CN205731840U - A kind of transistor assembling point glue continuous processing equipment - Google Patents
A kind of transistor assembling point glue continuous processing equipment Download PDFInfo
- Publication number
- CN205731840U CN205731840U CN201620452651.9U CN201620452651U CN205731840U CN 205731840 U CN205731840 U CN 205731840U CN 201620452651 U CN201620452651 U CN 201620452651U CN 205731840 U CN205731840 U CN 205731840U
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- housing
- glue
- support
- rotating disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 title claims abstract description 95
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 67
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 67
- 239000010703 silicon Substances 0.000 claims abstract description 67
- 238000007493 shaping process Methods 0.000 claims abstract description 39
- 238000009434 installation Methods 0.000 claims abstract description 15
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 10
- 230000001105 regulatory Effects 0.000 claims description 22
- 238000001514 detection method Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive Effects 0.000 claims 2
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 2
- 229920000715 Mucilage Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920000591 gum Polymers 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The utility model discloses a kind of transistor assembling point glue continuous processing equipment, first feeding device, housing apparatus for shaping, second feeding device, point glue equipment, blanking device is successively set on rotating disk periphery, pass through turntable rotation, housing mounting groove is successively at housing feeding station, silicon chip feeding station, point glue station, switch between discharge station, during work, first feeding device first feeding housing in housing mounting groove, then housing apparatus for shaping carries out shaping to the support of housing, ensure that the position that silicon chip is installed on housing is accurate, then the second feeding device by silicon chip feeding to silicon chip installation position, rearmost point gluing mechanism carries out a glue, blanking device is by the transistor component blanking after a glue；Transistor assembling point glue integration completes, and by shell holder being carried out shaping before upper silicon chip, is positioned a glue position by the first keeper and the second keeper with during time point glue, thus ensures a glue precision, be greatly improved transistor component qualification rate.
Description
Technical field
This utility model relates to transistor processing technique field, particularly relates to a kind of transistor assembling point glue continuous
Process equipment.
Background technology
During transistor assembling, some glue is one necessary operation, and some glue is exactly substantially at components and parts
Surface coating or other fluent material.Completed by hand by workman during initially some glue work, along with science and technology
Progress, also create a lot of Semi-automatic dispenser, also emerge more and more full-automatic glue-dropping machine successively.
And the appearance of the sophisticated product that gets more and more, a glue is required more and more higher, and transistor is in transport and charging
During, the easy extrusion of pin, a glue reliability and precision are affected relatively big, need during a glue
Pin being carried out shaping, to take considerable time, the most existing some glue process has had a strong impact on the life of whole line
Produce efficiency.
Utility model content
For solving technical problem present in background technology, the utility model proposes a kind of transistor assembling point glue
Continuous processing equipment.
A kind of transistor assembling point glue continuous processing equipment that the utility model proposes, for transistor component
Carrying out assembling and putting glue, described transistor component includes housing and silicon chip, and housing is provided with the first support and
Two supports, the first support and the second support are oppositely arranged, and the first support and the second support assorted form silicon chip peace
Dress position, silicon chip is vertically installed on described silicon chip installation position, described transistor assembling point glue continuous processing equipment
Including: workbench, rotating disk, the first feeding device, housing apparatus for shaping, the second feeding device, some mucilage binding
Put, blanking device, the first driving means, the second driving means；
Rotating disk is horizontally disposed with on the table, is provided with the first rotating shaft being vertically arranged and by first in the middle part of rotating disk
Rotating shaft may be rotatably mounted on workbench, and the first driving means and rotating disk are connected to drive turntable rotation, turn
Dish periphery is provided with at least one housing mounting groove, the first feeding device, housing apparatus for shaping, the second feeding dress
Put, silicon chip detection device, point glue equipment, blanking device around rotating disk arrange, the first feeding device for
Being positioned at the housing mounting groove feeding housing of the first feeding station, housing apparatus for shaping is used for being pointed to shaping work
The first support on the housing of position and the second support shaping, the second feeding device is for being positioned at the second feeding work
The silicon chip installation position feeding silicon chip of the housing of position, silicon chip detection device is positioned at the silicon of silicon chip installation position for detection
Sheet position, point glue equipment is for being positioned on a transistor component of glue station some glue, and blanking device is used for will
Complete transistor component blanking for dispensing glue；
Housing apparatus for shaping includes crane, adjusting part, and crane is positioned at rotating disk side, and crane is close
Rotating disk side is provided with horizontally disposed 3rd slide rail, and the 3rd slide rail is provided with slide block, and regulating part assembly is positioned at place
Above the housing mounting groove of shaping station and be arranged on slide block, adjusting part is for the first of adjustment housings
Distance between support and the second support.
Preferably, adjusting part includes the first regulating part and the second regulating part, the first regulating part and the second regulation
Part is separately mounted to slide block both sides along the 3rd slide rail direction, and the first regulating part is for expanding the first support and second
Distance between support, the second regulating part is for reducing the distance between the first support and the second support.
Preferably, point glue equipment include installing rack, the first keeper, the second keeper, the first glue applying mechanism,
Second point gluing mechanism, installing rack is positioned at rotating disk side, and installing rack is provided with horizontally disposed first guide rail and
Two guide rails, the first guide rail and the second guide rail be located along the same line, and the first guide rail is provided with and is slidably mounted
First balladeur train, the second guide rail is provided with the second balladeur train being slidably mounted, and the first keeper is positioned at above rotating disk
And it is arranged on the first balladeur train near the second balladeur train side, and the first glue applying mechanism is arranged on the first balladeur train, and second
Keeper is positioned at above rotating disk and is arranged on the second balladeur train near the first balladeur train side, and second point gluing mechanism is installed
On the second balladeur train.
Preferably, also including that silicon chip keeper, silicon chip keeper are positioned at rotating disk side, silicon chip keeper is used for
It it is the second feeding device location when the second feeding device feeding silicon chip.
Preferably, the first feeding device, housing apparatus for shaping, the second feeding device, silicon chip detection device,
Point glue equipment, blanking device set gradually around rotating disk.
Preferably, rotating disk is provided with six housing mounting grooves, and six housing mounting grooves uniformly divide along disk peripheral
Cloth.
In this utility model, the transistor assembling point glue continuous processing equipment proposed, the first feeding device,
Housing apparatus for shaping, the second feeding device, point glue equipment, blanking device are successively set on rotating disk periphery, logical
Cross turntable rotation, housing mounting groove successively housing feeding station, silicon chip feeding station, some glue station, under
Switch between material station, during work, the first feeding device first feeding housing in housing mounting groove, then
Housing apparatus for shaping carries out shaping to the support of housing, it is ensured that the position that silicon chip is installed on housing is accurate, connects
The second feeding device and silicon chip feeding to silicon chip installation position, rearmost point gluing mechanism are carried out a glue, blanking device
By the transistor component blanking after a glue.The transistor assembling point glue Continuous maching designed by above-mentioned optimization is set
Standby, reasonable in design so that transistor assembling point glue integration completes, by before upper silicon chip propping up housing
Frame carries out shaping, is positioned a glue position by the first keeper and the second keeper with during time point glue,
Thus ensure a glue precision, it is greatly improved transistor component qualification rate.
Accompanying drawing explanation
Fig. 1 is the transistor of a kind of transistor assembling point glue continuous processing equipment processing that the utility model proposes
The structural representation of assembly.
Fig. 2 is that the plan structure of a kind of transistor assembling point glue continuous processing equipment that the utility model proposes is shown
It is intended to.
Fig. 3 is that the side-looking structure of a kind of transistor assembling point glue continuous processing equipment that the utility model proposes is shown
It is intended to.
Detailed description of the invention
As shown in Figures 1 to 3, Fig. 1 is a kind of transistor assembling point glue Continuous maching that the utility model proposes
The structural representation of the transistor component of apparatus processing, Fig. 2 is a kind of transistor group that the utility model proposes
Decorateeing the plan structure schematic diagram of glue continuous processing equipment, Fig. 3 is a kind of transistor that the utility model proposes
Assemble the side-looking structural representation of some glue continuous processing equipment.
With reference to Fig. 1, a kind of transistor assembling point glue continuous processing equipment that the utility model proposes, for crystalline substance
Body pipe assembly carries out assembling and putting glue, and described transistor component includes housing 11 and silicon chip 12, on housing 11
Being provided with the first support 13 and the second support 14, the first support 13 and the second support 14 are oppositely arranged, first
Frame 13 and the second support 14 cooperatively form silicon chip installation position, and silicon chip 12 is vertically installed at described silicon chip installation position
On.
With reference to Fig. 2 and 3, described transistor assembling point glue continuous processing equipment includes: workbench 2, rotating disk 3,
First feeding device 4, housing apparatus for shaping, the second feeding device 6, silicon chip detection device 7, point glue equipment,
Blanking device the 9, first driving means, the second driving means；
Rotating disk 3 is horizontally set on workbench 2, is provided with the first rotating shaft being vertically arranged and leads in the middle part of rotating disk 3
Crossing the first rotating shaft and may be rotatably mounted on workbench 2, the first driving means and rotating disk 3 are connected to drive and turn
Dish 3 rotates, and rotating disk 3 periphery is provided with six housing mounting grooves, and six housing mounting grooves are equal along rotating disk 3 circumference
Even distribution, the first feeding device 4, housing apparatus for shaping, the second feeding device 6, silicon chip 12 detect device,
Point glue equipment, blanking device 9 set gradually around rotating disk 3, and the first feeding device 4 is for being positioned at first
Feeding housing 11 in the housing mounting groove of feeding station, housing apparatus for shaping is for being pointed to the shell of shaping station
The first support 13 and the second support 14 shaping on body 11, the second feeding device 6 is for being positioned at second
The silicon chip installation position feeding silicon chip 12 of the housing 11 of material station, silicon chip 12 detects device and is positioned at silicon for detection
Silicon chip 12 position of sheet installation position, point glue equipment is used for being positioned on a transistor component of glue station some glue,
Blanking device 9 will be for completing transistor component blanking for dispensing glue；
Housing apparatus for shaping includes that crane 51, adjusting part, crane 51 are positioned at rotating disk 3 side, lifting
Frame 51 is provided with horizontally disposed 3rd slide rail near rotating disk 3 side, and the 3rd slide rail is provided with slide block 54, regulation
Part assembly is located in above the housing mounting groove of shaping station and is arranged on slide block 54, and adjusting part is used for
Distance between first support 13 and second support 14 of adjustment housings 11；Specifically, adjusting part includes
First regulating part 52 and the second regulating part 53, the first regulating part 52 and the second regulating part 53 are along the 3rd slide rail side
To being separately mounted to slide block 54 both sides, the first regulating part 52 is for expanding the first support 13 and the second support 14
Between distance, the second regulating part 53 is for reducing the distance between the first support 13 and the second support 14；
Point glue equipment includes installing rack the 81, first keeper the 82, second keeper the 83, first glue applying mechanism
84, second point gluing mechanism 85, installing rack 81 is positioned at rotating disk 3 side, and installing rack 81 is provided with and is horizontally disposed with
The first guide rail and the second guide rail, the first guide rail and the second guide rail be located along the same line, the first guide rail sets
Having the first balladeur train being slidably mounted, the second guide rail is provided with the second balladeur train being slidably mounted, the first location
Part 82 is positioned at above rotating disk 3 and is arranged on the first balladeur train near the second balladeur train side, the first glue applying mechanism 84
Being arranged on the first balladeur train, the second keeper 83 is positioned at above rotating disk 3 and is arranged on the second balladeur train near first
Balladeur train side, second point gluing mechanism 85 is arranged on the second balladeur train.
During the specific works of the transistor assembling point glue continuous processing equipment of the present embodiment, during work, the
One driving means driving turntable rotation carries out housing mounting groove and switches between multiple stations；Housing mounting groove is first
First being positioned at housing feeding station, the first feeding device is feeding housing in housing mounting groove；Then move to shell
Body shaping station, the first support on housing and the second support are carried out shaping by housing apparatus for shaping, specifically,
Slide block along the 3rd slide rail slide make the regulator site of the first regulating part between the first support and the second support,
Crane moves down, the first regulating part outwardly against the first support and the second support, then between distance
Increasing, then slide block slides along the 3rd slide rail so that the regulator site of the second regulating part is in the first support and the
Two support both sides, crane moves down, and the second regulating part inwardly extrudes the first support and the second support, from
And ensure that the position of silicon chip installation position is accurate；Then the second feeding device by silicon chip feeding to silicon chip installation position,
Thus complete assembling procedure；
Then, housing mounting groove continuously moves to detect station, and whether detection device detection silicon chip feeding position
Accurately；Then rotating disk continues to rotate, and housing mounting groove moves to a glue station, after point glue equipment is to assembling
Glue is put on transistor component；Specifically, during point glue, the first glue applying mechanism and second point gluing mechanism lay respectively at
First support and the second support both sides, the first balladeur train and the second balladeur train are respectively along the first guide rail and the second guide rail phase
To slip so that the first keeper and the second keeper move the first support and the second support near direction
Location is to some glue position, it is ensured that silicon chip position on support is accurate, the first glue applying mechanism and the second point gum machine
Structure carries out a glue at the first support and the second support respectively, and after putting cementing bundle, the first balladeur train and the second balladeur train are answered
Position；Finally, housing mounting groove moves to discharge station with rotating disk, and blanking device carries out blanking.
In the present embodiment, the transistor assembling point glue continuous processing equipment proposed, the first feeding device,
Housing apparatus for shaping, the second feeding device, point glue equipment, blanking device are successively set on rotating disk periphery, logical
Cross turntable rotation, housing mounting groove successively housing feeding station, silicon chip feeding station, some glue station, under
Switch between material station, during work, the first feeding device first feeding housing in housing mounting groove, then
Housing apparatus for shaping carries out shaping to the support of housing, it is ensured that the position that silicon chip is installed on housing is accurate, connects
The second feeding device and silicon chip feeding to silicon chip installation position, rearmost point gluing mechanism are carried out a glue, blanking device
By the transistor component blanking after a glue.The transistor assembling point glue Continuous maching designed by above-mentioned optimization is set
Standby, reasonable in design so that transistor assembling point glue integration completes, by before upper silicon chip propping up housing
Frame carries out shaping, is positioned a glue position by the first keeper and the second keeper with during time point glue,
Thus ensure a glue precision, it is greatly improved transistor component qualification rate.
In a specific embodiment, the second feeding device includes that silicon chip keeper 60, silicon chip keeper 60 are positioned at
Rotating disk 3 side, silicon chip keeper 60 is used for being the second feeding when the second feeding device 6 feeding silicon chip 12
Device 6 positions；Ensure the second feeding device on housing during feeding silicon chip feeding position accurate.
The above, only this utility model preferably detailed description of the invention, but protection model of the present utility model
Enclose and be not limited thereto, the technology model that any those familiar with the art discloses at this utility model
In enclosing, conceive in addition equivalent or change according to the technical solution of the utility model and utility model thereof, all
Should contain within protection domain of the present utility model.
Claims (6)
1. a transistor assembling point glue continuous processing equipment, for transistor component being assembled and putting glue,
Described transistor component includes housing (11) and silicon chip (12), and housing (11) is provided with the first support (13)
It is oppositely arranged with the second support (14), the first support (13) and the second support (14), the first support (13)
Cooperatively forming silicon chip installation position with the second support (14), silicon chip (12) is vertically installed at described silicon chip and installs
On position, it is characterised in that described transistor assembling point glue continuous processing equipment includes: workbench (2), turn
Dish (3), the first feeding device (4), housing apparatus for shaping, the second feeding device (6), silicon chip detection dress
Put (7), point glue equipment, blanking device (9), the first driving means, the second driving means；
Rotating disk (3) is horizontally set on workbench (2), and rotating disk (3) middle part is provided with first be vertically arranged
Rotating shaft and may be rotatably mounted on workbench (2) by the first rotating shaft, the first driving means and rotating disk (3)
Being connected to drive rotating disk (3) to rotate, rotating disk (3) periphery is provided with at least one housing mounting groove, and first
Feeding device (4), housing apparatus for shaping, the second feeding device (6), silicon chip (12) detection device, point
Adhesive dispenser, blanking device (9) are arranged around rotating disk (3), and the first feeding device (4) is for being positioned at the
Feeding housing (11) in the housing mounting groove of one feeding station, housing apparatus for shaping is used for being pointed to shaping station
Housing (11) on the first support (13) and the second support (14) shaping, the second feeding device (6)
For silicon chip installation position feeding silicon chip (12) to the housing (11) being positioned at the second feeding station, silicon chip (12)
Detection device is positioned at silicon chip (12) position of silicon chip installation position for detection, and point glue equipment is for being positioned at a little
Putting glue on the transistor component of glue station, blanking device (9) will be for completing transistor component blanking for dispensing glue；
Housing apparatus for shaping includes that crane (51), adjusting part, crane (51) are positioned at rotating disk (3)
Side, crane (51) is provided with horizontally disposed 3rd slide rail, on the 3rd slide rail near rotating disk (3) side
Being provided with slide block (54), regulating part assembly is located in above the housing mounting groove of shaping station and is arranged on slide block
(54), on, adjusting part is used for the first support (13) and second support (14) of adjustment housings (11)
Between distance.
Transistor assembling point glue continuous processing equipment the most according to claim 1, it is characterised in that adjust
Joint assembly includes that the first regulating part (52) and the second regulating part (53), the first regulating part (52) and second are adjusted
Joint part (53) is separately mounted to slide block (54) both sides along the 3rd slide rail direction, and the first regulating part (52) is used
In the distance expanded between the first support (13) and the second support (14), the second regulating part (53) is used for
Reduce the distance between the first support (13) and the second support (14).
Transistor assembling point glue continuous processing equipment the most according to claim 1, it is characterised in that point
Adhesive dispenser includes installing rack (81), the first keeper (82), the second keeper (83), the first glue applying mechanism
(84), second point gluing mechanism (85), installing rack (81) is positioned at rotating disk (3) side, installing rack (81)
It is provided with horizontally disposed first guide rail and the second guide rail, the first guide rail and the second guide rail to be located along the same line,
First guide rail is provided with the first balladeur train being slidably mounted, and it is sliding that the second guide rail is provided with second be slidably mounted
Frame, the first keeper (82) is positioned at rotating disk (3) top and is arranged on the first balladeur train near the second balladeur train side,
First glue applying mechanism (84) is arranged on the first balladeur train, and the second keeper (83) is positioned at rotating disk (3) top
And it being arranged on the second balladeur train near the first balladeur train side, second point gluing mechanism (85) is arranged on the second balladeur train.
Transistor assembling point glue continuous processing equipment the most according to claim 1, it is characterised in that also
Including silicon chip keeper (60), silicon chip keeper (60) is positioned at rotating disk (3) side, silicon chip keeper (60)
For during when the second feeding device (6) feeding silicon chip (12) being the second feeding device (6) location.
Transistor assembling point glue continuous processing equipment the most according to claim 1, it is characterised in that the
One feeding device (4), housing apparatus for shaping, the second feeding device (6), silicon chip (12) detection device,
Point glue equipment, blanking device (9) set gradually around rotating disk (3).
Transistor assembling point glue continuous processing equipment the most according to claim 1, it is characterised in that turn
Dish (3) is provided with six housing mounting grooves, and six housing mounting grooves are distributed along rotating disk (3) even circumferential.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620452651.9U CN205731840U (en) | 2016-05-17 | 2016-05-17 | A kind of transistor assembling point glue continuous processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620452651.9U CN205731840U (en) | 2016-05-17 | 2016-05-17 | A kind of transistor assembling point glue continuous processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205731840U true CN205731840U (en) | 2016-11-30 |
Family
ID=57364763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620452651.9U Expired - Fee Related CN205731840U (en) | 2016-05-17 | 2016-05-17 | A kind of transistor assembling point glue continuous processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205731840U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105855128A (en) * | 2016-05-17 | 2016-08-17 | 安庆友仁电子有限公司 | Continuous machining equipment for assembling and dispensing transistor |
| CN106827794A (en) * | 2017-01-25 | 2017-06-13 | 昆山希盟自动化科技有限公司 | The transfer printing molded machines of glass spinning line UV |
| CN111112011A (en) * | 2019-12-06 | 2020-05-08 | 珠海格力智能装备有限公司 | Spacing adjustment mechanism and have its refuelling equipment |
-
2016
- 2016-05-17 CN CN201620452651.9U patent/CN205731840U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105855128A (en) * | 2016-05-17 | 2016-08-17 | 安庆友仁电子有限公司 | Continuous machining equipment for assembling and dispensing transistor |
| CN105855128B (en) * | 2016-05-17 | 2019-11-12 | 安庆友仁电子有限公司 | A kind of transistor assembling dispensing continuous processing equipment |
| CN106827794A (en) * | 2017-01-25 | 2017-06-13 | 昆山希盟自动化科技有限公司 | The transfer printing molded machines of glass spinning line UV |
| CN111112011A (en) * | 2019-12-06 | 2020-05-08 | 珠海格力智能装备有限公司 | Spacing adjustment mechanism and have its refuelling equipment |
| CN111112011B (en) * | 2019-12-06 | 2021-04-30 | 珠海格力智能装备有限公司 | Spacing adjustment mechanism and have its refuelling equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20190517 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |