CN205710979U - HDI plate becomes more meticulous copper plating device - Google Patents
HDI plate becomes more meticulous copper plating device Download PDFInfo
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- CN205710979U CN205710979U CN201620357430.3U CN201620357430U CN205710979U CN 205710979 U CN205710979 U CN 205710979U CN 201620357430 U CN201620357430 U CN 201620357430U CN 205710979 U CN205710979 U CN 205710979U
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- copper plating
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Abstract
This utility model relates to circuit board electroplating technical field, specifically, relate to a kind of HDI plate to become more meticulous copper plating device, including electrolysis bath (1), anode (2), wiring board negative electrode to be electroplated (3), the both sides of described wiring board to be electroplated are equipped with turbulence promoter (4), and this turbulence promoter is polyhedron empty ball structure (5).In electroplating process, electrolyte is circulated by circulating pump, the jet blasted is through the polyhedron empty ball structure (5) of turbulence promoter (4), the surface hydrodynamic condition making wiring board to be electroplated changes, thus increase surface of circuit board bath flow rate and shear rate, mass transfer enhancement, improves the electric current distribution in fine-line region.
Description
Technical field
This utility model relates to circuit board electroplating technical field, becomes more meticulous copper plating device in particular to a kind of HDI plate.
Background technology
The HDI direction of the features such as wiring board making at present forward fine rule road, small-bore, thin plate is developed, existing vertical electroplate technology completes plating thicken main aided process have inflating stirring, circulating pump filter, wave+vibrate, " V " font scaffold, jet injection etc., it is intended to strengthen mass transfer, promote that electrolyte is uniformly dispersed, improve secondary electricity distribution, it is thus achieved that good effect.But in the face of the HDI circuit production requirement more become more meticulous, do not increase any improvement, be difficulty with being uniformly distributed of face copper.
Such as Authorization Notice No. is the Chinese utility model patent of CN202022988U, it discloses the micropore copper plating device of a kind of HDI wiring board, this device includes the cell body for holding copper plating bath, cell body is arranged over lowering or hoisting gear, in cell body, two opposite side walls is provided with ultrasonic generator, and on cell body, edge is provided with pneumatic jack pump described in the pneumatic jack pump for making whole cell body vibrate and is symmetricly set in edge, cell body two opposite sides；Arranging air-inflating tube bottom cell body, air-inflating tube is connected with outside inflating pump.In copper plating device described in this utility model makes cell body by ultrasonic generator, copper plating bath forms the strongest turbulent condition, impacts and changes overflow situation in hole；Drive whole cell body to vibrate by the vibration of pneumatic jack pump again, slacken and eliminate " laminar flow " phenomenon in hole；By air-inflating tube, copper plating groove liquid medicine is carried out Efficient Cycle, it is ensured that use the micropore copper facing quality of normal vertical electroplating technology so that it is can meet and interconnect between HDI(high-density layer) the micropore copper facing prescription of wiring board.Decrease that PCB plate is unnecessary to be scrapped, reduce production cost.Lowering or hoisting gear two ends are stuck in the V-type draw-in groove on edge on cell body, it is simple to copper facing operates, but use ultrasonic wave added big to ultrasonic transducer load in industry coating bath, and use ultrasonic wave added plating solution easily to gasify, and the electroplating temperature range of choice is little.
The most such as Authorization Notice No. is the Chinese utility model patent of CN202705535U, it discloses a kind of circuit board electroplating copper plating device, including cell body, it is arranged in cell body two opposite side walls the titanium basket for containing anode material, floating target for fixed negative pole material, also include filter water absorbing box, air-inflating tube and the jet pipe being arranged on bottom cell body, it is arranged on the inflating pump outside cell body, filter, described filter water absorbing box, jet pipe are connected with filter respectively, and air-inflating tube is connected with inflating pump.This utility model adds filter water absorbing box, air-inflating tube and jet pipe bottom cell body, enhance the circulation of copper plating groove liquid medicine, and form turbulent flow, solve and use normal vertical copper facing to produce because copper facing lack of homogeneity causes fine and closely woven, separate lines easily to press from both sides the problem that film, copper facing are uneven；Reequiping semi-circular base bottom floating target, base is provided with micro-hole, it is simple to flies liquid medicine leakage when target is mentioned, strengthens circulating effect；Simple for structure, production cost is low, it is easy to large-scale production.But this device cannot ensure being uniformly distributed of face copper when the HDI circuit production in the face of more becoming more meticulous.
Utility model content
In order to solve the above-mentioned technological deficiency that prior art exists, the purpose of this utility model is to provide a kind of HDI plate to become more meticulous copper plating device, by on the basis of original electroplating production facility, turbulence promoter is set in wiring board both sides to be electroplated, the equally distributed problem of face copper cannot be ensured when the HDI circuit production in the face of more becoming more meticulous solving existing apparatus.
Become more meticulous copper plating device according to a kind of HDI plate of the present utility model, including electrolysis bath, anode and wiring board to be electroplated, this wiring board to be electroplated is the negative electrode in this copper plating device, and the both sides of described wiring board to be electroplated are provided with turbulence promoter, and this turbulence promoter is polyhedron empty ball structure.In electroplating process, electrolyte is circulated by circulating pump, the jet blasted is through the polyhedron empty ball structure of turbulence promoter, the surface hydrodynamic condition making wiring board to be electroplated changes, thus increase surface of circuit board bath flow rate and shear rate, mass transfer enhancement, improves the electric current distribution in fine-line region.
In any of the above-described scheme preferably, described stream promoters is rearranged by polyhedron empty ball structure direction.
In any of the above-described scheme preferably, described turbulence promoter selects acidproof plastics or pottery or fibrous material.
In any of the above-described scheme preferably, the outside of described electrolysis bath is provided with circulating pump.
In sum, HDI plate in this utility model copper plating device that becomes more meticulous has the advantage that the both sides of wiring board to be electroplated are provided with turbulence promoter, this turbulence promoter is polyhedron empty ball structure, in electroplating process, electrolyte is circulated by circulating pump, the jet blasted is through the polyhedron empty ball structure of turbulence promoter, the surface hydrodynamic condition making wiring board to be electroplated changes, thus increase surface of circuit board bath flow rate and shear rate, mass transfer enhancement, improve the electric current distribution in fine-line region, meet HDI plate and become more meticulous plating requirement.
Accompanying drawing explanation
Fig. 1 is the structural representation of a preferred embodiment of copper plating device of becoming more meticulous according to a kind of HDI plate of the present utility model.
Fig. 2 be become more meticulous according to a kind of HDI plate of the present utility model copper plating device embodiment illustrated in fig. 1 in the structural representation of turbulence promoter.
Label in accompanying drawing:
Electrolysis bath 1, anode 2, negative electrode 3, turbulence promoter 4, polyhedron empty ball 5.
Detailed description of the invention
That the following description is substantially merely exemplary and be not intended to limit the disclosure, application or purposes.It is further described below in conjunction with Figure of description this utility model HDI plate the become more meticulous detailed description of the invention of copper plating device.
The structural representation of a preferred embodiment of copper plating device as it is shown in figure 1, become more meticulous according to a kind of HDI plate of the present utility model.Become more meticulous copper plating device according to a kind of HDI plate of the present utility model, including electrolysis bath 1, anode 2 and wiring board to be electroplated, this wiring board to be electroplated is the negative electrode 3 in this copper plating device, and the both sides of described wiring board to be electroplated are provided with turbulence promoter 4, and this turbulence promoter is polyhedron empty ball structure 5.In electroplating process, electrolyte is circulated by circulating pump, the jet blasted is through the polyhedron empty ball structure 5 of turbulence promoter 4, the surface hydrodynamic condition making wiring board to be electroplated changes, thus increase surface of circuit board bath flow rate and shear rate, mass transfer enhancement, improves the electric current distribution in fine-line region.
In the present embodiment, described stream promoters 4 is aligned by polyhedron empty ball structure 5 and forms
In the present embodiment, described turbulence promoter 4 selects acidproof plastics or pottery or fibrous material.
In the present embodiment, the outside of described electrolysis bath 1 is provided with circulating pump.
The structural representation of turbulence promoter in the embodiment illustrated in fig. 1 of copper plating device as in figure 2 it is shown, become more meticulous according to a kind of HDI plate of the present utility model.
In the present embodiment, turbulence promoter 4 selects polyhedron empty ball structure 5, in electroplating process, electrolyte is circulated by circulating pump, and the jet blasted is through the polyhedron empty ball structure 5 of turbulence promoter 4 so that the surface hydrodynamic condition of wiring board to be electroplated changes, thus increase surface of circuit board bath flow rate and shear rate, mass transfer enhancement, improves the electric current distribution in fine-line region, and the face copper on wiring board is uniformly distributed.
In sum, HDI plate in this utility model copper plating device that becomes more meticulous has the advantage that the both sides of wiring board to be electroplated are provided with turbulence promoter 4, this turbulence promoter is polyhedron empty ball structure 5, in electroplating process, electrolyte is circulated by circulating pump, the jet blasted is through the polyhedron empty ball structure 5 of turbulence promoter 4, the surface hydrodynamic condition making wiring board to be electroplated changes, thus increase surface of circuit board bath flow rate and shear rate, mass transfer enhancement, improves the electric current distribution in fine-line region；Set up turbulence promoter 4, change PCB surface fluid dynamics condition to be electroplated, significantly improve plate surface current speed and shear rate, contribute to the electric current distribution improving on fine-line, meet HDI plate and become more meticulous plating requirement.
It will be apparent to those skilled in the art that a kind of HDI plate of the present utility model copper plating device that becomes more meticulous includes the combination in any of each several part in this specification.As space is limited and in order to make description simple and clear, these combinations are not discussed in detail one by one at this, but after having seen this specification, the scope of the present utility model that the combination in any of each several part being made up of this specification is constituted is the most self-evident.
Claims (4)
1. a HDI plate becomes more meticulous copper plating device, including electrolysis bath (1), anode (2) and wiring board to be electroplated, this wiring board to be electroplated is the negative electrode (3) in this copper plating device, it is characterized in that: the both sides of described wiring board to be electroplated are provided with turbulence promoter (4), this turbulence promoter is polyhedron empty ball structure (5).
2. HDI plate as claimed in claim 1 becomes more meticulous copper plating device, it is characterised in that: turbulence promoter (4) is aligned by polyhedron empty ball structure (5) and forms.
3. HDI plate as claimed in claim 1 or 2 becomes more meticulous copper plating device, it is characterised in that: turbulence promoter (4) selects acidproof plastics or pottery or fibrous material.
4. HDI plate as claimed in claim 1 becomes more meticulous copper plating device, it is characterised in that: the outside of electrolysis bath (1) is provided with circulating pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620357430.3U CN205710979U (en) | 2016-04-26 | 2016-04-26 | HDI plate becomes more meticulous copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620357430.3U CN205710979U (en) | 2016-04-26 | 2016-04-26 | HDI plate becomes more meticulous copper plating device |
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| Publication Number | Publication Date |
|---|---|
| CN205710979U true CN205710979U (en) | 2016-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620357430.3U Active CN205710979U (en) | 2016-04-26 | 2016-04-26 | HDI plate becomes more meticulous copper plating device |
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| Country | Link |
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| CN (1) | CN205710979U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110804755A (en) * | 2019-08-27 | 2020-02-18 | 宁波华远电子科技有限公司 | Electroplating apparatus |
-
2016
- 2016-04-26 CN CN201620357430.3U patent/CN205710979U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110804755A (en) * | 2019-08-27 | 2020-02-18 | 宁波华远电子科技有限公司 | Electroplating apparatus |
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| GR01 | Patent grant |