | Sensor testing method |
-
2016
- 2016-12-07 CN CN201621336402.XU patent/CN206209361U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114964346A (en) * | 2022-04-11 | 2022-08-30 | 合肥通用机械研究院有限公司 | Sensor testing method |
CN114964346B (en) * | 2022-04-11 | 2023-08-01 | 合肥通用机械研究院有限公司 | Sensor testing method |
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