CN206169129U - DIP encapsulation and integration circuit pin shaping device - Google Patents

DIP encapsulation and integration circuit pin shaping device Download PDF

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Publication number
CN206169129U
CN206169129U CN201621208451.5U CN201621208451U CN206169129U CN 206169129 U CN206169129 U CN 206169129U CN 201621208451 U CN201621208451 U CN 201621208451U CN 206169129 U CN206169129 U CN 206169129U
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CN
China
Prior art keywords
iron plate
integrated circuit
sizing die
working face
hole
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Active
Application number
CN201621208451.5U
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Chinese (zh)
Inventor
王铁冶
郑渠江
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Sichuan Mingtai Microelectronics Technology Co.,Ltd.
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Sichuan Ming Tai Electronic Science And Technology Co Ltd
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Priority to CN201621208451.5U priority Critical patent/CN206169129U/en
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Abstract

The utility model discloses a DIP encapsulation and integration circuit pin shaping device, its characterized in that: the through -hole of rectangle is equipped with in the working face central point of the workstation department of putting, the locating plate has been put to the top that is equipped with sizing die and sizing die in the top of through -hole left and right sides both sides symmetry, it wears the cover and has the cardboard to make locating plate and sizing die fix on the workstation working face to be equipped with threaded vertically stand and stand in workstation working face both sides, be fixed with the cylinder and piston rod of the cylinder lower extreme end connection has the clamp plate directly over workstation working face center, correspond the vertical groove of seting up a plurality of parallels on two lateral walls that the sizing die is relative, the interval in adjacent vertical groove equals the interval of integrated circuit with the adjacent pin in one side on the same sizing die, interval between the vertical groove that corresponds on two sizing dies equals the interval between the pin of integrated circuit both sides, the device has easy and simple to handlely, correction speed is fast, moreover, the steam generator is simple in structure, can be suitable for various specification DIP encapsulation and integration circuit, low cost's characteristics drop into.

Description

A kind of DIP encapsulates integrated circuit pin apparatus for shaping
Technical field
The utility model is related to electronic assistance aids field, more particularly to a kind of DIP encapsulation integrated circuit pin shaping dresses Put.
Background technology
When the integrated circuit of DIP encapsulation (dual-inline package) dispatches from the factory, generally antistatic is placed on together by multiple In hollow plastic strip sleeve pipe, to preserve and to transport.This kind of integrated circuit causes both sides pin outside when loading in sleeve pipe Curving can not keep straight so that operative employee is difficult integrated circuit to be inserted in weld nest or printed circuit board (PCB).Current way, Must be first with hand one by one by it by flattening, adjustment pin-pitch is from this kind of manual pin mode that arranges is extremely loaded down with trivial details, wastes people Power, increase production cost, affect operation, increased integrated circuit by the chance of hand contamination, gently then cause part components and parts work It is bad, it is heavy then damage whole equipment.
Utility model content
The purpose of this utility model is the defect for overcoming prior art, there is provided a kind of DIP encapsulation integrated circuit pin is whole Shape dress is put, and with easy to operate, correction rate is fast, simple structure, can be suitable for the integrated circuit that all size DIP is encapsulated, and puts into With low cost the characteristics of.
The technical solution adopted in the utility model is:
A kind of DIP encapsulates integrated circuit pin apparatus for shaping, it is characterised in that:Device includes workbench and in workbench The through hole of rectangle is provided with center of working face position, in top the right and left of through hole the upper of sizing die and sizing die is arranged with Fang Fangyou location-plates, the location hole and through hole and location hole that the rectangle of insertion is offered in the middle part of location-plate is in the same size, in work Bench work makees that face both sides are provided with threaded vertical column and column is coated with clamp so that location-plate and sizing die are fixed on On workbench working face, cylinder is fixed with directly over workbench center of working face and cylinder piston rod lower end is connected with pressure Plate, correspondence offers some parallel vertical slots on the relative side wall of two sizing dies, adjacent perpendicular on same sizing die To groove interval equal to the adjacent pin in integrated circuit the same side spacing, on two sizing dies between corresponding vertical slot between Away from equal to the spacing between the pin of integrated circuit both sides.
Further, the sizing die is made up of some iron plate A and iron plate B, on dry iron plate A and iron plate B correspondence positions Horizontal waist-shaped hole is provided with, the quantity and position for adjusting iron plate A and iron plate B constitutes vertical slot and bolt causes iron through waist-shaped hole Piece A and iron plate B form a whole, and are easy to adjust the vertical slot size of sizing die according to the integrated circuit for treating shaping.
Further, there is upper end to be provided with inclined step in the iron plate A, play positioning action, be easy to quickly be put into and treat The integrated circuit of shaping.
Further, the thickness of the iron plate A is 0.2~0.5mm, and the thickness of iron plate B is 0.1~0.3mm, is conveniently adjusted The size of the vertical slot of composition.
The beneficial effects of the utility model are:
The utility model is easy to operate, and shaping correction rate is fast, simple structure, can be suitable for the collection that all size DIP is encapsulated Into circuit, low in input cost.
Description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the overlooking the structure diagram of sizing die.
Fig. 3 is the structural representation of iron plate A.
Fig. 4 is the structural representation of iron plate B.
Specific embodiment
In order that the advantage of the purpose of this utility model and technical scheme becomes more apparent, below in conjunction with accompanying drawing and reality Example, is further elaborated to the utility model.
As shown in accompanying drawing 1~4, a kind of DIP encapsulates integrated circuit pin apparatus for shaping, it is characterised in that:Device includes work Make platform 1 and the through hole 2 of rectangle is provided with the center of working face position of workbench 1, symmetrically set in top the right and left of through hole 2 The top for having sizing die 3 and sizing die 3 is placed with location-plate 4, and the middle part of location-plate 4 offers the location hole 4-1 of the rectangle of insertion And through hole 2 and location hole 4-1 are in the same size, on the working face both sides of workbench 1 threaded vertical column 6 and column 6 are provided with Clamp 4 is coated with so that location-plate 4 and sizing die 3 are fixed on the working face of workbench 1, is just gone up in the center of working face of workbench 1 Side is fixed with cylinder 7 and the piston-rod lower end end of cylinder 7 is connected with pressing plate 8, and correspondence is opened on the relative side wall of two sizing dies 3 Some parallel vertical slots 3-4 are provided with, the interval of adjacent vertical slot 3-4 is same equal to integrated circuit on same sizing die 3 The spacing of the adjacent pin 10 in side, the spacing on two sizing dies 3 between corresponding vertical slot 3-4 is drawn equal to integrated circuit both sides Spacing between pin 10.
The sizing die 3 is made up of some iron plate A3-1 and iron plate B3-2, in dry iron plate A3-1 positions corresponding with iron plate B3-2 Put and be provided with horizontal waist-shaped hole 3-3, the quantity and position for adjusting iron plate A3-1 and iron plate B3-2 constitutes vertical slot 3-4 and bolt 9 cause iron plate A3-1 and iron plate B3-2 to form a whole through waist-shaped hole 3-3.
There is upper end to be provided with inclined step 3-5 in the iron plate A3-1.
The thickness of the iron plate A3-1 is 0.2~0.5mm, and the thickness of iron plate B3-2 is 0.1~0.3mm.
Working method of the present utility model is:
According to the spacing parameter between the pin 10 of the integrated circuit for treating shaping, suitable iron plate A3-1 and iron plate B3-2 is selected Quantity, adjust iron plate A3-1 and iron plate B3-2 position relationship cause adjacent vertical slot 3-4 spacing be equal to integrated circuit The spacing of the adjacent pin 10 in the same side, then causes the position of iron plate A3-1 and iron plate B3-2 using bolt 9 through waist-shaped hole 3-3 Put locked.The distance between two sizing dies 3 of adjustment cause the spacing between corresponding vertical slot 3-4 to be equal to integrated circuit both sides Spacing between pin 10.Put location-plate 4 so that location hole 4-1 and through hole are corresponded to about 2.The integrated of Shape correction will be treated It is both pin 10 towards being placed on top between two sizing dies 3 that circuit is put upside down, cylinder 7 vertically push with dynamic pressure plate 8 and with it is integrated Component is contacted and causes integrated circuit from passing through between two sizing dies 3.Acted on by homonymy vertical slot 3-4, integrated electricity The spacing of road homonymy does not wait pin 10 by combing again so that spacing is consistent.Acted on by both sides vertical slot 3-4, it is outwards askew Oblique pin 10 becomes vertical.After completing shaping, lower section through hole 2 is dropped out, and cylinder 7 returns to initial position, you can drawn again The Shape correction of pin 10.

Claims (4)

1. a kind of DIP encapsulates integrated circuit pin apparatus for shaping, it is characterised in that:Device includes workbench (1) and in workbench (1) through hole (2) of rectangle is provided with center of working face position, in top the right and left of through hole (2) sizing die is arranged with (3) location-plate (4) and above sizing die (3) is placed with, the location hole (4- of the rectangle of insertion is offered in the middle part of location-plate (4) 1) and through hole (2) and location hole (4-1) are in the same size, it is provided with threaded vertical column on workbench (1) working face both sides And column (6) is coated with clamp (4) so that location-plate (4) and sizing die (3) are fixed on workbench (1) working face, in work (6) Make to be fixed with cylinder (7) directly over platform (1) center of working face and cylinder (7) piston-rod lower end end is connected with pressing plate (8), two Correspondence offers some parallel vertical slots (3-4) on the relative side wall of individual sizing die (3), adjacent on same sizing die (3) Vertical slot (3-4) interval equal to the adjacent pin (10) in integrated circuit the same side spacing, correspondence on two sizing dies (3) Vertical slot (3-4) between spacing be equal to integrated circuit both sides pin (10) between spacing.
2. a kind of DIP according to claim 1 encapsulates integrated circuit pin apparatus for shaping, it is characterised in that:The shaping Mould (3) is made up of some iron plate A (3-1) and iron plate B (3-2), is set on dry iron plate A (3-1) and iron plate B (3-2) correspondence position There is horizontal waist-shaped hole (3-3), the quantity and position for adjusting iron plate A (3-1) and iron plate B (3-2) constitutes vertical slot (3-4) and spiral shell Bolt (9) causes iron plate A (3-1) and iron plate B (3-2) to form a whole through waist-shaped hole (3-3).
3. a kind of DIP according to claim 2 encapsulates integrated circuit pin apparatus for shaping, it is characterised in that:In the iron Piece A (3-1) has upper end to be provided with inclined step (3-5).
4. a kind of DIP according to Claims 2 or 3 encapsulates integrated circuit pin apparatus for shaping, it is characterised in that:The iron The thickness of piece A (3-1) is 0.2~0.5mm, and the thickness of iron plate B (3-2) is 0.1~0.3mm.
CN201621208451.5U 2016-11-09 2016-11-09 DIP encapsulation and integration circuit pin shaping device Active CN206169129U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621208451.5U CN206169129U (en) 2016-11-09 2016-11-09 DIP encapsulation and integration circuit pin shaping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621208451.5U CN206169129U (en) 2016-11-09 2016-11-09 DIP encapsulation and integration circuit pin shaping device

Publications (1)

Publication Number Publication Date
CN206169129U true CN206169129U (en) 2017-05-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621208451.5U Active CN206169129U (en) 2016-11-09 2016-11-09 DIP encapsulation and integration circuit pin shaping device

Country Status (1)

Country Link
CN (1) CN206169129U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107179033A (en) * 2017-06-02 2017-09-19 成都智明达电子股份有限公司 A kind of bad shaping universal fixturing of coplane degree
WO2019136974A1 (en) * 2018-01-12 2019-07-18 江苏华存电子科技有限公司 Semi-automatic machine for correcting shape of integrated circuit (ic) pin
CN110732609A (en) * 2019-10-29 2020-01-31 贵州鑫彤瑞科技有限公司 High-frequency transformer pin correcting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107179033A (en) * 2017-06-02 2017-09-19 成都智明达电子股份有限公司 A kind of bad shaping universal fixturing of coplane degree
WO2019136974A1 (en) * 2018-01-12 2019-07-18 江苏华存电子科技有限公司 Semi-automatic machine for correcting shape of integrated circuit (ic) pin
CN110732609A (en) * 2019-10-29 2020-01-31 贵州鑫彤瑞科技有限公司 High-frequency transformer pin correcting device
CN110732609B (en) * 2019-10-29 2021-08-27 贵州鑫彤瑞科技有限公司 High-frequency transformer pin correcting device

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: DIP encapsulation and integration circuit pin shaping device

Effective date of registration: 20190507

Granted publication date: 20170517

Pledgee: China Postal Savings Bank Limited by Share Ltd Suining Sui branch

Pledgor: Sichuan Ming Tai Electronic Science and Technology Co., Ltd.

Registration number: 2019510000053

PE01 Entry into force of the registration of the contract for pledge of patent right
CP01 Change in the name or title of a patent holder

Address after: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province

Patentee after: Sichuan Mingtai Microelectronics Technology Co.,Ltd.

Address before: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province

Patentee before: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD.

CP01 Change in the name or title of a patent holder
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20220328

Granted publication date: 20170517

Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch

Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD.

Registration number: 2019510000053

PC01 Cancellation of the registration of the contract for pledge of patent right