CN205838570U - Mems chip and the hybrid package structure of IC chip - Google Patents

Mems chip and the hybrid package structure of IC chip Download PDF

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Publication number
CN205838570U
CN205838570U CN201620627352.4U CN201620627352U CN205838570U CN 205838570 U CN205838570 U CN 205838570U CN 201620627352 U CN201620627352 U CN 201620627352U CN 205838570 U CN205838570 U CN 205838570U
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chip
upper substrate
mems
infrabasal plate
ic chip
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CN201620627352.4U
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Chinese (zh)
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黄卫东
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黄卫东
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Abstract

The utility model discloses the hybrid package structure of a kind of mems chip and IC chip, including mems chip, IC chip, upper substrate, infrabasal plate and the plastic packaging glue being arranged between upper substrate and infrabasal plate, mems chip, formed between IC chip with upper substrate and/or infrabasal plate and electrically connect, formed between upper substrate with infrabasal plate and electrically connect, at least one window penetrating upper substrate is outputed on upper substrate, one or more mems chips and/or IC chip are positioned at the window of upper substrate, lower substrate surface and/or upper substrate surface.This programme encapsulating structure integrated level is higher, and window structure reduces encapsulation integral thickness simultaneously, decreases the consumption of implant, therefore reduces cost;Can be with integrated pressure sensor chip;There is universality, it is adaptable to all kinds of micro electronmechanical integration packagings;Technique easily realizes, and product quality fully ensures that and encapsulates by technological ability measuring and calculating yields higher than 99%.

Description

Mems chip and the hybrid package structure of IC chip

Technical field

This utility model belongs to chip package field, is specifically related to the mixing of a kind of mems chip and IC chip Encapsulating structure.

Background technology

Integrated circuit (IC) chip is a kind of novel semi-conductor device grown up later stage the 1950's to the sixties Part.It is through semiconductor fabrication process such as peroxidating, photoetching, diffusion, extension, evaporations of aluminum, composition is had the circuit of certain function The elements such as required transistor, resistance, electric capacity and the connection wire between them are fully integrated on a fritter silicon chip surface, so After silicon chip surface circuit is electrically connected with outside foundation and is encapsulated.

Integrated antenna package, is process integrated circuit being assembled into chip final products, it is simply that Foundry is produced The integrated circuit die (Die) come is placed on one piece of substrate playing carrying effect, and pin is extracted, and then fixes being encapsulated as It is an entirety.Fig. 1 is a kind of encapsulating structure, by copper pin, chip circuit is guided to outside, and copper pin is electric with chip surface Road wire bonding connects.

MEMS (MEMS, Micro-Electro-Mechanical System), also referred to as mems System, micro electronmechanical, micromechanics etc., grow up on the basis of microelectric technique (semiconductor fabrication), merged photoetching, The high-tech electronic mechanical device of the fabrication techniques such as burn into thin film, LIGA, silicon micromachined, non-silicon micromachined and precision optical machinery processing Part, it is to form mechanical mechanism in chip, export the microsensor product of induced signal to external world, and its core is Micro electronmechanical (MEMS) chip.As IC chip, micro electronmechanical (MEMS) chip is also required to encapsulation.As in figure 2 it is shown, be The encapsulating structure of MEMS pressure sensor.

MEMS (MEMS) is currently widely used in the fields such as Internet of Things, wearable product and intelligent artifact. Our times integrated circuit (IC) technology develops the most significant trend and applies the various products being the theme exactly with micro electronmechanical (MEMS) Product will enter the growth outbreak period, and the market demand of various application directions is the most powerful.But it is current in the world for MEMS sensing The scheme of chip and IC integrated chip remain in by MEMS chip with IC integrated chip in a plastic-sealed body, such mould Block integrated level is the lowest, and can not be integrated in by the most frequently used pressure sensing chip.Up to now, there is not one in the world Company releases the integration packaging scheme for MEMS sensing module with universality, and the application of micro electronmechanical product is therefore by freight weight limit Weigh and stagnate.

MEMS sensor by its volume is little, low cost and can be huge excellent with what other intelligent chips integrated Gesture, will become main production technology and the application form of sensor.Consumer electronics, automotive electronics, medical services are MEMS sensings The main application market of device, the application of MEMS will gradually expand from now on, including the wearable device risen, Internet of Things Net and and people live closely bound up Smart Home and intelligent city is all the application that potentiality are the biggest.And these are new The essential core framework that emerging field needs is by low-power consumption MCU, eNVM, Analog&PM IC, and wireless be connected chip in addition Integrating, reconnect various sensor chip, therefore providing chip and the solution of sensor integration integration and processing procedure to realize will Significant, development space is the biggest.

From the angle analysis of technology, wire bonding remains the most general most economical chip connected mode.Although wafer level Encapsulation (WLP) and silicon perforation (TSV) are considered to be incorporated in the encapsulation of MEMS, but its high cost, poor integrated Before feasibility, relatively low yield and reliability make its application deterioration not.Fact proved, ripe sane Wire Bonding Technology is It is that MEMS senses integrated feasible connected mode.

Scheme for MEMS sensing chip Yu IC integrated chip remains in MEMS chip and IC the most in the world Integrated chip is in a plastic-sealed body, and such module integrated level is the lowest, and can not be by the most frequently used pressure sensing chip collection Become wherein.Encapsulating structure as shown in Figure 3, Figure 4 is that the current product structure of inertia nine axle sensor integration module (is integrated with ASIC/MCU chip, gyroscope chip, acceleration sensor chip and magnetic sensor chip), also it is the most at first The MEMS integrated products entered, have employed the mode that chip is three-dimensional stacked, but its integrated level is the lowest and can not sense by integrated pressure Device.The feature of this integrated products module is: integrated level relatively low (being integrated with 3 MEMS chip and 1 IC chip);Can not integrated press Force transducer;It is only limited to inertia sensing application, there is no universality;Technique is difficult to realize, and yield is relatively low (less than 95% even more Low).

Existing market has the MEMS sensing module of high integration in the urgent need to releasing, namely MEMS chip and ASIC/MCU Chip or the highly integrated package module of other chips, need to mix multiple IC chips with multiple mems chips It is encapsulated in a module.The core architecture that especially Internet of Things and wearable device need, will the MCU of low-power consumption, eNVM, Analog&PM chip, wireless RF be connected chip and all kinds of MEMS sensor chip is integrated, develop integrated sensing mould The new product framework of block and integrated technique, and realize commercialization.Market demand is just to use the three-dimension packaging of traditional approach Module can be realized integrated, its low cost but added value of product is high.

Summary of the invention

Technical problem to be solved in the utility model is: provide the mixing of a kind of mems chip and IC chip Encapsulating structure, solve that mems chip and IC chip integrated level in prior art be low, technique is difficult to realize, yield relatively Low problem.

This utility model is for solving above-mentioned technical problem by the following technical solutions:

The hybrid package structure of mems chip and IC chip, including mems chip, IC chip, on Substrate, infrabasal plate and the plastic packaging glue being arranged between upper substrate and infrabasal plate, mems chip, IC chip and upper base Form electrical connection between plate and/or infrabasal plate, formed between upper substrate with infrabasal plate and electrically connect, upper substrate outputs at least one Penetrate the window of upper substrate, one or more mems chips and/or IC chip be positioned at the window of upper substrate, under Substrate surface and/or upper substrate surface.

Further, described upper substrate is upper strata circuit substrate, and infrabasal plate is lower circuit substrate, wherein,

Mems chip or IC chip, referred to as infrabasal plate upper die, lower base is placed on the upper surface of infrabasal plate The circuit on mems chip above plate, the active surface of IC chip are by being electrically connected to the surface of infrabasal plate;

The top of infrabasal plate arranges plastic packaging glue, described in mould sealant covers infrabasal plate upper die, electronic devices and components and be electrically connected Access node structure;

The lower surface of upper substrate fits in the top of plastic packaging glue, and the gap between lower surface and the plastic packaging glue of upper substrate is arranged Implant;

It is arranged through plastic packaging glue and implant and having between lower surface and the upper surface of infrabasal plate of upper substrate to electrically connect Through hole, the internal conductive material of through hole;

Described window is through to plastic packaging glue surface, and mems chip or integrated electricity are placed in the plastic packaging glue surface in window Chip in road chip, referred to as window, the circuit on mems chip, the active surface of IC chip in window pass through electricity It is connected to the surface of upper substrate.

The oriented recessed structure sunk or raise up of plastic packaging glue in described window, is called recessed heavy window and protruding window Mouthful.

Described mems chip, IC chip are arranged around circuit protection device.

Described circuit protection device is that protectiveness covers colloid or plastic packaging glue.

Described upper substrate top arranges sealing device.

It is provided above at least one pre-plastic package cavity at upper substrate.

Described mems chip or IC chip can stack placement.

Complementary substrate is placed in plastic packaging glue surface in window first, and then the upper surface at complementary substrate places microcomputer Electrical chip.

Infrabasal plate lower surface with the printed circuit board (PCB) being disposed below or packaging body or power interconnection, and can be formed and be electrically connected Connect.

Described upper substrate uses metal frame substrate.

Described metal frame substrate is by plastic packaging glue plastic packaging, and this plastic packaging glue is referred to as metal frame substrate plastic packaging glue.

Described implant is metal frame substrate plastic packaging glue.

At least one electronic devices and components of formed electrical connection are set on the upper surface of described upper substrate and/or infrabasal plate Or its packaging body.

Compared with prior art, this utility model has the advantages that

1, the encapsulating structure integrated level of this programme is higher;Can be with integrated pressure sensor chip;There is universality, it is adaptable to All kinds of micro electronmechanical integration packagings;Technique easily realizes, and yields presses technological ability measuring and calculating higher than 99%.

2, this programme proposes the window structure that upper substrate is windowed, and has allowed multiple window.Part plastic packaging glue surface Coming out at the window's position, mems chip or IC chip are affixed directly to the plastic packaging glue surface in the window exposed On, such advantage is to reduce encapsulation integral thickness, reduces the consumption of implant, therefore reduces cost.

3, this utility model can by MCU, eNVM, Analog&PM chip of low-power consumption, wireless RF and be connected chip and All kinds of MEMS sensor chips are integrated, and develop new product framework and the integrated technique of integrated sensing module, the most in fact Existing commercialization.

4, this product structure is novel, technique is unique, uses the three-dimension packaging of traditional wire bonding mode to achieve that mould Block is integrated, its low cost but added value of product is high.

5, personalized integrated products can be produced for all kinds of MEMS sensor to put on market, product of the present utility model Product application direction can concentrate on the multi-shaft inertial sensor-based system integrated products as being applied to intelligent machine and wearable product, The sensing integrated products that is applied to the TPMS tire pressure monitoring system of automobile, the air pressure being applied to smart mobile phone and wearable product with The aspects such as altimeter product and miniature sphygomanometer.

Accompanying drawing explanation

Fig. 1 is a kind of encapsulating structure of integrated circuit in prior art.

Fig. 2 is the typical package structure of MEMS pressure sensor in prior art.

Fig. 3 is the LGA package structure of inertia nine axle sensor integration module in prior art.

Fig. 4 is the QFN encapsulating structure of inertia nine axle sensor integration module in prior art.

Fig. 5 is the encapsulating structure that this utility model upper substrate arranges a window.

Fig. 6 is the encapsulating structure that this utility model upper substrate arranges two windows.

Fig. 7 is that this utility model upper substrate arranges a recessed heavy window and the encapsulating structure of an embossed window.

Fig. 8 is this utility model upper substrate, infrabasal plate is respectively provided with IC chip and upper substrate arranges a window Encapsulating structure.

Fig. 9 is that this utility model upper substrate top arranges a pre-plastic package cavity and the encapsulating structure of sealing device.

Figure 10 a is that this utility model upper substrate top arranges two pre-plastic package cavitys and the encapsulating structure of sealing device.

Figure 10 b is the encapsulation knot that this utility model upper substrate top arranges chip, a pre-plastic package cavity and sealing device Structure.

Figure 11 is the encapsulating structure arranging protectiveness rubber cover in the pre-plastic package cavity of this utility model upper substrate top.

Figure 12 is the encapsulating structure that this utility model upper substrate top arranges protectiveness rubber cover and sealing device.

Figure 13 is the encapsulating structure that plastic packaging glue top arranges complementary substrate in this utility model window.

Figure 14 is the encapsulating structure that this utility model upper substrate uses metal frame substrate.

Figure 15 is the encapsulating structure that this utility model implant uses metal frame substrate plastic packaging glue.

Figure 16 is the encapsulating structure of this utility model upper substrate surface mount electronic component package body.

Figure 17 is the flow chart of the method for packing that encapsulating structure of the present utility model uses.

Wherein, the labelling in figure is as follows: 1-upper substrate;2-infrabasal plate;3-MEMS chip;4-IC chip;5-goes between;6-leads to Hole;7-plastic packaging glue;8-implant;9-window;The recessed heavy window of 10-;11-embossed window;12-pre-plastic package cavity;13-cover plate;14- Protectiveness rubber cover;The complementary substrate of 15-;16-metal frame substrate plastic packaging glue;17-metal frame substrate;18-cofferdam glue; 19-electronic devices and components packaging body.

Detailed description of the invention

This programme is proposed the double-deck overlay model of MEMS module product configuration, is formed bilevel in a module All kinds of chips and the laminated construction of MEMS, upper strata is integrated into master with MEMS chip, and lower floor is based on IC integrated chip, upper and lower two-layer Between connect with brazing metal and to ensure that circuit signal connects, module takes the mode molding of a plastic packaging and a pre-plastic package, because of This process aspect also has strategic structural to realize the scientific and normal controlled of manufacture process.

This programme proposes the window structure that upper substrate is windowed, and has allowed multiple window.Part plastic packaging glue surface exists The window's position comes out, and mems chip or IC chip are affixed directly to the plastic packaging glue surface in the window exposed On, such advantage is to reduce encapsulation integral thickness, reduces the consumption of implant, therefore reduces cost.

Through hole, compared with similar POP (Package On Package) encapsulation, the through hole in this product is mainly used in connecing The signal of logical micro-electro-mechanical sensors, therefore number of openings is less, and clear size of opening can be made relatively big, and thus greatly strengthen can Manufacturing, it is ensured that the quality of product and stability.It should be noted that the conductive material in through hole in this utility model Being not limited to brazing metal, no matter use which kind of mode, as long as forming an at least electrical connection between upper and lower base plate, just belonging to this reality Scope with novel rights protection.

This utility model will provide a kind of new core architecture for Internet of Things and wearable device, will low-power consumption MCU, ENVM, Analog&PM chip, wireless RF be connected chip and all kinds of MEMS sensor chip is integrated, develop integrated The new product framework of sensing module and integrated technique, easily realize commercialization.This product structure is novel, technique is unique, uses The three-dimension packaging of traditional wire bonding mode achieves that module is integrated, its low cost but added value of product is high.This practicality Novel is a kind of innovative three-dimension packaging scheme with universality, for integrated MEMS sensing module.The program is safe can OK, processing procedure and simple and reliable process, it is easy to realize the commercialization that MEMS sensing module is integrated.Can sense for all kinds of MEMS Device produces the integrated products of personalization and puts on market, and the commercialization application direction of the present utility model paid close attention at present will focus on As being applied to the multi-shaft inertial sensor-based system integrated products of intelligent machine and wearable product, being applied to the TPMS tire pressure prison of automobile The sensing integrated products of examining system, the air pressure and altitude meter product being applied to smart mobile phone and wearable product and miniature sphygomanometer Etc. aspect.

Below in conjunction with the accompanying drawings structure of the present utility model and work process are described further.

The hybrid package structure of mems chip and IC chip, including mems chip 3, IC chip 4, Upper substrate 1, infrabasal plate 2 and the molding compounds 7 being arranged between upper substrate 1 and infrabasal plate 2, upper substrate 1 is upper strata circuit Substrate, infrabasal plate 2 is lower circuit substrate, the upper surface of infrabasal plate 2 is placed mems chip 3 or IC chip 4, claims For infrabasal plate upper die, the circuit on mems chip 3 above infrabasal plate 2, the active surface of IC chip 4 pass through It is electrically connected to the surface of infrabasal plate 2.

One or more mems chips and/or IC chip are placed at the window 9 of upper substrate, infrabasal plate table Face and/or upper substrate surface, mems chip is to be preferred at the window being positioned over upper substrate, and upper substrate surface can also select Not chip placement (thus expand window area area) and increase the chip placement space at window.

Molding compounds, those skilled in the art are referred to as plastic packaging glue, therefore, in this programme by often habitual for molding compounds Described molding compounds is belonging to two kinds of different expression forms of same things with plastic packaging glue, and described plastic packaging glue 7 is coated with Above the upper surface portion of whole infrabasal plate, infrabasal plate upper die, infrabasal plate electronic devices and components and with infrabasal plate upper surface shape The electrical connection become.

Described upper substrate fits in the top of described plastic packaging glue, has in the gap between described upper substrate and described plastic packaging glue Implant 8 (such as epoxy flux or other can play the material of phase same-action), this implant must possess scaling powder Function is firmly bonded simultaneously again.

It is connected by lead-in wire 5 between described mems chip 3, IC chip 4 with upper substrate 1, infrabasal plate 2, upper base It is connected by conductive through hole 6 between plate with infrabasal plate.

Through hole, has between lower surface and the upper surface of described infrabasal plate of described upper substrate through plastic packaging glue 7 and implant 8 And the through hole 6 of through connection upper and lower base plate, the internal conductive material of through hole 6, upper substrate lower surface and infrabasal plate upper surface it Between formed electrical connection by conductive material.

At least one window penetrating upper substrate, one or more mems chips and/or integrated electricity is outputed on upper substrate Road chip is positioned at the window of upper substrate, lower substrate surface and/or upper substrate surface.

Window, has the window wearing sky, the window above plastic packaging glue in the not region with conductive material contacts of described upper substrate Port area non-filler, thus upper substrate does not cover all plastic packaging glue, but by part plastic packaging glue surface at the window's position Come out.In described window, the oriented recessed structure sunk or raise up of plastic packaging glue, is called recessed heavy window 10 and projection Window 11, and form various recessed heavy window 10 or the deformation design of embossed window 11, including recessed heavy window 10 by infrabasal plate The situation that square chip comes out.

Complementary substrate 15 is placed in plastic packaging glue surface in window first, then puts at the upper surface of described complementary substrate 15 Put mems chip to reduce the encapsulation stress impact on sensing measurement result.

Mems chip or IC chip are arranged in the window of exposure on plastic packaging glue surface, referred to as window inner core Sheet, in described window, the circuit of chip or active surface are electrically connected to the surface of upper substrate.

Mems chip or IC chip are arranged on upper substrate upper surface, referred to as upper substrate surface chip, institute Circuit or the active surface of stating upper substrate surface chip are electrically connected to upper substrate surface.

At least one electronic devices and components of formed electrical connection are set on the upper surface of described upper substrate and/or infrabasal plate Or its packaging body.

Mems chip or IC chip can be arranged at plastic packaging glue surface in window by the way of stickup.

The electrical connection of chip and upper and lower substrate can be in the way of being wire bonding, it is also possible to is that other modes are (such as flip chip bonding Connect).

Specific embodiment one,

As it is shown in figure 5, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;One window is set on upper substrate, 3 mems chips are set in window, between 3 mems chips and and upper substrate Between by lead-in wire formed electrical connection;Epoxy flux packing material is set between upper substrate and molding compounds;Upper substrate with Electrical connection is realized by conductive through hole between infrabasal plate.

The present embodiment only illustrates as a example by 4 IC chips and 3 mems chips, but is not limited to these cores Sheet, can arrange multiple different chip according to different user's requests, and can be configured to different combinations and be configured.

Specific embodiment two,

As shown in Figure 6, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;Two windows are set on upper substrate, 2 mems chips are set in one of them window, arrange in another window 1 micro- Dynamo-electric chip, is electrically connected between mems chip and with being formed by lead-in wire between upper substrate;Upper substrate and molding compounds Between epoxy flux packing material is set;Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

The present embodiment is not limited to these chips enumerated, can be according to different user's requests at upper and lower substrate and each Multiple different chip is set in window, and can be configured to different combinations and be configured.

Specific embodiment three,

As it is shown in fig. 7, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;Arranging two windows on upper substrate, one of them window is recessed heavy window, arranges 2 mems chips, separately in recessed heavy window One window is embossed window, arranges 1 mems chip in embossed window, between mems chip and and upper substrate between Electrical connection is formed by lead-in wire;Epoxy flux packing material is set between upper substrate and molding compounds;Upper substrate and lower base Electrical connection is realized by conductive through hole between plate.

Specific embodiment four,

As shown in Figure 8, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;One window is set on upper substrate, 2 mems chips is set in window, between mems chip and with upper substrate it Between by lead-in wire formed electrical connection;2 IC chips, IC chip and upper base is also set up on the upper surface of upper substrate Plate forms electrical connection by lead-in wire, arranges epoxy flux packing material between upper substrate and molding compounds;Upper substrate with under Electrical connection is realized by conductive through hole between substrate.

Specific embodiment five,

As it is shown in figure 9, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;One window is set on upper substrate, 3 mems chips is set in window, between mems chip and with upper substrate it Between by lead-in wire formed electrical connection;The top of upper substrate builds a pre-plastic package cavity, upper substrate, exposure by pre-plastic package colloid Window in the inner surface of plastic packaging glue surface and pre-plastic package colloid form the pre-plastic package cavity 12 of hollow, described pre-plastic package cavity Upward opening, pre-plastic package cavity 12 top arranges sealing device, and in this embodiment, sealing device uses the form of cover plate 13, upper base Epoxy flux packing material is set between plate and molding compounds;Electricity is realized by conductive through hole between upper substrate and infrabasal plate Connect.

Specific embodiment six,

As shown in Figure 10 a, mems chip and the hybrid package structure of IC chip, including mems chip, collection Become circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, on described infrabasal plate 4 IC chips are set, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formed electricity Connect;Two windows are set on upper substrate, are respectively provided with one or more mems chips in each window, between mems chip And electrically connect with being formed by lead-in wire between upper substrate;Two integrated electricity are set on the upper substrate upper surface between two windows Road chip, two are electrically connected by lead-in wire formation between IC chip with upper surface, the top of two IC chips Arranging circuit protection device, this circuit protection device is plastic packaging glue (part for pre-plastic package colloid, one in pre-plastic package technique Molding), this plastic packaging glue is coated with two IC chips of lid completely;The top of each window builds two by pre-plastic package colloid Pre-plastic package cavity, upper substrate, exposure window in the inner surface of plastic packaging glue surface and pre-plastic package colloid form the pre-plastic package of hollow Cavity, described pre-plastic package cavity upward opening, two pre-plastic package cavity tops the most each arrange sealing device, this embodiment Sealing device uses the form of cover plate 13, IC chip to be electrically connected by lead-in wire formation with upper substrate, upper substrate and molding Epoxy flux packing material is set between compound;Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

Specific embodiment seven,

As shown in fig. lob, mems chip and the hybrid package structure of IC chip, including mems chip, collection Become circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, on described infrabasal plate 4 IC chips are set, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formed electricity Connect;Arranging a window on upper substrate, arrange one or more mems chips in window, the present embodiment arranges two microcomputers Electrical chip, is electrically connected between mems chip and with being formed by lead-in wire between upper substrate;Two are arranged on upper substrate upper surface Individual IC chip, two are electrically connected by lead-in wire formation between IC chip with upper surface, two ic cores The top of sheet arranges circuit protection device, and this circuit protection device is that (part for pre-plastic package colloid, in pre-plastic package work for plastic packaging glue In skill one-body molded), this plastic packaging glue completely be coated with lid two IC chips;The top of window is built by pre-plastic package colloid Pre-plastic package cavity, upper substrate, exposure window in the inner surface of plastic packaging glue surface and pre-plastic package colloid form the pre-plastic package of hollow Cavity, described pre-plastic package cavity upward opening, pre-plastic package cavity top is respectively provided with sealing device, the sealing device of this embodiment The form of cover plate, IC chip is used to be electrically connected, between upper substrate and molding compounds by lead-in wire formation with upper substrate Epoxy flux packing material is set;Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

Specific embodiment eight,

As shown in figure 11, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;One window is set on upper substrate, 3 mems chips is set in window, between mems chip and with upper substrate it Between by lead-in wire formed electrical connection;The top of upper substrate builds a pre-plastic package cavity, upper substrate, exposure by pre-plastic package colloid Window in the inner surface of plastic packaging glue surface and pre-plastic package colloid form the pre-plastic package cavity of hollow, described pre-plastic package cavity to Upper shed, pre-plastic package cavity top arranges sealing device, and in this embodiment, sealing device uses the form of cover plate 13;Pre-plastic package chamber Internal protectiveness rubber cover 14 is set, mems chip and lead wire circuit structure is coated with completely, is used for protecting mems chip Circuit;Epoxy flux packing material is set between upper substrate and molding compounds;By conduction between upper substrate and infrabasal plate Through hole realizes electrical connection.

Specific embodiment nine,

As shown in figure 12, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;One window is set on upper substrate, 3 mems chips is set in window, between mems chip and with upper substrate it Between by lead-in wire formed electrical connection;Upper substrate top arranges sealing device, and this embodiment uses the form of cover plate;Protectiveness is set Rubber cover, is coated with completely by mems chip and lead wire circuit structure, is used for protecting mems chip circuit;Protectiveness rubber cover Periphery be previously provided with cofferdam glue 18 with limit protectiveness rubber cover coverage;Set between upper substrate and molding compounds Put epoxy flux packing material;Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

Specific embodiment ten,

As shown in figure 13, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;Arranging a window on upper substrate, arrange one or more mems chips in window, the present embodiment arranges 3 microcomputer battery cores Sheet, is electrically connected between mems chip and with being formed by lead-in wire between upper substrate;Pre-plastic package colloid is passed through on the top of window Build pre-plastic package cavity, upper substrate, exposure window in plastic packaging glue surface and the inner surface of pre-plastic package colloid formation hollow pre- Plastic packaging cavity, described pre-plastic package cavity upward opening, pre-plastic package cavity top is respectively provided with sealing device, the sealing of this embodiment Device uses the form of cover plate;Window inner mold compound top mounts complementary substrate, and mems chip is positioned over complementary The upper surface of substrate;Protectiveness rubber cover is set in window, mems chip and lead wire circuit structure is coated with completely, is used for protecting Protect mems chip circuit;Epoxy flux packing material is set between upper substrate and molding compounds;Upper substrate and infrabasal plate Between by conductive through hole realize electrical connection.

Specific embodiment 11,

As shown in figure 14, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;Arranging a window on upper substrate, arrange one or more mems chips in window, the present embodiment arranges 2 microcomputer battery cores Sheet, is electrically connected between mems chip and with being formed by lead-in wire between upper substrate;Described upper substrate uses metal framework lining The end 17;The top of window builds pre-plastic package cavity, metal frame substrate, exposure window in plastic packaging glue surface and pre-plastic package colloid Inner surface formed hollow pre-plastic package cavity, described pre-plastic package cavity upward opening, pre-plastic package cavity top is respectively provided with envelope Locking device, the sealing device of this embodiment uses the form of cover plate;Protectiveness rubber cover is set in window, by mems chip and Lead wire circuit structure is coated with completely, is used for protecting mems chip circuit;Arrange epoxy between upper substrate and molding compounds to help Solder flux packing material;Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

Specific embodiment 12,

As shown in figure 15, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;Arranging a window on upper substrate, arrange one or more mems chips in window, the present embodiment arranges 2 microcomputer battery cores Sheet, is electrically connected between mems chip and with being formed by lead-in wire between upper substrate;Described upper substrate uses metal framework lining The end, this metal frame substrate is by plastic packaging glue plastic packaging, and this plastic packaging glue is referred to as metal frame substrate plastic packaging glue;The top of window builds pre- Plastic packaging cavity, metal frame substrate, exposure window in plastic packaging glue surface and the inner surface of pre-plastic package colloid form the pre-of hollow Plastic packaging cavity, described pre-plastic package cavity upward opening, pre-plastic package cavity top is respectively provided with sealing device, the sealing of this embodiment Device uses the form of cover plate;Protectiveness rubber cover is set in window, mems chip and lead wire circuit structure is coated with completely, For protecting mems chip circuit;Metal frame substrate plastic packaging glue 16 implant is set between upper substrate and molding compounds; Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

Specific embodiment 13,

As shown in figure 16, the hybrid package structure of mems chip and IC chip, including mems chip, integrated Circuit chip, upper substrate, infrabasal plate and the molding compounds being arranged between upper substrate and infrabasal plate, described infrabasal plate sets Put 4 IC chips, between 4 IC chips and and the upper surface of infrabasal plate between by lead-in wire formation be electrically connected Connect;One window is set on upper substrate, 2 mems chips is set in window, between mems chip and with upper substrate it Between by lead-in wire formed electrical connection;Upper substrate top arranges sealing device, and this embodiment uses the form of cover plate;Protectiveness is set Rubber cover, is coated with completely by mems chip and lead wire circuit structure, is used for protecting mems chip circuit;Protectiveness rubber cover Periphery be previously provided with cofferdam glue 18 with limit protectiveness rubber cover coverage;Upper substrate top arranges two electronics units Device package, electronic devices and components packaging body is formed with upper substrate and electrically connects;Epoxy is set between upper substrate and molding compounds Scaling powder packing material;Realize electrically connecting by conductive through hole between upper substrate with infrabasal plate.

The sealing device that upper substrate top described in this programme is arranged is not limited to the form of the cover plate shown in figure, and other can Realize in this all kinds of devices carrying out sealing function above upper substrate are included in.

The circuit protection device that mems chip, IC chip described in this programme are arranged around is not limited only to protection Property cover colloid, in other devices being capable of this function are included in.

This programme is not limited to these chips enumerated, can be according to different user's requests at upper and lower substrate and each window Multiple different chip is set in Kou, and can be configured to different combinations and be configured.

Chip in this programme is not only to be set in parallel on upper and lower substrate, it is also possible to arrange by the way of stacking On upper and lower substrate.

Mems chip of the present utility model uses following method for packing, bag with the hybrid package structure of IC chip Include concrete steps:

Step 1, on infrabasal plate, carry out planting stannum ball, IC chip is pasted, wirebonding operations;

Step 2, the stannum ball on infrabasal plate, IC chip, lead-in wire carry out plastic packaging;

Step 3, the plastic package structure above stannum ball is carried out above laser ablation, and the stannum ball after laser ablation continue Carry out planting stannum ball exercise to make;

Step 4, upper substrate is set;

Step 5, at least one window is set on upper substrate;

Step 6, mems chip is set in window, and mems chip is carried out wirebonding operations;

Step 7, carry out glue dispensing and packaging formed encapsulating structure.

This embodiment uses the mode pasted on molding compounds by mems chip to be fixed mems chip.

Further, as shown in figure 17, mems chip of the present utility model is tied with the hybrid package of IC chip Structure can also use following method for packing, comprises the steps:

Step 1, on infrabasal plate, carry out planting stannum ball, IC chip is pasted, wirebonding operations;

Step 2, the stannum ball on infrabasal plate, IC chip, lead-in wire carry out plastic packaging;

Step 3, the plastic package structure above stannum ball is carried out above laser ablation, and the stannum ball after laser ablation continue Carry out planting stannum ball exercise to make;

Step 4, upper substrate is set;

Step 5, at least one window is set on upper substrate;

Step 6, pre-plastic package cavity is set on upper substrate top;

Step 7, mems chip is set in window, and mems chip is carried out wirebonding operations;

Step 8, sealing device is set on pre-plastic package cavity top;

Step 9, carry out glue dispensing and packaging formed encapsulating structure.

Claims (14)

1. mems chip and the hybrid package structure of IC chip, including mems chip, IC chip, upper base Plate, infrabasal plate and the plastic packaging glue being arranged between upper substrate and infrabasal plate, mems chip, IC chip and upper substrate And/or between infrabasal plate, form electrical connection, and formed between upper substrate with infrabasal plate and electrically connect, it is characterised in that: open on upper substrate Going out at least one window penetrating upper substrate, one or more mems chips and/or IC chip are positioned over upper substrate Window at, lower substrate surface and/or upper substrate surface.
Mems chip the most according to claim 1 and the hybrid package structure of IC chip, it is characterised in that: institute Stating upper substrate is upper strata circuit substrate, and infrabasal plate is lower circuit substrate, wherein,
Mems chip or IC chip, referred to as infrabasal plate upper die is placed, on infrabasal plate on the upper surface of infrabasal plate Side mems chip on circuit, IC chip active surface by being electrically connected to the surface of infrabasal plate;
The top of infrabasal plate arranges plastic packaging glue, described in mould sealant covers infrabasal plate upper die, electronic devices and components and the access node that is electrically connected Structure;
The lower surface of upper substrate fits in the top of plastic packaging glue, and the gap between lower surface and the plastic packaging glue of upper substrate arranges filling Thing;
Be arranged through between lower surface and the upper surface of infrabasal plate of upper substrate that plastic packaging glue and implant and having electrically connect is logical Hole, the internal conductive material of through hole;
Described window is through to plastic packaging glue surface, and mems chip or ic core are placed in the plastic packaging glue surface in window Chip in sheet, referred to as window, the circuit on mems chip, the active surface of IC chip in window pass through electrical connection Surface to upper substrate.
Mems chip the most according to claim 1 and the hybrid package structure of IC chip, it is characterised in that: institute State the oriented recessed structure sunk or raise up of plastic packaging glue in window, be called recessed heavy window and embossed window.
4., according to the hybrid package structure of the mems chip described in claim 1,2 or 3 Yu IC chip, its feature exists In: described mems chip, IC chip are arranged around circuit protection device.
Mems chip the most according to claim 4 and the hybrid package structure of IC chip, it is characterised in that: institute Stating circuit protection device is that protectiveness covers colloid or plastic packaging glue.
Mems chip the most according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists In: described upper substrate top arranges sealing device.
Mems chip the most according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists In: it is provided above at least one pre-plastic package cavity at upper substrate.
Mems chip the most according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists In: described mems chip or IC chip can parallel or stacking placements.
Mems chip the most according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists In: complementary substrate is placed in the plastic packaging glue surface in window first, and then the upper surface at complementary substrate places microcomputer battery core Sheet.
Mems chip the most according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists With the printed circuit board (PCB) being disposed below or packaging body or power interconnection, and electrical connection can be formed in: infrabasal plate lower surface.
11. mems chips according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists In: described upper substrate uses metal frame substrate.
12. mems chips according to claim 11 and the hybrid package structure of IC chip, it is characterised in that: Described metal frame substrate is by plastic packaging glue plastic packaging, and this plastic packaging glue is referred to as metal frame substrate plastic packaging glue.
13. mems chips according to claim 2 and the hybrid package structure of IC chip, it is characterised in that: Described implant is metal frame substrate plastic packaging glue.
14. mems chips according to claim 1 and 2 and the hybrid package structure of IC chip, its feature exists In: arrange on the upper surface of described upper substrate and/or infrabasal plate at least one electronic devices and components of formed electrical connection or its Packaging body.
CN201620627352.4U 2016-06-23 2016-06-23 Mems chip and the hybrid package structure of IC chip CN205838570U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106960827A (en) * 2017-03-29 2017-07-18 袁鹰 Three-dimension packaging structure and its method for packing
CN107539943A (en) * 2016-06-23 2018-01-05 黄卫东 The hybrid package structure and its method for packing of mems chip and IC chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107539943A (en) * 2016-06-23 2018-01-05 黄卫东 The hybrid package structure and its method for packing of mems chip and IC chip
CN106960827A (en) * 2017-03-29 2017-07-18 袁鹰 Three-dimension packaging structure and its method for packing

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