CN205720565U - A kind of batch testing plate for testing signal condition chip - Google Patents
A kind of batch testing plate for testing signal condition chip Download PDFInfo
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- CN205720565U CN205720565U CN201620658915.6U CN201620658915U CN205720565U CN 205720565 U CN205720565 U CN 205720565U CN 201620658915 U CN201620658915 U CN 201620658915U CN 205720565 U CN205720565 U CN 205720565U
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- low pressure
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- signal condition
- support plate
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- 238000012360 testing method Methods 0.000 title claims abstract description 63
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- 238000005259 measurement Methods 0.000 abstract description 4
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- 238000011031 large-scale manufacturing process Methods 0.000 description 2
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Abstract
The utility model discloses a kind of batch testing plate for testing signal condition chip, the negative pressure input of analog-digital converter is connected to ground connection after the earth terminal of product support plate by this test board by circuit board trace and/or lead-in wire, eliminate the deviation brought because earth point is different between test board measured value and sensor output voltage, improve the certainty of measurement of test board；Simultaneously, this utility model also includes jumper cap device for the batch testing plate testing signal condition chip, user stirs jumper cap device can select to be communicated to the first low pressure difference linear voltage regulator, the second low pressure difference linear voltage regulator or the 3rd low pressure difference linear voltage regulator the voltage output end mouth of batch testing plate, different low pressure difference linear voltage regulators has different voltage output so that this utility model test board can adapt to the sensor of Multiple Type.
Description
Technical field
This utility model relates to signal processing field, particularly relates to a kind of for test all-purpose bridge type magnetic sensor signal condition
The batch testing plate of chip.
Background technology
Sensor be a kind of can by measured according to certain rule be converted to the signal of telecommunication output detection device.Sensing
The operation principle of device is measured first with sensing element direct feeling and output has, with measured, the physical quantity determining relation
Signal, the physical quantity signal that sensing element exports is converted to the signal of telecommunication by recycling conversion element.Due to temperature, manufacturing process etc.
The impact of factor, the signal of telecommunication of the conversion element output in sensor tends not to directly as measuring signal output, it is necessary to have
This output signal of telecommunication is amplified by follow-up circuit, calibrate and temperature-compensating etc. process after just can export accurately survey
Amount signal is for other equipment.
The signal of telecommunication exporting sensor conversion element carries out method for subsequent processing two kinds: one is to use periphery discrete
Circuit carries out subsequent treatment, the operating procedure that this processing method is the most unified, and inefficiency and treatment effect depend on manually
Experience, is not suitable for large-scale production；The second is to use signal condition chip, and signal condition chip is integrated by subsequent process circuit
Being a chip, this chip can be formed integrally with sensor, it is not necessary to user configures peripheral circuit the most voluntarily, carries greatly
The high reliability of sensor.
Fig. 1 is the structure principle chart of the common bridge type magnetic sensor signal condition chip in a kind of domestic market, this signal condition
Chip can provide null offset and temperature-compensating, sensitivity and temperature-compensating thereof and nonlinear compensation for sensor.This kind of
Signal condition chip the most often implant to sensor internal, be a kind of with sensor together large-scale production product
Product.Before the sensor being configured with signal condition chip dispatches from the factory, producer needs to test sensor and demarcate.Fig. 2 is
The schematic diagram of the test board test sensor of test signal condition chip of the prior art, the malleation of analog-digital converter (ADC)
Input is connected with the outfan of sensor, the earth terminal of sensor and negative pressure input each ground connection of analog-digital converter.This
What kind of connected mode caused analog-digital converter actually enters voltage U1=U0+U2, U2It it is the electricity between two different earth points
Pressure.Single sensor is tested when, owing to test electric current is the least, ground voltage U2Value the least, can neglect
Slightly.But, in order to improve the testing efficiency of sensor, multiple sensors are tested by a lot of test boards simultaneously.Now, flow through
Electric current between two different earth points adds a lot, ground voltage U2Increasing the most therewith, this causes test board to be measured
There is a deviation can not ignore with sensor output voltage in voltage, measurement result is not accurate enough.
Utility model content
The technical problems to be solved in the utility model is that the test board of the test signal condition chip of prior art is at batch
During test sensor, it is measured and there is a deviation between voltage and sensor output voltage, causes measurement result not accurate enough.
For solving above-mentioned technical problem, the technical solution adopted in the utility model is: one is used for testing signal condition core
The batch testing plate of sheet, including power interface, single-chip microcomputer, product support plate and analog-digital converter；Power interface is used for connecting external
Power supply, external power supply is single-chip microcomputer and analog-digital converter is powered；Product support plate connects single-chip microcomputer and analog-digital converter, product support plate
For installing multiple signal condition chip, the outfan of product support plate connects the outfan of signal condition chip, product support plate
Earth terminal connects the earth terminal of signal condition chip；The positive pressure input port of analog-digital converter is connected with the outfan of product support plate,
The negative pressure input end grounding of analog-digital converter, the earth terminal ground connection of product support plate；The earth terminal of described analog-digital converter is by electricity
Road plate cabling and/or lead-in wire are connected to ground connection after the earth terminal of product support plate.
Further, batch testing plate also includes jumper cap device, the first low pressure difference linear voltage regulator, the second low voltage difference line
Property manostat and the 3rd low pressure difference linear voltage regulator, stir jumper cap device can select by the first low pressure difference linear voltage regulator,
Second low pressure difference linear voltage regulator or the 3rd low pressure difference linear voltage regulator are communicated to the voltage output end mouth of batch testing plate.
Further, spi bus and iic bus is used to connect between described product support plate and single-chip microcomputer.
Further, batch testing plate also includes the RS485 port being connected with single-chip microcomputer.
Beneficial effect: (1) this utility model is for testing the batch testing plate of signal condition chip by analog-digital converter
Negative pressure input is connected to ground connection after the earth terminal of product support plate by circuit board trace and lead-in wire, eliminates test board measured value
From the deviation brought because earth point is different between sensor output voltage, improve the certainty of measurement of test board.(2) this reality
Also including jumper cap device with the novel batch testing plate for testing signal condition chip, it is permissible that user stirs jumper cap device
Select to be communicated to the first low pressure difference linear voltage regulator, the second low pressure difference linear voltage regulator or the 3rd low pressure difference linear voltage regulator criticize
Measuring the voltage output end mouth of test plate (panel), different low pressure difference linear voltage regulators has different voltage output so that this practicality is new
Type test board can adapt to the sensor of Multiple Type.
Accompanying drawing explanation
Fig. 1 is the structure principle chart of prior art bridge type magnetic sensor signal condition chip.
Fig. 2 is the schematic diagram testing sensor for testing the test board of signal condition chip of prior art.
Fig. 3 is the structure principle chart of embodiment 1 batch testing plate.
Fig. 4 is embodiment 1 batch testing plate fundamental diagram.
Wherein: 1, power interface；2, single-chip microcomputer；3, product support plate；4, analog-digital converter；5, jumper cap device；6, first
Low pressure difference linear voltage regulator；7, the second low pressure difference linear voltage regulator；8, the 3rd low pressure difference linear voltage regulator.
Detailed description of the invention
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
Embodiment 1
As it is shown on figure 3, the present embodiment includes power interface 1, monolithic for the batch testing plate testing signal condition chip
Machine 2, product support plate 3, analog-digital converter 4, jumper cap device the 5, first low pressure difference linear voltage regulator the 6, second low pressure difference linearity are steady
Depressor 7 and the 3rd low pressure difference linear voltage regulator 8.
Power interface 1 is used for connecting external power supply, and external power supply is the regulated power supply of 9V, and external power supply is single-chip microcomputer 2 He
Analog-digital converter 4 is powered, and external power supply connects first low pressure difference linear voltage regulator the 6, second low pressure difference linearity by power interface 1
Manostat 7 and the 3rd low pressure difference linear voltage regulator 8.
Product support plate 3 connects single-chip microcomputer 2 and analog-digital converter 4, and the product support plate 3 of the present embodiment batch testing plate can be installed
64 sensors being integrated with signal condition chip, the outfan of product support plate 3 connects the signal condition chip of all the sensors
Outfan, the earth terminal of product support plate 3 connects the earth terminal of the signal condition chip of all the sensors.
The positive pressure input port of analog-digital converter 4 is connected with the outfan of product support plate 3, the negative pressure input of analog-digital converter 4
End is connected to ground connection after the earth terminal of product support plate 3 by circuit board trace.
First low pressure difference linear voltage regulator the 6, second low pressure difference linear voltage regulator 7 and the 3rd low pressure difference linear voltage regulator 8 lead to
Crossing jumper cap device 5 to be connected with the voltage output end mouth of batch testing plate, the first low pressure difference linear voltage regulator 6 can export 6.5V
Or 5V voltage, concrete output voltage is controlled by single-chip microcomputer 2；Second low pressure difference linear voltage regulator 7 output voltage scalable；3rd is low
Pressure reduction linear voltage regulator 8 exportable 3.3V voltage；User stirs jumper cap device 5 and can select the first low pressure difference linearity voltage stabilizing
Arbitrary electricity being communicated to batch testing plate in device the 6, second low pressure difference linear voltage regulator 7 or the 3rd low pressure difference linear voltage regulator 8
Pressure output port.
Spi bus and iic bus is used to connect between described product support plate 3 and single-chip microcomputer 2.Connect on single-chip microcomputer 2 and have
RS485 port, RS485 port is used for and upper machine communication.
Fig. 4 is the fundamental diagram of the present embodiment batch testing board test sensor, and product support plate is provided with 64 collection
Becoming to have the sensor of signal condition chip, the earth terminal of product support plate is connected with the earth terminal of these 64 signal condition chips, mould
The negative pressure input of number converter 4 is connected to ground connection after the earth terminal of product support plate 3 by circuit board trace.Compared to Fig. 2 institute
The test board of the prior art shown, the voltage U that the analog-digital converter 4 of the present embodiment batch testing plate is measured1With product support plate or
A ground voltage U is no longer differed between the voltage of output of products2, improve the precision that test board is measured.
Although in description being illustrated embodiment of the present utility model, but these embodiments are intended only as carrying
Show, should not limit protection domain of the present utility model.Without departing from carrying out various omission in the range of this utility model objective, putting
Change and change should be included in protection domain of the present utility model.
Claims (4)
1. for testing the batch testing plate of signal condition chip, including power interface (1), single-chip microcomputer (2),
Product support plate (3) and analog-digital converter (4)；
Power interface (1) is used for connecting external power supply, and external power supply is single-chip microcomputer (2) and analog-digital converter (4) power supply；
Product support plate (3) connects single-chip microcomputer (2) and analog-digital converter (4), and product support plate (3) is used for installing multiple signal condition core
Sheet, the outfan of product support plate (3) connects the outfan of signal condition chip,
The earth terminal of product support plate (3) connects the earth terminal of signal condition chip；
The positive pressure input port of analog-digital converter (4) is connected with the outfan of product support plate (3), and the negative pressure of analog-digital converter (4) is defeated
Enter and hold ground connection, the earth terminal ground connection of product support plate (3)；
It is characterized in that: the negative pressure input of described analog-digital converter (4) is connected to product by circuit board trace and/or lead-in wire
Ground connection after the earth terminal of support plate (3).
Batch testing plate for testing signal condition chip the most according to claim 1, it is characterised in that: also include jumping
Line cap device (5), the first low pressure difference linear voltage regulator (6), the second low pressure difference linear voltage regulator (7) and the 3rd low pressure difference linearity are steady
Depressor (8), stirs jumper cap device (5) and can select the first low pressure difference linear voltage regulator (6), the second low pressure difference linearity voltage stabilizing
Device (7) or the 3rd low pressure difference linear voltage regulator (8) are communicated to the voltage output end mouth of batch testing plate.
Batch testing plate for testing signal condition chip the most according to claim 2, it is characterised in that: described product
Spi bus and iic bus is used to connect between support plate (3) and single-chip microcomputer (2).
Batch testing plate for testing signal condition chip the most according to claim 3, it is characterised in that: also include with
The RS485 port that single-chip microcomputer (2) connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620658915.6U CN205720565U (en) | 2016-06-29 | 2016-06-29 | A kind of batch testing plate for testing signal condition chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620658915.6U CN205720565U (en) | 2016-06-29 | 2016-06-29 | A kind of batch testing plate for testing signal condition chip |
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| Publication Number | Publication Date |
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| CN205720565U true CN205720565U (en) | 2016-11-23 |
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| CN201620658915.6U Active CN205720565U (en) | 2016-06-29 | 2016-06-29 | A kind of batch testing plate for testing signal condition chip |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106782237A (en) * | 2016-12-14 | 2017-05-31 | 深圳Tcl新技术有限公司 | The test device of lcd panel test plate and television set |
| CN106841979A (en) * | 2016-12-28 | 2017-06-13 | 张家港市欧微自动化研发有限公司 | It is a kind of with can test and Real-time Feedback IC electrical characteristic test devices |
| CN109039352A (en) * | 2018-09-11 | 2018-12-18 | 西安航天自动化股份有限公司 | A kind of telemetering terminal power supply circuit |
| CN112558669A (en) * | 2020-12-10 | 2021-03-26 | 无锡中微亿芯有限公司 | FPGA distributed power supply network with self-test adjustable function |
| CN118566628A (en) * | 2024-08-02 | 2024-08-30 | 东北林业大学 | A fast testing method and system for digital integrated circuit board |
-
2016
- 2016-06-29 CN CN201620658915.6U patent/CN205720565U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106782237A (en) * | 2016-12-14 | 2017-05-31 | 深圳Tcl新技术有限公司 | The test device of lcd panel test plate and television set |
| CN106841979A (en) * | 2016-12-28 | 2017-06-13 | 张家港市欧微自动化研发有限公司 | It is a kind of with can test and Real-time Feedback IC electrical characteristic test devices |
| CN109039352A (en) * | 2018-09-11 | 2018-12-18 | 西安航天自动化股份有限公司 | A kind of telemetering terminal power supply circuit |
| CN112558669A (en) * | 2020-12-10 | 2021-03-26 | 无锡中微亿芯有限公司 | FPGA distributed power supply network with self-test adjustable function |
| CN112558669B (en) * | 2020-12-10 | 2022-05-31 | 无锡中微亿芯有限公司 | FPGA distributed power supply network with self-test adjustable function |
| CN118566628A (en) * | 2024-08-02 | 2024-08-30 | 东北林业大学 | A fast testing method and system for digital integrated circuit board |
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